DE19600994C2 - Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen Substraten - Google Patents
Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen SubstratenInfo
- Publication number
- DE19600994C2 DE19600994C2 DE19600994A DE19600994A DE19600994C2 DE 19600994 C2 DE19600994 C2 DE 19600994C2 DE 19600994 A DE19600994 A DE 19600994A DE 19600994 A DE19600994 A DE 19600994A DE 19600994 C2 DE19600994 C2 DE 19600994C2
- Authority
- DE
- Germany
- Prior art keywords
- solder
- substrate
- deposits
- carrier
- deposit carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 58
- 239000004020 conductor Substances 0.000 title claims description 36
- 238000000034 method Methods 0.000 title claims description 33
- 238000012360 testing method Methods 0.000 title claims description 33
- 229910000679 solder Inorganic materials 0.000 claims description 241
- 238000001465 metallisation Methods 0.000 claims description 41
- 238000012546 transfer Methods 0.000 claims description 36
- 230000008018 melting Effects 0.000 claims description 32
- 238000002844 melting Methods 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 30
- 230000005540 biological transmission Effects 0.000 claims description 16
- 238000009736 wetting Methods 0.000 claims description 16
- 239000012799 electrically-conductive coating Substances 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 230000036961 partial effect Effects 0.000 claims description 6
- 230000005496 eutectics Effects 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 2
- 229910001252 Pd alloy Inorganic materials 0.000 claims description 2
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 230000002401 inhibitory effect Effects 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 239000011733 molybdenum Substances 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 229910001020 Au alloy Inorganic materials 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- 239000003353 gold alloy Substances 0.000 claims 1
- 229910001930 tungsten oxide Inorganic materials 0.000 claims 1
- 239000007787 solid Substances 0.000 description 8
- 238000000151 deposition Methods 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 229910000978 Pb alloy Inorganic materials 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 229910001128 Sn alloy Inorganic materials 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 101100346656 Drosophila melanogaster strat gene Proteins 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 101100400378 Mus musculus Marveld2 gene Proteins 0.000 description 2
- 229910020658 PbSn Inorganic materials 0.000 description 2
- 101150071746 Pbsn gene Proteins 0.000 description 2
- 229910001080 W alloy Inorganic materials 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- IIDJRNMFWXDHID-UHFFFAOYSA-N Risedronic acid Chemical compound OP(=O)(O)C(P(O)(O)=O)(O)CC1=CC=CN=C1 IIDJRNMFWXDHID-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01068—Erbium [Er]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
Claims (21)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19600994A DE19600994C2 (de) | 1995-09-08 | 1996-01-12 | Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen Substraten |
KR1019980701689A KR19990044441A (ko) | 1995-09-08 | 1996-07-19 | 칩의 테스트 방법 및 장치 |
PCT/DE1996/001387 WO1997009740A1 (de) | 1995-09-08 | 1996-07-19 | Verfahren und vorrichtung zum testen eines chips |
EP96928330A EP0850490B1 (de) | 1995-09-08 | 1996-07-19 | Verfahren und vorrichtung zum testen eines chips |
DE59611449T DE59611449D1 (de) | 1995-09-08 | 1996-07-19 | Verfahren und vorrichtung zum testen eines chips |
JP8234493A JP2928484B2 (ja) | 1995-09-08 | 1996-09-04 | Icチップの試験のための方法および装置 |
US08/709,344 US6211571B1 (en) | 1995-09-08 | 1996-09-06 | Method and apparatus for testing chips |
US09/497,437 US6277660B1 (en) | 1995-09-08 | 2000-02-03 | Method and apparatus for testing chips |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19533170 | 1995-09-08 | ||
DE19600994A DE19600994C2 (de) | 1995-09-08 | 1996-01-12 | Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen Substraten |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19600994A1 DE19600994A1 (de) | 1997-03-13 |
DE19600994C2 true DE19600994C2 (de) | 1999-05-06 |
Family
ID=7771575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19600994A Expired - Lifetime DE19600994C2 (de) | 1995-09-08 | 1996-01-12 | Verfahren zum Testen von mit einer Leiterbahnstruktur versehenen Substraten |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR19990044441A (de) |
DE (1) | DE19600994C2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10062661B4 (de) * | 2000-12-15 | 2004-07-15 | Advanced Micro Devices, Inc., Sunnyvale | Testzellenstruktur und Verfahren zum Bestimmen elektrischer Eigenschaften von auf einem Substrat gebildeten eng beabstandeten Verbindungsflächen |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5217597A (en) * | 1991-04-01 | 1993-06-08 | Motorola, Inc. | Solder bump transfer method |
DE19524739A1 (de) * | 1994-11-17 | 1996-05-23 | Fraunhofer Ges Forschung | Kernmetall-Lothöcker für die Flip-Chip-Technik |
-
1996
- 1996-01-12 DE DE19600994A patent/DE19600994C2/de not_active Expired - Lifetime
- 1996-07-19 KR KR1019980701689A patent/KR19990044441A/ko not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5217597A (en) * | 1991-04-01 | 1993-06-08 | Motorola, Inc. | Solder bump transfer method |
DE19524739A1 (de) * | 1994-11-17 | 1996-05-23 | Fraunhofer Ges Forschung | Kernmetall-Lothöcker für die Flip-Chip-Technik |
Also Published As
Publication number | Publication date |
---|---|
KR19990044441A (ko) | 1999-06-25 |
DE19600994A1 (de) | 1997-03-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: ZAKEL, ELKE, DR., 14641 NAUEN, DE Owner name: PAC TECH-PACKAGING TECHNOLOGIES GMBH, 14641 NA, DE |
|
R082 | Change of representative |
Representative=s name: ADVOTEC. PATENT- UND RECHTSANWAELTE, DE |
|
R081 | Change of applicant/patentee |
Owner name: PAC TECH - PACKAGING TECHNOLOGIES GMBH, DE Free format text: FORMER OWNERS: PAC TECH-PACKAGING TECHNOLOGIES GMBH, 14641 NAUEN, DE; ZAKEL, ELKE, DR., 14641 NAUEN, DE Effective date: 20140602 Owner name: PAC TECH - PACKAGING TECHNOLOGIES GMBH, DE Free format text: FORMER OWNER: PAC TECH-PACKAGING TECHNOLOGIES,ELKE ZAKEL, , DE Effective date: 20140602 |
|
R082 | Change of representative |
Representative=s name: ADVOTEC. PATENT- UND RECHTSANWAELTE, DE Effective date: 20140602 |
|
R071 | Expiry of right |