DE112004000039D2 - Verfahren zur Herstellung einer elektronischen Baugruppe - Google Patents
Verfahren zur Herstellung einer elektronischen BaugruppeInfo
- Publication number
- DE112004000039D2 DE112004000039D2 DE112004000039T DE112004000039T DE112004000039D2 DE 112004000039 D2 DE112004000039 D2 DE 112004000039D2 DE 112004000039 T DE112004000039 T DE 112004000039T DE 112004000039 T DE112004000039 T DE 112004000039T DE 112004000039 D2 DE112004000039 D2 DE 112004000039D2
- Authority
- DE
- Germany
- Prior art keywords
- producing
- electronic assembly
- electronic
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2003102923 DE10302923A1 (de) | 2003-01-24 | 2003-01-24 | Elektronische Baugruppen |
PCT/DE2004/000063 WO2004068533A2 (de) | 2003-01-24 | 2004-01-17 | Verfahren zur herstellung einer elektronischen baugruppe |
Publications (1)
Publication Number | Publication Date |
---|---|
DE112004000039D2 true DE112004000039D2 (de) | 2005-06-30 |
Family
ID=32602944
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2003102923 Withdrawn DE10302923A1 (de) | 2003-01-24 | 2003-01-24 | Elektronische Baugruppen |
DE112004000039T Expired - Fee Related DE112004000039D2 (de) | 2003-01-24 | 2004-01-17 | Verfahren zur Herstellung einer elektronischen Baugruppe |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2003102923 Withdrawn DE10302923A1 (de) | 2003-01-24 | 2003-01-24 | Elektronische Baugruppen |
Country Status (2)
Country | Link |
---|---|
DE (2) | DE10302923A1 (de) |
WO (1) | WO2004068533A2 (de) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006053312A1 (de) * | 2006-11-13 | 2008-06-19 | Robert Bosch Gmbh | Elektronische Schaltungsanordnung mit mindestens einer flexiblen gedruckten Schaltung und Verfahren zu deren Verbindung mit einer zweiten Schaltung |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3500411C2 (de) * | 1985-01-08 | 1994-03-31 | Siemens Ag | Verfahren zum Lötverbinden der Leiterbahnen einer flexiblen gedruckten Leitung oder Schaltung mit den Anschlußflächen einer Leiterplatte |
JPH09139559A (ja) * | 1995-11-13 | 1997-05-27 | Minolta Co Ltd | 回路基板の接続構造 |
US6093894A (en) * | 1997-05-06 | 2000-07-25 | International Business Machines Corporation | Multiconductor bonded connection assembly with direct thermal compression bonding through a base layer |
EP0964608A3 (de) * | 1998-06-12 | 2001-09-05 | Ford Motor Company | Verfahren zum Laserlöten |
DE19832062C2 (de) * | 1998-07-16 | 2001-03-01 | Siemens Ag | Steuergerät für ein Kraftfahrzeug |
JP2001357916A (ja) * | 2000-06-13 | 2001-12-26 | Yazaki Corp | フラット回路体の接続構造 |
US6833526B2 (en) * | 2001-03-28 | 2004-12-21 | Visteon Global Technologies, Inc. | Flex to flex soldering by diode laser |
DE10224266A1 (de) * | 2002-05-31 | 2003-12-11 | Conti Temic Microelectronic | Elektronische Baugruppe |
-
2003
- 2003-01-24 DE DE2003102923 patent/DE10302923A1/de not_active Withdrawn
-
2004
- 2004-01-17 DE DE112004000039T patent/DE112004000039D2/de not_active Expired - Fee Related
- 2004-01-17 WO PCT/DE2004/000063 patent/WO2004068533A2/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2004068533A2 (de) | 2004-08-12 |
DE10302923A1 (de) | 2004-07-29 |
WO2004068533A3 (de) | 2004-10-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8181 | Inventor (new situation) |
Inventor name: KOENIG, SYBILL, DIPL.-ING. (TU), 86706 WEICHERING, Inventor name: WOZAR, UDO, 86643 RENNERTSHOFEN, DE Inventor name: HELMUT, HEINZ, DIPL.-ING., 91522 ANSBACH, DE |
|
8110 | Request for examination paragraph 44 | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |