CY1107257T1 - Μοναδα αισθητηρα, ειδικοτερα για αισθητηρες δακτυλικου αποτυπωματος - Google Patents

Μοναδα αισθητηρα, ειδικοτερα για αισθητηρες δακτυλικου αποτυπωματος

Info

Publication number
CY1107257T1
CY1107257T1 CY20081100317T CY081100317T CY1107257T1 CY 1107257 T1 CY1107257 T1 CY 1107257T1 CY 20081100317 T CY20081100317 T CY 20081100317T CY 081100317 T CY081100317 T CY 081100317T CY 1107257 T1 CY1107257 T1 CY 1107257T1
Authority
CY
Cyprus
Prior art keywords
specifically
sensor unit
fingerprint sensors
substrate
chip
Prior art date
Application number
CY20081100317T
Other languages
English (en)
Inventor
Mathiassen Svein
Ovidiu Vermesan
Jon Nysaether
Bjorn Erik Seeberg
Original Assignee
Idex Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idex Asa filed Critical Idex Asa
Publication of CY1107257T1 publication Critical patent/CY1107257T1/el

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/1335—Combining adjacent partial images (e.g. slices) to create a composite input or reference pattern; Tracking a sweeping finger movement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Image Input (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Thin Film Transistor (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

Η εφεύρεση σχετίζεται με τσιπ αισθητήρα, ειδικότερα για τη μέτρηση δομών στην επιφάνεια δακτύλου, που περιλαμβάνει ηλεκτρονικό τσιπ καθαυτού γνωστού τύπου που παρέχεται με πλήθος ηλεκτροδίων αισθητήρα για μετρήσεις της ηλεκτρικής χωρητικότητας, όπου το τσιπ βρίσκεται τοποθετημένο επάνω σε ηλεκτρικά μονωτικό υπόστρωμα που παρέχεται με πλήθος ανοιγμάτων διαμέσου των οποίων παρέχονται ηλεκτρικοί αγωγοί, ενώ οι απολήξεις των προαναφερθέντων αγωγών συνιστούν διάταξη αισθητήρα για μετρήσεις της ηλεκτρικής χωρητικότητας έτσι ώστε η διάταξη του αισθητήρα να βρίσκεται τοποθετημένη επάνω σε μία πρώτη πλευρά του εν λόγω υποστρώματος και το ηλεκτρονικό τσιπ να βρίσκεται τοποθετημένο επάνω στην άλλη πλευρά του υποστρώματος.
CY20081100317T 2000-06-09 2008-03-20 Μοναδα αισθητηρα, ειδικοτερα για αισθητηρες δακτυλικου αποτυπωματος CY1107257T1 (el)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NO20003004A NO315017B1 (no) 2000-06-09 2000-06-09 Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate
EP01938853A EP1303828B1 (en) 2000-06-09 2001-06-08 Sensor Unit, especially for Fingerprint Sensors

Publications (1)

Publication Number Publication Date
CY1107257T1 true CY1107257T1 (el) 2012-11-21

Family

ID=19911250

Family Applications (1)

Application Number Title Priority Date Filing Date
CY20081100317T CY1107257T1 (el) 2000-06-09 2008-03-20 Μοναδα αισθητηρα, ειδικοτερα για αισθητηρες δακτυλικου αποτυπωματος

Country Status (12)

Country Link
US (2) US7251351B2 (el)
EP (1) EP1303828B1 (el)
JP (1) JP4708671B2 (el)
AT (1) ATE384306T1 (el)
AU (1) AU2001264429A1 (el)
CY (1) CY1107257T1 (el)
DE (1) DE60132460T2 (el)
DK (1) DK1303828T3 (el)
ES (1) ES2299488T3 (el)
NO (1) NO315017B1 (el)
PT (1) PT1303828E (el)
WO (1) WO2001099035A2 (el)

Families Citing this family (107)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NO315016B1 (no) * 2000-06-09 2003-06-23 Idex Asa Miniatyrisert sensor
NO315017B1 (no) * 2000-06-09 2003-06-23 Idex Asa Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate
AU2002228809A1 (en) * 2000-12-05 2002-06-18 Validity, Inc. Swiped aperture capacitive fingerprint sensing systems and methods
JP4702586B2 (ja) * 2001-09-10 2011-06-15 日本電気株式会社 指紋センサ及び指紋センサ実装構造並びに該指紋センサを備えた指紋検出器
US6941004B2 (en) * 2001-12-06 2005-09-06 Motorola, Inc. Method and apparatus for asperity sensing and storage
DE10206187B4 (de) * 2002-02-14 2007-03-08 Infineon Technologies Ag Bildgebender, elektronischer Sensor
NO316796B1 (no) * 2002-03-01 2004-05-10 Idex Asa Sensormodul for maling av strukturer i en overflate, saerlig en fingeroverflate
KR100447141B1 (ko) * 2002-03-09 2004-09-07 (주)멜파스 차폐수단을 포함하는 반도체 지문감지장치
FI20030102A0 (fi) * 2003-01-22 2003-01-22 Nokia Corp Henkilön varmennusjärjestely
FI115109B (fi) * 2003-01-22 2005-02-28 Nokia Corp Tunnistusjärjestely ja tunnistusjärjestelyn käsittävä matkaviestin
WO2004077340A1 (en) * 2003-02-28 2004-09-10 Idex Asa Substrate multiplexing with active switches
US7697729B2 (en) 2004-01-29 2010-04-13 Authentec, Inc. System for and method of finger initiated actions
US20070183633A1 (en) * 2004-03-24 2007-08-09 Andre Hoffmann Identification, verification, and recognition method and system
US8447077B2 (en) 2006-09-11 2013-05-21 Validity Sensors, Inc. Method and apparatus for fingerprint motion tracking using an in-line array
US7751601B2 (en) * 2004-10-04 2010-07-06 Validity Sensors, Inc. Fingerprint sensing assemblies and methods of making
US8131026B2 (en) 2004-04-16 2012-03-06 Validity Sensors, Inc. Method and apparatus for fingerprint image reconstruction
WO2005104012A1 (en) * 2004-04-16 2005-11-03 Validity Sensors, Inc. Finger position sensing methods and apparatus
US8175345B2 (en) 2004-04-16 2012-05-08 Validity Sensors, Inc. Unitized ergonomic two-dimensional fingerprint motion tracking device and method
US8165355B2 (en) 2006-09-11 2012-04-24 Validity Sensors, Inc. Method and apparatus for fingerprint motion tracking using an in-line array for use in navigation applications
US8358815B2 (en) * 2004-04-16 2013-01-22 Validity Sensors, Inc. Method and apparatus for two-dimensional finger motion tracking and control
US8229184B2 (en) 2004-04-16 2012-07-24 Validity Sensors, Inc. Method and algorithm for accurate finger motion tracking
WO2005106774A2 (en) * 2004-04-23 2005-11-10 Validity Sensors, Inc. Methods and apparatus for acquiring a swiped fingerprint image
EP1617473A1 (en) * 2004-07-13 2006-01-18 Koninklijke Philips Electronics N.V. Electronic device comprising an ESD device
US7831070B1 (en) 2005-02-18 2010-11-09 Authentec, Inc. Dynamic finger detection mechanism for a fingerprint sensor
US8231056B2 (en) 2005-04-08 2012-07-31 Authentec, Inc. System for and method of protecting an integrated circuit from over currents
US7460697B2 (en) * 2005-07-19 2008-12-02 Validity Sensors, Inc. Electronic fingerprint sensor with differential noise cancellation
WO2007017848A2 (en) * 2005-08-11 2007-02-15 N-Trig Ltd. Apparatus for object information detection and methods of using same
FR2894049B1 (fr) * 2005-11-25 2008-01-04 Atmel Grenoble Soc Par Actions Dispositif de reactivation d'un appareil place en mode de veille
US7656392B2 (en) * 2006-03-24 2010-02-02 Synaptics Incorporated Touch sensor effective area enhancement
KR100792670B1 (ko) 2006-06-13 2008-01-09 주식회사 애트랩 반도체 장치 및 접촉센서 장치
JP4943807B2 (ja) * 2006-10-18 2012-05-30 日本電信電話株式会社 インピーダンス検出装置、インピーダンス検出方法、生体認識装置、および指紋認証装置
US7705613B2 (en) * 2007-01-03 2010-04-27 Abhay Misra Sensitivity capacitive sensor
US8107212B2 (en) 2007-04-30 2012-01-31 Validity Sensors, Inc. Apparatus and method for protecting fingerprint sensing circuitry from electrostatic discharge
US8290150B2 (en) 2007-05-11 2012-10-16 Validity Sensors, Inc. Method and system for electronically securing an electronic device using physically unclonable functions
US20110002461A1 (en) * 2007-05-11 2011-01-06 Validity Sensors, Inc. Method and System for Electronically Securing an Electronic Biometric Device Using Physically Unclonable Functions
US20080297174A1 (en) * 2007-05-31 2008-12-04 Sarangan Narasimhan Capacitive sensing devices
US8204281B2 (en) 2007-12-14 2012-06-19 Validity Sensors, Inc. System and method to remove artifacts from fingerprint sensor scans
US8276816B2 (en) 2007-12-14 2012-10-02 Validity Sensors, Inc. Smart card system with ergonomic fingerprint sensor and method of using
US20110178619A1 (en) * 2007-12-21 2011-07-21 Searete Llc, A Limited Liability Corporation Of The State Of Delaware Security-activated robotic tasks
US8116540B2 (en) 2008-04-04 2012-02-14 Validity Sensors, Inc. Apparatus and method for reducing noise in fingerprint sensing circuits
US8005276B2 (en) 2008-04-04 2011-08-23 Validity Sensors, Inc. Apparatus and method for reducing parasitic capacitive coupling and noise in fingerprint sensing circuits
WO2010036445A1 (en) 2008-07-22 2010-04-01 Validity Sensors, Inc. System, device and method for securing a device component
NO20083766L (no) * 2008-09-01 2010-03-02 Idex Asa Overflatesensor
US8391568B2 (en) 2008-11-10 2013-03-05 Validity Sensors, Inc. System and method for improved scanning of fingerprint edges
US8227889B2 (en) * 2008-12-08 2012-07-24 United Microelectronics Corp. Semiconductor device
US20100176892A1 (en) * 2009-01-15 2010-07-15 Validity Sensors, Inc. Ultra Low Power Oscillator
US20100180136A1 (en) * 2009-01-15 2010-07-15 Validity Sensors, Inc. Ultra Low Power Wake-On-Event Mode For Biometric Systems
US8600122B2 (en) 2009-01-15 2013-12-03 Validity Sensors, Inc. Apparatus and method for culling substantially redundant data in fingerprint sensing circuits
US8278946B2 (en) 2009-01-15 2012-10-02 Validity Sensors, Inc. Apparatus and method for detecting finger activity on a fingerprint sensor
US8374407B2 (en) 2009-01-28 2013-02-12 Validity Sensors, Inc. Live finger detection
US20100208953A1 (en) * 2009-02-17 2010-08-19 Validity Sensors, Inc. Illuminated Fingerprint Sensor and Method
US9400911B2 (en) 2009-10-30 2016-07-26 Synaptics Incorporated Fingerprint sensor and integratable electronic display
US9336428B2 (en) 2009-10-30 2016-05-10 Synaptics Incorporated Integrated fingerprint sensor and display
US9274553B2 (en) 2009-10-30 2016-03-01 Synaptics Incorporated Fingerprint sensor and integratable electronic display
NO20093601A1 (no) 2009-12-29 2011-06-30 Idex Asa Overflatesensor
US8866347B2 (en) 2010-01-15 2014-10-21 Idex Asa Biometric image sensing
US8791792B2 (en) 2010-01-15 2014-07-29 Idex Asa Electronic imager using an impedance sensor grid array mounted on or about a switch and method of making
US8421890B2 (en) 2010-01-15 2013-04-16 Picofield Technologies, Inc. Electronic imager using an impedance sensor grid array and method of making
US9666635B2 (en) 2010-02-19 2017-05-30 Synaptics Incorporated Fingerprint sensing circuit
US8716613B2 (en) 2010-03-02 2014-05-06 Synaptics Incoporated Apparatus and method for electrostatic discharge protection
US9001040B2 (en) 2010-06-02 2015-04-07 Synaptics Incorporated Integrated fingerprint sensor and navigation device
US8331096B2 (en) 2010-08-20 2012-12-11 Validity Sensors, Inc. Fingerprint acquisition expansion card apparatus
US8538097B2 (en) 2011-01-26 2013-09-17 Validity Sensors, Inc. User input utilizing dual line scanner apparatus and method
US8594393B2 (en) 2011-01-26 2013-11-26 Validity Sensors System for and method of image reconstruction with dual line scanner using line counts
GB2489100A (en) 2011-03-16 2012-09-19 Validity Sensors Inc Wafer-level packaging for a fingerprint sensor
US10043052B2 (en) 2011-10-27 2018-08-07 Synaptics Incorporated Electronic device packages and methods
JP5913906B2 (ja) * 2011-10-28 2016-04-27 日立オートモティブシステムズ株式会社 湿度検出装置
US9195877B2 (en) 2011-12-23 2015-11-24 Synaptics Incorporated Methods and devices for capacitive image sensing
US9785299B2 (en) 2012-01-03 2017-10-10 Synaptics Incorporated Structures and manufacturing methods for glass covered electronic devices
US9367173B2 (en) 2012-01-17 2016-06-14 Apple Inc. Finger sensor having pixel sensing circuitry for coupling electrodes and pixel sensing traces and related methods
US9268991B2 (en) 2012-03-27 2016-02-23 Synaptics Incorporated Method of and system for enrolling and matching biometric data
US9137438B2 (en) 2012-03-27 2015-09-15 Synaptics Incorporated Biometric object sensor and method
US9251329B2 (en) 2012-03-27 2016-02-02 Synaptics Incorporated Button depress wakeup and wakeup strategy
US9600709B2 (en) 2012-03-28 2017-03-21 Synaptics Incorporated Methods and systems for enrolling biometric data
US9152838B2 (en) 2012-03-29 2015-10-06 Synaptics Incorporated Fingerprint sensor packagings and methods
US20130279769A1 (en) 2012-04-10 2013-10-24 Picofield Technologies Inc. Biometric Sensing
US9030440B2 (en) 2012-05-18 2015-05-12 Apple Inc. Capacitive sensor packaging
US9651513B2 (en) 2012-10-14 2017-05-16 Synaptics Incorporated Fingerprint sensor and button combinations and methods of making same
US9411474B2 (en) * 2012-11-15 2016-08-09 Nokia Technologies Oy Shield electrode overlying portions of capacitive sensor electrodes
US9665762B2 (en) 2013-01-11 2017-05-30 Synaptics Incorporated Tiered wakeup strategy
NO20131423A1 (no) 2013-02-22 2014-08-25 Idex Asa Integrert fingeravtrykksensor
NO340311B1 (no) 2013-02-22 2017-03-27 Idex Asa Integrert fingeravtrykksensor
US9883822B2 (en) 2013-06-05 2018-02-06 Apple Inc. Biometric sensor chip having distributed sensor and control circuitry
NL2012891B1 (en) * 2013-06-05 2016-06-21 Apple Inc Biometric sensor chip having distributed sensor and control circuitry.
NO336318B1 (no) 2013-07-12 2015-08-03 Idex Asa Overflatesensor
US9984270B2 (en) 2013-08-05 2018-05-29 Apple Inc. Fingerprint sensor in an electronic device
US10296773B2 (en) 2013-09-09 2019-05-21 Apple Inc. Capacitive sensing array having electrical isolation
US9460332B1 (en) 2013-09-09 2016-10-04 Apple Inc. Capacitive fingerprint sensor including an electrostatic lens
US9697409B2 (en) 2013-09-10 2017-07-04 Apple Inc. Biometric sensor stack structure
WO2015127046A1 (en) * 2014-02-21 2015-08-27 Idex Asa Sensor employing overlapping grid lines and conductive probes for extending a sensing surface from the grid lines
CN104102902B (zh) 2014-07-04 2017-07-04 京东方科技集团股份有限公司 一种半导体指纹识别传感器及其制造方法
US9779280B2 (en) 2014-12-24 2017-10-03 Idex Asa Fingerprint sensor employing an integrated noise rejection structure
WO2016118683A1 (en) * 2015-01-23 2016-07-28 Corning Incorporated Coated substrate for use in sensors
USD776664S1 (en) * 2015-05-20 2017-01-17 Chaya Coleena Hendrick Smart card
CN108040494B (zh) 2015-06-23 2022-01-21 傲迪司威生物识别公司 双面指纹传感器
KR20170019581A (ko) 2015-08-12 2017-02-22 삼성전자주식회사 지문 감지 센서, 이를 포함하는 전자 장치 및 지문 감지 센서의 동작 방법
WO2017038196A1 (ja) * 2015-09-04 2017-03-09 シャープ株式会社 集積回路センサおよびセンサ基板
KR20170041010A (ko) * 2015-10-06 2017-04-14 삼성전기주식회사 지문센서용 기판, 지문센서 및 지문센서용 기판의 제조방법
CN105184287B (zh) * 2015-10-29 2019-10-01 京东方科技集团股份有限公司 一种电极结构、指纹识别模组及其制备方法、显示装置
US9898645B2 (en) * 2015-11-17 2018-02-20 Taiwan Semiconductor Manufacturing Company, Ltd. Fingerprint sensor device and method
US9875388B2 (en) 2016-02-26 2018-01-23 Taiwan Semiconductor Manufacturing Company, Ltd. Fingerprint sensor device and method
EP3606881A4 (en) 2017-04-04 2021-01-06 Corning Incorporated MULTI-LAYER STRUCTURE AND ITS MANUFACTURING PROCESS
WO2019004906A1 (en) * 2017-06-28 2019-01-03 Fingerprint Cards Ab METHOD FOR MANUFACTURING DIGITAL FOOTPRINT SENSOR MODULE
TWI705384B (zh) 2017-09-19 2020-09-21 挪威商藝達思公司 適合集成於電子裝置的雙面感測器模組
FR3111215B1 (fr) * 2020-06-04 2022-08-12 Linxens Holding Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module
KR20220013230A (ko) 2020-07-24 2022-02-04 삼성전자주식회사 지문 센서 패키지 및 이를 포함하는 스마트 카드
US11320935B1 (en) 2020-11-25 2022-05-03 Idex Biometrics Asa Touch sensors with multi-state electrodes

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63310087A (ja) * 1987-06-12 1988-12-19 Enitsukusu:Kk 接触式指紋入力装置
US5399898A (en) * 1992-07-17 1995-03-21 Lsi Logic Corporation Multi-chip semiconductor arrangements using flip chip dies
JPH04104377A (ja) * 1990-08-24 1992-04-06 Fujitsu Denso Ltd 指紋照合装置
US5371404A (en) * 1993-02-04 1994-12-06 Motorola, Inc. Thermally conductive integrated circuit package with radio frequency shielding
JP2871381B2 (ja) * 1993-03-30 1999-03-17 本田技研工業株式会社 圧力センサー
JP3550237B2 (ja) * 1994-12-26 2004-08-04 株式会社東芝 個人認証装置
FR2739977B1 (fr) * 1995-10-17 1998-01-23 France Telecom Capteur monolithique d'empreintes digitales
US5963679A (en) * 1996-01-26 1999-10-05 Harris Corporation Electric field fingerprint sensor apparatus and related methods
US5956415A (en) * 1996-01-26 1999-09-21 Harris Corporation Enhanced security fingerprint sensor package and related methods
FR2749955B1 (fr) 1996-06-14 1998-09-11 Thomson Csf Systeme de lecture d'empreintes digitales
US6020749A (en) * 1996-11-12 2000-02-01 Hewlett-Packard Company Method and apparatus for performing testing of double-sided ball grid array devices
US6259804B1 (en) * 1997-05-16 2001-07-10 Authentic, Inc. Fingerprint sensor with gain control features and associated methods
US5920640A (en) * 1997-05-16 1999-07-06 Harris Corporation Fingerprint sensor and token reader and associated methods
NO304766B1 (no) * 1997-06-16 1999-02-08 Sintef Fingeravtrykksensor
JP2959532B2 (ja) * 1997-06-30 1999-10-06 日本電気株式会社 静電容量検出方式の指紋画像入力装置
US6483931B2 (en) * 1997-09-11 2002-11-19 Stmicroelectronics, Inc. Electrostatic discharge protection of a capacitve type fingerprint sensing array
JP3102395B2 (ja) 1997-11-27 2000-10-23 日本電気株式会社 指紋検出装置
NO307065B1 (no) * 1998-02-26 2000-01-31 Idex As Fingeravtrykksensor
JP3400347B2 (ja) * 1998-05-18 2003-04-28 日本電信電話株式会社 表面形状認識用センサおよびその製造方法
US6026564A (en) * 1998-04-10 2000-02-22 Ang Technologies Inc. Method of making a high density multilayer wiring board
DE60032286T8 (de) * 1999-06-10 2007-09-27 Nippon Telegraph And Telephone Corp. Gerät zur Erkennung von Oberflächengestalten
JP2001141411A (ja) * 1999-11-12 2001-05-25 Sony Corp 指紋認識用半導体装置
JP2001208509A (ja) * 2000-01-24 2001-08-03 Sony Corp 表面形状認識用半導体装置およびその製造方法
NO315016B1 (no) 2000-06-09 2003-06-23 Idex Asa Miniatyrisert sensor
NO315017B1 (no) 2000-06-09 2003-06-23 Idex Asa Sensorbrikke, s¶rlig for måling av strukturer i en fingeroverflate
JP3971674B2 (ja) * 2002-07-10 2007-09-05 富士通株式会社 接触型センサ内蔵半導体装置及びその製造方法
JP3775601B2 (ja) * 2003-04-17 2006-05-17 セイコーエプソン株式会社 静電容量検出装置及びその駆動方法、指紋センサ並びにバイオメトリクス認証装置
JP3858864B2 (ja) * 2003-08-29 2006-12-20 セイコーエプソン株式会社 静電容量検出装置
KR100564915B1 (ko) * 2004-02-10 2006-03-30 한국과학기술원 정전용량방식 지문센서 및 이를 이용한 지문 센싱방법

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US7848550B2 (en) 2010-12-07
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WO2001099035A2 (en) 2001-12-27
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ATE384306T1 (de) 2008-02-15
NO315017B1 (no) 2003-06-23
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US20080002867A1 (en) 2008-01-03
JP2003536085A (ja) 2003-12-02
US7251351B2 (en) 2007-07-31
AU2001264429A1 (en) 2002-01-02
US20030161512A1 (en) 2003-08-28
EP1303828B1 (en) 2008-01-16
DE60132460D1 (de) 2008-03-06

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