CN2735548Y

CN2735548Y - Large-power LED radiating structure

Info

Publication number: CN2735548Y
Application number: CNU2004200123183U
Authority: CN
Inventors: 严美凤
Original assignee: Individual
Current assignee: Individual
Priority date: 2004-08-06
Filing date: 2004-08-06
Publication date: 2005-10-19
Anticipated expiration: 2014-08-06

Abstract

The utility model relates to a large-power LED heat radiation structure, which belongs to the electromechanical class. The large-power LED heat radiation structure comprises a casing base provided with a containing space and a heat radiation box arranged in the containing space of the casing base, and heat radiation liquid is sealed in the heat radiation box. The large-power LED heat radiation structure also comprises a circuit substrate arranged on the heat radiation box and at least one high power LED arranged on the circuit substrate. Wherein the heat radiation box comprises a load bearing tank body and a tank cover covering the load bearing tank body, and the heat radiation liquid is heat radiation silicon oil. A heat conducting adhesive layer is provided between the heat radiation and the circuit substrate, an agitating system is contained in the heat radiation box, and the heat radiation box is connected to an oil pressure circulation system. Penetrating the introduction of the heat radiation system can prevent the accumulation of heat from affecting the electrical property of the large-power LED. The large-power LED heat radiation structure has the advantages of simple structure and easy assembly, and the large-power LED heat radiation structure can prevent the accumulation of heat from affecting the electrical property of the large-power LED.

Description

The high-capacity LED radiator structure

Technical field

The utility model relates to electrical category, and particularly a kind of high-capacity LED radiator structure refers to a kind of radiator structure that is applicable to the high-power light emitting diode especially, and by the importing of this radiator structure, it is electrical because of accumulation of heat influences can to avoid light-emittingdiode combination.

Background technology

As everyone knows, light-emittingdiode (Light Emitting Diode, LED) be a kind of luminous PN diode of circulating current that utilizes, in the PN diode, add forward bias voltage drop, the P type partly is an anode, the N type partly is a negative electrode, and so, P type semiconductor can flow into electronics, the part of N type semiconductor then flows into electric hole, in addition, near the electronics PN engages and electric hole are understood because of vigorous the combination and are disappeared, at this moment, specific semiconductor, the electronics of its inflow and electric hole have can be luminous energy, utilize this kind situation and produce light source, promptly so-called light-emittingdiode;

Yet, no matter be the light-emittingdiode of which kind of type, its life cycle life-span and reliability mainly are subjected to the control of temperature, with high power GaN type light-emittingdiode is example, after this diode is accepted electric energy, can transfer 10% electric energy to luminous energy and disperse out, remaining 90% becomes the heat energy loss and goes out; So for GaN type light-emittingdiode, the electric energy that this LED wafer is accepted nearly all is converted into heat energy, also therefore just become an important problem at the heat dissipation problem of high-capacity LED, especially then even more important to the light fixture that assembles by high-capacity LED; As shown in Figure 1, it is a high-capacity LED light fixture combination commonly used, its primary structure comprises a housing pedestal 11, a circuit substrate 12 is locked on this housing pedestal 11, and a plurality of high-capacity LEDs 13, be arranged on this circuit substrate 12, see through the conduction of power lead 14, then this light fixture combination just can provide enough light sources; Yet, when reality is used, this high-capacity LED 13 can produce a large amount of heat energy, but in this type of apparatus structure, the conduction that this heat energy only can see through power lead 14 or circuit substrate 12 and housing pedestal 11 contact positions comes loss, its poor effect causes this high-capacity LED 13 to make it electrically influenced because of accumulation of heat and temperature rise, and need be improved.

The utility model content

According to the purpose of this utility model, the shortcoming at above-mentioned high-capacity LED radiator structure commonly used exists provides a kind of high-capacity LED radiator structure, and its structure comprises a housing pedestal, and it has an accommodation space; One heat radiation case is arranged in the accommodation space of this housing pedestal, and has sealed radiator liquid in this heat radiation case up for safekeeping; One circuit substrate is arranged on this heat radiation case; And at least one high-capacity LED, be arranged on this circuit substrate; Wherein, this heat radiation case comprises a carrying cell body, in order to carry this radiator liquid; One groove lid, lid thing are on this carrying cell body, and in order to this radiator liquid is sealed up for safekeeping among this carrying cell body, radiator liquid is a heat radiation silicon oil; Have a heat conduction glue-line between this heat radiation case and this circuit substrate, in order to bonding case and this circuit substrate of should dispelling the heat, and heat conduction therebetween; Comprise an agitation system in this heat radiation case, in order to stir the radiator liquid in this heat radiation case, in order to quicken the heat radiation function of this radiator liquid; This heat radiation case is connected to an oil pressure circulatory system, in order to the radiator liquid in this heat radiation case of transmission, and then the heat radiation function that quickens this radiator liquid; See through the importing of cooling system, effectively the heat that produced of this high-capacity LED of loss is avoided influencing the electrical of high-capacity LED because of accumulation of heat.

Advantage of the present utility model is: simple in structure, assembling is easy, and can avoid influencing the electrical of high-capacity LED because of accumulation of heat.

Description of drawings:

Fig. 1 is the structure dress combination schematic diagram of high-capacity LED light fixture commonly used;

Fig. 2 is a structural representation of the present utility model;

Fig. 3 is another embodiment schematic diagram of the present utility model;

Fig. 4 is an another embodiment schematic diagram of the present utility model;

Fig. 5 is an embodiment schematic diagram more of the present utility model.

Embodiment:

As shown in Figure 2, high-capacity LED light fixture group includes a housing pedestal 21, and it has an accommodation space; One heat radiation case 24 is arranged in the accommodation space of this housing pedestal 21, and has sealed radiator liquid 25 in this heat radiation case 24 up for safekeeping; One circuit substrate 22 is arranged on this heat radiation case 24; And at least one high-capacity LED 23, be arranged on this circuit substrate 22; Wherein, this heat radiation case 24 comprises a carrying cell body 241, in order to carry this radiator liquid 25; One groove lid 242, be covered on this carrying cell body 241, in order to this radiator liquid 25 is sealed up for safekeeping among this carrying cell body, can set up an oil sheet 243 between the two, seal up for safekeeping to reach closely, in practical application, 22 of this heat radiation case 24 and this circuit substrates have a heat conduction glue-line 26, in order to bonding case 24 and this circuit substrate 22 of should dispelling the heat, and heat conduction therebetween; The liquid of this radiator liquid preferable heat-sinking capability of 25 optional apparatus and low-thermal-expansion rate, general commercially available heat radiation silicon oil is promptly applicable;

Importing by heat radiation case 24 structures, the heat that high-capacity LED 23 produces, see through heat-conducting glue 26 by circuit substrate 22 and import heat radiation case 24, see through radiator liquid 25 convection current and conduction in the heat radiation case 24 again, just the effective heat that produced of this high-capacity LED of loss, avoid because of accumulation of heat influence high-capacity LED electrically or cause damage;

As shown in Figure 3, its structure comprises a housing pedestal 21, has an accommodation space in it, one printing opacity loam cake 34 is to should housing pedestal 21, in order to seal this accommodation space, one circuit substrate 22, be arranged in this accommodation space, at least one high-capacity LED 23 is arranged on this circuit substrate 22, an and radiator liquid 35, be filled in this accommodation space,, avoid that it is electrical because of accumulation of heat influences in order to the heat that this high-capacity LED 23 of loss is produced; Similarly, this radiator liquid can be a heat radiation silicon oil, certainly, in practical application, for radiator liquid 35 is sealed up for safekeeping in this accommodation space, this printing

opacity loam cake

34 and 21 of this housing pedestals can be set up an oil sheet 361, see through screw or other clamping modes again, with both driving fits; On the other hand, power lead 27 also can see through an oil sealing ring plate 362 and pass outwards through base housing 21 by this accommodation space inside, because radiator liquid 35 can directly contact with this high-capacity LED, so with more effective loss heat, and on the other hand, 35 of this radiator liquid are as an insulating material, can't influence high-capacity LED electrically; Moreover the light that high-capacity LED is dispersed is penetrated, and sees through the scattering of radiator liquid, more can produce the effect that softening light is penetrated;

As shown in Figure 4, in the bearing space in this heat radiation case 24 agitation system 41 can be set, in order to stirring the radiator liquid 25 in this bearing space, and then quicken the heat that this high-capacity LED 23 of loss is produced, avoid that it is electrical because of accumulation of heat influences;

As shown in Figure 5, the bearing spaces in this heat radiation case 24 are connected to an oil pressure circulatory system 51, in order to the radiator liquid 25 in this bearing space of transmission, and then quicken the heat that this high merit master LED of loss is produced, and avoid that it is electrical because of accumulation of heat influences.

In addition, the package assembly that the utility model discloses, no matter be housing pedestal or heat radiation case, it makes selecting for use of material must do detailed considering simultaneously, the utility model is considered at the housing pedestal or the material of heat radiation case, except the engineering properties of paying attention to material itself, isolated reaching the conductivity, with the coefficient of expansion of temperature correlation also considering substantially for the utility model material selection, otherwise material selection may make the housing of this light-emittingdiode package assembly improperly, phenomenon such as produce qualitative change, deterioration even break under temperature constantly changes.

Claims

1, a kind of high-capacity LED radiator structure is characterized in that: comprise

One housing pedestal, it has an accommodation space;

One heat radiation case is arranged in the accommodation space of this housing pedestal, and has sealed radiator liquid in this heat radiation case up for safekeeping;

One circuit substrate is arranged on this heat radiation case;

And at least one high-capacity LED, be arranged on this circuit substrate;

2, a kind of high-capacity LED radiator structure according to claim 1 is characterized in that: said heat radiation case comprises a carrying cell body, in order to carry this radiator liquid; And groove lid, be covered on this carrying cell body, in order to this radiator liquid is sealed up for safekeeping among this carrying cell body, this radiator liquid is heat radiation silicon oil.

3, a kind of high-capacity LED radiator structure according to claim 1 is characterized in that: have a heat conduction glue-line between said heat radiation case and this circuit substrate, and in order to bonding case and this circuit substrate of should dispelling the heat, and heat conduction therebetween.

4, a kind of high-capacity LED radiator structure according to claim 1 is characterized in that: comprise an agitation system in the said heat radiation case, in order to stir the radiator liquid in this heat radiation case.

5, a kind of high-capacity LED radiator structure according to claim 1, it is characterized in that: said heat radiation case is connected to an oil pressure circulatory system, in order to the radiator liquid in this heat radiation case of transmission.