CN2883920Y - Radiation structure for closed LED system - Google Patents

Radiation structure for closed LED system Download PDF

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Publication number
CN2883920Y
CN2883920Y CNU2005200099051U CN200520009905U CN2883920Y CN 2883920 Y CN2883920 Y CN 2883920Y CN U2005200099051 U CNU2005200099051 U CN U2005200099051U CN 200520009905 U CN200520009905 U CN 200520009905U CN 2883920 Y CN2883920 Y CN 2883920Y
Authority
CN
China
Prior art keywords
emitting diode
diode system
light
fin
airtight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2005200099051U
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Chinese (zh)
Inventor
方亮
张淑芳
刘高斌
秦友兰
肖鹏
廖克俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chongqing University
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Chongqing University
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Filing date
Publication date
Application filed by Chongqing University filed Critical Chongqing University
Priority to CNU2005200099051U priority Critical patent/CN2883920Y/en
Application granted granted Critical
Publication of CN2883920Y publication Critical patent/CN2883920Y/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a heat removal structure used for the airtight light emitting diode system, which is characterized in that the back of the circuit board comprising a plurality of light emitting diodes is covered with a radiation fin capable of both conducting heat and isolating. A support is attached between the heat radiator and the metal enclosure. The utility model has the advantages of having simple structure and low production cost, conducting the intersystem heat effectively, and improving the system life effectively.

Description

A kind of radiator structure that is used for airtight light-emitting diode system
Technical field
The utility model relates to a kind of semiconductor lighting engineering application technology, especially relates to a kind of radiator structure that is used for airtight light-emitting diode system.
Background technology
The serious heating problem of ubiquity in high-power and high density LED (LED) system, the rising of junction temperature make the very fast reduction of the luminous intensity of LED even the ability of losing the job.Especially under water in airtight LED such as lamp decoration system, heat dissipation problem is even more serious, and general operating ambient temperature may be higher than 80-90 ℃, near or surpassed the limiting temperature of LED and electronic component, cause LED and electronic component to lose the operate as normal ability very soon, even burn very soon.Therefore, the heating problem that solves under high-power and high density LED system, the especially closed environment is one of key technology of promoting the semiconductor lighting engineering.
Think, cause the reason of airtight LED system radiating difficulties such as lamp decoration under water to be: have heat sinking function metal shell because conduction can not with LED pin or circuit board between contact, cause only relying between LED and the metal shell air to conduct heat, the air thermal resistance is big, thermal conductivity is low, reduced the radiating efficiency of metal shell, the heating that makes electronic component produce can't effectively remove, and is particularly serious in closed system.
Summary of the invention
The purpose of this utility model provides a kind of LED system of energy efficiently radiates heat, its technical solution is: a kind of radiator structure that is used for airtight light-emitting diode system is characterized in that: be coated with the fin that heat conduction is insulated again at the wiring board back side that light emitting diode is housed.Between fin and metal shell, be connected with support.
Described fin or be the film shape, or be block.Its shape or be square, or be circular, or be polygon, or be only to cover the netted of led pins.Described fin is made up of one or more layers insulating materials.Described fin is the combination of any one or they in the materials such as diamond, DLC, aluminium nitride, silicon nitride, boron nitride, carborundum, silica, beryllium oxide, non-crystalline silicon, polysilicon.
The described combination that is supported for any one or they in the metal materials such as copper, aluminium, silver.Its shape or be cylinder, or be ring cylinder.
The utility model has the advantages that: simple in structure, production cost is low, the heat of internal system effectively can be conducted, and can effectively improve lifetime of system.
Description of drawings
Accompanying drawing is a structure chart of the present utility model.
In the accompanying drawing, 1 is light emitting diode, and 2 is wiring board, and 3 is plastic casing, and 4 is transparent glass, and 5 is metal shell, and 6 is fin, and 7 for supporting.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is further described.
Referring to accompanying drawing, light emitting diode 1, wiring board 2, plastic casing 3, transparent glass 4 and metal shell 5 constitute an airtight light-emitting diode system, a kind of radiator structure that is used for airtight light-emitting diode system is characterized in that: the fin 6 that is coated with not only heat conduction at wiring board 2 back sides that light emitting diode 1 is housed but also insulate.Between fin 6 and metal shell 5, be connected with and support 7.The utility model has changed the radiating mode that present LED system relies on air to conduct heat, and fin 6 has adopted the high heat conductive insulating material that can insulate and have the good heat conductive performance, can combine closely with heater element, has promoted radiating efficiency.
Described fin 6 or be the film shape, or be piece (sheet) shape.Its shape or be rectangle, or be circular, or be polygon, or be pin netted that only covers light emitting diode 1.Fin 6 can be the combination of any one or they in diamond, DLC, aluminium nitride, silicon nitride, boron nitride, carborundum, silica, beryllium oxide, non-crystalline silicon, the polysilicon etc.
Described support 7 is the combination of any one or they in the heat conductivility good metal materials such as copper, aluminium, silver, has the effect of auxiliary heat dissipation.Described support 7 or be cylinder, or be ring cylinder.

Claims (8)

1, a kind of radiator structure that is used for airtight light-emitting diode system is characterized in that: the fin (6) that is coated with insulation at the wiring board that light emitting diode (1) is housed (2) back side.
2, the radiator structure that is used for airtight light-emitting diode system according to claim 1 is characterized in that: be connected with support (7) between fin (6) and metal shell (5).
3, the radiator structure that is used for airtight light-emitting diode system according to claim 1 is characterized in that: described fin (6) or for the film shape, or be piece/sheet.
4, the radiator structure that is used for airtight light-emitting diode system according to claim 3 is characterized in that: the shape of described fin (6) or for square, or be circular, or be polygon, or be only to cover the netted of light emitting diode (1) pin.
5, according to claim 1, the 3 or 4 described radiator structures that are used for airtight light-emitting diode system, it is characterized in that: described fin (6) is made up of one or more layers insulating materials, and the thickness of every layer of insulating materials is 0.001 μ m-5000 μ m.
6, according to claim 1, the 3 or 4 described radiator structures that are used for airtight light-emitting diode system, it is characterized in that: described fin (6) is the combination of any one or they in the diamond, DLC, aluminium nitride, silicon nitride, boron nitride, carborundum, silica, beryllium oxide, non-crystalline silicon, polysilicon.
7, the radiator structure that is used for airtight light-emitting diode system according to claim 2 is characterized in that: support the combination that (7) are any one or they in copper, aluminium, the silver.
8, the radiator structure that is used for airtight light-emitting diode system according to claim 2 is characterized in that: described support (7) or for cylinder, or be ring cylinder.
CNU2005200099051U 2005-09-05 2005-09-05 Radiation structure for closed LED system Expired - Fee Related CN2883920Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2005200099051U CN2883920Y (en) 2005-09-05 2005-09-05 Radiation structure for closed LED system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2005200099051U CN2883920Y (en) 2005-09-05 2005-09-05 Radiation structure for closed LED system

Publications (1)

Publication Number Publication Date
CN2883920Y true CN2883920Y (en) 2007-03-28

Family

ID=37956981

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2005200099051U Expired - Fee Related CN2883920Y (en) 2005-09-05 2005-09-05 Radiation structure for closed LED system

Country Status (1)

Country Link
CN (1) CN2883920Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102931333A (en) * 2012-11-08 2013-02-13 杭州天柱科技有限公司 White-light light-emitting diode (LED) apparatus using cubic boron nitride film to promote radiation of chips

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102931333A (en) * 2012-11-08 2013-02-13 杭州天柱科技有限公司 White-light light-emitting diode (LED) apparatus using cubic boron nitride film to promote radiation of chips

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C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee