CN2833890Y

CN2833890Y - Heat radiator

Info

Publication number: CN2833890Y
Application number: CN 200520060304
Authority: CN
Inventors: 张璇; 肖荣建; 谭培波; 杨朝晖
Original assignee: ZTE Corp
Current assignee: ZTE Corp
Priority date: 2005-06-18
Filing date: 2005-06-18
Publication date: 2006-11-01
Anticipated expiration: 2015-06-18

Abstract

The utility model discloses a heat radiator comprises a base plate and one or more adjusting assemblies, wherein the base plate is upwardly protruded with a plurality of heat radiating fins and is at least provided with a through hole. Each adjusting assembly is provided with a bottom seat, wherein the outer surface of the bottom seat and the inner surface of the through hole of the base plate are matched in the clearance and can be movably arranged in the through hole of the base plate. Under the action of the pressure, the bottom surfaces of the bottom seats of the adjusting assemblies are tightly bonded with a heating element. The heat radiator can adapt the high variation of the heating element through the adjusting assemblies and achieve the heat radiation of different-height heating elements.

Description

A kind of heat abstractor

Technical field:

The utility model relates to a kind of heat abstractor, relates to a kind of better device of heat radiation of the euthermic chip on the circuit board that makes more specifically.

Background technology:

Along with the development of technology, the power of heater is more and more higher, and volume is more and more littler, and is more and more higher to the requirement of heat abstractor; Particularly along with development of semiconductor, the integrated level of chip is more and more higher, and function is more and more strong, but chip power-consumption also along with increase, the single-chip power consumption reaches the level of hectowatt, and heat radiation is had higher requirement.At first require radiator that bigger heat-sinking capability can be provided, moreover the thermal resistance between requirement and the heater is little, this just needs heat abstractor well to contact with heater.

Existing method be by the higher material of some conductive coefficients for example adhesive tape, heat conduction film, heat-conducting glue etc. heat abstractor is bonded on the heater, the material of perhaps all or part of use high heat dissipation efficiency is the copper production heat abstractor for example.But in this case, because the height of heater can change, for example chip is because the factor of making and welding, a scope is highly arranged, in order to guarantee that heat abstractor can satisfy the needs of all heaters, need the certain thickness of needs such as grafting material between heat abstractor and the heater such as adhesive tape, heat conduction film, heat-conducting glue, varied in thickness by grafting material adapts to the chip height variation, because the thickness effect of grafting material, can cause heat abstractor can not well contact with radiator, thermal resistance is bigger, the heat dispersion variation; Another situation, the grafting material thickness between heat abstractor and the heater is less, changes because the chip height variation can cause the total height after the installation, to system's generation considerable influence of needs control height; Generally need apply certain pressure in this case, the strong point can cause the deformation of heater or substrate at heater or substrate.

The utility model content:

The utility model purpose is to provide a kind of heat abstractor, guarantees that heater contacts with heat abstractor, and can adapt to the variation of heater height.

The utility model provides a kind of heat abstractor, comprises a substrate, one or more adjusting parts; Described substrate upwards stretches out some radiating fins, and described substrate is provided with at least one through hole; Described adjusting part is provided with a base, is matched in clearance between the outer surface of wherein said base and the inner surface of described substrate through-hole, in the through hole that is attached to described substrate movable up and down; Described adjusting part under pressure, closely amplexiform with heater element the bottom surface of its base.

Described substrate also is provided with a pillar in advance, and amplexiform mutually with one of them heater element the bottom surface of described pillar; Then described heat abstractor, when N heater element, this heat abstractor correspondence is provided with N-1 through hole, and N-1 adjusting part.

Described heat abstractor, corresponding each heater element, correspondence is provided with a through hole and an adjusting part.

The through hole of described substrate is circular, and the base correspondence of described adjusting part also is circular.

Described heat abstractor is provided with the plurality of fixed element, by described retaining element, fixes with the locking hole on the circuit board at heater element place.

The base of described adjusting part also upwards stretches out some radiating fins.

Described adjusting part is that copper material is made, and described substrate is made with aluminium.

The utility model closely contacts with heater by adjusting part, guarantees that the heat of heater element is transmitted to the heat abstractor substrate by adjusting part as early as possible, again by having the substrate heat radiation of the fin of area of dissipation greatly.In addition, the adjusting part of heat abstractor can adapt to the variation of heater element height, realizes the heat radiation to the differing heights heater element.

Description of drawings:

Engaging drawings and Examples below is described further the utility model.

Fig. 1 is the utility model heat abstractor three-dimensional exploded view;

Fig. 2 is a circuit board of using the utility model heat radiation;

Fig. 3 is the three-dimensional composition diagram of the utility model heat abstractor;

Fig. 4 is the end view of the utility model heat abstractor combination;

Fig. 5 is the vertical view of the utility model heat abstractor;

Fig. 6 is the A-A cutaway view of Fig. 5.

Embodiment:

Be example with the heat radiation of the euthermic chip on the circuit board below, introduce the composition of the utility model heat abstractor in conjunction with the accompanying drawings, and operation principle.

Fig. 1 is the utility model heat abstractor three-dimensional exploded view.Some radiating fins 32 that substrate 3 upwards stretches out, substrate plurality of fixed original paper 34, respectively establish a fixedly original paper 34 at substrate 3 four jiaos in the present embodiment, the substrate middle part offers a through hole 36, can be difformity, present embodiment is circular, and this manhole has an annular inner surface 38, the substrate 3 one sides also euthermic chip 10 on the corresponding circuits plate 1 are fixed with a pillar 40, can be the copper post; Adjusting part 5, comprise a base 50, base is circular in the present embodiment, and the some fins 52 that upwards stretch out by this base 50, the cup dolly 50 of this adjusting part 5 has an annular outer surface 54, wherein the external diameter of this base 50 is slightly less than the internal diameter of through hole 36, thereby is matched in clearance between the inner surface 38 of the through hole 36 of the annular outer surface 54 of base 50 and substrate 3, thereby makes in the through hole that is attached to this substrate 3 36 that this adjusting part 5 can be up and down.The outer surface 54 of base 50 and the inner surface of through hole 36 can be other shapes, as long as the two can matched in clearance.

Fig. 2 is a circuit board of using the utility model heat radiation.Circuit board 1 is provided with two

euthermic chips

10,12, and four locking holes 14.Here euthermic chip is the heating original paper.

Fig. 3 is the three-dimensional composition diagram of the utility model heat abstractor.

Fig. 4 is the end view of the utility model heat abstractor combination;

Fig. 5 is the vertical view of the utility model heat abstractor;

Fig. 6 is the A-A cutaway view of Fig. 5.

The operation principle of the utility model heat abstractor is as follows.Earlier in the locking hole 14 of circuit board 1, coat welding material, with four fixedly an end correspondence of original paper 34 be punctured in four locking holes 14 of this circuit board 1, thereby the substrate 3 of heat abstractor is attached on the circuit board 1, makes the bottom surface of the copper post 40 of substrate 3 amplexiform the end face of euthermic chip 10.With adjusting part 5 welding or be bonded in by heat-conducting glue in the through hole 36 of substrate 3, make the bottom surface of the base 50 of this adjusting part 5 tentatively amplexiform the end face of euthermic chip 12.Then, re-use a pressue device, apply respectively on the substrate 3 and adjusting part 5 that suitable pressure acts on heat abstractor, make the bottom surface of base 50 of copper post 40, adjusting part 5 of heat abstractor substrate 3 closely amplexiform with

euthermic chip

10,12 respectively.

Claims

1, a kind of heat abstractor is characterized in that: comprise a substrate, one or more adjusting parts; Described substrate upwards stretches out some radiating fins, and described substrate is provided with at least one through hole; Described adjusting part is provided with a base, is matched in clearance between the outer surface of wherein said base and the inner surface of described substrate through-hole, in the through hole that is attached to described substrate movable up and down; Described adjusting part under pressure, closely amplexiform with heater element the bottom surface of its base.

2, heat abstractor according to claim 1 is characterized in that: described substrate also is provided with a pillar in advance, and amplexiform mutually with one of them heater element the bottom surface of described pillar.

3, heat abstractor according to claim 2 is characterized in that: when N heater element, this heat abstractor correspondence is provided with N-1 through hole, and N-1 adjusting part.

4, heat abstractor according to claim 1 is characterized in that: described heat abstractor, and corresponding each heater element, correspondence is provided with a through hole and an adjusting part.

5, according to claim 1 or 3 or 4 described heat abstractors, it is characterized in that: the through hole of described substrate is circular, and the base correspondence of described adjusting part also is circular.

6, heat abstractor according to claim 5 is characterized in that: described heat abstractor is provided with the plurality of fixed element, by described retaining element, fixes with the locking hole on the circuit board at heater element place.

7, heat abstractor according to claim 6 is characterized in that: the base of described adjusting part also upwards stretches out some radiating fins.

8, heat abstractor according to claim 1 is characterized in that: described adjusting part is that copper material is made, and described substrate is made with aluminium.