CN105744732A - Circuit board and mobile terminal - Google Patents
Circuit board and mobile terminal Download PDFInfo
- Publication number
- CN105744732A CN105744732A CN201610286986.2A CN201610286986A CN105744732A CN 105744732 A CN105744732 A CN 105744732A CN 201610286986 A CN201610286986 A CN 201610286986A CN 105744732 A CN105744732 A CN 105744732A
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- Prior art keywords
- heat
- heat absorption
- circuit board
- absorption heat
- plate body
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a circuit board which comprises a board body and a heat absorbing and storing member. The board body comprises two board surfaces. At least one board surface is provided with the heat absorbing and storing member. The heat absorbing and storing member comprises a heat absorbing and storing material with a heat absorbing function and a heat storage function. The heat absorbing and storing material is used for absorbing heat which is radiated from a heating component on the board body. The invention further discloses a mobile terminal. The heat which is radiated from the heating component on the circuit board can be directly absorbed through the heat absorbing and storing material which is arranged on the circuit board, thereby realizing direct heat radiation on a position with relatively high heating value, thereby improving heat dissipation performance and reliability of the mobile terminal.
Description
Technical field
The present invention relates to a kind of electronic device field, particularly relate to a kind of circuit board and mobile terminal.
Background technology
Development along with mobile phone industry, mobile phone configuration is more and more higher, electronic devices and components on circuit board of mobile phone also get more and more, cause that cell-phone heating amount strains greatly mutually, if these heats do not reach control or transfer, the impact of two aspects can be brought: circuit board temperature 1, can be made too high, affect the performance of electronic devices and components, even result in mobile phone computing slack-off, affect Consumer's Experience.2, the heat that circuit board distributes is transferred to phone housing, causes that skin temperature is higher, there will be the problems such as hot, boiling hot ear during use.
For solving the heating problem of mobile phone, be usually in the industry at present is arranged on inner walls or mobile phone shielding lid by heat radiation graphite flake, chip is dispelled the heat indirectly, but inventor has found that heat radiation graphite flake setting when stating technical scheme on the implementation is bigger by the limitation of position, the position that caloric value is bigger be cannot be carried out direct heat radiation, thus causing that its heat dispersion is poor.
Summary of the invention
In order to solve above-mentioned technical problem, the invention provides a kind of circuit board, including plate body and heat absorption heat accumulation part, described plate body includes two plate faces, at least one of which plate face is provided with described heat absorption heat accumulation part, described heat absorption heat accumulation part includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function, the heat that described heat absorption heat accumulating heating element on the described plate body that absorbs heat distributes.
Wherein, a wherein plate face of described plate body is used for arranging heating element, and another plate face of described plate body is provided with described heat absorption heat accumulation part.
Further, at described plate body, the white space in the plate face that arranges described heating element is provided with described heat absorption heat accumulation part.
Wherein, two plate faces of described plate body are all used for arranging heating element, and the white space in each plate face of described plate body is provided with described heat absorption heat accumulation part.
Wherein, described circuit board also includes protecting film, and described protecting film is arranged on described heat absorption heat accumulation part, and described protecting film is located remotely from the side of described plate body.
Wherein, described circuit board includes at least one in printed circuit board (PCB) and flexible PCB.
Wherein, described heat absorption heat accumulating includes silicon dioxide and Polyethylene Glycol, and the mass ratio of described silicon dioxide and Polyethylene Glycol is 1:1～1:9.
Wherein, described heat absorption heat accumulating by some with described silicon dioxide be cyst wall, with described Polyethylene Glycol be capsule-core microcapsule constituted.
Wherein, described heat absorption heat accumulation part also includes titanate coupling agent and glue-line, described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, and described glue-line stacking is covered on described flaky material, and described flaky material is adhered on described plate body by described glue-line.
Wherein, described heat absorption heat accumulation part also includes retarder thinner and bonding solution, and described heat absorption heat accumulating, described retarder thinner and described bonding solution mix and coats on described plate body.
Wherein, described heat absorption heat accumulation part also includes substrate and glue-line, described heat absorption heat accumulating is coated in described substrate, and described glue-line stacking is covered on described heat absorption heat accumulating, and described in be coated with heat absorption heat accumulating substrate be adhered on described plate body by described glue-line.
The embodiment of the present invention additionally provides a kind of mobile terminal, and including housing and above-mentioned part or all of circuit board, thermal hole is offered at described shell rim position.
Implement the embodiment of the present invention, have the advantages that
Circuit board provided by the invention includes plate body and heat absorption heat accumulation part, plate body includes two plate faces, at least one of which plate face is provided with described heat absorption heat accumulation part, described heat absorption heat accumulation part includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function, the heat that heating element on circuit board distributes can absorb either directly through the heat absorption heat accumulating arranged on circuit board, achieve the position to caloric value is bigger directly to dispel the heat, improve thermal diffusivity and the reliability of mobile terminal.
Accompanying drawing explanation
In order to be illustrated more clearly that technical scheme, the accompanying drawing used required in embodiment will be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the printed circuit board (PCB) of embodiment of the present invention offer partial schematic diagram in mobile terminal；
Fig. 2 is the flexible PCB of embodiment of the present invention offer partial schematic diagram in mobile terminal；
Fig. 3 is the schematic diagram of the circuit board that the embodiment of the present invention provides；
Fig. 4 is the schematic diagram of the heat absorption heat accumulation part that first embodiment of the invention provides；
Fig. 5 is the schematic diagram of the heat absorption heat accumulation part that second embodiment of the invention provides；
Fig. 6 is the schematic diagram of the heat absorption heat accumulation part that third embodiment of the invention provides；
Fig. 7 is the schematic diagram of a kind of mobile terminal that the embodiment of the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in embodiment of the present invention, the technical scheme in embodiment of the present invention is clearly and completely described.
The mobile terminal that the present embodiments relate to can be any equipment possessing communication and storage function, such as: panel computer, mobile phone, electronic reader, remote controller, personal computer (PersonalComputer, PC), notebook computer, mobile unit, Web TV, wearable device etc. have the smart machine of network function.The circuit board that the embodiment of the present invention provides include printed circuit board (PCB) (English: PrintedCircuitBoard, be called for short: PCB) and flexible PCB (English: FlexiblePrintedCircuit, abbreviation: at least one in FPC).Wherein, printed circuit board (PCB) schematic diagram in mobile terminal may refer to Fig. 1；Flexible PCB schematic diagram in mobile terminal may refer to Fig. 2.
Refer to the schematic diagram that Fig. 3, Fig. 3 are the circuit boards that the embodiment of the present invention provides.As shown in Figure 3, circuit board 3 includes plate body 31 and heat absorption heat accumulation part 32, plate body 31 includes two plate faces, respectively the first plate face 311 and the second plate face 312, (Fig. 3 is provided with heat absorption heat accumulation part on two plate faces to be provided with heat absorption heat accumulation part 32 at least one plate face of plate body 31, in other alternative embodiments, it is possible to only a plate face arranges heat absorption heat accumulation part wherein), heat absorption heat accumulation part 32 includes the heat absorption heat accumulating 3211a with the material properties of heat absorption and heat storage function.The heat that heat absorption heat accumulating 3211a distributes for the heating element absorbed heat on plate body 31.
Heat absorption heat accumulating 3211a can be a kind of phase-change material, it can change physical property and can absorb substantial amounts of heat along with variations in temperature, increase along with the heat absorbed, heat absorption heat accumulating 3211a gradates as another kind of phase mutually from one, can stably maintain another kind of phase after absorbing sufficient heat and no longer absorb heat, when heating element does not distribute heat or the heat that distributes is relatively low, heat absorption heat accumulating 3211a carries out dispelling the heat and gradually along with reducing of heat is reverted to original phase mutually gradually by another kind.Wherein, heat absorption heat accumulating 3211a can along with the change of temperature from solid phase to liquid phase or liquid phase to solid transformation, or solid phase is to gas phase or liquid phase to solid transformation, or liquid phase is to gas phase or gas phase to liquid phase.
In the present embodiment, circuit board is provided with heat absorption heat accumulation part, described heat absorption heat accumulation part includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function, the heat that heating element distributes can absorb either directly through the heat absorption heat accumulating arranged on circuit board, achieve the position to caloric value is bigger directly to dispel the heat, improve thermal diffusivity and the reliability of mobile terminal.
Circuit board 3 can be single sided board, dual platen, four laminates or multi-layer sheet.
Single sided board is that a kind of one side applies copper, utilizes the welding of one side design circuit lead and the element having applied copper.If circuit board 3 is single sided board, it is assumed that the first plate face 311 of plate body 31 is used for arranging heating element, then the second plate face 312 of plate body 31 is provided with heat absorption heat accumulation part 32.
Further, if circuit board 3 is single sided board, the white space (being namely not provided with the region of electronic devices and components) in the first plate face 311 of plate body 31 is also provided with described heat absorption heat accumulation part 32.By the heat absorption heat accumulating 3211a of both sides, the heating element arranged on circuit board 3 is dispelled the heat, accelerate heat radiation dynamics, further increase thermal diffusivity and the reliability of mobile terminal.
Dual platen includes top layer, bottom and insulating barrier, and insulating barrier is between top layer and bottom.The bottom of dual platen and the two-sided of top layer are all covered with copper, say, that top layer and the two-sided of bottom can connect up and weld.If circuit board 3 is dual platen, then the entirety that plate body 31 is made up of top layer, bottom and insulating barrier.If the first plate face 311 of plate body 31 is the top layer side away from insulating barrier, then the second plate face 312 of plate body 31 is the bottom side away from insulating barrier.If the first plate face 311 of plate body 31 is the bottom side away from insulating barrier, then the second plate face 312 of plate body 31 is the top layer side away from insulating barrier.If circuit board 3 is dual platen, then heat absorption heat accumulation part 32 is all set at the white space in the first plate face 311 of plate body 31 and the second plate face 312.
Multi-layer sheet is then plus other layer between the top layer and bottom of dual platen, as placed two power supply flaggies.If circuit board 3 is multi-layer sheet, then the entirety that plate body 31 is made up of top layer, bottom and the layer that adds between the two.If the first plate face 311 of plate body 31 is the top layer side away from insulating barrier, then the second plate face 312 of plate body 31 is the bottom side away from insulating barrier.If the first plate face 311 of plate body 31 is the bottom side away from insulating barrier, then the second plate face 312 of plate body 31 is the top layer side away from insulating barrier.If circuit board 3 is multi-layer sheet, then heat absorption heat accumulation part 32 is all set at the white space in the first plate face 311 of plate body 31 and the second plate face 312.
In order to further improve, circuit board 3 also includes protecting film 33, and protecting film 33 is arranged on heat absorption heat accumulation part 32, and protecting film 33 is located remotely from the side of body 31.
In the present embodiment, protecting film 33 is polyethylene terephthalate (PET), and it is layered on heat absorption heat accumulation part 32, and the protecting film 33 heat accumulation part 32 that can absorb heat further carries out shaping and have dust-proof effect.Certainly, in other embodiments, the material of protecting film 33 can also be other, such as silica gel.
In order to further improve, heat absorption heat accumulating 3211a preferably comprises the silicon dioxide and Polyethylene Glycol that mass ratio is 1:1～1:9.Inventor is drawn by substantial amounts of experiment, by silicon dioxide and Polyethylene Glycol with mass ratio for 1:1～1:9 mixing can prepare organic-composite phase-change material has suitable phase transition temperature, the heat that heating element distributes can be absorbed in time, improve heat radiation and the reliability of mobile terminal further.Concrete, the phase transition temperature that this heat absorption heat accumulating 3211a mixing prepares is 40 degree, and after the heat namely distributed at heating element reaches 40 degree, heat absorption heat accumulating 3211a carries out decalescence, is taken away by heat, thus heating element is lowered the temperature.Certainly, in other embodiments, heat absorption heat accumulating 3211a can also be inorganic phase-changing material, or composite phase-change material etc..
In order to further improve, heat absorption heat accumulating 3211a by some with silicon dioxide be cyst wall, with Polyethylene Glycol be capsule-core microcapsule constituted.The heat that heating element can preferably be distributed by the heat absorption heat accumulating 3211a of this microcapsule structure carries out heat absorption heat accumulation, and then reaches preferably heat dispersion.Concrete, Polyethylene Glycol is joined in certain density Ludox, after all dissolving, drip CaCl2Accelerator solution, under strong stirring so that sol gel reaction occurs Polyethylene Glycol in Ludox, forms three-dimensional net structure gel after standing；By gel forced air drying 24～48h in 80 DEG C of baking ovens, be cooled to room temperature, can access with organo-siloxane compound produce in the basic conditions a large amount of with silica dioxide gel be cyst wall, the microcapsule that is capsule-core with the Polyethylene Glycol after emulsifying.Namely in each microcapsule, silicon dioxide wraps the Polyethylene Glycol as capsule-core as cyst wall so that Polyethylene Glycol will not leak from the process of solid-liquid, it is possible to is well lived by Silica-coated.The heat absorption heat accumulating of this formation microcapsule structure is after the heat that heating element distributes reaches 40 degree, start to absorb the heat that heating element distributes, and capsule-core itself is gradually increased gradually from solid-liquid along with heat, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating 3211a absorbs is saturated, and it stops absorbing heat.After the heat distributed when heating element is gradually decrease to preset temperature, the heat of absorption is come out by capsule-core, it is delivered in air, and capsule-core can be converted to solid phase from liquid phase gradually along with gradually decreasing of its fever of the body amount, changed by the circulation of above-mentioned solid phase to liquid phase, thus heating element is lowered the temperature, improve heat dispersion and the reliability of mobile terminal.Certainly, in other embodiments, heat absorption heat accumulating 3211a can also be other structure so that heat absorption heat accumulating 3211a can by lowering the temperature from the circulation conversion being solid to gas phase to chip 2.
As shown in Figure 4, Fig. 4 is the one heat absorption heat accumulation part 321 that first embodiment of the invention provides.In order to further improve, heat absorption heat accumulation part 321 also includes titanate coupling agent 3211b and glue-line 3212, heat absorption heat accumulating 3211a and titanate coupling agent 3211b is mixed and made into flaky material 3211, glue-line 3212 stacking is covered on flaky material 3211, and flaky material 3211 is adhered on plate body 31 by glue-line 3212.
By heat absorption heat accumulating 3211a and titanate coupling agent 3211b is mixed and made into flaky material 3211, it is connected on flaky material 3211 again through glue-line 3212 stacking and forms heat absorption heat accumulation part 321, the heat absorption heat accumulation part 321 of lamellar is applied more convenient, directly it is stained with, is cooled into coating without waiting for it.
In the present embodiment, heat absorption heat accumulating 3211a is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating 3211a, namely without influence on the heat absorption heat storage function of heat absorption heat accumulating 3211a, add titanate coupling agent 3211b hydrophobically modified at pulverous heat absorption heat accumulating 3211a and obtain inorganic plan organic composite shaping phase-change material, this inorganic plan organic composite shaping phase-change material is prepared through tabletting machine flake and flaky material 3211 again, flaky material 3211 stacking again connects upper glue layer 3212 and forms heat absorption heat accumulation part 321.It should be understood that glue-line 3212 can be gum, double faced adhesive tape or mould release membrance etc..The shape that heat absorption heat accumulation part 321 can be pasted as required is cut into definite shape, is fitted on plate body 31, it is achieved the function of heat absorption heat accumulation.
As it is shown in figure 5, Fig. 5 is the heat absorption heat accumulation part 322 that second embodiment of the invention provides.The basic structure of the heat absorption heat accumulation part 321 provided with first embodiment of the invention is roughly the same, it is different in that, heat absorption heat accumulation part 322 in the present embodiment also includes retarder thinner and bonding solution, coats on plate body 31 after heat absorption heat accumulating, retarder thinner and the mixing of bonding solution.
By retarder thinner, bonding solution are mixed to form heat absorption heat accumulation part 322 with heat absorption heat accumulating, heat absorption heat accumulation part 332 is made directly to have adhesive force, upper plate body 31 can be coated, thus providing a kind of use advantageously heat absorption heat accumulation part 322 without still further increasing glue-line.
In the present embodiment, heat absorption heat accumulating is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of each microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating, namely without influence on the heat absorption heat storage function of heat absorption heat accumulating, it is added to retarder thinner at pulverous heat absorption heat accumulating and adds the mixing of special binder solution (such as: methanol dimethylbenzene, acrylic resin etc.), heat absorption heat accumulation part 322 is made to have adhesive force, directly adopt the form of coating to be piled into certain thickness heat absorption heat accumulation part 322 and be attached on plate body 31, thus realizing the function of heat absorption heat accumulation.
Such as Fig. 6, the third embodiment of the present invention is provided a kind of heat absorption heat accumulation part 323, the basic structure of the heat absorption heat accumulation part 321 provided with first embodiment of the invention is roughly the same, it is different in that, heat absorption heat accumulation part 323 in the present embodiment also includes substrate 3232 and glue-line 3233, heat absorption heat accumulating 3231 is coated in substrate 3232, and glue-line 3233 stacking is connected on heat absorption heat accumulating 3231, and glue-line 3233 is adhered on plate body 31.
By directly heat absorption heat accumulating 3231 being coated molding in substrate 3232, then at heat absorption heat accumulating 3231, glue-line 3233 is set to be pasted on plate body 31, it is not necessary to tablet machine carries out tabletting, makes relatively simple.
In the present embodiment, substrate 3232 is polyethylene terephthalate (PET), heat absorption heat accumulating 3231 is smashed to pieces and strong stirring obtains powder, owing to the diameter of powder body is far longer than the diameter of microcapsule, thus without the microcapsule structure destroyed in heat absorption heat accumulating 3231, namely without influence on the heat absorption heat storage function of heat absorption heat accumulating 3231, pulverous heat absorption heat accumulating 3231 is directly coated at molding in substrate 3232, the substrate 3232 with heat absorption heat accumulating 3231 is adhered on plate body 31 by glue-line 3233, realize the heat absorption heat storage function of heat absorption heat accumulation part 323.It should be understood that glue-line can be gum, double faced adhesive tape or other etc..
Referring to the schematic diagram of the mobile terminal 7 that Fig. 7, Fig. 7 provide for the embodiment of the present invention, mobile terminal 7 includes the above-mentioned circuit board mentioned and housing.Wherein, circuit board includes any one in above-mentioned heat absorption heat accumulation part 321,322 and 323.
Mobile terminal is during fabrication, it is first determined need to arrange the position of heat absorption heat accumulation part on circuit board, then arranges heat absorption heat accumulation assembly in defined location, then arranges components and parts on circuit boards, finally by circuit board package in mobile terminal.Wherein, heat absorption heat accumulation part includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function, form the heat absorption heat accumulating of microcapsule structure after the heat that heating element distributes reaches 40 degree, start to absorb the heat that heating element distributes, and capsule-core itself is gradually from solid-liquid, after capsule-core is converted to liquid phase, the heat that heat absorption heat accumulating absorbs is saturated, it stops absorbing heat, and after the temperature outside heat pipe is gradually decrease to preset temperature, the heat of absorption is come out by capsule-core, it is delivered in air, and capsule-core can along with gradually decreasing of its fever of the body amount gradually from liquid-solid, circulating phase-change by the heat accumulating that absorbs heat, thus heating element is lowered the temperature, and then improve heat dispersion and the reliability of mobile terminal.
Mobile terminal provided by the invention is by arranging heat absorption memory device on circuit boards, described heat absorption heat accumulation part includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function, the heat that heating element distributes can absorb either directly through the heat absorption heat accumulating arranged on circuit board, achieve the position to caloric value is bigger directly to dispel the heat, improve thermal diffusivity and the reliability of mobile terminal.
Mobile terminal provided by the invention, by arranging protecting film on heat absorption heat accumulation part, so that heat absorption heat accumulation part to be protected further, improves thermal diffusivity and the reliability of mobile terminal.
Mobile terminal provided by the invention has suitable phase transition temperature also by by the organic phase change material that silicon dioxide and Polyethylene Glycol can prepare with mass ratio for 1:1～1:9 mixing, the heat that heating element distributes can be absorbed in time, improve the reliability of chip and mobile terminal further.
Mobile terminal provided by the invention makes microcapsule structure also by by heat absorption heat accumulating, it is possible to the heat preferably heating element distributed carries out heat absorption heat accumulation, and then reaches preferably heat dispersion.
Mobile terminal provided by the invention is mixed and made into flaky material also by by heat absorption heat accumulating and titanate coupling agent, it is connected on flaky material again through glue-line stacking and forms heat absorption heat accumulation part, not only make heat absorption heat accumulation part can go to cut according to certain shape, and the application of the heat absorption heat accumulation part of lamellar is more convenient, directly it is stained with, is cooled into coating without waiting for it.
Mobile terminal provided by the invention is mixed to form heat absorption heat accumulation part also by by retarder thinner, bonding solution with heat absorption heat accumulating, heat absorption heat accumulation part is made directly to have adhesive force, can coat on plate body without still further increasing glue-line, thus providing a kind of use advantageously heat absorption heat accumulation part.
Mobile terminal provided by the invention is also by coating in substrate by heat absorption heat accumulating, and glue-line stacking is covered on heat absorption heat accumulating, and the substrate being coated with heat absorption heat accumulating is adhered on described plate body by glue-line.By directly heat absorption heat accumulating being coated molding in substrate, then at heat absorption heat accumulating, glue-line is set to be pasted on plate body, it is not necessary to tablet machine carries out tabletting, makes relatively simple.
The thermal hole that mobile terminal provided by the invention is offered also by shell rim position, is dispersed into the heat produced inside mobile terminal outside mobile terminal, and then improves heat dispersion and the reliability of mobile terminal.
Being above the preferred embodiment of the present invention, it is noted that for those skilled in the art, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (12)
1. a circuit board, it is characterized in that, including plate body and heat absorption heat accumulation part, described plate body includes two plate faces, at least one of which plate face is provided with described heat absorption heat accumulation part, described heat absorption heat accumulation part includes the heat absorption heat accumulating with the material properties of heat absorption and heat storage function, the heat that described heat absorption heat accumulating heating element on the described plate body that absorbs heat distributes.
2. circuit board as claimed in claim 1, it is characterised in that a wherein plate face of described plate body is used for arranging heating element, and another plate face of described plate body is provided with described heat absorption heat accumulation part.
3. circuit board as claimed in claim 2, it is characterised in that the white space in the described plate body plate face for arranging described heating element is provided with described heat absorption heat accumulation part.
4. circuit board as claimed in claim 1, it is characterised in that two plate faces of described plate body are all used for arranging heating element, and the white space in each plate face of described plate body is provided with described heat absorption heat accumulation part.
5. circuit board as claimed in claim 1, it is characterised in that described circuit board also includes protecting film, and described protecting film is arranged on described heat absorption heat accumulation part, and described protecting film is located remotely from the side of described plate body.
6. circuit board as claimed in claim 1, it is characterised in that described circuit board includes at least one in printed circuit board (PCB) and flexible PCB.
7. the circuit board as described in any one of claim 1～6, it is characterised in that described heat absorption heat accumulating includes silicon dioxide and Polyethylene Glycol, the mass ratio of described silicon dioxide and Polyethylene Glycol is 1:1～1:9.
8. circuit board as claimed in claim 7, it is characterised in that described heat absorption heat accumulating by some with described silicon dioxide be cyst wall, with described Polyethylene Glycol be capsule-core microcapsule constituted.
9. circuit board as claimed in claim 8, it is characterized in that, described heat absorption heat accumulation part also includes titanate coupling agent and glue-line, described heat absorption heat accumulating and described titanate coupling agent are mixed and made into flaky material, described glue-line stacking is covered on described flaky material, and described flaky material is adhered on described plate body by described glue-line.
10. circuit board as claimed in claim 8, it is characterised in that described heat absorption heat accumulation part also includes retarder thinner and bonding solution, and described heat absorption heat accumulating, described retarder thinner and described bonding solution mix and coats on described plate body.
11. circuit board as claimed in claim 8, it is characterized in that, described heat absorption heat accumulation part also includes substrate and glue-line, described heat absorption heat accumulating is coated in described substrate, described glue-line stacking is covered on described heat absorption heat accumulating, and described in be coated with heat absorption heat accumulating substrate be adhered on described plate body by described glue-line.
12. a mobile terminal, it is characterised in that including housing and the circuit board as described in any one of claim 1～11, thermal hole is offered at described shell rim position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610286986.2A CN105744732A (en) | 2016-04-29 | 2016-04-29 | Circuit board and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610286986.2A CN105744732A (en) | 2016-04-29 | 2016-04-29 | Circuit board and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105744732A true CN105744732A (en) | 2016-07-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610286986.2A Pending CN105744732A (en) | 2016-04-29 | 2016-04-29 | Circuit board and mobile terminal |
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| CN (1) | CN105744732A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2022252019A1 (en) * | 2021-05-31 | 2022-12-08 | 华为数字能源技术有限公司 | Power adapter and electronic device system |
| US11665816B2 (en) | 2019-03-28 | 2023-05-30 | Huawei Technologies Co., Ltd. | Circuit board, method for manufacturing circuit board, and electronic device |
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| CN2824518Y (en) * | 2005-06-03 | 2006-10-04 | 华为技术有限公司 | Mobile terminal apparatus with heat storage material |
| US20090154113A1 (en) * | 2007-12-12 | 2009-06-18 | Inter Corporation | Thermal energy storage for mobile computing thermal management |
| CN101942290A (en) * | 2010-08-09 | 2011-01-12 | 西南交通大学 | Method for preparing polyethylene glycol/silicon dioxide composite shape-stabilized phase change energy storage material and product thereof |
| CN103476222A (en) * | 2012-06-08 | 2013-12-25 | 富瑞精密组件（昆山）有限公司 | Electronic apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US11665816B2 (en) | 2019-03-28 | 2023-05-30 | Huawei Technologies Co., Ltd. | Circuit board, method for manufacturing circuit board, and electronic device |
| WO2022252019A1 (en) * | 2021-05-31 | 2022-12-08 | 华为数字能源技术有限公司 | Power adapter and electronic device system |
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Application publication date: 20160706 |