CN2824518Y - Mobile terminal apparatus with heat storage material - Google Patents
Mobile terminal apparatus with heat storage material Download PDFInfo
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- CN2824518Y CN2824518Y CN 200520108690 CN200520108690U CN2824518Y CN 2824518 Y CN2824518 Y CN 2824518Y CN 200520108690 CN200520108690 CN 200520108690 CN 200520108690 U CN200520108690 U CN 200520108690U CN 2824518 Y CN2824518 Y CN 2824518Y
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- storage units
- heat storage
- heat
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Abstract
The utility model discloses a mobile terminal apparatus with heat storage material. The apparatus comprises a casing and components positioned at an internal printed circuit board and also comprises at least one heat storage unit containing heat storage material, and the heat storage unit is arranged at a heat generating component place of a mobile terminal and is used for absorbing the heat released by the heat generating component. The mobile terminal of the utility model can absorb the generated heat when the mobile terminal is operated through arranging the heat storage unit, and the temperature rising speed can be lowered when the mobile terminal is operated; thereby, the customer satisfaction degree can be improved and the long time reliability of the mobile terminal can be improved.
Description
Technical field
The utility model relates to mobile terminal design, refers to a kind of mobile terminal apparatus with heat accumulating especially.
Background technology
Development along with radio communication and chip encapsulation technology, increasing function just is being integrated on the small-sized portable terminal, such as: smart mobile phone equipment (Smart Phone), personal digital assistant (PDA, Personal Digital Assistant), palmtop PC, Personal Handyphone System etc., such power consumption of mobile terminals corresponding presenting significantly increases trend.Yet customer demand and competitive pressure force portable terminal manufacturer to pursue the miniaturization of equipment volume.This development trend of mobile terminal design causes the heat generation density of unit volume to increase, and in limited space, inside, can't adopt heat dissipation technologys such as fan, radiator or heat pipe to reduce temperature again, and this brings very big challenge for the portable terminal thermal design.
At present, thermal design that portable terminal is carried out and test are based on the steady-state analysis under the maximum transmission power mostly.But, from market reaction, the user complained in the short period of initial conversation, in 20 minutes, just obviously sensation portable terminal heating, promptly the user to the portable terminal temperature rise feel it is a complex psychological process, and not exclusively be to reach the concrete temperature rise value after the stable state, so in actual the use, the control temperature rise speed is only the focus of portable terminal thermal design.
For avoiding customer complaint, reduce temperature rise speed, improve thermal inertia, portable terminal manufacturer is forced to increase size of mobile terminals and quality.Increase size of mobile terminals and can increase area of dissipation, reduction reaches the maximum temperaturerise after the stable state, thereby reduces temperature rise speed; And for the portable terminal with identical hear rate, increase quality and can improve thermal inertia, lengthening reaches the stable state required time, also can reach the purpose that reduces temperature rise speed.But this mode does not meet the designer trends that size of mobile terminals diminishes, quality lightens, so be difficult for being accepted by market and user.
The utility model content
In view of this, main purpose of the present utility model is to provide a kind of mobile terminal apparatus with heat accumulating, when hear rate is big, with the cost of the increase portable terminal size of minimum, the temperature rise speed when reducing portable terminal work.
For achieving the above object, the technical solution of the utility model specifically is achieved in that
A kind of mobile terminal apparatus with heat accumulating, comprise: shell and be positioned at device on the internal printed circuit board, it is characterized in that, this device also comprises: at least one comprises the heat storage units of heat accumulating, be arranged on the heat generating components place of portable terminal, be used to absorb the heat that heat generating components discharges.
Preferably, described heat accumulating is a solid-solid phase transition material.
Further, described heat storage units also comprises the seal box that is used to hold heat accumulating.
Preferably, described heat accumulating is solid-liquid phase change material or reversible chemical reaction material.
Further, described heat generating components is at least one device on the printed circuit board (PCB), the position that then is arranged on the heat storage units at heat generating components place is: heat generating components and at least one heat storage units are positioned at the same side of printed circuit board (PCB), and described heat storage units surrounds the respective devices on the printed circuit board (PCB) respectively.
Further, described heat generating components is at least one device on the printed circuit board (PCB), the position that then is arranged on the heat storage units at heat generating components place is: heat storage units and heat generating components are positioned at the same side of printed circuit board (PCB), and heat storage units is positioned over the surface of described heat generating components.
Further, the described position that is arranged on the heat storage units at heat generating components place further comprises: heat storage units contacts placement with the mobile terminal case inner surface.
Further, the described heat storage units that is arranged on the heat generating components place further comprises: the contact-making surface of heat storage units and heat generating components is placed with heat conductive pad.
Further, described heat generating components is at least one device on the printed circuit board (PCB), the position that then is arranged on the heat storage units at heat generating components place is: heat storage units and heat generating components lay respectively at the both sides of printed circuit board (PCB), and heat storage units is positioned over described heat generating components below position on the printed circuit board (PCB).
Preferably, described heat storage units by gluing, be threaded, the mode of welding or geometry location anchors on the printed circuit board (PCB).
Further, described heat generating components is a mobile terminal case, and the position that then is arranged on the heat storage units at heat generating components place is: described heat storage units is placed on the inner surface of mobile terminal case.
Preferably, described heat storage units by gluing, be threaded, the mode of welding or geometry location anchors at the inner surface of mobile terminal case.
Preferably, described portable terminal is a GSM mobile handset, or the CDMA mobile phone, or 3G mobile, or personal digital assistant, or palmtop PC, or Personal Handyphone System.
As seen from the above technical solution, the heat that produces owing to power consumption when the mobile terminal apparatus of this band heat accumulating of the present utility model absorbs portable terminal work by heat storage units is set, temperature rise speed during the portable terminal that slows down work, especially reduce the temperature rise within 10-30 minute of virgin work, thereby improve the reliability of user satisfaction and portable terminal work.
Description of drawings
Fig. 1 is the equivalent specific heat coefficient comparison diagram of five kinds of materials commonly used in the prior art;
Fig. 2 (a)～(g) is the link position schematic diagram of heat storage units and heat generating components among the embodiment of the present utility model;
Fig. 3 is that the temperature rise ratio of power discharging device in the common mobile terminal of prior art and the utility model band heat accumulating portable terminal is than schematic diagram.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearer, below with reference to the accompanying drawing embodiment that develops simultaneously, the utility model is further described.
Temperature rise speed when working in order to reduce portable terminal, portable terminal described in the utility model is provided with heat storage units at the heat generating components place, absorb the heat that heat generating components produces by heat storage units when portable terminal is worked, make heat be unlikely to discharge within a short period of time, thereby the temperature when suppressing portable terminal work raise.
Be that example illustrates in detail to the utility model below with the mobile phone, this mobile phone can be GSM mobile handset, CDMA mobile phone or 3G mobile etc.The higher device of temperature when described heat generating components is meant operating handset comprises power amplifier (PA) device, LCD, radio frequency chip, CPU, charging triode, shielding box and makes a video recording first-classly, also comprises phone housing.Many devices such as power discharging device, LCD, radio frequency chip, CPU, charging triode and shielding box all are encapsulated on the interior printed circuit board (PCB) (PCB) of mobile phone.
In the above-mentioned heat generating components, power discharging device is the main thermal source of mobile phone.Such size of devices is 6 * 6 * 1.9mm normally
3To 3 * 3 * 1.8mm
3So when long-time high-power emission, its outer surface temperature rise can reach 30-50 ℃, accounts for the 40-60% of mobile phone overall heat consumption.
Described heat storage units is made up of seal box and heat accumulating.The material that the sealing box adopts metal or plastics etc. can be maintained fixed shape is made any 3D shape, fills heat accumulating in the seal box.Seal box also can be original shielding box on the mobile phone.
Above-mentioned heat accumulating can be solid-solid phase transition material or the solid-liquid phase change material of fusing point between 40-70 ℃, such as: KF2H
2O,
K
3PO
47H
2O, Zn (NO
3)
24H
2O, Ca (NO
3)
24H
2O, Na
2HPO
47H
2O, Na
2S
2O
35H
2O, Zn (NO
3)
22H
2O, NaOHH
2O, Na (CH
3COO) 3H
2O, Cd (NO
3)
24H
2O, Fe (NO
3)
26H
2O, Na
2B
4O
710H
2O, Na
3PO
412H
2O, Na
2P
2O
710H
2O, 61.5%Mg (NO
3)
26H
2O+38.5%NH
4NO
3, 58.7%Mg (NO
3) 6H
2O+41.3%MgCl
26H
2O, 53%Mg (NO
3)
26H
2O+47%Al (NO
3)
29H
2O, Mg (NO
3)
26H
2O/Mg (NO
3)
22H
2O, paraffin (Paraffin C
16-C
28, ParaffinC
20-C
33, Paraffin C
22-C
45, Paraffin C
21-C
50, Paraffin wax), polyethylene glycol (Polyglycol) E6000,37.5% urea (Urea)+63.5% acetamide (acetamide), 67.1% naphthalene (Naphthalene)+32.9% benzoic acid (benzoic acid), Rubitherm RT43-64, RT40-65 paraffin (Paraffin), STL47-55 hydroxide salt (Salt hydrate), ClimSel C48-58, n-eicosane (n-eicosane), Thermasorb etc.
Or the heat absorption and the special material of this reversible chemical reaction of heat release can take place in certain narrow temperature section, such as: reversible chemical reaction temperature potassium (Potassium) or the lithium doping carbon nano-tube (lithium-doped carbon nanotubes) etc. between 40-70 ℃.
Above-mentioned heat accumulating can absorb, store heat, has higher equivalent specific heat, thereby higher thermal inertia is arranged.Fig. 1 is temperature rise (Δ T) in the prior art when being 15 ℃, the equivalent specific heat coefficient comparison diagram of five kinds of materials commonly used, five kinds of materials are respectively: water 101, stone 102, wooden 103, plastics 104 and the phase-change material (PCM) 105 when undergoing phase transition, and the longitudinal axis refers to specific heat coefficient, and unit is KJ/Kg.As can be seen from Figure 1, the specific heat coefficient of PCM is the highest, promptly reaches same thermal inertia, volume that heat accumulating is required and quality minimum.
Further, described heat storage units only is made up of heat accumulating, and this heat accumulating can adopt solid-solid phase transition material etc. need not be encapsulated in the material that just can be maintained fixed shape in the seal box.
Fig. 2 (a)～(g) is the link position schematic diagram of heat storage units and heat generating components in the utility model preferred embodiment.
Among Fig. 2 (a), be made up of seal box 213 and heat accumulating 214 for the heat storage units that certain heat generating components 212 on the pcb board 211 is provided with, heat storage units and heat generating components 212 are positioned at the same side of pcb board 211, and heat generating components 212 is covered fully.Described heat accumulating 214 directly contacts with heat generating components 211, is used to absorb the heat that heat generating components 211 produces.The shape of seal box 213 is not limited to the rectangle shown in Fig. 2 (a), can make any 3D shape that is suitable for being placed on the mobile phone inner space.
Because the conductive coefficient of heat accumulating own is lower, in actual use, materials such as refinement bonding jumper, foamed aluminium in the heat accumulating that need be filled in seal box are so that fully import heat storage units with heat from heat generating components.
Described seal box can by gluing, be threaded or the mode of welding anchors on the pcb board; Perhaps provide certain geometric space, seal box is pressed abd fixed on the position of the placement that requires by geometry location by heat generating components on pcb board, the pcb board and handset shell.
Further, can corresponding heat storage units be set respectively for a plurality of heat generating components on the mobile phone.Among Fig. 2 (b), first heat generating components 222 on the pcb board 221 and second heat generating components 223 are respectively arranged with first heat storage units 224 and second heat storage units 225, and wherein the heat accumulating of filling in first heat storage units 224 and second heat storage units 225 can be inequality.
Among Fig. 2 (d), the power discharging device 242 that is placed on the pcb board 241 is covered with shielding box 243, shielding box 243 upper surfaces are placed heat storage units 244, on two contact-making surfaces between shielding box 243 and the heat storage units and between shielding box and the power discharging device, be placed with heat conductive pad 245 respectively, so that overcome the deviation of processing and fit on, make this three of heat storage units, shielding box and power discharging device keep tight and contact.
Heat generating components 252 among Fig. 2 (e) is positioned on the pcb board 251, between heat generating components 252 upper surfaces and phone housing 255, place heat storage units 253, by geometry location heat storage units 253 is fixed on mobile phone inside, is placed with heat conductive pad 254 on the contact-making surface of heat generating components 252 and heat storage units 253.
Further, can same heat storage units be set for a plurality of heat generating components on the pcb board.Among Fig. 2 (f), first heat generating components 262, second heat generating components 263 provide certain geometric space with phone housing 267, heat storage units 264 is made the shape that is suitable for being placed on this geometric space, and on the contact-making surface of first heat generating components 262, second heat generating components 263 and heat storage units, place first heat conductive pad 265 and second heat conductive pad 266 respectively.
For the temperature rising situation of handset shell, can be shown in Fig. 2 (g), at the inner surface of phone housing 272 heat storage units 271 is set, the placement location of heat storage units 271 and place at interval and determine according to actual conditions.
When the working temperature of the heat generating components that is provided with heat storage units surpassed the phase transformation temperature points of heat accumulating or chemical reaction point, near the heat storage units that is positioned at the heat generating components began to stop by heat accumulation the quick step rising of temperature.Fig. 3 is the temperature rise comparison diagram of power discharging device in the mobile phone 302 of regular handset 301 and the utility model band heat accumulating of prior art, and what wherein transverse axis was represented is the time, and minute to be unit, what the longitudinal axis was represented is temperature rise, ℃ being unit.As can be seen from Figure 3, compare with regular handset, although also there is certain temperature rise in the mobile phone of band heat storage units within initial 10～30 minutes of using, temperature raises and is starkly lower than regular handset.
Because mobile phone mainly is the terminal equipment of gap work, most of user once uses mobile phone to be no more than 20 minutes, so the utility model can reduce the working temperature of main thermals source such as power amplifier in the operating time, thereby reduce the surface temperature rise of whole mobile phone, make user's satisfaction improve.
In addition, the process that the every experience of mobile phone is once connected, conversed and shuts down, the device in the mobile phone will be through the thermal cycle that once heats up and lower the temperature.The utility model is provided with heat storage units at the heat generating components place of mobile phone, temperature rise peak value when reducing thermal cycle by absorbing heat, make variations in temperature, especially the air time is milder less than the variations in temperature under 20 minutes situations, this is to improving the reliability of this heat generating components, and prolonging mobile phone all has very big benefit useful life.
Portable terminal described in the utility model can also be miniaturized electronicss such as PDA, palmtop PC or Personal Handyphone System.The mode that heat storage units is set on above-mentioned portable terminal is identical with mobile phone, repeats no more herein.
By the above embodiments as seen, the mobile terminal apparatus of this band heat accumulating of the present utility model is by being provided with the heat that produces when heat storage units absorbs portable terminal work, temperature rise speed during the portable terminal that slows down work, thus the reliability of user satisfaction and portable terminal work improved.
Claims (13)
1, a kind of mobile terminal apparatus with heat accumulating, comprise: shell and be positioned at device on the internal printed circuit board, it is characterized in that, this device also comprises: at least one comprises the heat storage units of heat accumulating, be arranged on the heat generating components place of portable terminal, be used to absorb the heat that heat generating components discharges.
2, device according to claim 1 is characterized in that, described heat accumulating is a solid-solid phase transition material.
3, device according to claim 1 is characterized in that, described heat storage units also comprises the seal box that is used to hold heat accumulating.
4, device according to claim 3 is characterized in that, described heat accumulating is solid-liquid phase change material or reversible chemical reaction material.
5, device according to claim 1, it is characterized in that, described heat generating components is at least one device on the printed circuit board (PCB), the position that then is arranged on the heat storage units at heat generating components place is: heat generating components and at least one heat storage units are positioned at the same side of printed circuit board (PCB), and described heat storage units surrounds the respective devices on the printed circuit board (PCB) respectively.
6, device according to claim 1, it is characterized in that, described heat generating components is at least one device on the printed circuit board (PCB), the position that then is arranged on the heat storage units at heat generating components place is: heat storage units and heat generating components are positioned at the same side of printed circuit board (PCB), and heat storage units is positioned over the surface of described heat generating components.
7, device according to claim 6 is characterized in that, the described position that is arranged on the heat storage units at heat generating components place further comprises: heat storage units contacts placement with the mobile terminal case inner surface.
8, device according to claim 6 is characterized in that, the described heat storage units that is arranged on the heat generating components place further comprises: the contact-making surface of heat storage units and heat generating components is placed with heat conductive pad.
9, device according to claim 1, it is characterized in that, described heat generating components is at least one device on the printed circuit board (PCB), the position that then is arranged on the heat storage units at heat generating components place is: heat storage units and heat generating components lay respectively at the both sides of printed circuit board (PCB), and heat storage units is positioned over described heat generating components below position on the printed circuit board (PCB).
10, according to each described device of claim 5 to 9, it is characterized in that, described heat storage units by gluing, be threaded, the mode of welding or geometry location anchors on the printed circuit board (PCB).
11, device according to claim 1 is characterized in that, described heat generating components is a mobile terminal case, and the position that then is arranged on the heat storage units at heat generating components place is: described heat storage units is placed on the inner surface of mobile terminal case.
12, device according to claim 11 is characterized in that, described heat storage units by gluing, be threaded, the mode of welding or geometry location anchors at the inner surface of mobile terminal case.
13, device according to claim 1 is characterized in that, described portable terminal is a GSM mobile handset, or the CDMA mobile phone, or 3G mobile, or personal digital assistant, or palmtop PC, or Personal Handyphone System.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520108690 CN2824518Y (en) | 2005-06-03 | 2005-06-03 | Mobile terminal apparatus with heat storage material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520108690 CN2824518Y (en) | 2005-06-03 | 2005-06-03 | Mobile terminal apparatus with heat storage material |
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| Publication Number | Publication Date |
|---|---|
| CN2824518Y true CN2824518Y (en) | 2006-10-04 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520108690 Expired - Lifetime CN2824518Y (en) | 2005-06-03 | 2005-06-03 | Mobile terminal apparatus with heat storage material |
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| CN101472452B (en) * | 2007-12-12 | 2012-02-29 | 英特尔公司 | Thermal energy storage for mobile computing thermal management |
| CN103476223A (en) * | 2012-06-08 | 2013-12-25 | 富瑞精密组件（昆山）有限公司 | Phase change heat dissipation device |
| CN103476222A (en) * | 2012-06-08 | 2013-12-25 | 富瑞精密组件（昆山）有限公司 | Electronic apparatus |
| CN104036828A (en) * | 2014-05-15 | 2014-09-10 | 京东方科技集团股份有限公司 | Heat-radiation membrane material |
| CN104227913A (en) * | 2013-06-17 | 2014-12-24 | 英业达科技有限公司 | Forming method of electronic device shell and electronic device shell structure manufactured thereby |
| CN104582432A (en) * | 2014-12-05 | 2015-04-29 | 广东明路电力电子有限公司 | High-power component phase change heat adsorption structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101472452B (en) * | 2007-12-12 | 2012-02-29 | 英特尔公司 | Thermal energy storage for mobile computing thermal management |
| CN103476223A (en) * | 2012-06-08 | 2013-12-25 | 富瑞精密组件（昆山）有限公司 | Phase change heat dissipation device |
| CN103476222A (en) * | 2012-06-08 | 2013-12-25 | 富瑞精密组件（昆山）有限公司 | Electronic apparatus |
| CN104227913A (en) * | 2013-06-17 | 2014-12-24 | 英业达科技有限公司 | Forming method of electronic device shell and electronic device shell structure manufactured thereby |
| CN104036828A (en) * | 2014-05-15 | 2014-09-10 | 京东方科技集团股份有限公司 | Heat-radiation membrane material |
| CN104582432A (en) * | 2014-12-05 | 2015-04-29 | 广东明路电力电子有限公司 | High-power component phase change heat adsorption structure |
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| CN105744425A (en) * | 2016-04-29 | 2016-07-06 | 广东欧珀移动通信有限公司 | Telephone receiver assembly and mobile terminal |
| CN106028741A (en) * | 2016-04-29 | 2016-10-12 | 广东欧珀移动通信有限公司 | Heat conduction pipe and mobile terminal |
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| WO2017185960A1 (en) * | 2016-04-29 | 2017-11-02 | 广东欧珀移动通信有限公司 | Terminal device and related method |
| CN107333033A (en) * | 2016-04-29 | 2017-11-07 | 广东欧珀移动通信有限公司 | A kind of camera and mobile terminal |
| CN107340901A (en) * | 2016-04-29 | 2017-11-10 | 广东欧珀移动通信有限公司 | A kind of touch panel unit and mobile terminal |
| CN107343375A (en) * | 2016-04-29 | 2017-11-10 | 广东欧珀移动通信有限公司 | A kind of rear shell and mobile terminal |
| CN105763689B (en) * | 2016-04-29 | 2018-05-29 | 广东欧珀移动通信有限公司 | A kind of display/panel bracket and terminal |
| CN105933582B (en) * | 2016-04-29 | 2019-08-23 | Oppo广东移动通信有限公司 | A kind of camera and mobile terminal |
| CN105792616B (en) * | 2016-04-29 | 2019-02-05 | Oppo广东移动通信有限公司 | A kind of touch panel unit and mobile terminal |
| CN105873357B (en) * | 2016-04-29 | 2019-03-01 | Oppo广东移动通信有限公司 | Circuit board and mobile terminal |
| CN105792620B (en) * | 2016-04-29 | 2019-06-18 | Oppo广东移动通信有限公司 | Chip, circuit board and mobile terminal |
| CN106659060A (en) * | 2016-09-29 | 2017-05-10 | 努比亚技术有限公司 | Charging chip heat radiation structure and mobile terminal |
| CN108093604A (en) * | 2016-11-23 | 2018-05-29 | 三星电子株式会社 | Steam including being used to absorb heat（Two-phase）The electronic device of chamber |
| US10739830B2 (en) | 2016-11-23 | 2020-08-11 | Samsung Electronics Co., Ltd. | Electronic device including vapor (two phase) chamber for absorbing heat |
| CN108093604B (en) * | 2016-11-23 | 2021-09-21 | 三星电子株式会社 | Electronic device |
| CN113710067A (en) * | 2016-11-23 | 2021-11-26 | 三星电子株式会社 | Electronic device comprising a vapour (two-phase) chamber for absorbing heat |
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