DE102006017718A1 - Leuchte - Google Patents
Leuchte Download PDFInfo
- Publication number
- DE102006017718A1 DE102006017718A1 DE102006017718A DE102006017718A DE102006017718A1 DE 102006017718 A1 DE102006017718 A1 DE 102006017718A1 DE 102006017718 A DE102006017718 A DE 102006017718A DE 102006017718 A DE102006017718 A DE 102006017718A DE 102006017718 A1 DE102006017718 A1 DE 102006017718A1
- Authority
- DE
- Germany
- Prior art keywords
- housing
- electro
- current supply
- directly onto
- vehicle uses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/75—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with fins or blades having different shapes, thicknesses or spacing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Arrangements Of Lighting Devices For Vehicle Interiors, Mounting And Supporting Thereof, Circuits Therefore (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202006020926U DE202006020926U1 (de) | 2005-10-27 | 2006-04-15 | Leuchte |
DE102006017718A DE102006017718A1 (de) | 2005-10-27 | 2006-04-15 | Leuchte |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005051413 | 2005-10-27 | ||
DE102006017718A DE102006017718A1 (de) | 2005-10-27 | 2006-04-15 | Leuchte |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102006017718A1 true DE102006017718A1 (de) | 2007-05-16 |
Family
ID=37982778
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202006020926U Expired - Lifetime DE202006020926U1 (de) | 2005-10-27 | 2006-04-15 | Leuchte |
DE102006017718A Ceased DE102006017718A1 (de) | 2005-10-27 | 2006-04-15 | Leuchte |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202006020926U Expired - Lifetime DE202006020926U1 (de) | 2005-10-27 | 2006-04-15 | Leuchte |
Country Status (1)
Country | Link |
---|---|
DE (2) | DE202006020926U1 (de) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007041817A1 (de) * | 2007-09-03 | 2009-03-05 | Osram Gesellschaft mit beschränkter Haftung | Leuchtmodul und Verfahren zu dessen Herstellung |
DE102007040596A1 (de) * | 2007-08-27 | 2009-03-05 | Epsys Paul Voinea E.K. | Beleuchtungsmittel mit Wärmespreizung durch Wärmeleitbeschichtung |
EP2072893A1 (de) * | 2007-12-17 | 2009-06-24 | Tang Shih Chuan | Leuchtdiodenlampe (LED) mit Kühlsitz |
DE102009050700A1 (de) * | 2009-10-26 | 2011-05-05 | Technomid Gmbh | LED-Leuchte sowie System |
DE102010044312A1 (de) * | 2010-09-03 | 2012-03-08 | Tyco Electronics Amp Gmbh | Leuchte zur Verwendung in feuchten oder nassen Umgebungen mit Leuchtmittelträger |
DE102011085655A1 (de) * | 2011-11-03 | 2013-05-08 | Osram Gmbh | Beleuchtungseinrichtung mit Halbleiterlichtquellen |
DE102012107668A1 (de) * | 2012-08-21 | 2014-03-20 | Epcos Ag | Bauelementanordnung |
DE102012218059A1 (de) * | 2012-10-02 | 2014-04-03 | Osram Gmbh | LED-Leuchte und Verfahren zum Herstellen einer LED-Leuchte |
ITUB20169901A1 (it) * | 2016-01-11 | 2017-07-11 | Osram Gmbh | Procedimento per realizzare un involucro per dispositivi di illuminazione ed involucro corrispondente |
US9920887B2 (en) | 2012-05-29 | 2018-03-20 | Philips Lighting Holding B.V. | Internal envelope infrastructure for electrical devices |
FR3069048A1 (fr) * | 2017-07-17 | 2019-01-18 | Valeo Vision Belgique | Dispositif lumineux pour vehicule automobile |
WO2020011667A1 (de) * | 2018-07-13 | 2020-01-16 | Elektrobit Automotive Gmbh | Leiterplattenbauteil und verfahren zum fluiddichten verbinden des leiterplattenbauteils mit einer leiterplatte |
DE102021102554A1 (de) | 2021-02-04 | 2022-08-04 | Zumtobel Lighting Gmbh | Leuchtengehäuse zur aufnahme einer leuchtenkomponente |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19746893B4 (de) | 1997-10-23 | 2005-09-01 | Siemens Ag | Optoelektronisches Bauelement mit Wärmesenke im Sockelteil und Verfahren zur Herstellung |
DE10308917A1 (de) | 2003-02-28 | 2004-09-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil mit metallisiertem Reflektor |
DE10344230A1 (de) | 2003-09-24 | 2005-05-04 | Klaus Baulmann | Niedervolt-LED-Leuchtmittel |
-
2006
- 2006-04-15 DE DE202006020926U patent/DE202006020926U1/de not_active Expired - Lifetime
- 2006-04-15 DE DE102006017718A patent/DE102006017718A1/de not_active Ceased
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007040596A1 (de) * | 2007-08-27 | 2009-03-05 | Epsys Paul Voinea E.K. | Beleuchtungsmittel mit Wärmespreizung durch Wärmeleitbeschichtung |
DE102009007650A1 (de) | 2007-08-27 | 2010-08-12 | Epsys Paul Voinea E.K. | Beleuchtungsmittel mit Wärmespreizung durch Wärmeleitbeschichtung und Anpassung an das Stromversorgungsnetz und Herstellungsverfahren hierfür |
DE102007040596B4 (de) * | 2007-08-27 | 2011-01-13 | Epsys Paul Voinea E.K. | Beleuchtungsmittel mit Wärmespreizung durch Wärmeleitbeschichtung |
US8186849B2 (en) | 2007-09-03 | 2012-05-29 | Osram Ag | Luminous module and method for producing it |
DE102007041817A1 (de) * | 2007-09-03 | 2009-03-05 | Osram Gesellschaft mit beschränkter Haftung | Leuchtmodul und Verfahren zu dessen Herstellung |
DE102007041817B4 (de) * | 2007-09-03 | 2017-12-21 | Osram Gmbh | Leuchtmodul |
EP2072893A1 (de) * | 2007-12-17 | 2009-06-24 | Tang Shih Chuan | Leuchtdiodenlampe (LED) mit Kühlsitz |
DE102009050700A1 (de) * | 2009-10-26 | 2011-05-05 | Technomid Gmbh | LED-Leuchte sowie System |
DE102009050700B4 (de) * | 2009-10-26 | 2013-09-05 | Technomid Gmbh | LED-Leuchte sowie System |
DE102010044312B4 (de) * | 2010-09-03 | 2012-07-12 | Tyco Electronics Amp Gmbh | Leuchte zur Verwendung in feuchten oder nassen Umgebungen mit Leuchtmittelträger |
DE102010044312A1 (de) * | 2010-09-03 | 2012-03-08 | Tyco Electronics Amp Gmbh | Leuchte zur Verwendung in feuchten oder nassen Umgebungen mit Leuchtmittelträger |
DE102011085655A1 (de) * | 2011-11-03 | 2013-05-08 | Osram Gmbh | Beleuchtungseinrichtung mit Halbleiterlichtquellen |
US9920887B2 (en) | 2012-05-29 | 2018-03-20 | Philips Lighting Holding B.V. | Internal envelope infrastructure for electrical devices |
DE102012107668A1 (de) * | 2012-08-21 | 2014-03-20 | Epcos Ag | Bauelementanordnung |
US10278285B2 (en) | 2012-08-21 | 2019-04-30 | Epcos Ag | Electric component assembly |
DE102012218059A1 (de) * | 2012-10-02 | 2014-04-03 | Osram Gmbh | LED-Leuchte und Verfahren zum Herstellen einer LED-Leuchte |
EP3190339A1 (de) * | 2016-01-11 | 2017-07-12 | OSRAM GmbH | Verfahren zur bereitstellung eines gehäuses für beleuchtungsvorrichtungen und entsprechendes gehäuse |
ITUB20169901A1 (it) * | 2016-01-11 | 2017-07-11 | Osram Gmbh | Procedimento per realizzare un involucro per dispositivi di illuminazione ed involucro corrispondente |
FR3069048A1 (fr) * | 2017-07-17 | 2019-01-18 | Valeo Vision Belgique | Dispositif lumineux pour vehicule automobile |
EP3431861A1 (de) * | 2017-07-17 | 2019-01-23 | Valeo Vision Belgique | Leuchtmodul für kraftfahrzeug |
US10488030B2 (en) | 2017-07-17 | 2019-11-26 | Valeo Vision Belgique | Light device for a motor vehicle |
WO2020011667A1 (de) * | 2018-07-13 | 2020-01-16 | Elektrobit Automotive Gmbh | Leiterplattenbauteil und verfahren zum fluiddichten verbinden des leiterplattenbauteils mit einer leiterplatte |
DE102021102554A1 (de) | 2021-02-04 | 2022-08-04 | Zumtobel Lighting Gmbh | Leuchtengehäuse zur aufnahme einer leuchtenkomponente |
Also Published As
Publication number | Publication date |
---|---|
DE202006020926U1 (de) | 2011-02-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
R138 | Derivation of utility model |
Ref document number: 202006020926 Country of ref document: DE |
|
R081 | Change of applicant/patentee |
Owner name: KROMBERG & SCHUBERT KG, DE Free format text: FORMER OWNER: KROMBERG & SCHUBERT GMBH & CO. KG, 42389 WUPPERTAL, DE Effective date: 20110809 |
|
R082 | Change of representative |
Representative=s name: DREISS PATENTANWAELTE PARTG MBB, DE Effective date: 20110809 Representative=s name: DREISS PATENTANWAELTE PARTNERSCHAFT, DE Effective date: 20110809 |
|
R016 | Response to examination communication | ||
R082 | Change of representative |
Representative=s name: DREISS PATENTANWAELTE PARTNERSCHAFT, DE |
|
R082 | Change of representative |
Representative=s name: DREISS PATENTANWAELTE PARTNERSCHAFT, DE |
|
R081 | Change of applicant/patentee |
Owner name: KROMBERG & SCHUBERT KG, DE Free format text: FORMER OWNER: KROMBERG & SCHUBERT KG, 42283 WUPPERTAL, DE Effective date: 20130318 Owner name: KROMBERG & SCHUBERT KG, DE Free format text: FORMER OWNER: KROMBERG & SCHUBERT KG, 42389 WUPPERTAL, DE Effective date: 20130318 |
|
R082 | Change of representative |
Representative=s name: DREISS PATENTANWAELTE PARTG MBB, DE Effective date: 20130318 Representative=s name: DREISS PATENTANWAELTE PARTG MBB, DE Effective date: 20121109 Representative=s name: DREISS PATENTANWAELTE PARTNERSCHAFT, DE Effective date: 20130318 Representative=s name: DREISS PATENTANWAELTE PARTNERSCHAFT, DE Effective date: 20121109 |
|
R002 | Refusal decision in examination/registration proceedings | ||
R003 | Refusal decision now final | ||
R003 | Refusal decision now final |
Effective date: 20140724 |