DE102017200504A1 - Electronic component and method for producing an electronic component - Google Patents

Electronic component and method for producing an electronic component Download PDF

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Publication number
DE102017200504A1
DE102017200504A1 DE102017200504.1A DE102017200504A DE102017200504A1 DE 102017200504 A1 DE102017200504 A1 DE 102017200504A1 DE 102017200504 A DE102017200504 A DE 102017200504A DE 102017200504 A1 DE102017200504 A1 DE 102017200504A1
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Germany
Prior art keywords
electronic component
circuit board
printed circuit
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housed
Prior art date
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DE102017200504.1A
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German (de)
Inventor
Frieder Wittmann
Karin Beart
Bernhard Schuch
Thomas Schmidt
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Vitesco Technologies Germany GmbH
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Conti Temic Microelectronic GmbH
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Priority to DE102017200504.1A priority Critical patent/DE102017200504A1/en
Publication of DE102017200504A1 publication Critical patent/DE102017200504A1/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/36—Material effects
    • H01L2924/365—Metallurgical effects
    • H01L2924/3656—Formation of Kirkendall voids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0495—Cold welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

Die Erfindung betrifft eine elektronische Komponente (E), umfassend- eine Leiterplatte (1) mito zumindest einer elektrischen Leiterbahn (1.1) undo zumindest zwei elektronischen Bauteilen (2.1 bis 2.4),wobei zumindest eines der elektronischen Bauteile (2.1) eingehäust ist und mittels mindestens einer Verbindung (3.1) elektrisch leitend mit einer Anschlussstelle der Leiterplatte (1) verbunden, insbesondere gelötet ist und wobei zumindest ein weiteres elektronisches Bauteil (2.2) ungehäust ist und mittels mindestens eines Dickdrahts (3.2) elektrisch leitend mit einer Anschlussstelle der Leiterplatte (1) verbunden, insbesondere kalt verschweißt ist.The invention relates to an electronic component (E), comprising a printed circuit board (1) mito at least one electrical conductor track (1.1) ando at least two electronic components (2.1 to 2.4), wherein at least one of the electronic components (2.1) is housed and at least a connection (3.1) electrically connected to a connection point of the printed circuit board (1), in particular soldered and wherein at least one further electronic component (2.2) is unhoused and electrically conductive by means of at least one thick wire (3.2) with a connection point of the printed circuit board (1) connected, in particular cold-welded.

Description

Die Erfindung betrifft eine elektronische Komponente, umfassend eine Leiterplatte mit zumindest einer elektrischen Leiterbahn und zumindest zwei elektronischen Bauteilen. Des Weiteren betrifft die Erfindung ein Verfahren zur Herstellung einer elektronischen Komponente.The invention relates to an electronic component, comprising a printed circuit board with at least one electrical conductor track and at least two electronic components. Furthermore, the invention relates to a method for producing an electronic component.

Elektronische Komponenten umfassen beispielsweise eine Kombination von integrierten Schaltungen, elektronischen Halbleiterbauelementen und/oder aktiven/passiven Bauelementen, die auf einer Leiterplatte oder einem Substrat zu einer elektrischen Schaltungsanordnung zusammengeführt, insbesondere miteinander elektrisch verbunden sind. Eine solche elektronische Komponente wird beispielsweise in einem Steuergerät für ein Kraftfahrzeug, zum Beispiel in einem Getriebe- oder Motorsteuergerät, eingesetzt.Electronic components include, for example, a combination of integrated circuits, electronic semiconductor components and / or active / passive components, which are combined on a printed circuit board or a substrate to form an electrical circuit arrangement, in particular are electrically connected to one another. Such an electronic component is used for example in a control device for a motor vehicle, for example in a transmission or engine control unit.

Die Elemente auf der Leiterplatte können in Form sogenannter Bare Dies ungehäust oder als gelötete gehäuste elektronische Bauteile mit einer Kunststoffabdeckung auf der Flachseite der Leiterplatte angeordnet sein. Als Bare Dies werden insbesondere elektronische Bauteile bezeichnet, die ohne Abdeckung weiterverarbeitet werden. Diese ungehäusten elektronischen Bauteile werden direkt auf der Leiterplatte aufgebracht und mittels elektrischer Verbindungselemente, insbesondere mittels Bonddrähten meist mit der Leiterplatte oder dem Schaltungsträger verbunden.The elements on the circuit board can be arranged unhoused in the form of so-called bare dies or as soldered housed electronic components with a plastic cover on the flat side of the printed circuit board. Bare dies are in particular electronic components that are processed without cover. These unhoused electronic components are applied directly to the circuit board and connected by means of electrical connection elements, in particular by means of bonding wires usually with the circuit board or the circuit board.

Je nach Anforderungen an Bauraum und/oder Temperaturbeanspruchung ist die Leiterplatte, auch als Schaltungsträger bezeichnet, bei ausreichendem Bauraum ausschließlich mit eingehäusten Halbleiterbauelementen oder ausschließlich bei geringem Bauraum und hohen Temperaturen vollständig leitgeklebt mit sogenannten Bare-Die-Halbleiterbauelementen versehen.Depending on the requirements of space and / or temperature stress, the circuit board, also referred to as a circuit substrate, provided with sufficient space exclusively with housed semiconductor devices or only with minimal space and high temperatures completely glued with so-called bare die semiconductor devices.

Mit der Bare-Die-Technologie sind hohe Anforderungen an Sauberkeit und eine aufwändige Prozessführung sowie hohe Kosten aufgrund der Verwendung von Edelmetallen verbunden.The bare-die technology involves high requirements for cleanliness and time-consuming process management, as well as high costs due to the use of precious metals.

Mit der Lottechnologie können kostengünstige verzinnte Standard-Bauteile verwendet werden. Aufgrund der eingehäusten Ausführung dieser Bauteile ist damit ein hoher Bauraumbedarf verbunden.Low-cost tinned standard components can be used with the solder technology. Due to the housed design of these components is thus associated with a high space requirement.

Der Erfindung liegt die Aufgabe zugrunde, eine gegenüber dem Stand der Technik verbesserte elektronische Komponente und ein verbessertes Verfahren zur Herstellung einer solchen elektronischen Komponente anzugeben.The invention has for its object to provide an improved over the prior art electronic component and an improved method for producing such an electronic component.

Die Aufgabe wird erfindungsgemäß durch die im Anspruch 1 angegebenen Merkmale gelöst. Hinsichtlich des Verfahrens wird die Aufgabe erfindungsgemäß durch die im Anspruch 10 angegebenen Merkmale gelöst.The object is achieved by the features specified in claim 1. With regard to the method, the object is achieved by the features specified in claim 10.

Vorteilhafte Ausgestaltungen der Erfindung sind Gegenstand der Unteransprüche.Advantageous embodiments of the invention are the subject of the dependent claims.

Die erfindungsgemäße elektronische Komponente umfasst eine Leiterplatte oder ein Substrat mit zumindest einer elektrischen Leiterbahn und zumindest zwei elektronischen Bauteilen, wobei zumindest eines der elektronischen Bauteile eingehäust ist und mittels mindestens einer Verbindung, insbesondere eines Dünndrahts oder Metallbandes, insbesondere eines Aluminium-Dünndrahts, elektrisch leitend mit einer Anschlussstelle der Leiterplatte verbunden, insbesondere verlötet ist und zumindest ein weiteres elektronisches Bauteil ungehäust ist und mittels mindestens eines Dickdrahts, insbesondere eines Aluminium-Dickdrahts, elektrisch leitend mit einer Anschlussstelle der Leiterplatte verbunden, insbesondere kalt verschweißt ist.The electronic component according to the invention comprises a printed circuit board or a substrate having at least one electrical trace and at least two electronic components, wherein at least one of the electronic components is housed and by means of at least one compound, in particular a thin wire or metal strip, in particular an aluminum thin wire, electrically conductive a connection point of the circuit board is connected, in particular soldered and at least one further electronic component is unhoused and by means of at least one thick wire, in particular an aluminum thick-wire, electrically connected to a connection point of the circuit board, in particular cold welded.

Die Erfindung verbindet die Bare-Die-Technologie und somit ungehäuste elektronische Bauteile mit gehäusten elektronischen Bauteilen auf einem Substrat. Hierdurch sind Herstellungskosten im Vergleich zu Schaltungsträgern mit reinen Bare-Die-Bauteilen deutlich reduziert. Zudem sind die Einsatzmöglichkeiten betreffend Bauraum und Temperatur nahezu gleichbleibend. Darüber hinaus ermöglicht ein solcher Aufbau der elektronischen Komponente eine individuelle Anpassung auf notwendige Anforderungen an Temperatur und Bauraum. Ferner ist eine solche elektronische Komponente robust ausgestaltet, insbesondere temperaturfest ausgestaltet und gegenüber mechanischen Beanspruchungen hinreichend geschützt. Insbesondere kann eine solche elektronische Komponente bei höheren Temperaturen eingesetzt werden. Beispielsweise ist die elektronische Komponente in Bereichen mit hohen Temperatur- und/oder Bauraumanforderungen und mit Korrosionsgefahr einsetzbar. Zum Beispiel ist eine solche elektronische Komponente in einer Getriebesteuerung einsetzbar, bei welcher es zu einem direkten Kontakt mit aggressiven Medien kommen kann.The invention combines bare die technology and thus unpackaged electronic components with packaged electronic components on a substrate. As a result, manufacturing costs are significantly reduced compared to circuit carriers with pure bare-die components. In addition, the possible applications in terms of space and temperature are almost constant. In addition, such a structure of the electronic component allows individual adaptation to the necessary requirements for temperature and space. Furthermore, such an electronic component is designed to be robust, in particular temperature-resistant and adequately protected against mechanical stresses. In particular, such an electronic component can be used at higher temperatures. For example, the electronic component can be used in areas with high temperature and / or space requirements and with the risk of corrosion. For example, such an electronic component can be used in a transmission control in which it can come into direct contact with aggressive media.

Dadurch, dass als gehäustes elektronisches Bauteil ein Standard-Lötbauteil und zur elektrischen Kontaktierung des gehäusten elektronischen Bauteils eine herkömmliche elektrisch leitende Verbindung oder Kontaktierung, wie ein Leadframe oder ein Dünndraht, wie ein Aluminium-Dünndraht, verwendet wird, ist ein kostengünstiges elektronisches Bauteil ermöglicht. Dabei ersetzt das gehäuste elektronische Bauteil ein herkömmliches Bare-Die-Bauteil mit zu bondenden Dünndrähten. Die elektrischen Verbindungen des gehäusten elektronischen Bauteils werden einfach auf den Schaltungsträger aufgelötet. Characterized in that a standard soldering component is used as the housed electronic component and a conventional electrically conductive connection or contact, such as a leadframe or a thin wire, such as an aluminum thin wire, for electrically contacting the housed electronic component, a cost-effective electronic component is made possible. The housed electronic component replaces a conventional bare-die component with thin wires to be bonded. The electrical connections of the housed electronic component are simply soldered onto the circuit carrier.

Demgegenüber werden mit Dickdraht zu bondende Bauteile ungehäust und somit als Bare-Die Bauteile auf dem Schaltungsträger bestückt und angeordnet, wobei die Bare-Die Bauteile über Dickdrähte mit dem Schaltungsträger verbunden, insbesondere gebondet werden.In contrast, components to be bonded with thick wire are unhoused and thus populated as bare components on the circuit carrier and arranged, wherein the bare components are connected via thick wires to the circuit carrier, in particular bonded.

Der Vorteil der Erfindung liegt in der Kombination von gehäusten Bauteilen mit Lötverbindungen und Bare-Die-Bauteilen mit Bondverbindungen. Damit wird in vorteilhafter Art und Weise eine Kostenreduktion der elektronischen Komponente gegenüber dem Stand der Technik erreicht. Eine daraus resultierende Monometallverbindung, zumindest zwischen dem Bonddraht und dem ungehäusten elektronischen Bauteil, ermöglicht zudem die Verringerung eines Risikos zur Ausbildung intermetallischer Phasen und daraus resultierenden Fehlermechanismen, wie beispielweise der sogenannte Kirkendall-Effekt und Halogen-Korrosionsvorgänge. Darüber hinaus müssen Dünndrähte nicht mehr gebondet werden, wodurch eine Erhöhung der Robustheit, weniger hohe Anforderungen an Oberflächensauberkeit, weniger schwierige Prozessführung und keine anfälligen Dünndrahtverbindungen gegeben sind. Zudem führt dies zu einem nur gering größeren Platzbedarf der Schaltung im Vergleich zu rein gelöteten Baugruppen mit ausschließlich gehäusten Bauteilen.The advantage of the invention lies in the combination of packaged components with solder joints and bare die components with bonds. Thus, a cost reduction of the electronic component over the prior art is achieved in an advantageous manner. A resulting monometallic compound, at least between the bonding wire and the unhoused electronic component, also makes it possible to reduce the risk of forming intermetallic phases and resulting failure mechanisms, such as the so-called Kirkendall effect and halogen corrosion processes. In addition, thin wires no longer need to be bonded, resulting in an increase in ruggedness, less stringent surface cleanliness requirements, less difficult process control, and no susceptible thin wire connections. In addition, this leads to only a slightly larger space requirement of the circuit in comparison to purely brazed assemblies with exclusively housed components.

Die elektronische Komponente ist im Rahmen der Erfindung zur Anordnung in einem Steuergerät eines Kraftfahrzeugs, beispielswiese in einem Getriebesteuergerät, vorgesehen.The electronic component is provided in the context of the invention for arrangement in a control unit of a motor vehicle, for example in a transmission control unit.

In einer möglichen Ausführungsform ist ein Ende des mindestens einen Dickdrahtes elektrisch leitend mit der Oberfläche der Leiterplatte verbunden, insbesondere gebondet. Darüber hinaus ist mindestens ein gehäustes Bauteil mit der Oberfläche der Leiterplatte verbunden, insbesondere verlötet. Ein Ende des mindestens einen Dickdrahtes ist elektrisch leitend mit der Oberfläche der Leiterplatte verbunden und fixiert, insbesondere kalt verschweißt. Weiterhin ist mindestens ein Bare-Die-Bauteil auf dem Schaltungsträger fixiert und mittels der Dickdraht-Bondverbindung elektrisch leitend mit der Oberfläche der Leiterplatte verbunden.In one possible embodiment, one end of the at least one thick wire is electrically conductively connected to the surface of the printed circuit board, in particular bonded. In addition, at least one housed component is connected to the surface of the printed circuit board, in particular soldered. One end of the at least one thick wire is electrically conductively connected to the surface of the circuit board and fixed, in particular cold-welded. Furthermore, at least one bare-die component is fixed on the circuit carrier and electrically conductively connected to the surface of the printed circuit board by means of the thick-wire bond connection.

Zur Befestigung des mindestens einen Dickdrahtes weisen die Leiterplatte oder das Substrat wenigstens eine erste Bondfläche und das zumindest eine ungehäuste elektronische Bauteil wenigstens eine zweite Bondfläche auf. Die Bondflächen stellen elektrisch leitende Kontaktflächen dar, die mittels bekannter Metallisierungsverfahren aufgebracht werden können. Auf der Leiterplatte ist die Bondfläche elektrisch leitend mit zumindest einer Leiterbahn verbunden.For fastening the at least one thick wire, the printed circuit board or the substrate has at least one first bonding surface and the at least one unhoused electronic component has at least one second bonding surface. The bonding surfaces represent electrically conductive contact surfaces which can be applied by means of known metallization processes. On the circuit board, the bonding surface is electrically conductively connected to at least one conductor track.

Gemäß einer Ausgestaltung der Erfindung ist die wenigstens eine zweite Bondfläche auf dem zumindest einen ungehäusten elektronischen Bauteil gebildet. Beispielsweise sind die Bare-Die-Bauteile (ungehäustes Bauteil), insbesondere Leistungshalbleiter, oberflächenseitig metallisiert, beispielsweise Aluminium oder mit einer Aluminiumlegierung metallisiert. Daraus ergibt sich der Vorteil einer Monometallverbindung zwischen dem Bonddraht und dem ungehäusten elektronischen Bauteil, wie bereits zuvor erwähnt. Zusätzlich dazu werden Materialkosten eingespart, wobei die wenigstens eine zweite Bondfläche keine weitere Metallisierung, insbesondere eine sogenannte Over-Pad-Metallisierung, z. B. aus Nickel/Palladium/Gold (NiPdAu), benötigt. Eine Standardmetallisierung der Bondflächen, beispielsweise aus Aluminium, ist kostensparend und ausreichend.According to one embodiment of the invention, the at least one second bonding surface is formed on the at least one unhoused electronic component. For example, the bare-die components (unhoused component), in particular power semiconductors, are metallized on the surface side, for example aluminum or metallized with an aluminum alloy. This results in the advantage of a monometallic connection between the bond wire and the unpackaged electronic component, as previously mentioned. In addition, material costs are saved, wherein the at least one second bonding surface no further metallization, in particular a so-called over-pad metallization, z. B. of nickel / palladium / gold (NiPdAu) needed. A standard metallization of the bonding surfaces, for example made of aluminum, is cost-saving and sufficient.

Gemäß einer weiteren Ausgestaltung der Erfindung ist die wenigstens eine erste Bondfläche auf der Leiterplatte aus Gold gebildet. Zwar entsteht hierbei eine Bimetallverbindung, allerdings ist eine Schichtdicke der Bondfläche derart gering (im Nanometerbereich), dass eine Zuverlässigkeit der elektrischen Verbindung erhalten bleibt.According to a further embodiment of the invention, the at least one first bonding surface on the printed circuit board is formed of gold. Although this results in a bimetallic connection, however, a layer thickness of the bonding surface is so small (in the nanometer range) that a reliability of the electrical connection is maintained.

Eine Weiterbildung sieht vor, dass das eingehäuste elektronische Bauteil als ein eingehäustes integriertes elektronisches Bauelement ausgebildet ist. Beispielsweise ist das eingehäuste elektronische Bauteil ein integrierter Schaltkreis, der eine Kombination von zahlreichen miteinander elektrisch verbundenen elektronischen Halbleiterbauelementen, wie Transistoren, Dioden und/oder weiteren aktiven und/oder passiven Bauelementen, wie Kondensatoren, Widerstände, umfasst.A development provides that the housed electronic component is designed as a housed integrated electronic component. For example, the packaged electronic component is an integrated circuit that includes a combination of numerous electrically interconnected electronic semiconductor devices, such as transistors, diodes, and / or other active and / or passive devices, such as capacitors, resistors.

Das ungehäuste elektronische Bauteil ist beispielsweise als ein ungehäustes Halbleiterbauelement, insbesondere als eine Diode, ein Transistor, ausgebildet.The unhoused electronic component is designed, for example, as an unhoused semiconductor component, in particular as a diode, a transistor.

Gemäß einer weiteren Ausgestaltung ist das zumindest eine elektronische Bauteil, insbesondere das ungehäuste elektronische Bauteil mittels eines Klebstoffs, insbesondere eines elektrisch leitenden Klebstoffs, stoffschlüssig auf der Leiterplatte fixiert. According to a further embodiment, the at least one electronic component, in particular the unhoused electronic component, is firmly bonded to the printed circuit board by means of an adhesive, in particular an electrically conductive adhesive.

Darüber hinaus umfasst die Leiterplatte gemäß einem Ausführungsbeispiel einen Trägerkörper, der aus einer Mehrzahl von Schichten, insbesondere Substratschichten, gebildet ist. Die Schichten, insbesondere die Substratschichten, sind beispielsweise Glasfasermatten, die zur adhäsiven Verbindung untereinander mit einem Harz vorimprägniert sind.In addition, the printed circuit board according to one embodiment comprises a carrier body, which is formed from a plurality of layers, in particular substrate layers. The layers, in particular the substrate layers, are, for example, glass fiber mats which are preimpregnated with a resin for adhesive bonding to one another.

Die wenigstens eine erste Bondfläche ist dabei auf einer ersten Schicht der Leiterplatte, insbesondere des Trägerkörpers, angeordnet, wobei die erste Schicht eine Oberflächenseite der Leiterplatte bildet. Zwischen den Schichten können elektrisch leitende Innenlagen angeordnet sein, die beispielsweise analog zu den Leiterbahnen aus Kupfer gebildet sind. Eine elektrische Verbindung der Innenlagen unterschiedlicher Schichten erfolgt z. B. mittels Durchkontaktierungen (auch als „Vias“ oder „Mikrovias“ bekannt).The at least one first bonding surface is arranged on a first layer of the printed circuit board, in particular of the carrier body, wherein the first layer forms a surface side of the printed circuit board. Between the layers electrically conductive inner layers may be arranged, which are formed, for example, analogous to the conductor tracks made of copper. An electrical connection of the inner layers of different layers is z. By means of vias (also known as "vias" or "microvias").

Bei einem Verfahren zur Herstellung der beschriebenen elektronischen Komponente werden die Leiterplatte mit der zumindest einen Leiterbahn und die zumindest zwei elektronischen Bauteile bereitgestellt, wobei zumindest eines der elektronischen Bauteile eingehäust ist und mittels mindestens einer Verbindung, wie einem freien Kontaktende oder freien Ende eines integrierten Stanzgitters oder eines anderen geeigneten Kontaktelementes, insbesondere eines Dünndrahts elektrisch leitend mit einer Anschlussstelle der Leiterplatte verbunden, insbesondere gelötet, wird und zumindest ein weiteres elektronisches Bauteil ungehäust ist und mittels mindestens eines Dickdrahts elektrisch leitend mit der Leiterplatte verbunden, insbesondere kalt verschweißt, wird.In a method for producing the described electronic component, the printed circuit board is provided with the at least one printed circuit and the at least two electronic components, wherein at least one of the electronic components is housed and by means of at least one connection, such as a free contact end or free end of an integrated stamped grid another suitable contact element, in particular a thin wire electrically conductively connected to a connection point of the circuit board, in particular soldered, and at least one further electronic component is unhoused and electrically connected by means of at least one thick wire to the circuit board, in particular cold welded, is.

Die oben beschriebenen Eigenschaften, Merkmale und Vorteile dieser Erfindung sowie die Art und Weise, wie diese erreicht werden, werden klarer und deutlicher verständlich im Zusammenhang mit der folgenden Beschreibung von Ausführungsbeispielen, die im Zusammenhang mit der Zeichnung näher erläutert werden. Dabei zeigt die einzige:

  • FIG schematisch eine Schnittdarstellung eines erfindungsgemäßen Ausführungsbeispiels einer elektronischen Komponente.
The above-described characteristics, features, and advantages of this invention, as well as the manner in which they will be achieved, will become clearer and more clearly understood in connection with the following description of exemplary embodiments which will be described in connection with the drawings. The only one shows:
  • Schematically shows a sectional view of an embodiment of an electronic component according to the invention.

Die einzige Figur zeigt ein erfindungsgemäßes Ausführungsbeispiel einer elektronischen Komponente E in einer schematischen Schnittdarstellung.The single FIGURE shows an inventive embodiment of an electronic component E in a schematic sectional view.

Die elektronische Komponente E ist beispielsweise zur Anordnung in einem Steuergerät für ein Kraftfahrzeug, z. B. in einem Getriebesteuergerät, vorgesehen und umfasst eine Leiterplatte 1 als Schaltungsträger oder Substrat.The electronic component E is for example for arrangement in a control unit for a motor vehicle, for. B. in a transmission control unit, and includes a printed circuit board 1 as a circuit carrier or substrate.

Auf diesem Schaltungsträger ist eine Mehrzahl elektronischer Bauteile 2.1 bis 2.4 angeordnet.On this circuit board is a plurality of electronic components 2.1 to 2.4 arranged.

Die Leiterplatte 1 umfasst einen mehrschichtigen Trägerkörper, welcher eine Mehrzahl von Schichten S1 bis Sn aufweist, die in Richtung einer Hochachse Z übereinander angeordnet sind. Beispielsweise ist jede Schicht S1 bis Sn aus einer Glasfasermatte gebildet, die zur adhäsiven Verbindung mit einer angrenzenden Glasfasermatte mit einem Harz vorimprägniert ist. Derartige Glasfasermatten sind auch als Prepregs bekannt.The circuit board 1 comprises a multilayer carrier body, which has a plurality of layers S1 to Sn, which are arranged one above the other in the direction of a vertical axis Z. For example, each layer S1 to Sn is formed from a fiberglass mat that is pre-impregnated with a resin for adhesive bonding to an adjacent fiberglass mat. Such fiberglass mats are also known as prepregs.

Auf einer oberen, ersten Schicht S1 ist mindestens eine elektrisch leitende Leiterbahn 1.1, welche alternativ auch mehrere Leiterbahnen 1.1 repräsentieren kann, angeordnet. Die Leiterbahn 1.1 ist beispielsweise aus Kupfer gebildet. Die Leiterbahn 1.1 ist beispielsweise durch Ätzprozesse, wie z. B. Kupferätzung, herstellbar.On an upper, first layer S1 is at least one electrically conductive trace 1.1 , which alternatively also several tracks 1.1 can represent, arranged. The conductor track 1.1 is formed of copper, for example. The conductor track 1.1 is for example by etching processes, such. B. copper etching, produced.

Weiterhin sind in Schichten S2 bis Sn unterhalb der ersten Schicht S1 elektrisch leitende Innenlagen 1.2 angeordnet, die vorzugsweise analog zu den Leiterbahnen 1.1 aus Kupfer gebildet sind und die einer elektrisch leitenden Verbindung der elektronischen Komponente E mit weiteren nicht gezeigten Komponenten und/oder einer elektrischen Verbindung einer auf der Leiterplatte 1 integrierten Schaltung dienen.Furthermore, layers S1 to Sn below the first layer S1 have electrically conductive inner layers 1.2 arranged, preferably analogous to the conductor tracks 1.1 are formed of copper and that of an electrically conductive connection of the electronic component E with other components not shown and / or an electrical connection on the circuit board 1 serve integrated circuit.

Die Innenlagen 1.2 sind mittels Durchkontaktierungen 1.3 elektrisch und/oder thermisch leitend miteinander verbunden. Die unterhalb des/der elektronischen Bauteils/e 2.1 bis 2.4 angeordnete Leiterbahn 1.1, welche alternativ auch mehrere Leiterbahnen 1.1 repräsentieren kann, ist mittels einer Mehrzahl von Durchkontaktierungen 1.3 mit mindestens einer der Innenlage 1.2 und/oder mit der Leiterbahn 1.1 auf der oberen, ersten Schicht S1 elektrisch und thermisch leitend verbunden.The inner layers 1.2 are by means of vias 1.3 connected electrically and / or thermally conductive. The arranged below the / of the electronic component / e 2.1 to 2.4 trace 1.1 , which alternatively also several tracks 1.1 can represent is by means of a plurality of vias 1.3 with at least one of the inner layer 1.2 and / or with the conductor track 1.1 electrically and thermally conductively connected on the upper, first layer S1.

Im vorliegenden Ausführungsbeispiel sind die Durchkontaktierungen 1.3 als Bohrungen im Substrat der Leiterplatte 1 ausgebildet, die jeweils eine elektrisch leitende Innenbeschichtung aufweisen. In the present embodiment, the vias 1.3 as holes in the substrate of the circuit board 1 formed, each having an electrically conductive inner coating.

Die auf der ersten Schicht S1 angeordneten Leiterbahnen 1.1 dienen der elektrischen Verbindung der gezeigten elektronischen Bauteile 2.1 bis 2.4.The conductor tracks arranged on the first layer S1 1.1 serve the electrical connection of the electronic components shown 2.1 to 2.4 ,

Zumindest eines der elektronischen Bauteile 2.1 ist eingehäust und mittels mindestens eines nach außen geführten Dünndrahtes oder einer Verbindung 3.1, insbesondere einer nach außen geführten Kontaktierung, zum Beispiel Aluminium-Dünndrahts oder eines Metallbandes, insbesondere eines Kupfer- oder Kupferlegierungsbandes (leadframe) elektrisch leitend mit einer Anschlussstelle der Leiterplatte 1 verbunden, insbesondere gelötet. Das eingehäuste elektronische Bauteil 2.1 stellt im vorliegenden Ausführungsbeispiel ein eingehäustes, integriertes elektronisches Bauelement, beispielsweise eine Halbleiterkomponente, z. B. ein Mikrochip, dar.At least one of the electronic components 2.1 is housed and by means of at least one guided outward thin wire or a compound 3.1 , In particular, a guided outward contact, for example aluminum thin wire or a metal strip, in particular a copper or copper alloy strip (leadframe) electrically conductive with a connection point of the circuit board 1 connected, in particular soldered. The housed electronic component 2.1 represents in the present embodiment a gepäustes, integrated electronic component, such as a semiconductor component, for. As a microchip, is.

Zumindest ein weiteres der elektronischen Bauteile 2.2 ist ungehäust und mittels mindestens eines Dickdrahts 3.2 elektrisch leitend mit der Leiterplatte 1 verbunden, insbesondere kalt verschweißt. Das ungehäuste elektronische Bauteil 2.2 (auch Bare-Die-Komponente oder Nacktelement/-chip genannt) ist beispielsweise als ein ungehäustes Halbleiterbauelement, insbesondere als eine Diode, ein Transistor, eine integrierte Schaltung, ausgebildet.At least one more of the electronic components 2.2 is unhoused and by means of at least one thick wire 3.2 electrically conductive with the circuit board 1 connected, in particular cold-welded. The unhoused electronic component 2.2 (Also called bare-die component or nude element / chip) is, for example, as an unhoused semiconductor device, in particular as a diode, a transistor, an integrated circuit formed.

Das gehäuste elektronische Bauteil 2.1 ist auf einer der Leiterbahnen 1.1 angeordnet und mit dieser stoffschlüssig und elektrisch leitend verbunden, z. B. adhäsiv mittels eines elektrisch leitfähigen Klebstoffs K.The housed electronic component 2.1 is on one of the tracks 1.1 arranged and connected to this cohesively and electrically conductive, z. B. adhesively by means of an electrically conductive adhesive K.

Ebenso ist das ungehäuste elektronische Bauteil 2.2 auf einer der Leiterbahnen 1.1 angeordnet und mit dieser stoffschlüssig und elektrisch leitend verbunden, z. B. adhäsiv mittels eines elektrisch leitfähigen Klebstoffs K.Likewise, the unhoused electronic component 2.2 on one of the tracks 1.1 arranged and connected to this cohesively and electrically conductive, z. B. adhesively by means of an electrically conductive adhesive K.

Das gehäuste elektronische Bauteil 2.1 ist mittels zumindest einer Verbindung 3.1 elektrisch leitend mit der Leiterplatte 1 verbunden, insbesondere gelötet. Je nach Art und Aufbau des gehäusten elektronischen Bauteils 2.1 weist dieses ein oder mehrere aus dem gehäusten elektronischen Bauteil 2.1 herausragende Kontaktierungen oder Verbindungen 3.1 oder andere geeignete herausragende Kontaktierungen, wie Metallbänder, auf, die mit der Leiterbahn 1.1 der Leiterplatte 1 elektrisch leitend verbunden, insbesondere gelötet werden.The housed electronic component 2.1 is by means of at least one connection 3.1 electrically conductive with the circuit board 1 connected, in particular soldered. Depending on the type and structure of the housed electronic component 2.1 this one or more of the housed electronic component 2.1 outstanding contacts or connections 3.1 or other suitable protruding contacts, such as metal bands, on top of the track 1.1 the circuit board 1 electrically connected, in particular soldered.

Das ungehäuste elektronische Bauteil 2.2 ist mittels eines Dickdrahtes 3.2 elektrisch leitend mit einer auf der Leiterplatte 1 ausgebildeten ersten Bondfläche 1.4 (auch als Bondpad bekannt) verbunden. Dabei ist die erste Bondfläche 1.4 elektrisch leitend mit einer der Leiterbahnen 1.1 verbunden bzw. auf diese aufgebracht.The unhoused electronic component 2.2 is by means of a thick wire 3.2 electrically conductive with a on the circuit board 1 formed first bonding surface 1.4 (also known as Bondpad) connected. Here is the first bonding surface 1.4 electrically conductive with one of the conductor tracks 1.1 connected or applied to this.

Das ungehäuste elektronische Bauteil 2.2 weist zusätzlich mindestens eine zweite Bondfläche 2.2.1 zur Kontaktierung des Bond-Dickdrahtes 3.2 am ungehäusten elektronischen Bauteil 2.2 auf. Die zweite Bondfläche 2.2.1 ist beispielsweise aus Aluminium oder einer Aluminiumlegierung gebildet, so dass zwischen den Dickdrähten 3.2 aus Aluminium und den zweiten Bondflächen 2.2.1 jeweils eine Monometallverbindung entsteht. Dabei kann das ungehäuste elektronische Bauteil 2.2 mittels mehrerer Dickdrähte 3.2 mit einer oder mehrerer der Leiterbahnen 1.1 elektrisch leitend verbunden sein.The unhoused electronic component 2.2 additionally has at least one second bonding surface 2.2.1 for contacting the bonding thick wire 3.2 on the unhoused electronic component 2.2 on. The second bond area 2.2.1 For example, is formed of aluminum or an aluminum alloy, so that between the thick wires 3.2 made of aluminum and the second bonding surfaces 2.2.1 each produces a monometallic compound. This can be the unhoused electronic component 2.2 by means of several thick wires 3.2 with one or more of the tracks 1.1 be electrically connected.

Hierbei ist die Verbindung zwischen den Dickdrähten 3.2 und den zweiten Bondflächen 2.2.1 besonders robust und zuverlässig ausgebildet, wobei intermetallische Phasen, Korrosionsvorgänge und der sogenannte Kirkendall-Effekt gegenüber Bimetallverbindungen zuverlässig verhindert werden können.Here is the connection between the thick wires 3.2 and the second bonding surfaces 2.2.1 designed particularly robust and reliable, with intermetallic phases, corrosion processes and the so-called Kirkendall effect against bimetallic compounds can be reliably prevented.

Weiterhin ermöglicht eine derartige Monometallverbindung eine Kostenreduzierung bei der Herstellung der elektronischen Komponente E, da hierbei keine kostenintensive, zusätzliche Metallisierungsschicht erforderlich ist, wie es beispielsweise bei Gold-Bonddrähten und Aluminium-Bondflächen der Fall ist.Furthermore, such a monometallic compound enables a cost reduction in the production of the electronic component E, since in this case no cost-intensive, additional metallization layer is required, as is the case, for example, with gold bonding wires and aluminum bonding surfaces.

Die ersten Bondflächen 1.4 auf der Leiterplatte 1 sind beispielsweise aus Gold mit einer Schichtdicke im Nanometerbereich ausgebildet. Hierbei ist zwar zwischen dem Dickdraht 3.2 und der ersten Bondfläche 1.4 aus Gold eine Bimetallverbindung hergestellt, allerdings bleibt eine Zuverlässigkeit der Verbindung aufgrund der geringen Schichtdicke des Golds erhalten.The first bonding surfaces 1.4 on the circuit board 1 are formed, for example, of gold with a layer thickness in the nanometer range. Although this is between the thick wire 3.2 and the first bonding surface 1.4 made of gold, a bimetallic compound, however, a reliability of the compound is retained due to the small layer thickness of the gold.

Zusätzlich ist die Leiterplatte 1 mit weiteren elektronischen Bauteilen 2.3 bis 2.4 bestückt. Beispielsweise ist das elektronische Bauteil 2.3 ein aktives Halbleiterbauelement, insbesondere eine Diode oder ein Transistor. Alternativ oder zusätzlich kann das elektronische Bauteil 2.4 ein passives Halbleiterbauelement, wie ein Widerstand, sein.In addition, the circuit board 1 with other electronic components 2.3 to 2.4 stocked. For example, the electronic component 2.3 an active semiconductor device, in particular a diode or a transistor. Alternatively or additionally, the electronic component 2.4 a passive semiconductor device, such as a resistor.

Die elektronischen Bauteile 2.1 bis 2.4 sind mittels Lottechnologie direkt und/oder indirekt über die ersten Bondflächen 1.4 mit der oder den Leiterbahnen 1.1 elektrisch leitend verbunden. Alternativ können die elektronischen Bauteile 2.1 bis 2.4 mittels anderer Verbindungstechniken, wie mittels eines elektrisch leitfähigen Klebers oder Lotmittels L oder mittels Sintern, mit der Leiterplatte 1, insbesondere mit der oder den Leiterbahnen 1.1 stoffschlüssig und elektrisch leitend verbunden sein.The electronic components 2.1 to 2.4 are directly and / or indirectly via the first bonding surfaces by means of solder technology 1.4 with the conductor or tracks 1.1 electrically connected. Alternatively, the electronic components 2.1 to 2.4 by means of other bonding techniques, such as by means of an electrically conductive adhesive or solder L or by means of sintering, with the circuit board 1 , in particular with the conductor or tracks 1.1 be cohesively connected and electrically conductive.

Zur Verbindung der Bonddrähte, insbesondere der Dickdrähte 3.2 auf der Leiterplatte 1 kommen zwei verschiedene Drahtbondprozesse zum Einsatz. Dabei werden die Dick- (Bond) drähte 3.2 auf der ersten Bondfläche 1.4 zur Verbindung der Leiterplatte 1 mit dem betreffenden ungehäusten elektronischen Bauteil 2.2 aufgebracht. Beispielsweise wird ein Bonddraht, z. B. ein Dickdraht mit einem Drahtdurchmesser von 125-500 µm aus Aluminium in einem sogenannten Wedge-Wedge-Verfahren aufgebracht. Bei Halbleiter-Leistungskomponenten wie bei Metall-Oxid-Halbleiter-Feldeffekttransistoren (= MOSFET) werden Dickdrähte mit einem Drahtdurchmesser größer als 200 µm verwendet, um hohe Ströme zu transportieren.For connecting the bonding wires, in particular the thick wires 3.2 on the circuit board 1 Two different wire bonding processes are used. At this time, the thick (bonding) wires 3.2 become on the first bonding surface 1.4 for connecting the circuit board 1 with the relevant unhoused electronic component 2.2 applied. For example, a bonding wire, for. B. a thick wire with a wire diameter of 125-500 microns of aluminum applied in a so-called wedge-wedge process. For semiconductor power components such as metal oxide semiconductor field effect transistors (= MOSFET), thick wires with a wire diameter larger than 200 μm are used to carry high currents.

Für kleine Ströme bzw. Signale wird ein Bonddraht, insbesondere ein Dünndraht mit einem Drahtdurchmesser von 20-50 µm aus Gold aufgebracht, beispielsweise bei Logikbauteilen wie integrierten Schaltungen und/oder bei Halbleitern wie Dioden, verwendet.For small currents or signals, a bonding wire, in particular a thin wire with a wire diameter of 20-50 μm made of gold, is used, for example in logic components such as integrated circuits and / or in semiconductors such as diodes.

Die in diesem Ausführungsbeispiel beschriebene elektronische Komponente E kann in sämtlichen Bereichen mit hohen Temperatur- und/oder Bauraumanforderungen und/oder hoher Korrosionsgefahr eingesetzt werden.The electronic component E described in this embodiment can be used in all areas with high temperature and / or space requirements and / or high risk of corrosion.

BezugszeichenlisteLIST OF REFERENCE NUMBERS

11 Leiterplattecircuit board 1.11.1 Leiterbahnconductor path 1.21.2 innere Leiterbahninner trace 1.31.3 Durchkontaktierungvia 1.41.4 erste Bondflächefirst bonding surface 2.1 bis 2.42.1 to 2.4 elektronisches Bauteilelectronic component 2.12.1 gehäustes elektronisches Bauteilhoused electronic component 2.22.2 ungehäustes elektronisches BauteilUnhooked electronic component 2.2.12.2.1 zweite Bondflächesecond bond area 2.32.3 HalbleiterbauelementSemiconductor device 2.42.4 weiteres Halbleiterbauelementanother semiconductor device 3.13.1 Verbindungconnection 3.23.2 DickdrahtHeavy wire Ee Elektronische KomponenteElectronic component KK Klebstoffadhesive LL LotmittelSolder S1 bis SnS1 to Sn Schichtenlayers ZZ Hochachsevertical axis

Claims (10)

Elektronische Komponente (E), umfassend - eine Leiterplatte (1) mit o zumindest einer elektrischen Leiterbahn (1.1) und o zumindest zwei elektronischen Bauteilen (2.1 bis 2.4), wobei zumindest eines der elektronischen Bauteile (2.1) eingehäust ist und mittels mindestens einer Verbindung (3.1) elektrisch leitend mit einer Anschlussstelle der Leiterplatte (1) verbunden, insbesondere gelötet, ist und wobei zumindest ein weiteres elektronisches Bauteil (2.2) ungehäust ist und mittels mindestens eines Dickdrahts (3.2) elektrisch leitend mit einer Anschlussstelle der Leiterplatte (1) verbunden, insbesondere kalt verschweißt, ist.Electronic component (E), comprising - a printed circuit board (1) with o at least one electrical conductor track (1.1) and o at least two electronic components (2.1 to 2.4), wherein at least one of the electronic components (2.1) is housed and electrically connected by means of at least one connection (3.1) to a connection point of the printed circuit board (1), in particular soldered, and wherein at least one further electronic component (2.2) is unhoused and by means of at least of a thick wire (3.2) electrically connected to a connection point of the printed circuit board (1), in particular cold welded, is. Elektronische Komponente (E) nach Anspruch 1, wobei ein Ende der mindestens einen Verbindung (3.1) mittels Lottechnologie elektrisch leitend mit einer Anschlussstelle der Leiterplatte (1) verbunden und fixiert ist.Electronic component (E) after Claim 1 , wherein one end of the at least one connection (3.1) by means of solder technology is electrically connected to a connection point of the printed circuit board (1) and fixed. Elektronische Komponente (E) nach Anspruch 1, wobei ein Ende des mindestens einen Dickdrahtes (3.2) elektrisch leitend mit einer Anschlussstelle der Leiterplatte (1) kalt verschweißt und fixiert ist.Electronic component (E) after Claim 1 in which one end of the at least one thick wire (3.2) is cold-welded and fixed in an electrically conductive manner to a connection point of the printed circuit board (1). Elektronische Komponente (E) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass zur Befestigung des mindestens einen Dickdrahtes (3.2) die Leiterplatte (1) wenigstens eine erste Bondfläche (1.4) und das zumindest eine ungehäuste elektronische Bauteil (2.2) wenigstens eine zweite Bondfläche (2.2.1) aufweisen.Electronic component (E) according to one of the preceding claims, characterized in that for fastening the at least one thick wire (3.2) the printed circuit board (1) at least a first bonding surface (1.4) and the at least one unhoused electronic component (2.2) at least a second bonding surface (2.2.1). Elektronische Komponente (E) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das eingehäuste elektronische Bauteil (2.1) als ein eingehäustes integriertes elektronisches Bauelement ausgebildet ist.Electronic component (E) according to one of the preceding claims, characterized in that the housed electronic component (2.1) is designed as a housed integrated electronic component. Elektronische Komponente (E) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das ungehäuste elektronische Bauteil (2.2) als ein ungehäustes Halbleiterbauelement ausgebildet ist.Electronic component (E) according to one of the preceding claims, characterized in that the unhoused electronic component (2.2) is designed as an unhoused semiconductor component. Elektronische Komponente (E) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das ungehäuste elektronische Bauteil (2.2) mittels eines elektrisch leitfähigen Klebstoffs (K) oder eines elektrisch leitfähigen Lotmittels (L) auf der Leiterplatte (1) befestigt ist.Electronic component (E) according to one of the preceding claims, characterized in that the unhoused electronic component (2.2) by means of an electrically conductive adhesive (K) or an electrically conductive solder (L) on the circuit board (1) is attached. Elektronische Komponente (E) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass die Leiterplatte (1) einen Trägerkörper umfasst, der aus einer Mehrzahl von Schichten (Sl bis Sn) gebildet ist.Electronic component (E) according to one of the preceding claims, characterized in that the printed circuit board (1) comprises a carrier body which is formed from a plurality of layers (Sl to Sn). Elektronische Komponente (E) nach Anspruch 5, dadurch gekennzeichnet, dass die wenigstens eine erste Bondfläche (1.4) der Leiterplatte (1) auf einer ersten Schicht (Sl) der Leiterplatte (1) angeordnet ist, wobei die erste Schicht (Sl) eine dem zumindest einen elektronischen Bauteil (2.1 bis 2.4) zugewandte Oberflächenseite der Leiterplatte (1) bildet.Electronic component (E) after Claim 5 , characterized in that the at least one first bonding surface (1.4) of the printed circuit board (1) is arranged on a first layer (S1) of the printed circuit board (1), the first layer (S1) forming an at least one electronic component (2.1 to 2.4 ) facing surface side of the printed circuit board (1). Verfahren zur Herstellung einer elektronischen Komponente (E) nach einem der vorhergehenden Ansprüche, wobei - eine Leiterplatte (1) mit o zumindest einer elektrischen Leiterbahn (1.1) und o zumindest zwei elektronischen Bauteilen (2.1 bis 2.4) bereitgestellt wird, und wobei - zumindest eines der elektronischen Bauteile (2.1) eingehäust ist und mittels mindestens einer Verbindung (3.1) elektrisch leitend einer Anschlussstelle mit der Leiterplatte (1) verbunden, insbesondere gelötet wird und - zumindest ein weiteres elektronisches Bauteil (2.2) ungehäust ist und mittels mindestens eines Dickdrahts (3.2) elektrisch leitend mit der Leiterplatte (1) verbunden, insbesondere kalt verschweißt wird.A method for producing an electronic component (E) according to any one of the preceding claims, wherein - A circuit board (1) with o at least one electrical conductor track (1.1) and o at least two electronic components (2.1 to 2.4) is provided, and wherein - At least one of the electronic components (2.1) is housed and by means of at least one connection (3.1) electrically connected to a connection point with the circuit board (1), in particular soldered and - At least one further electronic component (2.2) is unhoused and by means of at least one thick wire (3.2) electrically connected to the circuit board (1), in particular cold welded.
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DE102022206300A1 (en) 2022-06-23 2023-07-06 Zf Friedrichshafen Ag Electronic device, method of assembling an electronic device and method of connecting an electronic device to a circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022206300A1 (en) 2022-06-23 2023-07-06 Zf Friedrichshafen Ag Electronic device, method of assembling an electronic device and method of connecting an electronic device to a circuit board

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