CN2800355Y - Heat radiation mechanism of mother board power element - Google Patents
Heat radiation mechanism of mother board power element Download PDFInfo
- Publication number
- CN2800355Y CN2800355Y CN 200520001561 CN200520001561U CN2800355Y CN 2800355 Y CN2800355 Y CN 2800355Y CN 200520001561 CN200520001561 CN 200520001561 CN 200520001561 U CN200520001561 U CN 200520001561U CN 2800355 Y CN2800355 Y CN 2800355Y
- Authority
- CN
- China
- Prior art keywords
- power component
- circuit board
- motherboard
- high heat
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000007246 mechanism Effects 0.000 title claims abstract description 20
- 230000005855 radiation Effects 0.000 title abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000010949 copper Substances 0.000 claims abstract description 5
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000007769 metal material Substances 0.000 claims abstract description 4
- 238000001816 cooling Methods 0.000 claims description 17
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000012774 insulation material Substances 0.000 claims 2
- 229910000806 Latten Inorganic materials 0.000 claims 1
- 238000009434 installation Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 229910001369 Brass Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000010951 brass Substances 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 239000004922 lacquer Substances 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a heat radiation mechanism of a power component of a host board or a circuit board, wherein a high-temperature conduction part of the power component arranged on the host board or the circuit board is made of metal material of high heat conduction, such as copper, etc., and meanwhile, the high-temperature conduction part of the power component extends outwards to form a plurality of through holes on a high-temperature conduction extension part in an utilization rate increase mode of the host board or the circuit board, thereby, air is easy to carry out convection to achieve the purposes of heat radiation and cost reduction.
Description
Technical field
The utility model relates to the cooling mechanism of a kind of motherboard or circuit board power component, particularly relate to a kind of utilization factor that can increase motherboard or circuit board, effectively reduce cost, prolong product serviceable life, the motherboard of hoisting power element radiating effect or the cooling mechanism of circuit board power component.
Background technology
The power component of motherboard or circuit board just produces heat energy through passing to electric current.Owing to generally to the heat that some power component such as source element or chips etc. produced, can't do effective heat radiation,, also influence the life-span of whole motherboard or circuit board indirectly so the life-span of power component 2 is generally shorter.
As shown in Figure 1, on this motherboard or the circuit board 1 before installation power element 2, it is the synoptic diagram that a slice is provided with Copper Foil and contact, Fig. 2 then is the synoptic diagram with the power component installation, when general power component 2 temperature are too high, if no cooling mechanism will shorten other electron component and life of product.Therefore, if when power component 2 temperature are too high, just must dispel the heat.
As shown in Figure 3, generally above power component 2 finned 3 (heat sink) as cooling mechanism, the operation of just can dispelling the heat.Yet finned 3 mechanisms increase cost on foot, influence the market competitiveness.Certainly, the general heat radiation of present high-speed CPU is with fan or other method, otherwise is to improve, and it not is that desire replaces the prior art function that the utility model is discussed, and as can and using or better effect being arranged, does not repeat them here.
So this case creation is artificial to solve inconvenience and the disappearance that power component is had on above-mentioned existing motherboard or the circuit board on cooling mechanism, propose the cooling mechanism of a kind of motherboard or circuit board power component, can effectively reach the heat radiation purpose and reduce cost.
Summary of the invention
Fundamental purpose of the present utility model provides a kind ofly utilizes Copper Foil area in motherboard or the circuit board to reach identical, even better radiating effect, relatively low with respect to aforesaid traditional heat-dissipating method cost, product serviceable life and degree of stability be can effectively prolong, and motherboard or a kind of motherboard of circuit board utilization factor or the cooling mechanism of circuit board power component increased.
Be the motherboard that achieves the above object or the cooling mechanism of circuit board power component, to desire the high heat conduction part of installation power element on motherboard or circuit board makes with the high metal material of heat conduction, such as but not limited to copper, aluminium, brass, steel, stainless steel etc., the high heat conduction part at power component place simultaneously, to increase the mode of motherboard or circuit board utilization factor, stretch out and a plurality of through holes of formation on high heat conduction extension, make the easy convection current of air, reach heat radiation and the purpose that reduces cost.
Preferably, this power component periphery need stamp green lacquer, and scolding tin flows out or plate body when carrying soldering furnace when preventing to produce, and element drift to be welded influences qualification rate.And starting to print the part of tin cream, and only carry out at element to be welded, avoid scolding tin to flow out too much and block through hole.
Below in conjunction with the drawings and specific embodiments the utility model is described in detail, but not as to qualification of the present utility model.
Description of drawings
Fig. 1 is the not synoptic diagram of installation power element of legacy hosts plate;
Fig. 2 is the synoptic diagram of legacy hosts plate installation power element;
Fig. 3 installs gelled synoptic diagram on the power component of legacy hosts plate;
Fig. 4 is the not front schematic view of installation power element of the utility model;
Fig. 5 is the not reverse side synoptic diagram of installation power element of the utility model; And
Fig. 6 is the synoptic diagram of the utility model motherboard installation power element.
Wherein, description of reference numerals is as follows:
The 10-motherboard
The high heat conduction part of 11-
The 12-second high heat conduction part
The 13-power component
The high heat conduction of 14-extension
The 15-through hole
The 16-insulating material
Embodiment
Please be simultaneously with reference to Fig. 4 and shown in Figure 5, be the utility model not front schematic view and the reverse side synoptic diagram of installation power element, the cooling mechanism of the utility model motherboard or circuit board power component is when making motherboard or circuit board 10 (below be generically and collectively referred to as motherboard), reserve the Copper Foil of power component 13 to be installed in advance as chip or source element etc., and be on the tow sides of motherboard 10, to reserve the Copper Foil position, for example chip is a rectangle, just reserve the rectangle Copper Foil, as be square, then reserve square Copper Foil, this making can be by utilizing the light shield etching to form on the substrate.
Therefore, after above-mentioned steps is finished, i.e. insulating material 16 in the part coating that need not be stained with glutinous scolding tin as green lacquer, and can be used as and prevents in the processing procedure that scolding tin flows out and when crossing soldering furnace, desire the drift of soldered elements.For example these power component 13 peripheries are coated with an insulating material 16, and the standard that above-mentioned all fabrication steps all are circuit boards is made flow process, need not to change because of this heat dissipation technology.
The utility model will be desired the high heat conduction part 11 of installation power element 13 and make with the high metal material of heat conduction on motherboard 10, such as but not limited to copper, aluminium, brass, steel, stainless steel etc., wherein the coefficient of heat conductivity of copper, aluminium, brass, steel be respectively 0.92,0.48,0.26,0.12cal/ (cm.S-1 ℃).
As shown in Figure 4, this Copper Foil partly is high heat conduction part 11.Outwards extend and on high heat conduction extension 14, form a plurality of through holes 15 in the mode that increases motherboard 10 utilization factors in the high heat conduction part 11 of desiring installation power element 13 places, as shown in Figure 4, these through hole 15 quantity are many more, area of dissipation increases, the convection current that can allow air produce is also relatively more, the promptly kind spacious place of motherboard that uses makes the easy convection current of air, reaches the purpose that increases radiating effect.These through hole 15 diameters are preferable more preferably greater than diameter 1mm.
As shown in Figure 5, also be provided with one second high heat conduction part 12 with respect to motherboard 10 reverse side of this high heat conduction part 11, its both shapes are identical.Therefore this through hole 15 promptly becomes the perforation of conducting up and down, and the heat energy that so can allow the high heat conduction part 11 in motherboard 10 fronts be accepted can be transmitted to the second high heat conduction part 12 of reverse side rapidly, increases area of dissipation, helps the lifting of radiating effect.
By Fig. 4 and shown in Figure 5, be not coated with green lacquer on this high heat conduction extension 14, make area of dissipation also can increase, simultaneously, electronic component design on motherboard 10, with line design, can do a whole consideration at the utilization factor on the whole motherboard 10, therefore, this high heat conduction extension 14 can increase the space availability ratio on the motherboard 10 at the space availability ratio of motherboard 10, and this a part of space can cooperate the extension of this high heat conduction extension 14 and increase, in order to increase area of dissipation, can effectively utilize the space availability ratio of motherboard 10.
Preferably,, also carry out, avoid scolding tin to flow out too much and block through hole at element to be welded starting to print the part of tin cream.
Please refer to Fig. 6, synoptic diagram for the utility model motherboard installation power element, the cooling mechanism of the utility model motherboard power component is included in a motherboard 10 fronts and is provided with a high heat conduction part 11 and is provided with one second high heat conduction part 12 at these motherboard 10 reverse side with respect to the position of this high heat conduction part 11, this high heat conduction part 11 is equipped with a power component 13, and outwards extend a high heat conduction extension 14, have a plurality of through holes 15 on this high heat conduction extension 14.
After this high heat conduction part 11 installs this power component 13, when the temperature of this power component 13 is too high, this heat just can borrow this high heat conduction part 11 to be transmitted on this second high heat conduction part 12 and this high heat conduction extension 14, and utilize a plurality of through holes 15 and cross-ventilated relation, make heat energy to reach and promote the radiating effect purpose.
In sum, the utility model really can borrow above-mentioned disclosed technology to utilize the Copper Foil area in motherboard or the circuit board can reach identical or better radiating effect, relatively can reduce cost, prolong product serviceable life, increase the utilization factor of motherboard or circuit board.
The above is preferred embodiment of the present utility model only, is not to be used for limiting practical range of the present utility model; Every equivalent variations and modification of doing according to the utility model all contained by claim scope of the present utility model.
Claims (6)
1, the cooling mechanism of a kind of motherboard or circuit board power component is characterized in that, comprising:
On a motherboard or circuit board front, be provided with a high heat conduction part;
Be provided with one second high heat conduction part at described motherboard or circuit board reverse side with respect to described high heat conduction position partly, described high heat conduction partly is equipped with a power component, and outwards extend a high heat conduction extension, described high heat conduction has a plurality of through holes on the extension.
2, the cooling mechanism of motherboard according to claim 1 or circuit board power component is characterized in that, described power component periphery is coated with an insulation material layer.
3, the cooling mechanism of motherboard according to claim 2 or circuit board power component is characterized in that, described insulation material layer is green enamelled coating.
4, the cooling mechanism of motherboard according to claim 1 or circuit board power component is characterized in that, described high heat-conduction part is divided into the high metal material sheet of heat conduction.
5, the cooling mechanism of motherboard according to claim 4 or circuit board power component is characterized in that, described high heat-conduction part is divided into copper sheet, aluminium flake, latten(-tin), steel disc or stainless steel substrates.
6, the cooling mechanism of motherboard according to claim 1 or circuit board power component is characterized in that, described through-hole diameter is greater than 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520001561 CN2800355Y (en) | 2005-01-28 | 2005-01-28 | Heat radiation mechanism of mother board power element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520001561 CN2800355Y (en) | 2005-01-28 | 2005-01-28 | Heat radiation mechanism of mother board power element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2800355Y true CN2800355Y (en) | 2006-07-26 |
Family
ID=36842850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520001561 Expired - Lifetime CN2800355Y (en) | 2005-01-28 | 2005-01-28 | Heat radiation mechanism of mother board power element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2800355Y (en) |
-
2005
- 2005-01-28 CN CN 200520001561 patent/CN2800355Y/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |
Expiration termination date: 20150128 Granted publication date: 20060726 |