CN2593363Y

CN2593363Y - Heat tube radiator

Info

Publication number: CN2593363Y
Application number: CN 03202080
Authority: CN
Inventors: 叶永丰
Original assignee: Individual
Current assignee: Individual
Priority date: 2003-01-02
Filing date: 2003-01-02
Publication date: 2003-12-17
Anticipated expiration: 2013-01-02

Abstract

The utility model relates to a heat tube radiator, which can be used for semiconductor component cooling and heat rejection and belongs to the technical field of heat engineering and electric appliance. The utility model is characterized in that a cooling fin (6) is provided with a heat tube base (3) on the basis of the existing radiator structure; the upper end of the heat tube base (3) is provided with filling pipes (1); the base (3) is drilled with a plurality of pore canals (2); the filling pipes (1) are communicated with the pore canals (2); holes of the pore canals (2) are communicated with each other; the pore canals (2) are filled with low boiling point liquid working medium (4); the shape of the base (3) can be a rectangle or a square or a circle; the installation and the arrangement of the cooling fin (6) and the base (3) can be a single side shape or a surrounding shape; the shape of the cooling fin (6) can be a wave shape or a zigzag or a radiate shape; the shape of the pore canals (2) can be a circle or an ellipse or a polygon. The utility model has the advantages that the heat tube radiator can enhance the heat rejection effect of a radiator under the identical condition, and simultaneously promote the miniaturization and the high efficiency of the radiator; the heat tube radiator has novel structure and simple structure.

Description

Heat-pipe radiator

Technical field

The utility model relates to thermal technology and technical field of electric appliances, especially for the heat-pipe radiator of semiconductor components and devices heat radiation cooling.

Background technology

At present, the radiator of semiconductor components and devices aspect generally adopts shape or air quantity that improves fan that improves cooling fins in the radiator or the volume that increases radiator to improve radiating effect, the structure of general radiator, as shown in Figure 1, comprise fan (5) and cooling fins (6), both are fastenedly connected, cooling fins (6) and semiconductor refrigerating combination of elements.But always can not break through limited heat radiation scope.Need on the market particularly that volume is little, during the product type of compact conformation, just can not adapt to, bring restriction for the heat radiation and the cooling of semiconductor and element thereof.

The utility model content

The purpose of this utility model is at above-mentioned defective, provides a kind of hot pipe technique is combined with existing radiator, has the heat-pipe radiator of high heat conductivility.

The technical solution of the utility model is on existing heat spreader structures basis, heat pipe substrate (3) also is installed on cooling fins (6), topping up pipe (1) is installed in its upper end, be drilled with several ducts (2) in the substrate (3), topping up pipe (1) is communicated with duct (2), is communicated with between duct (2) mesopore and the hole; In duct (2), be filled with low-boiling point liquid working medium (4).

The shape of said substrate (3) is that rectangle is square or circular, and it is single side type or circulating type that cooling fins (6) is arranged with the installation of substrate (3), and the shape of cooling fins (6) is waveform or zigzag or radiation; The shape in duct (2) is circle or ellipse or polygon.

Said low-boiling point liquid working medium (4) is ammoniacal liquor.

The utility model has the advantages that the radiating effect that can improve radiator under the same conditions greatly, promote the miniaturization of radiator high efficiency, structure is novel, simple and compact for structure.

Description of drawings

Further describe embodiment below in conjunction with accompanying drawing.

Fig. 1 is the utility model side sectional view.

Fig. 2 is an A-A cutaway view among Fig. 1.

Fig. 3 is the front view of second kind of embodiment.

Fig. 4 is the B-B cutaway view of Fig. 3.

Embodiment

With reference to Fig. 1,1---topping up pipe, 2---duct, 3---heat pipe substrate, 4---low-boiling point liquid working medium, 5-fan, 6---cooling fins.As seen from the figure, be drilled with several ducts (2) in the substrate (3), the bottom of duct (2) is connected also and outside seal; Substrate (3) upper end is installed topping up pipe (1) and is tightly connected, and this pipe (1) is communicated with duct (2), is communicated with between duct (2) mesopore and the hole.The bottom of (2) is filled with low-boiling point liquid working medium (4) in the duct.The cooling fins (6) of the multiple multi-disc that distributing in the side of substrate (3).The shape of substrate (3) can be that rectangle is square or circular.It can be single side type or circulating type that cooling fins (6) is arranged with the installation of substrate (3).The shape of cooling fins (6) can be waveform or zigzag or radiation.And duct (2) shape in the substrate (3) can be circle or ellipse or polygon, and general low-boiling point liquid working medium (4) adopts ammoniacal liquor.Can also adopt the boiling point of adjusting working medium (4) to adapt to multi-purpose needs, fin (6) also can be made diversified form, and fluid resistance is low, compact conformation, and the heat exchange efficiency height changes the form that has radiator poor efficiency, large volume now.

With reference to Fig. 2, be the A-A cutaway view of Fig. 1.As seen from the figure, the arrangement situation of duct (2), the zigzag arranging situation of cooling fins (6).

With reference to Fig. 3, be another kind of embodiment, substrate (3) is placed on central authorities, fan (5) portion mounted thereto.As seen from the figure, the situation that is connected between duct (2) mesopore and the hole.

With reference to Fig. 4, be the B-B cutaway view of Fig. 3.As seen from the figure, cooling fins (6) be looped around substrate (3) around, present radial plan.The arrangement in the duct (2) in the substrate (3) is different again.Cooling fins (6) adopts aluminium or copper product to make.

Claims

1, heat-pipe radiator comprises fan (5) and cooling fins (6), and both are fastenedly connected, and it is characterized in that:

A, heat pipe substrate (3) is installed also on cooling fins (6), topping up pipe (1) is installed in its upper end, is drilled with several ducts (2) in the substrate (3), and topping up pipe (1) is communicated with duct (2), is communicated with between duct (2) mesopore and the hole;

B, in duct (2), be filled with low-boiling point liquid working medium (4).

2, according to the said heat-pipe radiator of claim 1, the shape that it is characterized in that substrate (3) is that rectangle is square or circular, it is single side type or circulating type that cooling fins (6) is arranged with the installation of substrate (3), and the shape of cooling fins (6) is waveform or zigzag or radiation; The shape in duct (2) is circle or ellipse or polygon.

3, according to claim 1 or 2 said heat pipe heat radiation pipes, it is characterized in that said low-boiling point liquid working medium (4) is ammoniacal liquor.