DE102007039536B4 - Multiple bonding wire composite and simultaneous bonding - Google Patents

Multiple bonding wire composite and simultaneous bonding Download PDF

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Publication number
DE102007039536B4
DE102007039536B4 DE102007039536A DE102007039536A DE102007039536B4 DE 102007039536 B4 DE102007039536 B4 DE 102007039536B4 DE 102007039536 A DE102007039536 A DE 102007039536A DE 102007039536 A DE102007039536 A DE 102007039536A DE 102007039536 B4 DE102007039536 B4 DE 102007039536B4
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Prior art keywords
bonding
wires
composite
insulation
bonding wire
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DE102007039536A
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German (de)
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DE102007039536A1 (en
Inventor
Bianca Bonifer
Peter Prenosil
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Heraeus Deutschland GmbH and Co KG
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WC Heraus GmbH and Co KG
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2924/20751—Diameter ranges larger or equal to 10 microns less than 20 microns
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
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    • H05K2203/049—Wire bonding

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Abstract

Verbund, enthaltend eine Isolierung und einen Bonddraht, dadurch gekennzeichnet, dass die Isolierung eine den Bonddraht teilweise einbettende Rinne aufweist, so dass eine Seite des Verbunds aus Isolation besteht und eine Seite des Verbunds eine freiliegende Bonddrahtoberfläche aufweist.A composite comprising an insulation and a bonding wire, characterized in that the insulation comprises a gutter partially embedding the bonding wire such that one side of the composite consists of insulation and one side of the composite has an exposed bonding wire surface.

Figure 00000001
Figure 00000001

Description

Die vorliegende Erfindung betrifft Bonddrähte, insbesondere als Mehrfach-Bonddrahtverbund (Multi-Wire-Bonddrähte) und ein rationalisiertes Bonden, insbesondere gleichzeitiges Bonden mehrerer Bonddrähte (Multi-Wire-Bonden = MWB).The The present invention relates to bonding wires, in particular as a multi-bonding wire bond (multi-wire bonding wires) and a rationalized bonding, in particular simultaneous bonding several bonding wires (Multi-wire bonding = MWB).

Bonddrähte sind zumindest dafür geeignet, elektronische Kleinstbauteile miteinander oder an Leiterplatten elektrisch anzuschließen. Bonddrähte werden in einer Länge von bis zu einigen 100 Metern erzeugt, um in Stücke von wenigen Millimetern zerkleinert zu werden. Der minimale Durchmesser wird durch die mechanischen Eigenschaften vorgegeben. Als Feinstdraht wird im Sinne der vorliegenden Erfindung ein Draht mit einem Durchmesser zwischen 1 und 60 μm bezeichnet.Bonding wires are at least for that suitable, electronic miniature components with each other or on printed circuit boards to connect electrically. Bonding wires are in one length produced up to several 100 meters to pieces of a few millimeters to be crushed. The minimum diameter is determined by the mechanical Properties specified. As ultrafine wire is in the sense of the present Invention referred to a wire with a diameter between 1 and 60 microns.

Im Bereich der Leistungselektronik werden derzeit mehrere Dickdrähte mit einem Durchmesser von 100 bis 600 μm parallel auf dasselbe Pad gesetzt, um den benötigen Leiterquerschnitt zu erreichen.in the The field of power electronics are currently using several thick wires a diameter of 100 to 600 μm parallel to the same pad set to need the To achieve conductor cross section.

US 5,127,570 A beschreibt eine flexible Leiterplatte und ein Verfahren zum Bonden. Die flexible Leiterplatte weist metallisierte Kontaktbereiche auf, deren Oberfläche aus Gold besteht. Eine anfänglich aufgebrachte Schutzschicht wird im Bereich der Kontaktbereiche durch einen Laser entfernt. Mittels eines Bondverfahrens wird eine Verbindungsleitung mit dem Kontaktbereich verbunden. US 5,127,570 A describes a flexible printed circuit board and a method for bonding. The flexible printed circuit board has metallized contact areas whose surface consists of gold. An initially applied protective layer is removed in the region of the contact areas by a laser. By means of a bonding method, a connecting line is connected to the contact area.

Es besteht ein Bedarf, mehrere voneinander unabhängige, gegeneinander isolierte Verbindungen zu erstellen, sowie nach schnelleren Bondverfahren.It there is a need, several mutually independent, mutually isolated Create connections as well as faster bonding methods.

Ein weiterer Bedarf besteht in der Reduzierung der Dimensionen von Feinstdrähten, deren Abstand zueinander und der Anschlussflächen sowie einer Stabilitätserhöhung.One There is a further need to reduce the dimensions of ultra-fine wires whose Distance to each other and the pads and a stability increase.

Erfindungsgemäß wird ein Verbund bereitgestellt, der auf einer Seite eine Isolation aufweist und auf der anderen Seite den blanken, sich längs erstreckenden Bonddraht.According to the invention is a Composite provided with insulation on one side and on the other side the bare, longitudinally extending bonding wire.

Dies ermöglicht es, den Bonddraht-Durchmesser von Feinstdrähten weiter zu reduzieren, indem die mechanische Stabilität durch die Isolierung erhöht wird.This allows it to further reduce the bond wire diameter of ultra-fine wires, by the mechanical stability increased by the insulation becomes.

Die Fixierung der Bonddrähte, insbesondere Feinstdrähte an der Isolierung ermöglicht es, den Abstand zwischen den Bonddrähten genau zu definieren und damit den Abstand zu minimieren. Sowohl die dünneren Feinstdrähte als auch die geringere Beabstandung der Feinstdrähte zueinander ermöglichen wiederum die Anschlussflächen und deren Abstand zum Bauteil und damit das gesamte Bauteil zu verkleinern.The Fixation of the bonding wires, especially fine wires on the insulation allows to precisely define the distance between the bonding wires and to minimize the distance. Both the thinner fines than also allow the smaller spacing of the finest wires to each other turn the pads and to reduce their distance from the component and thus the entire component.

Erfindungsgemäß wird gleichzeitig ermöglicht, mehrere voneinander unabhängige, gegeneinander isolierte Verbindungen zu erstellen, insbesondere, ein Kreuzen der Verbund-Bonddrähte zu ermöglichen.According to the invention simultaneously allows several independent, to create mutually isolated connections, in particular, a crossing of the composite bonding wires to enable.

In erfinderischer Weiterbildung werden entsprechende Flachbandverbünde bereitgestellt, bei denen in Rinnen eines isolierenden Flachbandes die Bonddrähte, insbesondere Feinstdrähte, aus der Isolierung ragen. Der erfindungsgemäße Flachbandverbund ermöglicht ein simultanes Bonden, eine engere Anordnung der Bonddrähte und eine kleinere Dimensionierung der Pads und der darauf angebrachten Bondstellen. Die mechanische Belastung der Bondstelle wird durch die gleichmäßige Verteilung der Belastung über die parallelen Bondstellen verringert, so dass die Dimensionierung auch aus Gründen verringerter Belastbarkeit kleiner werden kann.In Inventive refinement corresponding flat band networks are provided, in which in gutters of an insulating ribbon the bonding wires, in particular ultrafine wires, protrude from the insulation. The flat ribbon assembly according to the invention allows a simultaneous bonding, a closer arrangement of the bonding wires and a smaller dimensioning of the pads and the bonding sites attached thereto. The mechanical stress of the bonding site is due to the even distribution the load over reduces the parallel bond points, allowing the sizing also for reasons reduced load capacity can become smaller.

Erfindungsgemäß lässt sich somit eine Vielzahl von Bonddrähten schneller, insbesondere simultan bonden, wobei gleichzeitig eine neue Qualität bei der Verkleinerung der Dimensionierung geschaffen wird. Diese Vorteile sind vor allem für die Massenproduktion von großer Bedeutung.According to the invention can be thus a variety of bonding wires faster, in particular simultaneous bonding, at the same time a new quality is created in the reduction of the dimensioning. These Benefits are mainly for the mass production of great Importance.

Erfindungsgemäß können Bonddrähte, insbesondere Dickdrähte, auf einer mit Klebstoff beschichteten Kunststofffolie nebeneinander angeordnet werden. Diese Technik wird für die Anordnung von 2 bis 10, insbesondere 3 bis 5 Bonddrähten bevorzugt. Bei dieser Technik sind die Drähte nur zu einem geringen Teil ihres Umfangs in der Klebeschicht, bzw. im Isolationsband eingebettet. Analog sind Bonddrähte auf eine Kunststofffolie laminierbar.According to the invention, bonding wires, in particular Thick wires on an adhesive-coated plastic film side by side to be ordered. This technique is used for the arrangement of 2 to 10, in particular 3 to 5 bonding wires prefers. In this technique, the wires are only a small part their extent in the adhesive layer, or embedded in the insulating tape. Analog are bonding wires Laminable on a plastic film.

In einer weiter bevorzugten Ausführung werden die Drähte in der Isolation eingeklemmt, insbesondere zu über 50% ihres Umfangs eingebettet, vorzugsweise zwischen 55 und 80%, insbesondere zu ungefähr 60 bis 70%.In a further preferred embodiment become the wires trapped in the insulation, in particular embedded over 50% of its circumference, preferably between 55 and 80%, in particular about 60 to 70%.

Im Folgenden wird die Erfindung mit Bezug auf die anliegenden Zeichnungen verdeutlicht.in the The invention will now be described with reference to the accompanying drawings clarified.

1 zeigt einen Flachbandverbund 10, bestehend aus einem bandförmigen Kunststoff-Folienprofil 11 mit einer Dicke von 5 bis 100 μm, insbesondere 20 bis 50 μm und mehreren Feinstdrähten 13 als Adern mit einem Durchmesser von 5 bis 25 μm, insbesondere 10 bis 20 μm, die nebeneinander mit einem Abstand angeordnet sind, der kleiner ist als der Drahtdurchmesser, insbesondere mit einem Abstand von 1 bis 10 μm. Bewährt haben sich Bonddrähte aus Aluminium, Kupfer oder Gold und Legierungen davon mit bis zu 30% Legierungsbestandteil oder Manteldrähte davon, insbesondere mit Gold- oder Aluminiummantel. 1 shows a flat band composite 10 , consisting of a band-shaped plastic film profile 11 with a thickness of 5 to 100 microns, especially 20 to 50 microns and several fine wires 13 as wires with a diameter of 5 to 25 microns, in particular 10 to 20 microns, which are arranged side by side with a distance which is smaller than the wire diameter, in particular with a distance of 1 to 10 microns. Bonding wires made of aluminum, copper or gold and alloys thereof with up to 30% alloy constituent or sheath have proven successful wires thereof, in particular with gold or aluminum sheath.

Für die Leistungselektronik haben sich Dickdrähte 24 mit einem Durchmesser von 100 bis 600 μm gemäß 2 bewährt. Die Bonddrähte eines Flachbandverbundes 10, 20 werden simultan auf demselben Pad befestigt, um den benötigten Leiterquerschnitt zu erreichen.For the power electronics have thick wires 24 with a diameter of 100 to 600 microns according to 2 proven. The bonding wires of a ribbon connection 10 . 20 are attached simultaneously on the same pad to achieve the required conductor cross-section.

Das simultane Bonden ist besonders zeiteffizient. Eine qualitative Verbesserung erfolgt durch die Verstärkung der Folie und die Lastenverteilung der einzelnen Bondstellen, wobei die einzelne Belastung dadurch abgesenkt ist. Die aus Gründen der Stromtragfähigkeit oder der Zuverlässigkeit parallel gebondeten Bonddrähte 13, 24 sind aufgrund der erfindungsgemäßen Lastenverteilung stabiler aufgebaut. Weiterhin wird ein kurzschlussfreies Überkreuzen der Bonddrähte 13, 24 ermöglicht, da durch die Isolierung eine Berührung zweier sich kreuzender Verbünde 10, 20 erfindungsgemäß erlaubt wird.Simultaneous bonding is particularly time-efficient. A qualitative improvement is made by the reinforcement of the film and the load distribution of the individual bonding sites, whereby the individual load is lowered thereby. The parallel bonded bonding wires for reasons of current carrying capacity or reliability 13 . 24 are more stable due to the load distribution according to the invention. Furthermore, a short-circuit-free crossing of the bonding wires 13 . 24 allows, as a result of the insulation, a touch of two intersecting networks 10 . 20 is allowed according to the invention.

Besonders vorteilhaft können gemäß 1 Feinstdrähte 13 angewendet werden, deren Durchmesser zu gering ist, um als isolierter Bonddraht ausreichende mechanische Stabilität zu gewährleisten. Durch die feste Anordnung der Feinstdrähte 13 an der Isolierung 11 kann der Abstand 15 zwischen den Feinstdrähten 13 gegenüber frei beweglichen Feinstdrähten 13 minimiert werden. Der geringere Feinstdrahtdurchmesser, verbunden mit dem verringerten Abstand 15 der Feinstdrähte 13 untereinander im Flachbandverbund 10, ermöglicht das Bonden auf kleineren Pads, weshalb wiederum die Bauteile kleiner dimensioniert werden können.Particularly advantageous according to 1 superfine 13 are used whose diameter is too small to ensure sufficient mechanical stability as an insulated bonding wire. Due to the fixed arrangement of the finest wires 13 on the insulation 11 can the distance 15 between the fine wires 13 opposite freely moving fine wires 13 be minimized. The smaller fines wire diameter associated with the reduced spacing 15 the finest wires 13 with each other in the flat band composite 10 , allows bonding on smaller pads, which in turn allows the components to be made smaller.

Für die IC-Technologie wird damit erfindungsgemäß einerseits simultanes Bonden und der damit verbundene Zeitgewinn ermöglicht und andererseits eine neue Qualität zur Verkleinerung der Bauteile bereitgestellt.For the IC technology is thus inventively one hand Simultaneous bonding and the associated time savings possible and on the other hand, a new quality provided for the reduction of the components.

Gemäß 1 sind die Feinstdrähte 13 in dem bandförmigen, isolierenden Profil 11 so eingebettet, dass sie mechanisch eingeklemmt sind. Hierzu muss die Einbettung mehr als 50% des Umfangs der Adern umfassen. Diese Einklemmtechnik ist auch für Dickdraht 24 geeignet.According to 1 are the finest wires 13 in the band-shaped, insulating profile 11 embedded so that they are mechanically clamped. For this, the embedding must cover more than 50% of the circumference of the wires. This pinching technique is also for thick wire 24 suitable.

Bei 55% Einbettung des Kabels ist bereits eine brauchbare Umklammerung gegeben, ohne dass dadurch die Bondfläche merklich eingeschränkt würde. Bei etwa 60% Einbettung ist bereits eine gute Klemmwirkung erzielbar, wobei die Breite der freien Oberfläche der Adern noch unmerklich verkleinert ist. Bei 65 bis 70% Einbettung wird zwar deren Stabilität weiter verbessert, jedoch steht dem bereits eine merkliche Abnahme der freien Breite der Adern gegenüber. Ab etwa 75 bis 80% Ummantelung wird die Abnahme der freien Oberfläche sowie der freien Breite der Adern besonders merklich.at 55% embedment of the cable is already a useful clasp without significantly limiting the bond area. at about 60% embedding a good clamping effect is already achievable the width of the free surface of the wires is still imperceptible is reduced. At 65 to 70% embedment, although their stability continues improved, but is already a marked decrease in the already free width of the wires opposite. From about 75 to 80% sheathing will decrease the free surface as well free width of wires especially noticeable.

2 zeigt einen Flachbandverbund 20, bei dem Dickdrähte 24 mit einem Durchmesser von 10 bis 600 μm, insbesondere 200 bis 300 μm an einer Klebefolie aus Kunststoff und Kleber befestigt sind. Geeignete Klebebänder haben eine Dicke von 20 bis 70 μm, insbesondere 25 bis 50 μm, wobei die Dicke der Kunststofffolie ungefähr um eine Größenordnung größer ist als die des Klebers. 2 shows a flat band composite 20 in which thick wires 24 with a diameter of 10 to 600 .mu.m, in particular 200 to 300 .mu.m are attached to a film of adhesive plastic and adhesive. Suitable adhesive tapes have a thickness of 20 to 70 .mu.m, in particular 25 to 50 microns, wherein the thickness of the plastic film is about an order of magnitude greater than that of the adhesive.

3 zeigt kreuzende Flachbandverbünde 10, 20, gemäß 1 und 2. Im Vergleich zu den in 4 gemäß Stand der Technik angeordneten Bonddrähten ist die Sicherheit der überkreuzenden Verbindungen auf vielfältige Weise erhöht. Erstens hätte eine Berührung der Bänder keinen Kurzschluss zur Folge, da zwischen den Bonddrähten eine Isolation vor Kurzschlüssen bewahrt. Zweitens fixieren sich die Bonddrähte im Verbund gegenseitig, so dass ihre Bewegungsmöglichkeit eingeschränkt ist und somit ihre Lage im Raum besser fixiert ist. Drittens bedeutet diese Fixierung im Raum, dass ggf. auftretende mechanische Einwirkungen ihre Belastung auf die Vielzahl von Bondstellen verteilen, weshalb eine einzelne Bondstelle geringeren Krafteinwirkungen ausgesetzt wird. 3 shows crossing flat band networks 10 . 20 , according to 1 and 2 , Compared to the in 4 According to the prior art arranged bonding wires, the security of the crossing connections is increased in many ways. First, touching the tapes would not result in a short circuit because isolation between the bondwires will prevent short circuits. Second, the bonding wires fix each other in the composite, so that their movement is limited and thus their position in the room is better fixed. Third, this fixation in space means that any mechanical actions that may occur will spread their stress over the multiple bonding sites, leaving a single bonding site exposed to less force.

Die Fixierung der Bonddrähte zueinander ermöglicht außerdem ein engeres Zusammenrücken der Bonddrähte, so dass mehr Bonddrähte nebeneinander angeordnet werden können und damit die Dimensionierung der Bauteile verkleinert werden kann. Weiterhin können die Bonddrähte feiner ausgebildet werden, da sie im Verbund geringeren Belastungen ausgesetzt sind. Auf diese Weise kann einerseits Material für Bonddrähte eingespart werden, sowie weiterhin ein engeres Zusammenrücken der Bonddrähte erreicht werden und damit eine nochmalige Verkleinerung der Bauteile bewirkt werden.The Fixation of the bonding wires allows each other Furthermore a closer together of the Bonding wires, so that more bonding wires can be arranged side by side and thus the sizing the components can be reduced. Furthermore, the Bond wires be formed finer, since they are exposed to lower loads in the composite are. In this way, on the one hand material for bonding wires can be saved, as well continue a closer together reached the bonding wires be and thus causes a further reduction of the components become.

Weiterhin können die erfindungsgemäßen Bänder rationeller gebondet werden und ersparen damit einen ernormen Arbeitsaufwand gegenüber dem Bonden einzelner Drähte.Farther can the bands according to the invention more rational Bonded and thus save a tremendous amount of work compared to the Bonding of individual wires.

Ein simultanes Bonden ist insbesondere im Bereich der Leistungselektronik von Vorteil, bei der von einem Anschlussfeld (Pad) mehrere Bonddrähte zu einem anderen Pad geführt werden. Der bandförmige erfindungsgemäße Verbund ermöglicht hierfür ein simultanes Bonden (siehe 5) wogegen im Stand der Technik der Aufwand für das Bonden einzelner Drähte sehr aufwendig ist (siehe 6).A simultaneous bonding is particularly advantageous in the field of power electronics, in which a plurality of bonding wires are led from one pad field to another pad. The band-shaped composite according to the invention allows a simultaneous bonding (see 5 ) whereas in the prior art, the effort for the bonding of individual wires is very expensive (see 6 ).

Claims (9)

Verbund, enthaltend eine Isolierung und einen Bonddraht, dadurch gekennzeichnet, dass die Isolierung eine den Bonddraht teilweise einbettende Rinne aufweist, so dass eine Seite des Verbunds aus Isolation besteht und eine Seite des Verbunds eine freiliegende Bonddrahtoberfläche aufweist.Composite comprising an insulation and a bonding wire, characterized in that the iso lierungsierung has a bonding wire partially embedding groove so that one side of the composite consists of insulation and one side of the composite has an exposed bonding wire surface. Verbund nach Anspruch 1, dadurch gekennzeichnet, dass der Bonddraht ein Feinstdraht ist.Composite according to claim 1, characterized that the bonding wire is a very fine wire. Verbund nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der Bonddraht in eine Rinne der Isolierung eingeklemmt ist.Composite according to Claim 1 or 2, characterized that the bonding wire is clamped in a groove of the insulation. Verbund nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass der Bonddraht an ein Isolierband geklebt ist.Composite according to Claim 1 or 2, characterized that the bonding wire is glued to an insulating tape. Verbund nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass der Bonddraht ein Feinstdraht mit einem Durchmesser zwischen 5 und 30 μm ist.Composite according to one of claims 1 to 4, characterized that the bonding wire is a fine wire with a diameter between 5 and 30 μm is. Verbund nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass der Verbund ein Flachband ist, in dem mehrere Bonddrähte teilweise eingebettet sind.Composite according to one of claims 1 to 5, characterized that the composite is a ribbon, in which several bonding wires partially embedded are. Anordnung überkreuzender Verbindungen aus Bonddrähten, dadurch gekennzeichnet, dass die überkreuzenden Verbindungen einen Verbund aufweisen, welcher auf einer Seite eine Isolierung aufweist und auf der anderen Seite einen aus der Isolierung ragenden Bonddraht.Arrangement of crossing Connections made of bonding wires, characterized in that the crossing connections have a composite, which on one side insulation and on the other side a protruding from the insulation Bonding wire. Verfahren zum Bonden von Bonddrähten, dadurch gekennzeichnet, dass mehrere Bonddrähte nebeneinander an einem Band fixiert werden.Method for bonding bonding wires, characterized that several bonding wires next to each other to be fixed on a tape. Verfahren nach Anspruch 8, dadurch gekennzeichnet, dass mehrere Bonddrähte simultan gebondet werden.Method according to claim 8, characterized in that that several bonding wires be bonded simultaneously.
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