DE1047078B - Process for increasing the durability of temperature-resistant, in particular, insulating lacquer coatings on copper made of organosilicon lacquers - Google Patents

Process for increasing the durability of temperature-resistant, in particular, insulating lacquer coatings on copper made of organosilicon lacquers

Info

Publication number
DE1047078B
DE1047078B DES38955A DES0038955A DE1047078B DE 1047078 B DE1047078 B DE 1047078B DE S38955 A DES38955 A DE S38955A DE S0038955 A DES0038955 A DE S0038955A DE 1047078 B DE1047078 B DE 1047078B
Authority
DE
Germany
Prior art keywords
resistant
organosilicon
temperature
copper
lacquers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES38955A
Other languages
German (de)
Inventor
Karl Knoll
Gerhard Gahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DES38955A priority Critical patent/DE1047078B/en
Priority to FR1118650D priority patent/FR1118650A/en
Priority to CH333324D priority patent/CH333324A/en
Publication of DE1047078B publication Critical patent/DE1047078B/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B05D7/16Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies using synthetic lacquers or varnishes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/308Wires with resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00Metallic substrate
    • B05D2202/40Metallic substrate based on other transition elements
    • B05D2202/45Metallic substrate based on other transition elements based on Cu
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2350/00Pretreatment of the substrate
    • B05D2350/60Adding a layer before coating
    • B05D2350/65Adding a layer before coating metal layer

Description

DEUTSCHESGERMAN

Während Lackaufträge auf Kupfer, die keinen höheren Temperaturen ausgesetzt sind, meist gut haften, neigen höheren Temperaturen, beispielsweise mehr als 120° C, insbesondere 150° C, ausgesetzte Aufträge aus hitzebeständigen Lacken, beispielsweise solche auf siliciumoTganischer Basis, zum Abplatzen, da die bei der Wärmebehandlung entstehende Kupferoxydschicht nur sehr schlecht am Kupfer haftet und sich deshalb leicht mit dem Lackauftrag abziehen läßt. Man hat deshalb schon auf Kupferleiter, die mit temperaturbeständigem Lacken isoliert sind, Zwischenschichten aus Kadmium oder Nickel oder Edelmetallen, wie Silber, aufgebracht. Die Haftfestigkeit der Laeke ist bei Silber und Nickel zwar immer noch bedeutend besser als bei Kupfer, jedoch ist dies allein nicht ausschlaggebend. Es kommt nämlich hinzu, daß je nach dem Metall der Lackauftrag längere oder kürzere Zeit zum Duircbhärten braucht. Diese Erscheinung ist wohl darin begründet, daß die betreffenden Metalle oder Metalloxyde verschieden stark die Härtung beschleunigen oder verzögern. Dies kann durch ihre chemischen Eigenschaften bedingt sein oder durch die Fähigkeit, sich mehr oder weniger gut im Lackstoff zu lösen oder in diesen zu diffundieren. Versuche haben gezeigt, daß bei Kupfer die Härtezeit verhältnismäßig· kurz ist. Bei Nickel, Silber, Aluminium ist sie aber fast viermal so lang. Kadmium oder Zinnüberzüge als Zwischenschicht haben den weiteren Nachteil, daß sie in den Kupferleiter diffundieren und dadurch dessen Leitfähigkeit beeinträchtigen.While paint applications on copper that are not exposed to higher temperatures usually adhere well, Tend to higher temperatures, for example more than 120 ° C, especially 150 ° C, exposed applications made of heat-resistant lacquers, for example those on a silicono-organic basis, to flake off, because the copper oxide layer produced during the heat treatment adheres very poorly to the copper and can therefore easily be peeled off with the paint application. So you already have copper conductors with them insulated with temperature-resistant lacquers, intermediate layers of cadmium or nickel or precious metals, like silver, applied. The adhesive strength of the Laeke is still significant with silver and nickel better than copper, but this alone is not decisive. In addition, there is the fact that Depending on the metal the lacquer application takes longer or shorter time to harden. This appearance is probably due to the fact that the metals or metal oxides in question have different strengths Accelerate or retard hardening. This can be due to their chemical properties or through the ability to dissolve more or less well in the paint or to diffuse into it. try have shown that the hardening time for copper is relatively short. With nickel, silver, aluminum but it is almost four times as long. Cadmium or tin coatings as an intermediate layer have the other Disadvantage that they diffuse into the copper conductor and thereby impair its conductivity.

Die Erfindung vermeidet diese Schwierigkeiten. Sie bezieht sich auf ein Verfahren zur Erhöhung der Dauerhaftfestigkeit temperatur beständiger, insbesondere aus siliciumorganischen Lacken bestehender Isolierlacküberzüge auf Kupfer durch eine metallische Zwischenschicht. Erfindungsgemäß wird eine Zwischenschicht aus Eisen aufgebracht.The invention avoids these difficulties. It refers to a method of increasing the Durability of temperature-resistant, in particular of organosilicon lacquers, insulating lacquer coatings on copper by means of a metallic one Intermediate layer. According to the invention, an intermediate layer made of iron is applied.

Der Eisenüberzug bietet folgende Vorteile: Er gibt eine viel bessere Haftung als Kupfer und eine erheblich kürzere Härtezeit als Nickel, Silber od. dgl. und diffundiert nicht in den Leiter, so· daß dessen Leitfähigkeit nicht beeinträchtigt wird. Versuche haben gezeigt, daß mit Silicon lackierte Kupferbleche Verfahren zur Erhöhung der Dauerhaftfestigkeit temperaturbeständiger,
insbesondere aus siliciumorganischen
Lacken bestehender Isolierlacküberzüge
auf Kupfer
The iron coating offers the following advantages: It gives a much better adhesion than copper and a considerably shorter hardening time than nickel, silver or the like and does not diffuse into the conductor, so that its conductivity is not impaired. Tests have shown that silicon-coated copper sheets can be used to increase the durability of temperature-resistant,
in particular from organosilicon
Lacquering of existing insulating lacquer coatings
on copper

Anmelder:Applicant:

Siemens -S chucker twerkeSiemens chucker twerke

Aktiengesellschaft,Corporation,

Berlin und Erlangen,Berlin and Erlangen,

Erlangen, Werner-von-Siemens-Str. 50Erlangen, Werner-von-Siemens-Str. 50

Karl Knoll, Feucht bei Nürnberg,Karl Knoll, Feucht near Nuremberg,

und Gerhard Gähn, Erlangen,
sind als Erfinder genannt worden
and Gerhard Gähn, Erlangen,
have been named as inventors

oder Drähte mit Zwischenschicht aus Eisen selbst nach vierwöchentlicher Wärmebehandlung bei etwa 200° C wiederholt gebogen und gefaltet werden konnten, ohne daß der Lack abplatzte. Auch zeigte die Lackschicht praktisch keine Verfärbung, während in derselben Weise lackierte Kupferbleche oder -drahte ohne Zwischenschicht bereits nach längstens 9stündiger Einwirkung von 200° C bei geringen mechanischen Beanspruchungen die Lackschicht abspringen lassen.or wires with an intermediate layer of iron even after four weeks of heat treatment at about 200 ° C could be bent and folded repeatedly without the varnish flaking off. Also showed the paint layer practically no discoloration, while copper sheets or wires lacquered in the same way without an intermediate layer after a maximum of 9 hours exposure to 200 ° C with low mechanical loads let the layer of paint peel off.

Claims (1)

Patentanspruch:Claim: Verfahren zur Erhöhung der Dauerhaftfestigkei/t temperaturbeständiger, insbesondere aus siliciumo-rganischen Lacken bestehender Isolierlacküberzüge auf Kupfer durch eine metallische Zwischenschicht, dadurch gekennzeichnet, daß eine Zwischenschicht aus Eisen aufgebracht wird.Process to increase the permanent strength / t more temperature-resistant, in particular from organosilicon Lacquering of existing insulating lacquer coatings on copper using a metallic intermediate layer, characterized in that an intermediate layer of iron is applied. In Betracht gezogene Druckschriften:
Deutsche Patentschrift Nr. 421 278.
Considered publications:
German patent specification No. 421 278.
DES38955A 1954-04-30 1954-04-30 Process for increasing the durability of temperature-resistant, in particular, insulating lacquer coatings on copper made of organosilicon lacquers Pending DE1047078B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DES38955A DE1047078B (en) 1954-04-30 1954-04-30 Process for increasing the durability of temperature-resistant, in particular, insulating lacquer coatings on copper made of organosilicon lacquers
FR1118650D FR1118650A (en) 1954-04-30 1955-02-02 Process for enhancing the permanent adhesion of heat-resistant insulating coatings, in particular organo-silicic coatings on copper or copper alloys
CH333324D CH333324A (en) 1954-04-30 1955-04-26 Process for the production of permanent, temperature-resistant coatings on electrical conductors made of copper or copper alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES38955A DE1047078B (en) 1954-04-30 1954-04-30 Process for increasing the durability of temperature-resistant, in particular, insulating lacquer coatings on copper made of organosilicon lacquers

Publications (1)

Publication Number Publication Date
DE1047078B true DE1047078B (en) 1958-12-18

Family

ID=7483119

Family Applications (1)

Application Number Title Priority Date Filing Date
DES38955A Pending DE1047078B (en) 1954-04-30 1954-04-30 Process for increasing the durability of temperature-resistant, in particular, insulating lacquer coatings on copper made of organosilicon lacquers

Country Status (3)

Country Link
CH (1) CH333324A (en)
DE (1) DE1047078B (en)
FR (1) FR1118650A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6649930B2 (en) 2000-06-27 2003-11-18 Energenius, Inc. Thin film composite containing a nickel-coated copper substrate and energy storage device containing the same
CN1318646C (en) * 2001-06-28 2007-05-30 艾纳尔杰纽斯公司 Method of making nickel-coated copper substrate and thin film composite containing same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE421278C (en) * 1923-11-09 1925-11-10 Siemens Schuckertwerke G M B H Process to increase the adhesion of the lacquer insulation on wires made of resistance material

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE421278C (en) * 1923-11-09 1925-11-10 Siemens Schuckertwerke G M B H Process to increase the adhesion of the lacquer insulation on wires made of resistance material

Also Published As

Publication number Publication date
FR1118650A (en) 1956-06-08
CH333324A (en) 1958-10-15

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