DE20011590U1 - Semiconductor chip module with protective film - Google Patents

Semiconductor chip module with protective film

Info

Publication number
DE20011590U1
DE20011590U1 DE20011590U DE20011590U DE20011590U1 DE 20011590 U1 DE20011590 U1 DE 20011590U1 DE 20011590 U DE20011590 U DE 20011590U DE 20011590 U DE20011590 U DE 20011590U DE 20011590 U1 DE20011590 U1 DE 20011590U1
Authority
DE
Germany
Prior art keywords
semiconductor chip
protective film
chip module
module according
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20011590U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE20011590U priority Critical patent/DE20011590U1/en
Publication of DE20011590U1 publication Critical patent/DE20011590U1/en
Priority to PCT/DE2001/002332 priority patent/WO2002003460A2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3164—Partial encapsulation or coating the coating being a foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (7)

1. Halbleiterchip-Modul (1), in welchem wenigstens ein Halb­ leiterchip (2) auf einem Träger (3) befestigt und mit diesem elektrisch leitend kontaktiert ist, dadurch gekennzeichnet, dass auf die dem Träger (3) abgewandte Oberfläche (4) des Halbleiterchips (2) eine aus einer Klebeschicht (5) und einer Elastomerschicht (6) bestehende Schutzfolie (7) mit der Kle­ beschicht (5) voran aufgebracht ist und diese Schutzfolie (7) allseitig über die Oberfläche (4) des Halbleiterchips (2) übersteht.1. Semiconductor chip module ( 1 ), in which at least one semiconductor chip ( 2 ) is attached to a carrier ( 3 ) and is electrically conductively contacted with it, characterized in that on the carrier ( 3 ) facing away from the surface ( 4 ) Semiconductor chips ( 2 ) a protective film ( 7 ) consisting of an adhesive layer ( 5 ) and an elastomer layer ( 6 ) with the adhesive layer ( 5 ) applied in front and this protective film ( 7 ) on all sides over the surface ( 4 ) of the semiconductor chip ( 2 ) survives. 2. Halbleiterchip-Modul gemäß Anspruch 1, dadurch gekennzeichnet, dass er mehrere, auf einer Leiterplatte (3) angeordnete Halb­ leiterchips (2) umfasst.2. The semiconductor chip module according to claim 1, characterized in that it comprises a plurality of semiconductor chips ( 2 ) arranged on a printed circuit board ( 3 ). 3. Halbleiterchip-Modul gemäß Anspruch 2, dadurch gekennzeichnet, dass der Halbleiterchip (2) ein Chip Size Package ist.3. The semiconductor chip module according to claim 2, characterized in that the semiconductor chip ( 2 ) is a chip size package. 4. Halbleiterchip-Modul gemäß Anspruch 2 oder 3, nämlich SDRAM-Modul.4. The semiconductor chip module according to claim 2 or 3, namely SDRAM module. 5. Halbleiterchip-Modul gemäß einem der Ansprüche 2 bis 4, dadurch gekennzeichnet, dass die Halbleiterchips (2) in einer Reihe angeordnet sind und die Schutzfolie (7) in Form eines sämtliche Halbleiter­ chips (2) bedeckenden Streifens ausgebildet ist. 5. Semiconductor chip module according to one of claims 2 to 4, characterized in that the semiconductor chips ( 2 ) are arranged in a row and the protective film ( 7 ) is designed in the form of a strip covering all semiconductor chips ( 2 ). 6. Halbleiterchip-Modul gemäß einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass die Schutzfolie (7) auf wenigstens einer ihrer über den Halbleiterchip (2) überstehenden Seiten zum Träger (3) herun­ tergeführt und an diesen angeklebt ist.6. The semiconductor chip module according to one of claims 1 to 5, characterized in that the protective film ( 7 ) is guided down to at least one of its sides projecting beyond the semiconductor chip ( 2 ) to the carrier ( 3 ) and is adhered thereto. 7. Halbleiterchip-Modul gemäß einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass die Schutzfolie (7) beschriftet ist.7. Semiconductor chip module according to one of claims 1 to 6, characterized in that the protective film ( 7 ) is labeled.
DE20011590U 2000-07-03 2000-07-03 Semiconductor chip module with protective film Expired - Lifetime DE20011590U1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE20011590U DE20011590U1 (en) 2000-07-03 2000-07-03 Semiconductor chip module with protective film
PCT/DE2001/002332 WO2002003460A2 (en) 2000-07-03 2001-06-27 Semiconductor chip module with a protective film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20011590U DE20011590U1 (en) 2000-07-03 2000-07-03 Semiconductor chip module with protective film

Publications (1)

Publication Number Publication Date
DE20011590U1 true DE20011590U1 (en) 2000-09-07

Family

ID=7943506

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20011590U Expired - Lifetime DE20011590U1 (en) 2000-07-03 2000-07-03 Semiconductor chip module with protective film

Country Status (2)

Country Link
DE (1) DE20011590U1 (en)
WO (1) WO2002003460A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10107399A1 (en) * 2001-02-14 2002-09-12 Infineon Technologies Ag Device used as a semiconductor chip comprises an electronic component, a mechanically and electrically connected wiring plate, and a flexible layer around the peripheral edges of the rear side of the electronic component
WO2007096018A2 (en) * 2006-02-20 2007-08-30 Siemens Aktiengesellschaft Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10300958A1 (en) * 2003-01-13 2004-07-22 Epcos Ag Encapsulated module

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2304412A1 (en) * 1973-01-30 1974-08-01 Siemens Ag MOISTURE-PROOF COVERING FOR ELECTRICAL COMPONENTS OR COMPONENT COMBINATIONS
JPS5956745A (en) * 1982-09-24 1984-04-02 Sharp Corp Electronic component parts
JPS60116152A (en) * 1983-11-28 1985-06-22 Matsushita Electric Works Ltd Manufacture of sealed hybrid ic
DE9109295U1 (en) * 1991-04-11 1991-10-10 Export-Contor Aussenhandelsgesellschaft Mbh, 8500 Nuernberg, De
JP3378338B2 (en) * 1994-03-01 2003-02-17 新光電気工業株式会社 Semiconductor integrated circuit device
JP3119569B2 (en) * 1995-02-10 2000-12-25 株式会社ピーエフユー Heat dissipation structure of heating element
JPH08335653A (en) * 1995-04-07 1996-12-17 Nitto Denko Corp Semiconductor device, its production and tape carrier for semiconductor device used for production of the semiconductor device
JP3825475B2 (en) * 1995-06-30 2006-09-27 株式会社 東芝 Manufacturing method of electronic parts
DE19739591A1 (en) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclable circuit board, consisting of a foil and carrier system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10107399A1 (en) * 2001-02-14 2002-09-12 Infineon Technologies Ag Device used as a semiconductor chip comprises an electronic component, a mechanically and electrically connected wiring plate, and a flexible layer around the peripheral edges of the rear side of the electronic component
WO2007096018A2 (en) * 2006-02-20 2007-08-30 Siemens Aktiengesellschaft Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device
WO2007096018A3 (en) * 2006-02-20 2007-11-15 Siemens Ag Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device
US8591689B2 (en) 2006-02-20 2013-11-26 Siemens Aktiengesellschaft Method for selectively producing film laminates for packaging and for insulating unpackaged electronic components and functional patterns and corresponding device

Also Published As

Publication number Publication date
WO2002003460A3 (en) 2002-07-18
WO2002003460A2 (en) 2002-01-10

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20001012

R150 Term of protection extended to 6 years

Effective date: 20031028

R151 Term of protection extended to 8 years

Effective date: 20060926

R152 Term of protection extended to 10 years

Effective date: 20081002

R071 Expiry of right