CN2676568Y - Microwave artificial band gap material composed of chip inductor capacitor - Google Patents
Microwave artificial band gap material composed of chip inductor capacitor Download PDFInfo
- Publication number
- CN2676568Y CN2676568Y CN 200320122757 CN200320122757U CN2676568Y CN 2676568 Y CN2676568 Y CN 2676568Y CN 200320122757 CN200320122757 CN 200320122757 CN 200320122757 U CN200320122757 U CN 200320122757U CN 2676568 Y CN2676568 Y CN 2676568Y
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- microwave
- band gap
- utility
- model
- gap material
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Abstract
The utility model discloses a microwave artificial band gap material composed of paster type inductors and paster type capacitors, relating to a high impedance electromagnetic wave surface in the microwave frequency band, and adopting the technology of the printed circuit board to design and produce graph structures complying with the operating requirement on a medium copper-clad panel. The medium copper-clad panel consisting of clutch gold (5) and medium (9) is characterized in that the clutch gold (5) is respectively welded with a paster type capacitor or/and a paster type inductor by solder (6) in the horizontal slit (7) and the vertical through hole (4) of the graph structure in order, which forms a two-dimensional composite network structure. The band gap regulating range of the microwave artificial band gap material of the utility model can be increased to 0. 5GHz-10GHz, the band gap depth is 20-40dB, and the area is reduced by 8-10 times. The microwave artificial band gap material is easy to design, easy to regulate, easy to produce and simple in technology. The material of the utility model is applied widely on the reflection plane of the base plate of the microwave antenna, the base plate of the microwave filter and the microwave shielding material, etc.
Description
Technical field
The utility model relates to the material of a kind of substrate that can be used for microwave antenna and microwave filter etc., refers to the improvement structure on the high impedance electromagnetic wave surface of microwave frequency band especially.
Background technology
The microwave man-made band gap material claims the electromagnetic wave crystal again, specifically is meant the high impedance electromagnetic wave surface of microwave frequency band, because of it has the concern that purposes widely is subjected to the insider.When this material is used for the substrate (reflecting surface) of microwave antenna, or when the substrate of microwave filter and micro-wave screening material etc., has very superior performance.At present, making this high impedance electromagnetic wave surface, all is to adopt to make on metallic sheet material to have periodic figure formation.Metallic plate can be individual layer, bilayer or multilayer.Specifically be on metallic plate, to make various rectangles with periodic structure with printed-board technology, square, hexagon, the octangle figures, through after such making, this material had both had continuity, has the patterned surface that periodic new printed circuit is formed again, so can not allow a certain frequency band of microwave frequency pass through, make this surface not support surface wave propagation under this frequency, thereby make the various requirement of its microwave frequency band that meets the design and use requirement, have electromagnetic band resistance characteristic-promptly have the band structure material of band gap characteristics, i.e. a high impedance electromagnetic wave surface and become.But, because this microwave man-made band gap material is to make of printed circuit technique merely to constitute, so the material of this structure is subjected to the restriction of its dimension of picture and material thickness, the suitable frequency range that makes the band gap adjustable range promptly in fact can regulate and change is in fact very limited, do greatly especially, not only increase cost, and can not satisfy the instructions for use of some occasion.
Summary of the invention
The purpose of this utility model is to release a kind of microwave man-made band gap material that can increase band gap adjustable range, reduced volume, satisfy various occasion instructions for uses.
In order to achieve the above object, the utility model adopts passive SMT Inductor or/and the patch capacitor device, in conjunction with the graphic structure of printed circuit board (PCB) (PCB), constitute the compound planar network structure of two dimension, reach the purpose that the utility model increases band gap adjustable range, reduced volume.Concrete structure is as follows:
Comprise and adopt printed-board technology in the medium copper-clad plate, to design, make the graphic structure that meets instructions for use, the medium copper-clad plate is made of Copper Foil and medium, be characterized in: between the horizontal gap of graphic structure, by scolding tin and plain conductor with patch capacitor device and Copper Foil firm welding, simultaneously in the vertical through hole of graphic structure, with SMT Inductor and Copper Foil also firm welding, constitute the composite network structure of two dimension by scolding tin.
Perhaps between the horizontal gap of graphic structure, only by scolding tin and plain conductor with patch capacitor device and Copper Foil firm welding, and be connected with sheet metal in the vertical through hole of graphic structure, constitute two-dimentional composite network structure.
Perhaps in the vertical through hole in graphic structure, only SMT Inductor and Copper Foil are welded, constitute the composite network structure of two dimension of the present utility model, can both reach the purpose that increases band gap adjustable range, reduced volume, expansion use occasion by scolding tin.
The utility model has the advantages that:
1. owing to adopt passive SMT Inductor or/and the patch capacitor device constitutes the composite network of two dimension, in conjunction with the graphic structure of printed circuit board (PCB) (PCB), therefore the band gap adjustable range of microwave man-made band gap material of the present utility model can increase to 0.5GH
z～10GH
z, the band gap degree of depth is that 20～40dB, area dwindle 8～10 times.
2. because structure of the present utility model is to increase patch capacitor device and/or inductor on pcb board, therefore has easy design, easily the advantage of making and regulating easily.
3. because making of the present utility model is to adopt traditional scolding tin, and the Copper Foil of medium copper-clad plate provides convenience for scolding tin, and it is simple therefore to have technology, the advantage of quality assurance.
Description of drawings
Fig. 1 is a structural representation of using SMT Inductor and patch capacitor device simultaneously of the present utility model
Fig. 2 is the A-A cutaway view of Fig. 1
Fig. 3 is of the present utility model the structural representation with SMT Inductor
Fig. 4 is the B-B cutaway view of Fig. 3
Fig. 5 is of the present utility model the structural representation with the patch capacitor device
Fig. 6 is the C-C cutaway view of Fig. 5
Label declaration in the accompanying drawing
1-SMT Inductor 2-plain conductor 3-patch capacitor device 4-vertical through hole
5-Copper Foil 6-scolding tin 7-horizontal gap 8-sheet metal 9-medium
Embodiment
At first see also Fig. 1,2,3.The utility model comprises the employing printed-board technology, by set the square-shaped patterns that requirement designs and produces in the medium copper-clad plate, horizontal gap 7 is arranged between the square, and horizontal gap 7 intersections are provided with vertical through hole 4.The medium copper-clad plate is a medium 9 by the centre, and both sides are that Copper Foil 5 constitutes up and down.7 of horizontal gaps,, be consolidated with passive patch capacitor device 3 with scolding tin 6 and plain conductor 2.Simultaneously, be consolidated with SMT Inductor 1 with scolding tin 6 in vertical through hole 4, constitute the compound planar network structure of two dimension, this structure has the two-dimentional high impedance electromagnetic wave surface-microwave man-made band gap material of microwave frequency band.
See also Fig. 3,4.Material of the present utility model adopts printed-board technology identical with Fig. 1 and 2 with the making graphic structure by setting the requirement design in the medium copper-clad plate.Not existing together is in the vertical through hole 4 of the figure that is made into, affixed by scolding tin 6 and Copper Foil 5 with passive SMT Inductor 1, constitutes the two-dimentional high impedance electromagnetic wave surface with microwave frequency band of the present utility model.
See also Fig. 5 and 6.Material of the present utility model adopts printed-board technology identical with Fig. 1 and 2 with the making graphic structure by setting the requirement design in the medium copper-clad plate.Do not exist together is 7 of the horizontal gaps of the figure that is made into, only with passive patch capacitor device 3, by scolding tin 6 and plain conductor 2, itself and Copper Foil 5 is fixed, and in vertical through hole 4, be provided with sheet metal 8, and weld with Copper Foil 5, constitute the two-dimentional high impedance electromagnetic wave surface-microwave man-made band gap material with microwave frequency band of the present utility model.
Medium copper-clad plate of the present utility model can be individual layer, bilayer or multilayer, is as the criterion to satisfy the instructions for use of surface wave propagation characteristic conforms.Use patch capacitor device 3 and SMT Inductor 1 no matter be simultaneously in 7 of horizontal gaps in graphic structure and the vertical through hole 4, perhaps only with SMT Inductor 1, or only use patch capacitor device 3, and can both reach increase band gap, reduced volume, satisfy the purpose that various occasions are used.If this high impedance electromagnetic wave of the present utility model surface is used as the microwave antenna reflecting surface, then improve the radiation frequency of antenna very significantly, dwindled antenna volume greatly, effectively raise directivity, reduced radiation loss etc.
Claims (3)
1. use the microwave man-made band gap material of SMT Inductor capacitor formation, comprise and adopt printed-board technology in the medium copper-clad plate, to design, making meets the graphic structure of instructions for use, the medium copper-clad plate is made of Copper Foil (5) and medium (9), it is characterized in that: between the horizontal gap of graphic structure (7), with scolding tin (6) and plain conductor (2) with patch capacitor device (3) and Copper Foil (5) firm welding, simultaneously in the vertical through hole (4) of graphic structure, also use scolding tin (6) with SMT Inductor (1) and Copper Foil (5) also firm welding, constitute the composite network structure of two dimension.
2. the microwave man-made band gap material that constitutes with SMT Inductor patch capacitor device according to claim 1, it is characterized in that: described between the horizontal gap of graphic structure between (7), by scolding tin (6) and plain conductor (2), only use patch capacitor device (3) and Copper Foil (5) to weld, and be connected with sheet metal (8) in the vertical through hole of graphic structure (4), constitute the composite network structure of two dimension.
3. the microwave man-made band gap material that constitutes with chip inductor and/or patch capacitor according to claim 1, it is characterized in that: in the described vertical through hole (4) at graphic structure, only SMT Inductor (1) and Copper Foil (5) are welded, constitute the composite network structure of two dimension by scolding tin (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320122757 CN2676568Y (en) | 2003-12-24 | 2003-12-24 | Microwave artificial band gap material composed of chip inductor capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320122757 CN2676568Y (en) | 2003-12-24 | 2003-12-24 | Microwave artificial band gap material composed of chip inductor capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2676568Y true CN2676568Y (en) | 2005-02-02 |
Family
ID=34476285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320122757 Expired - Fee Related CN2676568Y (en) | 2003-12-24 | 2003-12-24 | Microwave artificial band gap material composed of chip inductor capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2676568Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800950A (en) * | 2012-08-03 | 2012-11-28 | 电子科技大学 | Printed broadband terminal antenna |
| CN102983394A (en) * | 2012-09-19 | 2013-03-20 | 电子科技大学 | Small size planar antenna with five frequency ranges being covered |
| CN106785395A (en) * | 2016-12-20 | 2017-05-31 | 国网重庆市电力公司电力科学研究院 | A kind of high impedance surface structure and a kind of unilateral nmr sensor |
| US20210203062A1 (en) * | 2019-12-27 | 2021-07-01 | Samsung Electronics Co., Ltd. | Cover device for optimal beam implementation of antenna in wireless communication system |
-
2003
- 2003-12-24 CN CN 200320122757 patent/CN2676568Y/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102800950A (en) * | 2012-08-03 | 2012-11-28 | 电子科技大学 | Printed broadband terminal antenna |
| CN102800950B (en) * | 2012-08-03 | 2015-09-09 | 电子科技大学 | printed broadband terminal antenna |
| CN102983394A (en) * | 2012-09-19 | 2013-03-20 | 电子科技大学 | Small size planar antenna with five frequency ranges being covered |
| CN102983394B (en) * | 2012-09-19 | 2015-07-15 | 电子科技大学 | Small size planar antenna with five frequency ranges being covered |
| CN106785395A (en) * | 2016-12-20 | 2017-05-31 | 国网重庆市电力公司电力科学研究院 | A kind of high impedance surface structure and a kind of unilateral nmr sensor |
| CN106785395B (en) * | 2016-12-20 | 2019-06-04 | 国网重庆市电力公司电力科学研究院 | A kind of high impedance surface structure and a kind of unilateral nmr sensor |
| US20210203062A1 (en) * | 2019-12-27 | 2021-07-01 | Samsung Electronics Co., Ltd. | Cover device for optimal beam implementation of antenna in wireless communication system |
| US11677138B2 (en) * | 2019-12-27 | 2023-06-13 | Samsung Electronics Co., Ltd. | Cover device for optimal beam implementation of antenna in wireless communication system |
| US12009579B2 (en) | 2019-12-27 | 2024-06-11 | Samsung Electronics Co., Ltd. | Cover device for optimal beam implementation of antenna in wireless communication system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |