DE1021488B - Layered semiconductor crystallode - Google Patents
Layered semiconductor crystallodeInfo
- Publication number
- DE1021488B DE1021488B DEB29787A DEB0029787A DE1021488B DE 1021488 B DE1021488 B DE 1021488B DE B29787 A DEB29787 A DE B29787A DE B0029787 A DEB0029787 A DE B0029787A DE 1021488 B DE1021488 B DE 1021488B
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor
- crystallode
- emitter
- base
- band gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 43
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 239000010703 silicon Substances 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 2
- OPTOQCQBJWTWPN-UHFFFAOYSA-N [Si].[Ge].[Si] Chemical compound [Si].[Ge].[Si] OPTOQCQBJWTWPN-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Bipolar Transistors (AREA)
Description
Halbleiter-Kristallode der Schichtenbauart Das Frequenzverhalten von Flächen-Halbleiter-Kristalloden, insbesondere Halbleiter-Kristalltrioden, aus einem einzigen Halbleitermaterial ist durch die Kapazitäten bestimmt. Physikalisch definierte Dotierungsverhältnisse der Halbleiter von Kollektor-Basis einerseits und Basis-Emitter andererseits erlauben es nicht, die Kapazitäten klein zu halten. Außerdem erzwingt das letztere ein für gute Injektionswirkung notwendiges Dotierungsverhältnis und damit ein Basishalbleitermaterial von etwa 0,6 bis 1 Ohmcm.Layered semiconductor crystal The frequency response of Surface semiconductor crystal electrodes, in particular semiconductor crystal triodes, from one single semiconductor material is determined by the capacities. Physically defined Doping ratios of the semiconductors of collector-base on the one hand and base-emitter on the other hand, they do not allow the capacities to be kept small. Also forces the latter a doping ratio necessary for a good injection effect and thus a base semiconductor material of about 0.6 to 1 ohm cm.
Die Erfindung bezieht sich auf eine Halbleiter-Kristallode der Schichtenbauart mit p-n-Verbindungen, bei der der Emitter-Halbleiter gegenüber dem Basis-Halbleiter einen größeren Bandabstand, d. h. eine größere Breite der verbotenen Zone, aufweist. Kristalloden dieser Gattungsart sind bereits bekannt. Nach der Erfindung wird eine solche Kristallode dadurch weitergebildet, daß der Basis-Halbleiter stärker dotiert ist als der Emitter-oder Kollektor-Halbleiter.The invention relates to a layered type semiconductor crystallode with p-n connections, in which the emitter semiconductor is opposite to the base semiconductor a larger band gap, d. H. a greater width of the forbidden zone. Crystallodes of this genus are already known. According to the invention, a such a crystallode is further developed in that the base semiconductor is more heavily doped is called the emitter or collector semiconductor.
Die bei den Halbleiter-Kristalloden nach der Erfindung verwendete starke Dotierung der Basisschicht ermöglicht weit geringere Basisdicken als bisher, ohne daß dadurch der Basiswiderstand unzulässig hoch wird. Zudem wird dadurch auch die störende Rückwirkung des Kollektors herabgesetzt. Da das Grenzfrequenzverhalten eines Transistors in der Hauptsache durch die Gleichung beschrieben wird, wobei f g die Grenzfrequenz, D die Diffusionskonstante, w die Basisdicke ist, so ist der Vorteil geringerer Basisdicken sofort ersichtlich.The heavy doping of the base layer used in the semiconductor crystallodes according to the invention enables much smaller base thicknesses than before without the base resistance becoming inadmissibly high as a result. In addition, this also reduces the disruptive reaction of the collector. Since the cutoff frequency behavior of a transistor is mainly determined by the equation is described, where fg is the cutoff frequency, D is the diffusion constant, w is the base thickness, the advantage of smaller base thicknesses is immediately apparent.
Die Erfindung ist nicht auf Halbleiter-Kristalldioden beschränkt, sondern kann mit besonderem Vorteil auch bei anderen Halbleiter-Kristalloden, insbesondere Halbleiter-Kristalltrioden, zum Einsatz kommen. Im Falle einer Halbleiter-Kristalltriode wird der Basis-Halbleiter durch eine Substanz mit niedrigem Bandabstand gebildet, während Emitter- und Kollektor-Halbleiter aus Substanzen mit hohem Bandabstand bestehen. Beispielsweise kann bei der Halbleiter-Kristallode nach der Erfindung eine Germaniumschicht an eine Siliziumschicht grenzen. Die Halbleiter-Kristallode kann zweckmäßig vom Typ Silizium-Germanium-Silizium sein, wenn es sich um eine Halbleiter-Kristalltriode handelt.The invention is not limited to semiconductor crystal diodes, but can also be used with particular advantage in the case of other semiconductor crystallodes, in particular Semiconductor crystal triodes are used. In the case of a semiconductor crystal triode the base semiconductor is formed by a substance with a low band gap, while emitter and collector semiconductors consist of substances with a high band gap. For example, a germanium layer can be used in the semiconductor crystallode according to the invention border on a silicon layer. The semiconductor crystallode can expediently from Type silicon-germanium-silicon if it is a semiconductor crystal triode acts.
Es ist auch möglich, die üblichen als Halbleiter zu verwenden, indem eine geeignete Verbindung dieser Art gegen Germanium oder Silizium benutzt wird. Gegebenenfalls kann der Basis-Halbleiter aus einer geeigneten AIIIBv-Verbindung gebildet werden, während Emitter- und Kollektor-Halbleiter aus Silizium bestehen. Ferner ist es möglich, den Basis-Halbleiter aus Germanium herzustellen, während Emitter- und Kollektor-Halbleiter aus einer AIIIBv-Verbindung zusammengesetzt sind. Es lassen sich alle Kombinationen bilden, bei denen die Forderung erfüllt ist, daß der Basis-Halbleiter aus einer Substanz mit niedrigem Bandabstand besteht, während für Emitter- und Kollektor-Halbleiter Substanzen mit höherem Bandabstand benutzt werden. In jedem Fall liegen die Kapazitäten weit niedriger als bei den reinen Germanium-p-n-Verbindungen. Ein Silizium-Emitter mit beispielsweise 1013 Störstellen pro cm3 ist noch ein ausgezeichneter Emitter gegen eine Germanium-Basisschicht von 1017 bis 1018 Störatomen pro cm3.It is also possible to use the usual ones as semiconductors by a suitable compound of this kind against germanium or silicon is used. If necessary, the base semiconductor can consist of a suitable AIIIBv compound are formed, while emitter and collector semiconductors are made of silicon. It is also possible to manufacture the base semiconductor from germanium while Emitter and collector semiconductors are composed of an AIIIBv compound. All combinations can be formed in which the requirement is met that the base semiconductor consists of a low-bandgap substance while substances with a higher band gap are used for emitter and collector semiconductors will. In any case, the capacities are far lower than with the pure germanium p-n compounds. A silicon emitter with, for example, 1013 imperfections per cm3 is still an excellent one Emitter against a germanium base layer of 1017 to 1018 impurity atoms per cm3.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEB29787A DE1021488B (en) | 1954-02-19 | 1954-02-19 | Layered semiconductor crystallode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEB29787A DE1021488B (en) | 1954-02-19 | 1954-02-19 | Layered semiconductor crystallode |
Publications (1)
Publication Number | Publication Date |
---|---|
DE1021488B true DE1021488B (en) | 1957-12-27 |
Family
ID=6963018
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DEB29787A Pending DE1021488B (en) | 1954-02-19 | 1954-02-19 | Layered semiconductor crystallode |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE1021488B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1151605B (en) * | 1960-08-26 | 1963-07-18 | Telefunken Patent | Semiconductor component |
DE1152762B (en) * | 1960-10-13 | 1963-08-14 | Deutsche Bundespost | Transistor for switching with partially falling emitter voltage-emitter current characteristics |
DE1189656B (en) * | 1962-08-07 | 1965-03-25 | Siemens Ag | Semiconductor component with at least one pn junction between zones made of different semiconductor materials |
DE1212222B (en) * | 1960-09-06 | 1966-03-10 | Western Electric Co | Semiconductor diode with a pn junction exhibiting a tunnel effect |
DE1284518B (en) * | 1960-01-29 | 1968-12-05 | Philips Nv | Surface transistor and process for its manufacture |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH277131A (en) * | 1948-02-26 | 1951-08-15 | Western Electric Co | Semiconductor element for amplifying electrical signals. |
DE814487C (en) * | 1948-06-26 | 1951-09-24 | Western Electric Co | Solid, conductive electrical device using semiconductor layers to control electrical energy |
-
1954
- 1954-02-19 DE DEB29787A patent/DE1021488B/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH277131A (en) * | 1948-02-26 | 1951-08-15 | Western Electric Co | Semiconductor element for amplifying electrical signals. |
DE814487C (en) * | 1948-06-26 | 1951-09-24 | Western Electric Co | Solid, conductive electrical device using semiconductor layers to control electrical energy |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1284518B (en) * | 1960-01-29 | 1968-12-05 | Philips Nv | Surface transistor and process for its manufacture |
DE1151605B (en) * | 1960-08-26 | 1963-07-18 | Telefunken Patent | Semiconductor component |
DE1151605C2 (en) * | 1960-08-26 | 1964-02-06 | Telefunken Patent | Semiconductor component |
DE1212222B (en) * | 1960-09-06 | 1966-03-10 | Western Electric Co | Semiconductor diode with a pn junction exhibiting a tunnel effect |
DE1152762B (en) * | 1960-10-13 | 1963-08-14 | Deutsche Bundespost | Transistor for switching with partially falling emitter voltage-emitter current characteristics |
DE1189656B (en) * | 1962-08-07 | 1965-03-25 | Siemens Ag | Semiconductor component with at least one pn junction between zones made of different semiconductor materials |
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