DE10195142T1 - Elektrostatisches Haltern - Google Patents

Elektrostatisches Haltern

Info

Publication number
DE10195142T1
DE10195142T1 DE10195142T DE10195142T DE10195142T1 DE 10195142 T1 DE10195142 T1 DE 10195142T1 DE 10195142 T DE10195142 T DE 10195142T DE 10195142 T DE10195142 T DE 10195142T DE 10195142 T1 DE10195142 T1 DE 10195142T1
Authority
DE
Germany
Prior art keywords
electrostatic holder
electrostatic
holder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10195142T
Other languages
English (en)
Inventor
David Andrew Tossell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aviza Europe Ltd
Original Assignee
Aviza Europe Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aviza Europe Ltd filed Critical Aviza Europe Ltd
Publication of DE10195142T1 publication Critical patent/DE10195142T1/de
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
DE10195142T 2000-12-05 2001-12-04 Elektrostatisches Haltern Ceased DE10195142T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0029570.9A GB0029570D0 (en) 2000-12-05 2000-12-05 Electrostatic clamp
PCT/GB2001/005357 WO2002047126A1 (en) 2000-12-05 2001-12-04 Electrostatic clamping

Publications (1)

Publication Number Publication Date
DE10195142T1 true DE10195142T1 (de) 2003-10-23

Family

ID=9904419

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10195142T Ceased DE10195142T1 (de) 2000-12-05 2001-12-04 Elektrostatisches Haltern

Country Status (5)

Country Link
US (1) US6876534B2 (de)
AU (1) AU2002220882A1 (de)
DE (1) DE10195142T1 (de)
GB (2) GB0029570D0 (de)
WO (1) WO2002047126A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7358411B2 (en) 2003-06-30 2008-04-15 Shell Oil Company Hydrocracking of diphenylalkanes
US7646580B2 (en) * 2005-02-24 2010-01-12 Kyocera Corporation Electrostatic chuck and wafer holding member and wafer treatment method
KR101689550B1 (ko) * 2009-01-11 2016-12-26 어플라이드 머티어리얼스, 인코포레이티드 기판들을 운반하기 위한 정전기 엔드 이펙터 장치, 시스템들 및 방법들
US10896842B2 (en) 2009-10-20 2021-01-19 Tokyo Electron Limited Manufacturing method of sample table
JP5628507B2 (ja) * 2009-10-20 2014-11-19 東京エレクトロン株式会社 試料台及びマイクロ波プラズマ処理装置
US9428833B1 (en) 2015-05-29 2016-08-30 Lam Research Corporation Method and apparatus for backside deposition reduction by control of wafer support to achieve edge seal
US10056453B2 (en) 2016-07-22 2018-08-21 Globalfoundries Inc. Semiconductor wafers with reduced bow and warpage
US11302557B2 (en) * 2020-05-01 2022-04-12 Applied Materials, Inc. Electrostatic clamping system and method

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4692836A (en) * 1983-10-31 1987-09-08 Toshiba Kikai Kabushiki Kaisha Electrostatic chucks
US5325261A (en) * 1991-05-17 1994-06-28 Unisearch Limited Electrostatic chuck with improved release
US5267607A (en) * 1991-05-28 1993-12-07 Tokyo Electron Limited Substrate processing apparatus
US5421401A (en) * 1994-01-25 1995-06-06 Applied Materials, Inc. Compound clamp ring for semiconductor wafers
JPH08130207A (ja) * 1994-10-31 1996-05-21 Matsushita Electric Ind Co Ltd プラズマ処理装置
CH692000A5 (de) * 1995-11-13 2001-12-31 Unaxis Balzers Ag Beschichtungskammer, Substratträger hierfür, Verfahren zum Vakuumbedampfen sowie Beschichtungsverfahren.
GB9618620D0 (en) 1996-09-06 1996-10-16 Electrotech Equipments Ltd A method of forming a layer
JPH11145265A (ja) 1997-11-11 1999-05-28 Nissin Electric Co Ltd 静電チャック
US6228208B1 (en) * 1998-08-12 2001-05-08 Applied Materials, Inc. Plasma density and etch rate enhancing semiconductor processing chamber
US6162336A (en) * 1999-07-12 2000-12-19 Chartered Semiconductor Manufacturing Ltd. Clamping ring design to reduce wafer sticking problem in metal deposition

Also Published As

Publication number Publication date
US6876534B2 (en) 2005-04-05
GB0029570D0 (en) 2001-01-17
US20030002237A1 (en) 2003-01-02
GB0216711D0 (en) 2002-08-28
AU2002220882A1 (en) 2002-06-18
GB2375432B (en) 2005-06-08
WO2002047126A1 (en) 2002-06-13
GB2375432A (en) 2002-11-13

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Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: ZEITLER, VOLPERT, KANDLBINDER, 80539 MUENCHEN

8110 Request for examination paragraph 44
8125 Change of the main classification

Ipc: H01L 21/683 AFI20090206BHDE

R016 Response to examination communication
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final