CN2757328Y - Press type application combining device of package chip - Google Patents
Press type application combining device of package chip Download PDFInfo
- Publication number
- CN2757328Y CN2757328Y CN 200420116309 CN200420116309U CN2757328Y CN 2757328 Y CN2757328 Y CN 2757328Y CN 200420116309 CN200420116309 CN 200420116309 CN 200420116309 U CN200420116309 U CN 200420116309U CN 2757328 Y CN2757328 Y CN 2757328Y
- Authority
- CN
- China
- Prior art keywords
- circuit board
- packaged chip
- type application
- chip
- shell fragment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The utility model relates to an oppression type application combining device for a packaging chip, which is an oppression type assembling device for applying the packaging chip on a circuit board. The oppression type application combining device for packaging chips comprises at least a vertical elastic conduction connection structure which is composed of an external electric terminal connection point of the packaging chip and a surface connection point of the circuit board; the vertical elastic conduction connection structure of the utility model has a structure that the external electric terminal connection point can be formed into a shape of an elastic sheet, or the surface connection point of the circuit board can be formed into a shape of the elastic sheet. By using vertical pressure of a pressing and holding device on the upper part of the packaging chip, the packaging chip can be pressed on the surface of the circuit board and an elastic combining structure without welding is composed of the elastic sheet and the corresponding connection points so as to obtain the purposes of convenient maintenance and replacement and no welding.
Description
Technical field
The utility model relates to a kind of device of packaged chip, is meant packaged chip compression type application combination device especially.This device is meant the composite set that packaged chip and circuit board can exempt to weld and arrange in pairs or groups and use mutually.
Background technology
At present, existing packaged chip is made of semiconductor chip, outer conductive wire frame, metal connection and peripheral adhesive body, utilize the interior electric tip node and the metal connection of this lead frame to be connected with semiconductor chip formation conduction, and can make packaged chip bring into play its function for using with electronic product conducting such as the external circuit board with the dispatch from foreign news agency tip node of this lead frame.The structure that traditional packaged chip and circuit board assembling are used is used welding and the conductive media of scolding tin as the two usually.Its weak point is after solder cools is solidified, and promptly can't remove arbitrarily, causes the maintain and replace operational difficulty of this packaged chip; Secondly, use scolding tin as conductive media, in assembling process, easily generation high temperature is damaged packaged chip, the tin liquor overflow causes short circuit, and many quality defectses that are difficult to technology control, particularly under packaged chip downsizing now, precise treatment trend, allow relevant dealer's QC work more attain difficulty.
Used another kind of packaged chip is exempted from the welding assembly application apparatus, be common in the computer hardware of main frame, it is to be preset with a slidingtype electric connector in circuit board (motherboard), this electric connector is provided with most jacks, in the hole and be provided with the conducting terminal of transverse elasticity tension force, this structure can provide a central processing unit (CPU) assembling of pegging graft.But the assembling application apparatus weak point that this kind exempts to weld is the conducting wire frame structure that is defined in packaged chip must be formed with several needle-like pins, the ability transplanting is in the jack of electric connector, and constitute conduction with its conducting terminal and be connected, as seen, other volume is less or do not have the chip (for example memory chip etc.) of needle-like pin, will be difficult to carry out this kind set of applications assembling device.
Summary of the invention
The purpose of this utility model is to avoid above-mentioned weak point of the prior art and product that a kind of compression type application combination device of packaged chip is provided, the vertical structure that is flexibly connected between the packaged chip of this device and the circuit board, the press holder structural design that cooperates packaged chip top, the compression type application combination structure that formation can be exempted to weld further obtains easy maintain and replace and saves the purpose of welding cost.
The purpose of this utility model can reach by following measure:
A kind of compression type application combination device of packaged chip comprises that packaged chip, circuit board and a press holder form; This packaged chip is that semiconductor chip constitutes in conjunction with a lead frame, and this lead frame is formed for having most pin arrangements, and each pin has a dispatch from foreign news agency tip node and is connected with circuit board work conduction; This circuit board is to be provided with most contacts in the plate face.
This press holder is arranged at this packaged chip top, is a deckle board, and this deckle board below is provided with removable pin, makes this tear the formula pin open and plants in circuit board.
Wherein, this press holder is one " ㄇ " shape shell fragment, is respectively equipped with a hook portion in two bottoms, and the embedding of " ㄇ " shape shell fragment is colluded in this circuit board.
Wherein, this vertical structure that is flexibly connected comprises that the dispatch from foreign news agency tip node that makes each pin of lead frame constitutes the shell fragment shape that extends below being bent to.
Wherein, this vertical structure that is flexibly connected comprises that the most contacts that make this circuit board face are made as the shell fragment of bent projection.
The utility model has following advantage compared to existing technology: the utility model is by comprising that packaged chip, circuit board and a press holder are formed, wherein: packaged chip, it is the chip body that is constituted in conjunction with an outer conductive wire frame for semiconductor chip, this lead frame is formed by having most pins, each pin has in one electric tip node and is provided with lead and makes conduction with semiconductor chip and is connected, and has a dispatch from foreign news agency tip node and can conduct electricity with the circuit board work and be connected; Circuit board is the circuit-board card that is provided with most contacts for a kind of plate face; Press holder is in order to press seal cartridge chip and the fixing constructional device of circuit board; The dispatch from foreign news agency tip node and the circuit board face contact that reach the packaged chip lead frame whereby constitute the vertical structure that is flexibly connected, this vertical structure that is flexibly connected can make the dispatch from foreign news agency tip node of packaged chip lead frame constitute the shell fragment shape, or make circuit board face contact constitute the shell fragment shape, lateral pressure by packaged chip top one press holder, make this packaged chip and the pressing of circuit board face, make described shell fragment and corresponding contact constitute unjointed elasticity combining structure, change to reach for ease of maintenaince, and the purpose of exempting to weld.
Description of drawings
Fig. 1 is the decomposing schematic representation of the compression type application combination device of packaged chip.
Fig. 2 is the sectional schematic diagram of the compression type application combination device of packaged chip.
Fig. 3 is another embodiment decomposing schematic representation of compression type application combination device of packaged chip.
Fig. 4 is another embodiment sectional schematic diagram of compression type application combination device of packaged chip.
Fig. 5 is the embodiment sectional schematic diagram of the compression type application combination device of packaged chip.
Fig. 6 is the embodiment decomposing schematic representation of the compression type application combination device of packaged chip.
Fig. 7 is another embodiment sectional schematic diagram of the compression type application combination device of packaged chip.
The figure number explanation
Packaged chip 1; Semiconductor chip 11;
Interior electric tip node 122; Dispatch from foreign news agency tip node 123;
Hook portion 34;
Embodiment
Existing adjoint embodiment is described in detail as follows architectural feature of the present utility model and other effect, purpose:
See also shown in Figure 1ly, the compression type application combination device of a kind of packaged chip of the utility model comprises that packaged chip 1, circuit board 2 and a press holder 3 form, wherein:
Packaged chip 1, be that (this is the article that prior art constituted for semiconductor chip 11, promptly usually with the made chip type electronic assembly of semi-conducting material, make it have functions such as logical operation, memory storage) chip body that constituted in conjunction with an outer conductive wire frame 12, and the outside insulating properties adhesive body 13 in order to sealing that is provided with; Wherein, this lead frame 12 is arranged formation by most sheet pins 121, its arrangement form comprises to be located at packaged chip 1 below, two sides or to form matrix array shape, respectively this pin 121 is to have in one electric tip node 122 to be provided with lead and to do to conduct electricity with semiconductor chip 11 and be connected, and have a dispatch from foreign news agency tip node 123 and expose outside this adhesive body 13, borrow this dispatch from foreign news agency tip node 123 to make conduction and be connected with circuit board 2;
Above structure, make each pin 121 dispatch from foreign news agency tip node 123 of this packaged chip 1 lead frame 12 constitute a vertical structure that is flexibly connected respectively with 2 contacts 21 of this circuit board, even described dispatch from foreign news agency tip node 123 constitutes a kind of with the contacted package assembly of metal clips tension force with contact 21, as shown in Figures 1 and 2, can make the dispatch from foreign news agency tip node 123 of this packaged chip 1 constitute the shell fragment 124 that extends below being bent to, form Elastic Contact with 2 contacts of circuit board 21.
See also Fig. 3 and shown in Figure 4, the dispatch from foreign news agency tip node 123 of these lead frame 12 each pins 121 described in the utility model, also can constitute and be exposed to adhesive body 13 belows and be plane contact-making surface, and make 2 contacts 21 of this circuit board be made as the shell fragment 22 of bent projection, constitute the described vertical structure that is flexibly connected, can make the shell fragment 22 of 2 of this circuit boards and the dispatch from foreign news agency tip node 123 of packaged chip 1 form Elastic Contact; Wherein, described these shell fragment 22 constituted modes, can be an insulating properties fixed head 23 and be fixed with most and contact 21 corresponding bending shell fragments 22 earlier, make each shell fragment 22 be exposed to fixed head 23 above and below, and make this fixed head 23 be fixedly arranged on 2 of circuit boards (for example to plug fixed form), make each shell fragment 22 bottom make conduction with contact 21 and contact, this structure can utilize dispatch from foreign news agency tip node 123 Elastic Contact of each shell fragment 22 top and packaged chip 1 to form the vertical structure that is flexibly connected.
As previously mentioned, this press holder 3 of the utility model is to be fixed in structure on this circuit board 2 for pressing down this packaged chip 1, its execution mode sees also Fig. 5 and Fig. 6 is described, can constitute a deckle board 31, these deckle board 31 belows are provided with removable pin 32, this removable pin 32 is planted in circuit board 2,, make described shell fragment 124 or 22 form the vertical structure that is flexibly connected even deckle board 31 presses down packaged chip 1; And for example shown in Figure 7, this press holder 3 also can be one " ㄇ " shape shell fragment 33, is respectively equipped with a hook portion 34 in two bottoms, and 33 embeddings of " ㄇ " shape shell fragment are colluded in this circuit board 2, can press down packaged chip 1, make described shell fragment 124 or 22 form the vertical structure that is flexibly connected; But, the execution mode of above-mentioned this press holder 3 only is one of the utility model embodiment, and the structural form of unrestricted variableization enforcement, promptly every this packaged chip 1 that can press down is fixed in structure on this circuit board 2, but in all application implementations of the utility model.
The compression type application combination device of the utility model packaged chip, utilize the described vertical respective outer side edges press holder 3 that is flexibly connected, this packaged chip 1 and circuit board 2 assemblings are used, can exempt existing welding manner, so be easy to dismounting in the time of making in the future maintain and replace, and exempt existing welding cost, can improve the shortcomings such as high temperature, tin liquor overflow of existing scolding tin welding especially, reduce the QC cost, and promote its assembling quality.
In sum, the compression type application combination device of the utility model packaged chip, really tool practicality and creativity, the utilization of its means also undoubtedly for novelty, and effect and purpose of design really meet, and claimed rationally progressive to bright, for this reason, utility application is proposed in accordance with the law.
Claims (4)
1, a kind of compression type application combination device of packaged chip comprises that packaged chip, circuit board and a press holder form; This packaged chip is that semiconductor chip constitutes in conjunction with a lead frame, and this lead frame is formed for having most pin arrangements, and each pin has a dispatch from foreign news agency tip node and is connected with circuit board work conduction; This circuit board is to be provided with most contacts in the plate face, it is characterized in that:
This press holder is arranged at this packaged chip top, is a deckle board, and this deckle board below is provided with removable pin, makes this tear the formula pin open and plants in circuit board.
2, the compression type application combination device of a kind of packaged chip as claimed in claim 1 is characterized in that: wherein, this press holder is one " ㄇ " shape shell fragment, is respectively equipped with a hook portion in two bottoms, and the embedding of " ㄇ " shape shell fragment is colluded in this circuit board.
3, the compression type application combination device of a kind of packaged chip as claimed in claim 1 or 2 is characterized in that: wherein, this vertical structure that is flexibly connected comprises that the dispatch from foreign news agency tip node that makes each pin of lead frame constitutes the shell fragment shape that extends below being bent to.
4, the compression type application combination device of a kind of packaged chip as claimed in claim 1 or 2 is characterized in that: wherein, this vertical structure that is flexibly connected comprises that the most contacts that make this circuit board face are made as the shell fragment of bent projection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420116309 CN2757328Y (en) | 2004-12-01 | 2004-12-01 | Press type application combining device of package chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200420116309 CN2757328Y (en) | 2004-12-01 | 2004-12-01 | Press type application combining device of package chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2757328Y true CN2757328Y (en) | 2006-02-08 |
Family
ID=35965712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200420116309 Expired - Fee Related CN2757328Y (en) | 2004-12-01 | 2004-12-01 | Press type application combining device of package chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2757328Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105206640A (en) * | 2015-10-08 | 2015-12-30 | 格科微电子（上海）有限公司 | Camera module and assembling method thereof |
| CN112992821A (en) * | 2019-12-13 | 2021-06-18 | 珠海格力电器股份有限公司 | Chip packaging structure and packaging method thereof |
-
2004
- 2004-12-01 CN CN 200420116309 patent/CN2757328Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105206640A (en) * | 2015-10-08 | 2015-12-30 | 格科微电子（上海）有限公司 | Camera module and assembling method thereof |
| CN105206640B (en) * | 2015-10-08 | 2020-04-21 | 格科微电子（上海）有限公司 | Camera module and assembling method thereof |
| CN112992821A (en) * | 2019-12-13 | 2021-06-18 | 珠海格力电器股份有限公司 | Chip packaging structure and packaging method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |