DE112019003634T8 - Optoelektronisches bauelement und das verfahren zur herstellung eines optoelektronischen bauelements - Google Patents

Optoelektronisches bauelement und das verfahren zur herstellung eines optoelektronischen bauelements Download PDF

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Publication number
DE112019003634T8
DE112019003634T8 DE112019003634.3T DE112019003634T DE112019003634T8 DE 112019003634 T8 DE112019003634 T8 DE 112019003634T8 DE 112019003634 T DE112019003634 T DE 112019003634T DE 112019003634 T8 DE112019003634 T8 DE 112019003634T8
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Prior art keywords
optoelectronic component
manufacturing
optoelectronic
component
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE112019003634.3T
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English (en)
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DE112019003634T5 (de
Inventor
Yi Zheng
Victor E. Perez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Publication of DE112019003634T5 publication Critical patent/DE112019003634T5/de
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Publication of DE112019003634T8 publication Critical patent/DE112019003634T8/de
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02Use of particular materials as binders, particle coatings or suspension media therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/006Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of microcrystallites, e.g. of optically or electrically active material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502Wavelength conversion materials
    • H01L33/504Elements with two or more wavelength conversion materials
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Dispersion Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
DE112019003634.3T 2018-07-19 2019-07-10 Optoelektronisches bauelement und das verfahren zur herstellung eines optoelektronischen bauelements Active DE112019003634T8 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/039,556 US10475968B1 (en) 2018-07-19 2018-07-19 Optoelectronic component and a method for producing an optoelectronic component
US16/039,556 2018-07-19
PCT/EP2019/068585 WO2020016080A1 (en) 2018-07-19 2019-07-10 Optoelectronic component and a method for producing an optoelectronic component

Publications (2)

Publication Number Publication Date
DE112019003634T5 DE112019003634T5 (de) 2021-04-01
DE112019003634T8 true DE112019003634T8 (de) 2021-05-27

Family

ID=67303449

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112019003634.3T Active DE112019003634T8 (de) 2018-07-19 2019-07-10 Optoelektronisches bauelement und das verfahren zur herstellung eines optoelektronischen bauelements

Country Status (3)

Country Link
US (1) US10475968B1 (de)
DE (1) DE112019003634T8 (de)
WO (1) WO2020016080A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017101729A1 (de) * 2017-01-30 2018-08-02 Osram Opto Semiconductors Gmbh Strahlungsemittierende Vorrichtung
CN114477989B (zh) * 2020-11-11 2023-05-16 中国科学院福建物质结构研究所 一种石墨烯改性的绿光透明陶瓷材料及其制备方法和应用

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010042217A1 (de) 2010-10-08 2012-04-12 Osram Ag Optoelektronisches Halbleiterbauelement und Verfahren zu seiner Herstellung
CN103367611B (zh) * 2012-03-28 2017-08-08 日亚化学工业株式会社 波长变换用无机成型体及其制造方法以及发光装置
WO2016209871A1 (en) 2015-06-24 2016-12-29 Osram Sylvania Inc. Glass composite wavelength converter and light source having same
JP6872139B2 (ja) 2016-11-17 2021-05-19 日本電気硝子株式会社 無機ナノ蛍光体粒子複合体及び波長変換部材

Also Published As

Publication number Publication date
DE112019003634T5 (de) 2021-04-01
WO2020016080A1 (en) 2020-01-23
US10475968B1 (en) 2019-11-12

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