CN2901578Y - High efficiency CPU heat radiator - Google Patents
High efficiency CPU heat radiator Download PDFInfo
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- CN2901578Y CN2901578Y CN 200620059183 CN200620059183U CN2901578Y CN 2901578 Y CN2901578 Y CN 2901578Y CN 200620059183 CN200620059183 CN 200620059183 CN 200620059183 U CN200620059183 U CN 200620059183U CN 2901578 Y CN2901578 Y CN 2901578Y
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- dividing plate
- current limliting
- cpu
- limliting dividing
- thermal conductor
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Abstract
This utility model discloses a high-performance CPU heating radiator comprising a sealed hollow heat transmission body whose most part of inner space is filled with heat emission liquid, wherein the hollow heat transmission body is with a shape of flat rectangular and the principal plane parallels with the main board plane, wherein one main board plane is connected with CPU for heat absorption, and an extended surface is provide on another main board plane. At least one current-limiting baffle board is provided in the position relative to the position of CPU, which divides the space in the hollow heat transmission body into at least two elongated cavities which are connected with each other on both ends. This utility model makes use of the principle that liquids produce countercurrent after being heated to control the countercurrent direction via the current-limiting baffle board to prevent the liquid with high temperature from accumulating at a machine base or the top of the heat transferring body, so that heat can be conducted to the machine base or every part of the heat transferring body achieving the effect of even heating.
Description
Technical field:
The utility model relates to field of computer technology, especially relates to a kind of cpu heat that CPU is overheated that is used for preventing.
Background technology:
In computer, in order to prevent that cpu temperature in the course of the work is too high and influence the use of machine, generally all be provided with radiator to CPU.Original cpu heat adds radiating fin by base and is formed, because the area of CPU only reaches 1/10～1/8 of base area, therefore the radiator of this form the temperature height of base central part in use will occur and environment temperature is low and away from the low phenomenon of temperature of the fin tips of base, radiating effect is not good near the radiating fin temperature of base is high.
For overcoming the existing shortcoming of above-mentioned cpu heat, other several multi-form cpu heat has appearred at present, see shown in the accompanying drawing 1: a kind of radiator of form is to change its base 01 into vaporium, through experimental results show that, vaporium can be delivered to heat each corner of base apace, make base temperature homogeneous everywhere, thereby solved existing first problem of above-mentioned original radiator, but this kind mode is subject to electronic component around the CPU and can not expands area.
Some design takes base 01 to extend upward more than one group for the liquid tank chamber that is parallel to the CPU plane adds and perpendicular to the turriform vaporium 02 on CPU plane in addition, the mode (seeing shown in accompanying drawing 2 and the accompanying drawing 3) that 03 of fin links to each other with turriform vaporium 02 perpendicular to the CPU plane.Because turriform vaporium 02 both sides can connect fin 03, so can increase area of dissipation, needn't have oversize fin 03, radiating fin 03 temperature that has solved close base 01 is high and away from the low problem of fin 03 terminal temperature of base 01.
But, above-mentioned vapor chamber heat sink has following shortcoming: reduce because it must vacuumize the boiling point that makes liquid, thereby need to use suitable vaccum-pumping equipment to reach perfectly sealing, otherwise the words that cause vacuum degree not reach even leak gas because of the deviation of manufacture craft, to cause product failure, so can not popularization and application until still thought unsettled product now by industry.
The utility model content:
The purpose of this utility model is the weak point that exists at prior art and a kind of high-effect cpu heat is provided, the heat that this cpu heat can make CPU distribute evenly is transmitted to the various piece of radiator, even prolong the length of radiator along the fin direction, what increased also is actual effectively area of dissipation, and can not cause the unsettled phenomenon of properties of product because of the manufacture craft factor.
For achieving the above object, the utility model comprises the hollow thermal conductor of a sealing, exhausted most space is perfused with radiator liquid in it, described hollow thermal conductor is the flattened rectangular shape, its primary flat and mainboard plane parallel, one of them primary flat contacts heat absorption with CPU, another primary flat then is provided with fin; With respect to the position of CPU, be provided with at least one current limliting dividing plate in described hollow thermal conductor, the current limliting dividing plate becomes plural strip hole with the separated by spaces in the hollow thermal conductor, and the strip hole is interconnected at its two ends.
Also be provided with baffler in the described hollow thermal conductor, the shape row becomes tortuous back and forth passage between baffler and the current limliting dividing plate.
Described current limliting dividing plate is a polylith, and wherein, the thickness of current limliting dividing plate that is positioned at the CPU both sides is thicker, and its middle part offers the groove that runs through thermal conductor, and groove gos deep into current limliting dividing plate inside, and its degree of depth is near the height of current limliting dividing plate, and length is then less than the current limliting dividing plate.
Described current limliting dividing plate be positioned at hollow thermal conductor middle part and with the CPU plane parallel
Described current limliting dividing plate and baffler are all polylith, and wherein, the current limliting divider upright is provided with in the CPU plane, and baffler then is parallel to the CPU plane and is provided with.
The height of the liquid level of radiator liquid is higher than the current limliting dividing plate.
The strip hole is cuboid or cylinder.
Described radiator liquid is a low-boiling point liquid.
The beneficial effect of utility model is: (1), it utilizes the principle that produces convection current behind the heated liquid, by the current limliting dividing plate come controlling liquid to flow path direction, make the high liquid that can not of temperature accumulate in the top of hollow thermal conductor, thereby heat is transmitted to each position of hollow thermal conductor fast, reaches equal thermal effect.
(2), the hollow thermal conductor is the flattened rectangular shape, its primary flat and mainboard plane parallel, one of them primary flat contacts heat absorption with CPU, opposite side is provided with fin, make fin be positioned at the CPU top, so the advantage of design is, in the process that rises gradually after the liquid heat absorption, can immediately heat be passed to fin, to accelerate radiating rate; And make self cooling simultaneously, increase density,, can not look like some other designs, after hydrothermal solution is raised to certain position, just begin heat transfer and give fin, cause hydrothermal solution to be accumulated in the top, not only slow the and reduction convection rate of heat radiation to keep the ability of convection current.
(2), fin is located at CPU top, makes radiator outward appearance of the present utility model with general current cpu heat is identical at present, so can be applied to immediately on the present PC, needn't change whole mechanism design.
(3), near the heat absorption back of the liquid CPU rises, and ensures that the CPU position can not be the hottest part.
(4), it not only goes for the vertically disposed situation of mainboard, also is applicable to the horizontally disposed situation of mainboard, versatility is preferable.
(5), it is than the easier assembling of vapor chamber heat sink, not necessarily will vacuumize, so the performance quite stable, can realize producing in batches.
Description of drawings:
Below in conjunction with accompanying drawing the utility model is described further:
Accompanying drawing 1 is the structural representation of one of existing C PU radiator
Accompanying drawing 2 is two a structural representation of existing C PU radiator
Accompanying drawing 3 is three a structural representation of existing C PU radiator
Accompanying drawing 4 is the structural representation of one of the utility model embodiment
Accompanying drawing 5 is that the A-A of accompanying drawing 4 is to one of sectional view
Accompanying drawing 6 is two the structural representation of the utility model embodiment
Accompanying drawing 7 is three the structural representation of the utility model embodiment
Accompanying drawing 8 is four the structural representation of the utility model embodiment
Accompanying drawing 9 is five the structural representation of the utility model embodiment
Accompanying drawing 10 is six the structural representation of the utility model embodiment
Accompanying drawing 11 is that the B-B of accompanying drawing 10 is to sectional view
Accompanying drawing 12 is seven the structural representation of the utility model embodiment
Accompanying drawing 13 is the oblique view of the current limliting dividing plate in the accompanying drawing 12
Accompanying drawing 14 is depicted as eight the structural representation of embodiment of the present utility model
Accompanying drawing 15 is the vertical view of accompanying drawing 14
Accompanying drawing 16 is the oblique view of accompanying drawing 14
Accompanying drawing 17 is depicted as nine the structural representation of embodiment of the present utility model
Accompanying drawing 18 is the inside current limliting dividing plate and the baffler stravismus location diagram of accompanying drawing 17
Accompanying drawing 19 is depicted as ten the structural representation of embodiment of the present utility model
Accompanying drawing 20 is depicted as 11 the structural representation of embodiment of the present utility model
Accompanying drawing 21 is the vertical view of accompanying drawing 20
Accompanying drawing 22 is the oblique view of accompanying drawing 20
Embodiment:
The following stated only is preferred embodiment of the present utility model, does not therefore limit protection range of the present utility model.
See shown in accompanying drawing 4 and the accompanying drawing 5: in this embodiment, cpu heat comprises that an inside is perfused with the low boiling radiator liquid (as the mixture of water, alcohol, acetone or former three, also can be the mixture of CFC and HCFC) hollow thermal conductor 10, hollow thermal conductor 10 vertically is provided with, its shape can be rectangle or square, and inner most space is perfused with the radiator liquid of convection current.One side of thermal conductor 10 is fixed with fin 20, and fin 20 can be and is horizontally disposed with, and also can be vertical setting, and the center position of opposite side (being the bottom surface) attaches CPU100.Position in hollow thermal conductor 10 inside with respect to CPU is provided with two current limliting dividing plates 30, and be provided with two bafflers 60 in addition, current limliting dividing plate 30 and baffler 60 all are respectively in the both sides of CPU100, and the spacing of middle two current limliting dividing plates 30 is equal to or slightly greater than the width of CPU100.The upper and lower side of current limliting dividing plate 30 and baffler 60 does not link to each other with the upper plate and the lower plate of base or thermal conductor 10, thus 5 strip holes 40 that become top and bottom to be interconnected the separated by spaces in base or the thermal conductor 10.In addition, for making things convenient for the circulation of radiator liquid, the height of the liquid level 50 of radiator liquid is higher than current limliting dividing plate 40.When CPU100 works, radiator liquid after being heated can only upwards flow, and be diffused into other each 40 places, hole to the left and right via those 40 tops, strip hole over against CPU100, cold liquid then flows to over against the bottom (shown in arrow among the figure) in that hole 40 of CPU from other hole 40 by the bottom connection in each hole, thereby finish convection process, reach the effect of Homogeneouslly-radiating.
Accompanying drawing 6 is depicted as two of embodiment of the present utility model, and in this embodiment, the sticking position of CPU departs from the center of thermal conductor 10 bottom surfaces, and all the other are identical with embodiment one.
Accompanying drawing 7 is depicted as three of embodiment of the present utility model, and in this embodiment, CPU100 is attached at thermal conductor 10 bottom surfaces one side, and all the other are identical with embodiment one.But need to prove: in this case, in fact only need a current limliting dividing plate 30 to play a role, and two current limliting dividing plates 30 needn't be set.
Accompanying drawing 8 is depicted as four of embodiment of the present utility model, baffler 60 is made of several straight plates parallel and vertical with current limliting dividing plate 30, the shape row becomes tortuous back and forth passage between baffler 60 and the current limliting dividing plate 30, make can flow through all positions of thermal conductor 10 bottom surfaces of hydrothermal solution, convection current liquid is got back to the CPU100 position from the below way after presenting tortuous back and forth up and down flowing.
Accompanying drawing 9 is depicted as six of embodiment of the present utility model, baffler 60 is a polylith, and it is vertical with current limliting dividing plate 30, the same passage of complications back and forth that forms between baffler 60 and the current limliting dividing plate 30, after the convection current heated liquid rises, after pressing from both sides back tortuous decline about presenting, get back to the CPU100 position from following square channel.
Accompanying drawing 12 and 13 is depicted as seven of embodiment of the present utility model, it is applicable to the horizontally disposed situation of mainboard, and also be horizontally disposed with as the liquid tank chamber of thermal conductor 10, by-level is provided with current limliting dividing plate 30 in the liquid tank chamber, level flowed to the four directions after current limliting dividing plate 30 central openings rose hydrothermal solution, and current limliting dividing plate 30 also has opening at four edges, makes top liquid can be back to the below.
Accompanying drawing 14～accompanying drawing 16 is depicted as eight of embodiment of the present utility model, it is applicable to the vertically disposed situation of mainboard, as we can see from the figure, thermal conductor 10 inside are synthesized by two different holes 40 of width, separate with a current limliting dividing plate 30 that is parallel to CPU therebetween, the height that is shorter in length than hole 40 of current limliting dividing plate 30 makes two holes 40 communicate in the upper-lower position place.
Shown in arrow among the figure, after at first absorbing heat, the radiator liquid in the narrower hole 40 of close CPU100 rise, and fin 20 is given in the hole 40 and the heat transfer that flow to another broad then, the formation convective activity
Accompanying drawing 17～18 is depicted as nine of embodiment of the present utility model, combination for above-mentioned example one and example seven, at the indoor current limliting dividing plate 30 of liquid tank perpendicular to the CPU plane, and baffler 60 and CPU plane parallel, so design makes the design's radiator both can be applicable to the vertically disposed situation of mainboard, also can be applicable to the horizontally disposed situation of mainboard.
Above-mentioned embodiment of the present utility model to nine, strip hole 40 shown in the figure is all cuboid, but also can become cylinder, ten of embodiment of the present utility model as shown in Figure 19, under the vertically disposed situation of mainboard, vertical cylinder bodily form strip hole is interconnected at two ends up and down, forms the passage of circulating fluid, same rises behind central part and CPU joint place heated liquid, produces convection current heat transferred is arrived position away from CPU.
Accompanying drawing 20～accompanying drawing 22 is depicted as 11 of embodiment of the present utility model, it is applicable to the vertically disposed situation of mainboard, be deriving of the embodiment eight shown in the accompanying drawing 14, as we can see from the figure, current limliting dividing plate 30 is a trihedral, be located at thermal conductor 10 inside, thermal conductor 10 inside are divided into two holes 40.
Claims (8)
1. high-effect cpu heat, it comprises the hollow thermal conductor (10) of a sealing, exhausted most space is perfused with radiator liquid in it, it is characterized in that: described hollow thermal conductor (10) is the flattened rectangular shape, its primary flat and mainboard plane parallel, one of them primary flat contacts heat absorption with CPU, another primary flat then is provided with fin (20); In described hollow thermal conductor (10) with respect to the position of CPU, be provided with at least one current limliting dividing plate (30), current limliting dividing plate (30) becomes plural strip hole (40) with the separated by spaces in the hollow thermal conductor (10), and strip hole (40) are interconnected at its two ends.
2. high-effect cpu heat according to claim 1 is characterized in that: also be provided with baffler (60) in the described hollow thermal conductor (10), the shape row becomes tortuous back and forth passage between baffler (60) and the current limliting dividing plate (30).
3. high-effect cpu heat according to claim 2, it is characterized in that: described current limliting dividing plate (30) is a polylith, wherein, the thickness of current limliting dividing plate (30) that is positioned at the CPU both sides is thicker, its middle part offers the groove (31) that runs through thermal conductor (10) surface, groove (31) gos deep into current limliting dividing plate (30) inside, and its degree of depth is near the height of current limliting dividing plate (30), and length is then less than current limliting dividing plate (30).
4. high-effect cpu heat according to claim 1 is characterized in that: described current limliting dividing plate (30) be positioned at hollow thermal conductor (10) middle part and with the CPU plane parallel.
5. high-effect cpu heat according to claim 2, it is characterized in that: described current limliting dividing plate (30) and baffler (60) are all polylith, wherein, current limliting dividing plate (30) is provided with perpendicular to the CPU plane, and baffler (60) then is parallel to the CPU plane and is provided with.
6. according to each described high-effect cpu heat in the claim 1 to 5, it is characterized in that: the height of the liquid level of radiator liquid (50) is higher than current limliting dividing plate (30).
7. high-effect cpu heat according to claim 6 is characterized in that: strip hole (40) are cuboid or cylinder.
8. high-effect cpu heat according to claim 7 is characterized in that: described radiator liquid is a low-boiling point liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620059183 CN2901578Y (en) | 2006-05-22 | 2006-05-22 | High efficiency CPU heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620059183 CN2901578Y (en) | 2006-05-22 | 2006-05-22 | High efficiency CPU heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2901578Y true CN2901578Y (en) | 2007-05-16 |
Family
ID=38085742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620059183 Expired - Fee Related CN2901578Y (en) | 2006-05-22 | 2006-05-22 | High efficiency CPU heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2901578Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101835367B (en) * | 2010-05-11 | 2012-04-25 | 电子科技大学 | Air-cooling and liquid-cooling combined type heat radiating system |
| CN103748682A (en) * | 2011-05-31 | 2014-04-23 | 赛方塊股份有限公司 | Laminated module and interposer used in same |
-
2006
- 2006-05-22 CN CN 200620059183 patent/CN2901578Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101835367B (en) * | 2010-05-11 | 2012-04-25 | 电子科技大学 | Air-cooling and liquid-cooling combined type heat radiating system |
| CN103748682A (en) * | 2011-05-31 | 2014-04-23 | 赛方塊股份有限公司 | Laminated module and interposer used in same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |