CN2842544Y - Electronic apparatus with rediating module - Google Patents
Electronic apparatus with rediating module Download PDFInfo
- Publication number
- CN2842544Y CN2842544Y CN 200520109114 CN200520109114U CN2842544Y CN 2842544 Y CN2842544 Y CN 2842544Y CN 200520109114 CN200520109114 CN 200520109114 CN 200520109114 U CN200520109114 U CN 200520109114U CN 2842544 Y CN2842544 Y CN 2842544Y
- Authority
- CN
- China
- Prior art keywords
- radiating module
- electronic installation
- radiating
- heat exchanger
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses an electronic apparatus with a heat radiating module. The utility model comprises a circuit plate, a central processing unit, a chip group, a first heat radiating module, a second heat radiating module and a fan, wherein the central processing unit and the chip group are arranged at the circuit plate, the first heat radiating module is arranged at the central processing unit, the second heat radiating module is arranged at the chip group, the fan and the first heat radiating module are connected with the circuit plate in an adjacent mode, and the first heat radiating module and the second heat radiating module are connected with the circuit plate in an adjacent mode.
Description
Technical field
The utility model relates to a kind of electronic installation with radiating module, particularly relates to a kind of electronic installation with the radiating module that can increase heat dissipation.
Background technology
Along with every electronic apparatus functions day by day increases, the chip that is positioned on the circuit board the every function of control also increases many, so the central processing unit treatment efficiency is also increasingly important.In order to increase the treatment efficiency of central processing unit, just must increase its running speed, so the heat energy in the electronic installation also increases thereupon, still be present problem so how to improve the heat dissipation of central processing unit.
Moreover, because the electronic installation size also is tending towards small and exquisite frivolous, so the space of circuit board also diminishes thereupon, but central processor utilizes different radiating modules to dispel the heat with chipset at present, not only do not improve the heat dissipation of central processing unit, in addition, two space and weight that fan is shared allow lighter and handier that the volume of electronic installation and weight can't become.
The utility model content
In view of this, the utility model provides a kind of electronic installation with two radiating modules of a fan combination, and it has the heat dissipation that improves central processing unit.
The purpose of this utility model is to provide a kind of electronic installation with radiating module, can increase heat dissipation.
According to the utility model, a kind of electronic installation with radiating module is provided, comprise a circuit board, one central processing unit, one chipset, one first radiating module, one second radiating module, an and fan, wherein central processing unit is arranged on the circuit board, chipset is arranged on the circuit board, first radiating module is arranged on the central processing unit, second radiating module is arranged on the chipset, fan is arranged on the circuit board, and the fan and first radiating module are connected on the circuit board in adjacent mode, and first radiating module and second radiating module are connected on the circuit board in adjacent mode.
In a preferred embodiment, first radiating module comprises one first heat pipe and one first heat exchanger, and second radiating module comprises one second heat pipe and one second heat exchanger.
In another preferred embodiment, first heat pipe is connected with the mode of central processing unit with contact.
In another preferred embodiment, first heat pipe is connected with first heat exchanger.
In another preferred embodiment, first heat pipe is connected with the mode of first heat exchanger with mutual bonding.
In another preferred embodiment, second heat pipe is connected with the mode of chipset with contact.
In another preferred embodiment, second heat pipe is connected with this second heat exchanger.
In another preferred embodiment, second heat pipe is connected with the mode of second heat exchanger with mutual bonding.
In another preferred embodiment, have a plurality of first radiating fins on first heat exchanger, and have a plurality of second radiating fins on second heat exchanger.
In another preferred embodiment, have one first between any two first adjacent radiating fins at interval, and have one second between any two second adjacent radiating fins at interval, and first is provided with in mode aligned with each other at interval with second at interval.
In another preferred embodiment, second radiating fin on second heat exchanger can be arranged and form a notch part, and notch part makes to win has a space between the radiating fin and second radiating fin.
In another preferred embodiment, look being shaped as a U font or a V-shape on the notch part.
In another preferred embodiment, electronic installation is a mobile computer.
Advantage of the present utility model is that it can improve the heat dissipation of central processing unit, and it is little to take up space with two radiating modules of a fan combination, thereby makes lighter and handier that the volume of its electronic installation and weight can't become.
Description of drawings
Fig. 1 is the floor map that the utlity model has the electronic installation of radiating module;
Fig. 2 is the part end perspective view of radiating module among Fig. 1;
Fig. 3 is another distortion end perspective view of part of radiating module among Fig. 1;
Fig. 4 is another distortion end perspective view of part of radiating module among Fig. 1.
Embodiment
With reference to figure 1, the electronic installation 1 that the utlity model has radiating module comprises a circuit board 2, a central processing unit 3, a chipset 4, one first radiating module 5, one second radiating module 6 and a fan 7.
Central processing unit 3 is arranged on the circuit board 2 with chipset 4, first radiating module 5 is arranged on the central processing unit 3, and comprise one first heat pipe 51 and one first heat exchanger 52, wherein first heat pipe 51 contacts with central processing unit 3, and first heat pipe 51 binds mutually with first heat exchanger 52 and is connected, with reference to having a plurality of first radiating fin 52a on figure 2, the first heat exchangers 52, has one first interval 52b between any two first adjacent radiating fin 52a in addition.
Refer again to Fig. 1, second radiating module 6 is arranged on the chipset 4, and comprise one second heat pipe 61 and one second heat exchanger 62, wherein second heat pipe 61 contacts with chipset 4, and second heat pipe 61 binds mutually with second heat exchanger 62 and is connected, in addition with reference to figure 2, have a plurality of second radiating fin 62a on second heat exchanger 62, any two second adjacent radiating fin 62a have one second 62b at interval, and first on first heat exchanger 52 at interval 52b be provided with in the mode of aliging mutually with the second interval 62b on second heat exchanger 62.In addition, first heat exchanger 52 and second heat exchanger 62 are arranged on the circuit board 2 in adjacent mode, wherein, the first radiating fin 52a is corresponding with the position of the second radiating fin 62a, as shown in Figure 1, fan 7 then is connected on the circuit board 2 with the tight adjacent mode and first heat exchanger 52.
Refer again to Fig. 1, because the consideration of location tolerance, making wins must exist a minimum clearance C between the heat exchanger 52 and second heat exchanger 62
1In addition, can arrange formation one notch part 62c with reference to the second radiating fin 62a on figure 2, the second heat exchangers 62, look shape on the notch part 62c and can be a U font, notch part 62c makes to win and has more a space C between the radiating fin 52a and the second radiating fin 62a
2
When using this electronic installation 1, the heat that is produced during central processing unit 3 runnings can be passed on first heat pipe 51 of first radiating module 5, first heat pipe 51 is again with heat transferred to the first heat exchanger 52, owing to have a plurality of first radiating fin 52a on first heat exchanger 52, can increase its area of dissipation; And the heat during chipset 4 running then utilizes second heat pipe 61 on second radiating module 6 with heat transferred to the second heat exchanger 62, and increases area of dissipation by a plurality of second radiating fin 62a on second heat exchanger 62.
When fan 7 running, the distinguished and admirable meeting of fan 7 with the heat band on the first radiating fin 52a from, the heat dissipation of OverDrive CPU 3; Then, clearance C is crossed in wind circulation
1, and, know clearly it in notch part 62c place's rectification, because the space C of notch part 62c
2Make by the first radiating fin 52a be cut distinguished and admirable, can pool together again, reduce distinguished and admirable effect of boundary layer, then distinguished and admirable meeting becomes to pass through the second radiating fin 62a than even velocity, and take away the heat that is passed on the second radiating fin 62a equably, make that the heat on the chipset 4 is able to dissipation.Therefore, fan 7 of the utility model utilization can be reached simultaneously with the purpose of central processing unit 3 with chipset 4 heat radiations, and has improved the heat dissipation of central processing unit 3, makes electronic installation 1 can can't dissipation not damage because of heat energy.In addition, the electronic installation 1 that the utlity model has radiating module can be a mobile computer, does not use on mobile computer but only do not limit, and can be used on the electronic installation of any needs two radiating modules.
It should be noted that the number of the first radiating fin 51a and the second radiating fin 61a and shape do not limit as Fig. 2 to shown in Figure 4.
It should be noted, look shape on the notch part 62c and do not limit as shown in Figure 2, also can be V-shape shown in Figure 3, or as shown in Figure 4, make notch part 62c on look and be shaped as one flat mouthful of shape.
Claims (14)
1. the electronic installation with radiating module is characterized in that, comprising: a circuit board; One central processing unit is arranged on this circuit board: a chipset is arranged on this circuit board; One first radiating module is arranged on this central processing unit; One second radiating module is arranged on this chipset; And a fan, be arranged on this circuit board, wherein this fan and this first radiating module are connected on this circuit board in adjacent mode, and this first radiating module and this second radiating module are connected on this circuit board in adjacent mode.
2. the electronic installation with radiating module as claimed in claim 1 is characterized in that, this first radiating module comprises one first heat pipe and one first heat exchanger, and second radiating module comprises one second heat pipe and one second heat exchanger.
3. the electronic installation with radiating module as claimed in claim 2 is characterized in that, this first heat pipe is connected with the mode of this central processing unit with contact.
4. the electronic installation with radiating module as claimed in claim 2 is characterized in that, this first heat pipe is connected with this first heat exchanger.
5. the electronic installation with radiating module as claimed in claim 4 is characterized in that, this first heat pipe is connected with the mode of this first heat exchanger with mutual bonding.
6. the electronic installation with radiating module as claimed in claim 2 is characterized in that, this second heat pipe is connected with the mode of this chipset with contact.
7. the electronic installation with radiating module as claimed in claim 2 is characterized in that, this second heat pipe is connected with this second heat exchanger.
8. the electronic installation with radiating module as claimed in claim 7 is characterized in that, this second heat pipe is connected with the mode of this second heat exchanger with mutual bonding.
9. the electronic installation with radiating module as claimed in claim 2 is characterized in that, has a plurality of first radiating fins on this first heat exchanger, and has a plurality of second radiating fins on this second heat exchanger.
10. the electronic installation with heat abstractor as claimed in claim 9, it is characterized in that, have one first between any two first adjacent radiating fins at interval, and have one second between any two second adjacent radiating fins at interval, and this first interval is provided with in mode aligned with each other with this second interval.
11. the electronic installation with radiating module as claimed in claim 9 is characterized in that, this second radiating fin on this second heat exchanger can be arranged and form a notch part, and this notch part makes between this first radiating fin and this second radiating fin a space.
12. the electronic installation with radiating module as claimed in claim 11 is characterized in that, looks on this notch part to be shaped as a U font.
13. the electronic installation with heat abstractor as claimed in claim 11 is characterized in that, looks on this notch part to be shaped as a V-shape.
14. the electronic installation with heat abstractor as claimed in claim 1 is characterized in that, this electronic installation is a mobile computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520109114 CN2842544Y (en) | 2005-06-14 | 2005-06-14 | Electronic apparatus with rediating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520109114 CN2842544Y (en) | 2005-06-14 | 2005-06-14 | Electronic apparatus with rediating module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2842544Y true CN2842544Y (en) | 2006-11-29 |
Family
ID=37446423
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520109114 Expired - Lifetime CN2842544Y (en) | 2005-06-14 | 2005-06-14 | Electronic apparatus with rediating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2842544Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103188914A (en) * | 2011-12-29 | 2013-07-03 | 富瑞精密组件（昆山）有限公司 | Radiating module |
| CN108021181A (en) * | 2016-10-31 | 2018-05-11 | 研祥智能科技股份有限公司 | Reinforced notebook computer computer and its cooling system |
-
2005
- 2005-06-14 CN CN 200520109114 patent/CN2842544Y/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103188914A (en) * | 2011-12-29 | 2013-07-03 | 富瑞精密组件（昆山）有限公司 | Radiating module |
| CN108021181A (en) * | 2016-10-31 | 2018-05-11 | 研祥智能科技股份有限公司 | Reinforced notebook computer computer and its cooling system |
| CN108021181B (en) * | 2016-10-31 | 2023-11-24 | 研祥智慧物联科技有限公司 | Reinforced notebook computer and heat dissipation system thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20150614 Granted publication date: 20061129 |