DE112006004256A5 - Verfahren zur Herstellung eines SOI-Bauelements - Google Patents
Verfahren zur Herstellung eines SOI-Bauelements Download PDFInfo
- Publication number
- DE112006004256A5 DE112006004256A5 DE112006004256T DE112006004256T DE112006004256A5 DE 112006004256 A5 DE112006004256 A5 DE 112006004256A5 DE 112006004256 T DE112006004256 T DE 112006004256T DE 112006004256 T DE112006004256 T DE 112006004256T DE 112006004256 A5 DE112006004256 A5 DE 112006004256A5
- Authority
- DE
- Germany
- Prior art keywords
- producing
- soi device
- soi
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823481—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type isolation region manufacturing related aspects, e.g. to avoid interaction of isolation region with adjacent structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/84—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being other than a semiconductor body, e.g. being an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1203—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI
- H01L27/1207—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body the substrate comprising an insulating body on a semiconductor body, e.g. SOI combined with devices in contact with the semiconductor body, i.e. bulk/SOI hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
- H01L29/6609—Diodes
- H01L29/66128—Planar diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/8611—Planar PN junction diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28123—Lithography-related aspects, e.g. sub-lithography lengths; Isolation-related aspects, e.g. to solve problems arising at the crossing with the side of the device isolation; Planarisation aspects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0617—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type
- H01L27/0629—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region comprising components of the field-effect type in combination with diodes, or resistors, or capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Thin Film Transistor (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/127,329 | 2005-05-11 | ||
US11/127,329 US7361534B2 (en) | 2005-05-11 | 2005-05-11 | Method for fabricating SOI device |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112006004256A5 true DE112006004256A5 (de) | 2013-04-25 |
Family
ID=36716797
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112006004256T Pending DE112006004256A5 (de) | 2005-05-11 | 2006-04-19 | Verfahren zur Herstellung eines SOI-Bauelements |
DE112006001169T Expired - Fee Related DE112006001169B4 (de) | 2005-05-11 | 2006-04-19 | Verfahren zur Herstellung eines SOI-Bauelements |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE112006001169T Expired - Fee Related DE112006001169B4 (de) | 2005-05-11 | 2006-04-19 | Verfahren zur Herstellung eines SOI-Bauelements |
Country Status (8)
Country | Link |
---|---|
US (2) | US7361534B2 (de) |
JP (1) | JP5079687B2 (de) |
KR (1) | KR101201489B1 (de) |
CN (1) | CN100562988C (de) |
DE (2) | DE112006004256A5 (de) |
GB (1) | GB2440861B (de) |
TW (1) | TWI390666B (de) |
WO (1) | WO2006124182A1 (de) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007004859A1 (de) * | 2007-01-31 | 2008-08-14 | Advanced Micro Devices, Inc., Sunnyvale | SOI-Bauelement mit einer Substratdiode mit Prozess toleranter Konfiguration und Verfahren zur Herstellung des SOI-Bauelements |
US7879663B2 (en) * | 2007-03-08 | 2011-02-01 | Freescale Semiconductor, Inc. | Trench formation in a semiconductor material |
US20080247101A1 (en) * | 2007-04-09 | 2008-10-09 | Advanced Micro Devices, Inc. | Electronic device and method |
DE102007052097B4 (de) * | 2007-10-31 | 2010-10-28 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren zur Herstellung eines SOI-Bauelements mit einer Substratdiode |
US7875913B2 (en) * | 2008-05-30 | 2011-01-25 | Omnivision Technologies, Inc. | Transistor with contact over gate active area |
US8120110B2 (en) * | 2008-08-08 | 2012-02-21 | International Business Machines Corporation | Semiconductor structure including a high performance FET and a high voltage FET on a SOI substrate |
US8026131B2 (en) * | 2008-12-23 | 2011-09-27 | International Business Machines Corporation | SOI radio frequency switch for reducing high frequency harmonics |
US7999320B2 (en) * | 2008-12-23 | 2011-08-16 | International Business Machines Corporation | SOI radio frequency switch with enhanced signal fidelity and electrical isolation |
DE102008063403A1 (de) * | 2008-12-31 | 2010-07-08 | Advanced Micro Devices, Inc., Sunnyvale | SOI-Bauelement mit einem vergrabenen isolierenden Material mit erhöhter Ätzwiderstandsfähigkeit |
US8299537B2 (en) | 2009-02-11 | 2012-10-30 | International Business Machines Corporation | Semiconductor-on-insulator substrate and structure including multiple order radio frequency harmonic supressing region |
ATE535937T1 (de) * | 2009-05-18 | 2011-12-15 | Soitec Silicon On Insulator | Herstellungsverfahren für ein hybrid- halbleitersubstrat |
US8048753B2 (en) * | 2009-06-12 | 2011-11-01 | Globalfoundries Inc. | Charging protection device |
DE102009031114B4 (de) * | 2009-06-30 | 2011-07-07 | Globalfoundries Dresden Module One LLC & CO. KG, 01109 | Halbleiterelement, das in einem kristallinen Substratmaterial hergestellt ist und ein eingebettetes in-situ n-dotiertes Halbleitermaterial aufweist, und Verfahren zur Herstellung desselben |
US7955940B2 (en) * | 2009-09-01 | 2011-06-07 | International Business Machines Corporation | Silicon-on-insulator substrate with built-in substrate junction |
JP5721147B2 (ja) * | 2010-03-09 | 2015-05-20 | 大学共同利用機関法人 高エネルギー加速器研究機構 | 半導体装置及び半導体装置の製造方法 |
DE102011002877B4 (de) * | 2011-01-19 | 2019-07-18 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Verfahren zur Herstellung eines SOI-Halbleiterbauelements mit einer Substratdiode und einer Schichtdiode, die unter Anwendung einer gemeinsamen Wannenimplantationsmaske hergestellt sind |
FR2985089B1 (fr) * | 2011-12-27 | 2015-12-04 | Commissariat Energie Atomique | Transistor et procede de fabrication d'un transistor |
KR20160058499A (ko) * | 2014-11-17 | 2016-05-25 | 삼성전자주식회사 | 반도체 소자, 및 그 반도체 소자의 제조방법과 제조장치 |
US10446644B2 (en) * | 2015-06-22 | 2019-10-15 | Globalfoundries Inc. | Device structures for a silicon-on-insulator substrate with a high-resistance handle wafer |
WO2021035420A1 (zh) | 2019-08-23 | 2021-03-04 | 京东方科技集团股份有限公司 | 显示面板及其制造方法、显示装置 |
WO2021035414A1 (zh) | 2019-08-23 | 2021-03-04 | 京东方科技集团股份有限公司 | 像素电路及驱动方法、显示基板及驱动方法、显示装置 |
US11600234B2 (en) | 2015-10-15 | 2023-03-07 | Ordos Yuansheng Optoelectronics Co., Ltd. | Display substrate and driving method thereof |
CN105185816A (zh) * | 2015-10-15 | 2015-12-23 | 京东方科技集团股份有限公司 | 阵列基板及其制造方法、显示装置 |
US10418380B2 (en) * | 2017-07-31 | 2019-09-17 | Globalfoundries Inc. | High-voltage transistor device with thick gate insulation layers |
US10699963B2 (en) * | 2017-08-31 | 2020-06-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure and formation method of semiconductor device structure with isolation feature |
US10115837B1 (en) * | 2017-09-28 | 2018-10-30 | Globalfoundries Singapore Pte. Ltd. | Integrated circuits with solar cells and methods for producing the same |
EP4020596A4 (de) * | 2019-08-23 | 2022-08-10 | BOE Technology Group Co., Ltd. | Anzeigevorrichtung und herstellungsverfahren dafür |
EP4020575A4 (de) | 2019-08-23 | 2022-12-14 | BOE Technology Group Co., Ltd. | Anzeigevorrichtung und herstellungsverfahren dafür |
US11404451B2 (en) | 2019-08-27 | 2022-08-02 | Boe Technology Group Co., Ltd. | Electronic device substrate, manufacturing method thereof, and electronic device |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6113662A (ja) * | 1984-06-28 | 1986-01-21 | Nippon Telegr & Teleph Corp <Ntt> | 相補形misトランジスタ装置及びその製法 |
JPH0738413B2 (ja) * | 1984-10-31 | 1995-04-26 | 富士通株式会社 | 半導体装置 |
JPH02102569A (ja) | 1988-10-12 | 1990-04-16 | Nippon Telegr & Teleph Corp <Ntt> | 半導体装置 |
JPH0982814A (ja) * | 1995-07-10 | 1997-03-28 | Denso Corp | 半導体集積回路装置及びその製造方法 |
JPH09115999A (ja) * | 1995-10-23 | 1997-05-02 | Denso Corp | 半導体集積回路装置 |
US5847419A (en) * | 1996-09-17 | 1998-12-08 | Kabushiki Kaisha Toshiba | Si-SiGe semiconductor device and method of fabricating the same |
JP3415401B2 (ja) * | 1997-08-28 | 2003-06-09 | 株式会社東芝 | 半導体集積回路装置及びその製造方法 |
US5869379A (en) * | 1997-12-08 | 1999-02-09 | Advanced Micro Devices, Inc. | Method of forming air gap spacer for high performance MOSFETS' |
JPH11238860A (ja) | 1998-02-19 | 1999-08-31 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
TW426998B (en) * | 1998-05-04 | 2001-03-21 | United Microelectronics Corp | Layer-stacked integrated circuit structure |
KR100344220B1 (ko) * | 1999-10-20 | 2002-07-19 | 삼성전자 주식회사 | 에스·오·아이(soi) 구조를 갖는 반도체 소자 및 그 제조방법 |
US6303414B1 (en) * | 2000-07-12 | 2001-10-16 | Chartered Semiconductor Manufacturing Ltd. | Method of forming PID protection diode for SOI wafer |
KR100456526B1 (ko) * | 2001-05-22 | 2004-11-09 | 삼성전자주식회사 | 식각저지막을 갖는 에스오아이 기판, 그 제조방법, 그위에 제작된 에스오아이 집적회로 및 그것을 사용하여에스오아이 집적회로를 제조하는 방법 |
JP2003224264A (ja) * | 2002-01-29 | 2003-08-08 | Sony Corp | 半導体装置及びその製造方法 |
US6835622B2 (en) * | 2002-06-04 | 2004-12-28 | Taiwan Semiconductor Manufacturing Co., Ltd | Gate electrode doping method for forming semiconductor integrated circuit microelectronic fabrication with varying effective gate dielectric layer thicknesses |
US6849530B2 (en) * | 2002-07-31 | 2005-02-01 | Advanced Micro Devices | Method for semiconductor gate line dimension reduction |
US6835662B1 (en) * | 2003-07-14 | 2004-12-28 | Advanced Micro Devices, Inc. | Partially de-coupled core and periphery gate module process |
JP3962729B2 (ja) * | 2004-06-03 | 2007-08-22 | 株式会社東芝 | 半導体装置 |
-
2005
- 2005-05-11 US US11/127,329 patent/US7361534B2/en not_active Expired - Fee Related
-
2006
- 2006-04-19 CN CNB2006800163892A patent/CN100562988C/zh not_active Expired - Fee Related
- 2006-04-19 WO PCT/US2006/014626 patent/WO2006124182A1/en active Application Filing
- 2006-04-19 DE DE112006004256T patent/DE112006004256A5/de active Pending
- 2006-04-19 JP JP2008511132A patent/JP5079687B2/ja not_active Expired - Fee Related
- 2006-04-19 GB GB0721841A patent/GB2440861B/en not_active Expired - Fee Related
- 2006-04-19 KR KR1020077028975A patent/KR101201489B1/ko not_active IP Right Cessation
- 2006-04-19 DE DE112006001169T patent/DE112006001169B4/de not_active Expired - Fee Related
- 2006-05-08 TW TW095116200A patent/TWI390666B/zh not_active IP Right Cessation
-
2008
- 2008-02-19 US US12/033,060 patent/US7741164B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN100562988C (zh) | 2009-11-25 |
GB2440861A (en) | 2008-02-13 |
WO2006124182A1 (en) | 2006-11-23 |
DE112006001169B4 (de) | 2012-04-26 |
US20080138941A1 (en) | 2008-06-12 |
US7741164B2 (en) | 2010-06-22 |
JP2008541446A (ja) | 2008-11-20 |
CN101180725A (zh) | 2008-05-14 |
US20060258110A1 (en) | 2006-11-16 |
GB0721841D0 (en) | 2007-12-27 |
DE112006001169T5 (de) | 2008-03-06 |
KR20080011227A (ko) | 2008-01-31 |
JP5079687B2 (ja) | 2012-11-21 |
US7361534B2 (en) | 2008-04-22 |
TW200735263A (en) | 2007-09-16 |
GB2440861B (en) | 2010-06-16 |
KR101201489B1 (ko) | 2012-11-14 |
TWI390666B (zh) | 2013-03-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE112006004256A5 (de) | Verfahren zur Herstellung eines SOI-Bauelements | |
ATE516816T1 (de) | Verfahren zur herstellung von impfstoffen | |
ATE455105T1 (de) | Verfahren zur herstellung von difluormethylpyrazolylcarboxylaten | |
DE602006004019D1 (de) | Verfahren zur herstellung vibrierender mikromechanischer strukturen | |
ATE408604T1 (de) | Verfahren zur herstellung von 1-alkyl-3- phenyluracilen | |
DE602006004751D1 (de) | Verfahren zur Herstellung eines planaren Kondensators | |
ATE529527T1 (de) | Verfahren zur herstellung von alkoholen | |
ATE403639T1 (de) | Verfahren zur herstellung substituierter biphenyle | |
DE602005021088D1 (de) | Verfahren zur herstellung eines quartz-sensorsystems | |
AT505197A3 (de) | Verfahren zur aktivierung eines photosensibilisators | |
ATE533747T1 (de) | Verfahren zur herstellung von tetrahydrochinolinderivaten | |
DE602006015090D1 (de) | Verfahren zur herstellung von gezielt durchlässigen laminaten | |
DE602007013189D1 (de) | Verfahren zur herstellung eines luftreifens | |
DE502007002538D1 (de) | Halbleiterlaser und Verfahren zur Herstellung eines solchen | |
DE602004006782D1 (de) | Verfahren zur herstellung eines verspannten finfet-kanals | |
ATE480531T1 (de) | Verfahren zur herstellung von benzopyran-2- olderivaten | |
DE602007004543D1 (de) | Verfahren zur Anzeige eines elastischen Bildes | |
ATE382833T1 (de) | Verfahren zur herstellung eines optischen spiegels | |
DE502007002942D1 (de) | Verfahren zur herstellung eines einteiligen kolbens | |
DE602005007670D1 (de) | Vorrichtung zur Herstellung eines Gummistreifens | |
DE602006006812D1 (de) | Verfahren zur herstellung einer aluminiumart | |
ATE444303T1 (de) | Verfahren zur herstellung von ferrisuccinylcasein | |
DE502007005615D1 (de) | Verfahren zur herstellung eines piezoaktors | |
DE602005021380D1 (de) | Verfahren zur herstellung eines luftreifens | |
ATE539067T1 (de) | Verfahren zur herstellung einer aminomethylthiazolverbindung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R012 | Request for examination validly filed | ||
R131 | Declaration of division deemed not made | ||
R409 | Internal rectification of the legal status completed | ||
R129 | Divisional application from |
Ref document number: 112006001169 Country of ref document: DE Effective date: 20120214 |
|
R409 | Internal rectification of the legal status completed | ||
R409 | Internal rectification of the legal status completed | ||
R016 | Response to examination communication | ||
R002 | Refusal decision in examination/registration proceedings | ||
R409 | Internal rectification of the legal status completed | ||
R003 | Refusal decision now final |
Effective date: 20140423 |