DE112019005141A5 - Chip-Auswerfer - Google Patents

Chip-Auswerfer Download PDF

Info

Publication number
DE112019005141A5
DE112019005141A5 DE112019005141.5T DE112019005141T DE112019005141A5 DE 112019005141 A5 DE112019005141 A5 DE 112019005141A5 DE 112019005141 T DE112019005141 T DE 112019005141T DE 112019005141 A5 DE112019005141 A5 DE 112019005141A5
Authority
DE
Germany
Prior art keywords
chip ejector
ejector
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112019005141.5T
Other languages
English (en)
Inventor
Fabian Hurschler
Stefan Behler
Brian Pulis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Besi Switzerland AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland AG filed Critical Besi Switzerland AG
Publication of DE112019005141A5 publication Critical patent/DE112019005141A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
DE112019005141.5T 2018-10-15 2019-10-15 Chip-Auswerfer Pending DE112019005141A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH01254/18A CH715447B1 (de) 2018-10-15 2018-10-15 Chip-Auswerfer.
CHCH01254/18 2018-10-15
PCT/IB2019/058780 WO2020079589A1 (de) 2018-10-15 2019-10-15 Chip-auswerfer

Publications (1)

Publication Number Publication Date
DE112019005141A5 true DE112019005141A5 (de) 2021-07-01

Family

ID=68240782

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112019005141.5T Pending DE112019005141A5 (de) 2018-10-15 2019-10-15 Chip-Auswerfer

Country Status (8)

Country Link
US (1) US20210391205A1 (de)
JP (1) JP7503052B2 (de)
KR (1) KR20210061433A (de)
CN (1) CN113228244A (de)
CH (1) CH715447B1 (de)
DE (1) DE112019005141A5 (de)
SG (1) SG11202103724SA (de)
WO (1) WO2020079589A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240053715A (ko) 2022-10-17 2024-04-25 세메스 주식회사 다이 이젝팅 장치 및 이를 포함하는 다이 본딩 설비

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* Cited by examiner, † Cited by third party
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JP3976541B2 (ja) * 2001-10-23 2007-09-19 富士通株式会社 半導体チップの剥離方法及び装置
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JP4624813B2 (ja) * 2005-01-21 2011-02-02 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体製造装置
JP5054933B2 (ja) * 2006-05-23 2012-10-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR20070120319A (ko) * 2006-06-19 2007-12-24 삼성전자주식회사 한 쌍의 이젝터들을 구비하는 반도체 칩의 탈착 장치 및이를 이용한 반도체 칩의 탈착 방법
US7665204B2 (en) 2006-10-16 2010-02-23 Asm Assembly Automation Ltd. Die detachment apparatus comprising pre-peeling structure
JP4693805B2 (ja) * 2007-03-16 2011-06-01 株式会社東芝 半導体装置の製造装置及び製造方法
TWI463580B (zh) * 2007-06-19 2014-12-01 Renesas Electronics Corp Manufacturing method of semiconductor integrated circuit device
KR20090120208A (ko) * 2008-05-19 2009-11-24 삼성테크윈 주식회사 다이 공급 장치 및 이를 사용한 다이 공급 방법
CH699851A1 (de) * 2008-11-05 2010-05-14 Esec Ag Chip-Auswerfer und Verfahren zum Ablösen und Entnehmen eines Halbleiterchips von einer Folie.
MY150953A (en) 2008-11-05 2014-03-31 Esec Ag Die-ejector
US8715457B2 (en) * 2008-11-12 2014-05-06 Esec Ag Method for detaching and removing a semiconductor chip from a foil
US8141612B2 (en) * 2009-04-02 2012-03-27 Asm Assembly Automation Ltd Device for thin die detachment and pick-up
US8092645B2 (en) * 2010-02-05 2012-01-10 Asm Assembly Automation Ltd Control and monitoring system for thin die detachment and pick-up
JP5123357B2 (ja) * 2010-06-17 2013-01-23 株式会社日立ハイテクインスツルメンツ ダイボンダ及びピックアップ装置
DE202011002247U1 (de) * 2011-02-02 2011-04-21 Kuhnke Automation Gmbh & Co. Kg Drehmagnet
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KR200466085Y1 (ko) * 2012-08-31 2013-04-03 세메스 주식회사 다이 이젝팅 장치
DE102012021386B4 (de) * 2012-10-31 2019-09-19 Anvis Deutschland Gmbh Federfunktionsbauteil für ein hydroelastisches Lager und hydroelastisches Lager
KR101496024B1 (ko) * 2013-08-13 2015-02-25 세메스 주식회사 다이 이젝팅 장치
CN103730333B (zh) * 2013-12-23 2016-04-20 华中科技大学 一种多顶针芯片剥离装置
CN203649397U (zh) * 2013-12-31 2014-06-18 昆山优磁电子有限公司 一种uf型磁芯模具
KR101585316B1 (ko) * 2014-01-29 2016-01-13 세메스 주식회사 다이 이젝팅 장치
JP5717910B1 (ja) 2014-02-26 2015-05-13 株式会社新川 半導体ダイのピックアップ装置及びピックアップ方法
DE102014006510B3 (de) * 2014-05-02 2015-10-29 Festo Ag & Co. Kg Ventilanordnung
SG10201403372SA (en) * 2014-06-18 2016-01-28 Mfg Integration Technology Ltd System and method for peeling a semiconductor chip from a tape using a multistage ejector
CN104347457B (zh) * 2014-09-17 2017-01-11 华中科技大学 一种适于顶针快速更换的芯片剥离装置
KR101791787B1 (ko) * 2016-05-27 2017-10-30 세메스 주식회사 이젝터 핀 조립체 및 이를 포함하는 다이 이젝팅 장치
US9915305B2 (en) * 2016-06-08 2018-03-13 Deere & Company Retention pin having foot for holding spring in disc brake pack reaction plate during assembly and for operating stator disc
KR102365660B1 (ko) * 2019-08-27 2022-02-18 세메스 주식회사 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치
KR102284457B1 (ko) * 2019-08-27 2021-07-30 세메스 주식회사 다이 픽업 모듈 및 이를 포함하는 다이 본딩 장치
JP2023064405A (ja) * 2021-10-26 2023-05-11 三菱電機株式会社 半導体製造装置および半導体装置の製造方法

Also Published As

Publication number Publication date
US20210391205A1 (en) 2021-12-16
CH715447B1 (de) 2022-01-14
SG11202103724SA (en) 2021-05-28
KR20210061433A (ko) 2021-05-27
JP7503052B2 (ja) 2024-06-19
WO2020079589A1 (de) 2020-04-23
CH715447A2 (de) 2020-04-15
CN113228244A (zh) 2021-08-06
JP2022504581A (ja) 2022-01-13

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