DE102006017382A1 - Method and device for coating and / or treating surfaces - Google Patents

Method and device for coating and / or treating surfaces Download PDF

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Publication number
DE102006017382A1
DE102006017382A1 DE102006017382A DE102006017382A DE102006017382A1 DE 102006017382 A1 DE102006017382 A1 DE 102006017382A1 DE 102006017382 A DE102006017382 A DE 102006017382A DE 102006017382 A DE102006017382 A DE 102006017382A DE 102006017382 A1 DE102006017382 A1 DE 102006017382A1
Authority
DE
Germany
Prior art keywords
coating
treating surfaces
cathodes
hipims
sequentially
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102006017382A
Other languages
German (de)
Inventor
Horst Rettenmaier
Wolf-Dieter Muenz
Sven Zaenger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ITG INDUKTIONSANLAGEN GmbH
Original Assignee
ITG INDUKTIONSANLAGEN GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ITG INDUKTIONSANLAGEN GmbH filed Critical ITG INDUKTIONSANLAGEN GmbH
Priority to DE102006017382A priority Critical patent/DE102006017382A1/en
Priority to PCT/DE2006/001802 priority patent/WO2007054048A1/en
Publication of DE102006017382A1 publication Critical patent/DE102006017382A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
    • H01J37/3452—Magnet distribution
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3464—Operating strategies
    • H01J37/3467—Pulsed operation, e.g. HIPIMS

Abstract

Ein Verfahren zum Beschichten und/oder Behandeln von Oberflächen mittels High Power Impuls Magnetron Sputtering (HIPIMS), ist im Hinblick auf ein möglichst effektives Durchführen eines Sputter-Prozesses bei niedrigen Kosten derart ausgebildet, dass mindestens zwei Kathoden simultan oder sequenziell gepulst werden, wobei die Kathoden über eine Schaltvorrichtung mit einer gemeinsamen Energieversorgung verbunden werden. Eine entsprechende Vorrichtung insbesondere zur Anwendung des erfindungsgemäßen Verfahrens ist angegeben.A method for coating and / or treating surfaces by means of high power impulse magnetron sputtering (HIPIMS) is designed in order to perform a sputtering process as effectively as possible at low cost such that at least two cathodes are pulsed simultaneously or sequentially, the Cathodes are connected via a switching device with a common power supply. A corresponding device, in particular for the application of the method according to the invention is specified.

DE102006017382A 2005-11-14 2006-04-11 Method and device for coating and / or treating surfaces Withdrawn DE102006017382A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102006017382A DE102006017382A1 (en) 2005-11-14 2006-04-11 Method and device for coating and / or treating surfaces
PCT/DE2006/001802 WO2007054048A1 (en) 2005-11-14 2006-10-12 Method and device for coating and/or treating surfaces

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005054568 2005-11-14
DE102006017382A DE102006017382A1 (en) 2005-11-14 2006-04-11 Method and device for coating and / or treating surfaces

Publications (1)

Publication Number Publication Date
DE102006017382A1 true DE102006017382A1 (en) 2007-05-16

Family

ID=37605714

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102006017382A Withdrawn DE102006017382A1 (en) 2005-11-14 2006-04-11 Method and device for coating and / or treating surfaces

Country Status (2)

Country Link
DE (1) DE102006017382A1 (en)
WO (1) WO2007054048A1 (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008019202A1 (en) 2008-04-17 2009-10-22 Kennametal Inc. Coating method, workpiece or tool and its use
WO2009132822A3 (en) * 2008-04-28 2010-01-21 Cemecon Ag Device and method for pretreating and coating bodies
DE102008050499A1 (en) 2008-10-07 2010-04-08 Systec System- Und Anlagentechnik Gmbh & Co. Kg PVD coating method, apparatus for carrying out the method and substrates coated by the method
DE102008021912B4 (en) 2008-05-01 2010-05-12 Cemecon Ag Coating method and apparatus for coating
WO2012143087A1 (en) * 2011-04-20 2012-10-26 Oerlikon Trading Ag, Trübbach High-power sputtering source
WO2012143091A1 (en) * 2011-04-20 2012-10-26 Oerlikon Trading Ag, Trübbach Method for supplying sequential power impulses
DE102011117177A1 (en) * 2011-10-28 2013-05-02 Oerlikon Trading Ag, Trübbach Method for providing sequential power pulses
WO2013083238A1 (en) * 2011-12-05 2013-06-13 Oerlikon Trading Ag, Trübbach Reactive sputtering process
DE102011121770A1 (en) * 2011-12-21 2013-06-27 Oerlikon Trading Ag, Trübbach Homogeneous HIPIMS coating process
DE102012013577A1 (en) * 2012-07-10 2014-01-16 Oerlikon Trading Ag, Trübbach Pulsed Power coating method
WO2014067650A1 (en) * 2012-11-01 2014-05-08 Oerlikon Trading Ag, Trübbach Power distributor for defined sequential power distribution
EP2325349A4 (en) * 2008-09-08 2015-10-21 Kobe Steel Ltd Sputter device

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE533395C2 (en) * 2007-06-08 2010-09-14 Sandvik Intellectual Property Ways to make PVD coatings
TWI381063B (en) * 2008-09-24 2013-01-01 Iner Aec Executive Yuan High-power pulse magnetron sputtering apparatus and surface treatment apparatus
US11473189B2 (en) 2019-02-11 2022-10-18 Applied Materials, Inc. Method for particle removal from wafers through plasma modification in pulsed PVD

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61238958A (en) * 1985-04-15 1986-10-24 Hitachi Ltd Method and apparatus for forming composite thin film
SE9704607D0 (en) * 1997-12-09 1997-12-09 Chemfilt R & D Ab A method and apparatus for magnetically enhanced sputtering
SE519931C2 (en) * 2000-06-19 2003-04-29 Chemfilt R & D Ab Device and method for pulsed, highly ionized magnetron sputtering
AU2003265503A1 (en) * 2002-08-16 2004-03-03 The Regents Of The University Of California Process and apparatus for pulsed dc magnetron reactive sputtering of thin film coatings on large substrates using smaller sputter cathodes

Cited By (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008019202A1 (en) 2008-04-17 2009-10-22 Kennametal Inc. Coating method, workpiece or tool and its use
WO2009132822A3 (en) * 2008-04-28 2010-01-21 Cemecon Ag Device and method for pretreating and coating bodies
US9812299B2 (en) 2008-04-28 2017-11-07 Cemecon Ag Apparatus and method for pretreating and coating bodies
CN102027564B (en) * 2008-04-28 2013-05-22 塞梅孔公司 Device and method for pretreating and coating bodies
DE102008021912C5 (en) * 2008-05-01 2018-01-11 Cemecon Ag coating process
DE102008021912B4 (en) 2008-05-01 2010-05-12 Cemecon Ag Coating method and apparatus for coating
EP2325349A4 (en) * 2008-09-08 2015-10-21 Kobe Steel Ltd Sputter device
US9617634B2 (en) 2008-09-08 2017-04-11 Kobe Steel, Ltd Sputter device
DE102008050499A1 (en) 2008-10-07 2010-04-08 Systec System- Und Anlagentechnik Gmbh & Co. Kg PVD coating method, apparatus for carrying out the method and substrates coated by the method
EP2175044A1 (en) 2008-10-07 2010-04-14 Systec System- und Anlagentechnik GmbH & Co. KG PVD coating method, device for carrying out the procedure and substances coated with the procedure
DE102008050499B4 (en) * 2008-10-07 2014-02-06 Systec System- Und Anlagentechnik Gmbh & Co. Kg PVD coating method, apparatus for carrying out the method and substrates coated by the method
WO2012143091A1 (en) * 2011-04-20 2012-10-26 Oerlikon Trading Ag, Trübbach Method for supplying sequential power impulses
CN103620731A (en) * 2011-04-20 2014-03-05 欧瑞康贸易股份公司(特吕巴赫) High-power sputtering source
JP2014514452A (en) * 2011-04-20 2014-06-19 エリコン・トレーディング・アクチェンゲゼルシャフト，トリュープバッハ High power sputtering source
US9376745B2 (en) 2011-04-20 2016-06-28 Oerlikon Surface Solutions Ag, Pfaffikon High-power sputtering source
RU2602571C2 (en) * 2011-04-20 2016-11-20 Эрликон Серфиз Солюшнз Аг, Пфеффикон High-power sputtering source
WO2012143087A1 (en) * 2011-04-20 2012-10-26 Oerlikon Trading Ag, Trübbach High-power sputtering source
CN103620731B (en) * 2011-04-20 2016-10-26 欧瑞康表面解决方案股份公司，普费菲孔 High power sputtering source
US9267200B2 (en) 2011-04-20 2016-02-23 Oerlikon Surface Solutions Ag, Trubbach Method for supplying sequential power impulses
US9906210B2 (en) 2011-10-28 2018-02-27 Oerlikon Surface Solutions Ag, Pfäffikon Method for providing sequential power pulses
WO2013060415A1 (en) * 2011-10-28 2013-05-02 Oerlikon Trading AG,Trübbach Method for providing sequential power pulses
DE102011117177A1 (en) * 2011-10-28 2013-05-02 Oerlikon Trading Ag, Trübbach Method for providing sequential power pulses
RU2631670C2 (en) * 2011-10-28 2017-09-26 Эрликон Серфиз Солюшнз Аг, Пфеффикон Method of providing sequence pulses of power
CN104246967A (en) * 2011-10-28 2014-12-24 欧瑞康贸易股份公司(特吕巴赫) Method for providing sequential power pulses
WO2013083238A1 (en) * 2011-12-05 2013-06-13 Oerlikon Trading Ag, Trübbach Reactive sputtering process
US10458015B2 (en) 2011-12-05 2019-10-29 Oerlikon Surface Solutions Ag, Pfäffikon Reactive sputtering process
CN104272429A (en) * 2011-12-05 2015-01-07 欧瑞康贸易股份公司(特吕巴赫) Reactive sputtering process
RU2632210C2 (en) * 2011-12-05 2017-10-03 Эрликон Серфиз Солюшнз Аг, Пфеффикон Method of reactive spray
CN104272429B (en) * 2011-12-05 2016-08-24 欧瑞康表面解决方案股份公司，普费菲孔 method for reactive sputtering
WO2013091761A1 (en) * 2011-12-21 2013-06-27 Oerlikon Trading Ag, Trübbach Homogeneous hipims coating method
US10982321B2 (en) 2011-12-21 2021-04-20 Oerlikon Surface Solutions Ag, Pfäffikon Homogeneous HiPIMS coating method
KR101934141B1 (en) 2011-12-21 2018-12-31 오를리콘 서피스 솔루션스 아크티엔게젤샤프트, 페피콘 Homogeneous hipims coating method
DE102011121770A1 (en) * 2011-12-21 2013-06-27 Oerlikon Trading Ag, Trübbach Homogeneous HIPIMS coating process
RU2633516C2 (en) * 2011-12-21 2017-10-13 Эрликон Серфиз Солюшинз Аг, Пфеффикон Method of homogeneous applying hipims coatings
DE102012013577A1 (en) * 2012-07-10 2014-01-16 Oerlikon Trading Ag, Trübbach Pulsed Power coating method
WO2014067650A1 (en) * 2012-11-01 2014-05-08 Oerlikon Trading Ag, Trübbach Power distributor for defined sequential power distribution
US10074976B2 (en) 2012-11-01 2018-09-11 Oerlikon Surface Solutions Ag, Pfäffikon Power distributor for defined sequential power distribution
CN105027255B (en) * 2012-11-01 2017-07-14 欧瑞康表面解决方案股份公司，特吕巴赫 Power divider and coating apparatus for the continuous power distribution of definition
KR20150079930A (en) * 2012-11-01 2015-07-08 오를리콘 서피스 솔루션스 아크티엔게젤샤프트, 트뤼프바흐 Power distributor for defined sequential power distribution
KR102085704B1 (en) 2012-11-01 2020-03-06 오를리콘 서피스 솔루션스 아크티엔게젤샤프트, 페피콘 Power distributor for defined sequential power distribution
CN105027255A (en) * 2012-11-01 2015-11-04 欧瑞康表面解决方案股份公司，特吕巴赫 Power distributor for defined sequential power distribution

Also Published As

Publication number Publication date
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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: C23C 14/54 AFI20060411BHDE

R016 Response to examination communication
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20131101