CN110868838A - Uniform temperature plate radiator - Google Patents

Uniform temperature plate radiator Download PDF

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Publication number
CN110868838A
CN110868838A CN201910965710.0A CN201910965710A CN110868838A CN 110868838 A CN110868838 A CN 110868838A CN 201910965710 A CN201910965710 A CN 201910965710A CN 110868838 A CN110868838 A CN 110868838A
Authority
CN
China
Prior art keywords
passage
receiving unit
channel
radiating
heat receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910965710.0A
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Chinese (zh)
Inventor
陈彦
姚树楠
林连凯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taicang Huaying Electronic Material Co Ltd
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Taicang Huaying Electronic Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taicang Huaying Electronic Material Co Ltd filed Critical Taicang Huaying Electronic Material Co Ltd
Priority to CN201910965710.0A priority Critical patent/CN110868838A/en
Publication of CN110868838A publication Critical patent/CN110868838A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention discloses a temperature-equalizing plate radiator which comprises a substrate and radiating fins, wherein a plurality of groups of radiating fins are arranged at one end of the outer wall of the substrate, the substrate is fixed with the radiating fins in a welding mode, the substrate comprises a first heated part and a second heated part, the first heated part and the second heated part are not communicated with each other, the interiors of the first heated part and the second heated part are both hollow tubular, the radiating fins comprise a first radiating part and a second radiating part, the first radiating part and the second radiating part are not communicated with each other, a first channel is arranged in the first radiating part, the first channel is communicated with the interior of the first heated part, a second channel is arranged in the second radiating part, and the second channel is communicated with the interior of the second heated part. Has the advantages that: compared with radiators with the same size and the same radiating area, the radiator is high in radiating efficiency and strong in practicability, and has very important significance.

Description

Uniform temperature plate radiator
Technical Field
The invention relates to the technical field of uniform temperature plate heat dissipation, in particular to a uniform temperature plate heat radiator for efficiently dissipating heat of a large outdoor product.
Background
Large-scale outdoor power consumption product, for example LED advertising light board, sign and other open-air equipment can produce a large amount of heats when it uses, if not in time the effluvium then can influence its use, in order to prolong its life and normal use, often can install the radiator in large-scale outdoor product, utilizes the air convection of nature to dispel the heat usually.
However, the existing radiator has certain disadvantages in use:
1. at present, the base plate and the radiating fins of the radiator are fixed in riveting and other modes, so that the radiating efficiency is low;
2. at present, the substrate is radiated by a single channel, and the radiating effect close to the top end of the substrate is poor through test verification.
Aiming at the problems in the related art, a uniform temperature plate radiator is provided for efficient heat dissipation of large outdoor products.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the uniform temperature plate radiator, which improves the radiating efficiency, enables a large outdoor product to radiate heat efficiently and further solves the problems in the background technology.
(II) technical scheme
In order to achieve the purpose, the invention adopts the following specific technical scheme:
the utility model provides a temperature-uniforming plate radiator, includes base plate and fin, the outer wall one end of base plate is provided with a plurality of groups of fin, and the base plate is fixed with the fin through the welding mode, the base plate includes first heated portion and second heated portion, first heated portion and second heated portion do not communicate with each other, and the inside of first heated portion and second heated portion is hollow tubulose, the fin includes first heat dissipation portion and second heat dissipation portion, first heat dissipation portion and second heat dissipation portion do not communicate with each other, the inside of first heat dissipation portion is provided with first passageway, first passageway communicates with each other with the inside of first heated portion, the inside of second heat dissipation portion is provided with the second passageway, the second passageway communicates with each other with the inside of second heated portion.
Furthermore, capillary structures are arranged in the first heated part and the second heated part of the substrate.
Further, the first channel comprises a first channel, a second channel and a third channel, the head and the tail of the first channel are respectively communicated with the second channel and the third channel, and the other ends of the second channel and the third channel are communicated with the interior of the first heated part.
Further, the second channel comprises a channel four, a channel five and a channel six, the head and the tail of the channel four are respectively communicated with the channel five and the channel six, and the other ends of the channel five and the channel six are communicated with the inside of the second heated part.
Further, the interiors of the first and second heat receiving units and the first and second passages are both vacuum.
Further, liquid working media are filled in the first heat receiving unit and the second heat receiving unit.
(III) advantageous effects
Compared with the prior art, the invention provides a uniform temperature plate radiator, which has the following beneficial effects:
the base plate and the radiating fins are connected together and are communicated internally, so that the thermal contact resistance between the base plate and the radiating fins is greatly reduced, the radiating efficiency is improved, and compared with a radiator with the same size and the same radiating area, the radiating efficiency of the product is high, and the practicability is high; the substrate is divided into a plurality of groups of structures according to the antipyretic power and the chip position, so that the problems of poor top heat dissipation and the like are solved, and the method has very important significance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a front view of a vapor plate heat sink according to an embodiment of the present invention;
FIG. 2 is a schematic upper partially exploded view according to FIG. 1;
FIG. 3 is a schematic view of the lower exploded structure according to FIG. 1;
FIG. 4 is a schematic diagram of a right side view of a vapor plate heat sink according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a top view of a vapor plate heat sink according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of the upper structure of FIG. 1 illustrating heat dissipation principles;
fig. 7 is a schematic view of the heat dissipation principle of the lower partial structure according to fig. 1.
In the figure:
1. a substrate; 2. a heat sink; 3. a first heat receiving unit; 4. a second heat receiving unit; 5. a first heat sink portion; 6. a second heat sink member; 71. a first channel; 72. a second channel; 73. a third channel; 81. a fourth channel; 82. a fifth channel; 83. and a sixth channel.
Detailed Description
For further explanation of the various embodiments, the drawings which form a part of the disclosure and which are incorporated in and constitute a part of this specification, illustrate embodiments and, together with the description, serve to explain the principles of operation of the embodiments, and to enable others of ordinary skill in the art to understand the various embodiments and advantages of the invention, and, by reference to these figures, reference is made to the accompanying drawings, which are not to scale and wherein like reference numerals generally refer to like elements.
According to an embodiment of the present invention, a vapor plate heat sink is provided.
The invention will now be further described with reference to the accompanying drawings and detailed description, as shown in figures 1 to 7:
the temperature-uniforming plate radiator of the embodiment comprises a substrate 1 and radiating fins 2, wherein one end of the outer wall of the substrate 1 is provided with a plurality of groups of radiating fins 2, the substrate 1 is fixed with the radiating fins 2 in a welding mode, the number of openings at the top end of the connecting surface of the radiating fins 2 and the substrate 1 is larger than the number of bottoms, the interiors of the substrate 1 and the radiating fins 2 are completely sealed, the substrate 1 comprises a first heated part 3 and a second heated part 4, the first heated part 3 and the second heated part 4 are not communicated with each other, the interiors of the first heated part 3 and the second heated part 4 are both in a hollow tubular shape, the radiating fins 2 comprise a first radiating part 5 and a second radiating part 6, the first radiating part 5 and the second radiating part 6 are not communicated with each other, a first channel is arranged in the first heated part 5, the first channel is communicated with the interior of the first heated part 3, and a second channel is arranged in the second radiating part 6, the second passage communicates with the inside of the second heat receiving unit 4.
In the vapor chamber heat sink of the present embodiment, capillary structures are disposed in both the first heat receiving unit 3 and the second heat receiving unit 4 of the substrate 1.
In the vapor-panel radiator of the present embodiment, the first passage includes a first passage 71, a second passage 72, and a third passage 73, the head and the tail of the first passage 71 are respectively communicated with the second passage 72 and the third passage 73, the other ends of the second passage 72 and the third passage 73 are communicated with the inside of the first heat receiving unit 3, and the first heat receiving unit 3, the first passage 71, the second passage 72, and the third passage 73 form a circulation loop.
In the vapor-panel radiator of the present embodiment, the second passage includes a fourth passage 81, a fifth passage 82, and a sixth passage 83, the head and the tail of the fourth passage 81 are respectively communicated with the fifth passage 82 and the sixth passage 83, the other ends of the fifth passage 82 and the sixth passage 83 are communicated with the inside of the second heat receiving unit 4, and the second heat receiving unit 4, the fourth passage 81, the fifth passage 82, and the sixth passage 83 form a loop.
In the vapor-panel radiator of the present embodiment, the interiors of the first heat receiving unit 3 and the second heat receiving unit 4 and the interiors of the first channel and the second channel are both vacuum.
In the uniform-temperature plate radiator of the present embodiment, the first heat receiving unit 3 and the second heat receiving unit 4 are both filled with a certain amount of liquid working medium.
The working principle is as follows: as shown in fig. 6 and 7, the left side of the substrate 1 is a heated surface, and the arrow points to the flow direction of the heated hot air flow of the internal working medium. The large outdoor product radiates heat by natural convection of air, so in order to improve the radiating efficiency, the interiors of a radiator substrate 1 and a radiating fin 2 are divided into a plurality of groups of parallel type separation structures, the substrate 1 is divided into two areas, namely a first heated part 3 and a second heated part 4, the radiating fin 2 is divided into two areas, namely a first radiating part 5 and a second radiating part 6, the internal structure and the radiating area are divided according to the magnitude of the antipyretic power so as to improve the radiating efficiency, the first heated part 3, a channel I71, a channel II 72 and a channel III 73 form a circulating loop, the second heated part 4, a channel IV 81, a channel V82 and a channel VI 83 form a loop, an internal liquid working medium flows along the direction indicated by an arrow in the figure when being heated, and the radiating fin 2 takes away heat through heat exchange.
The uniform temperature plate radiator of the embodiment connects the substrate 1 and the radiating fins 2 together, and the inner parts of the substrate 1 and the radiating fins 2 are communicated, so that the thermal contact resistance of the substrate 1 and the radiating fins 2 is greatly reduced, and the radiating efficiency is improved; the substrate 1 is divided into a plurality of groups of structures according to the antipyretic power and the chip position, so that the problems of poor top heat dissipation and the like are solved, and the method has very important significance.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.

Claims (6)

1. The utility model provides a temperature-uniforming plate radiator, includes base plate (1) and fin (2), its characterized in that: a plurality of groups of radiating fins (2) are arranged at one end of the outer wall of the base plate (1), the base plate (1) is fixed with the radiating fins (2) in a welding mode, the substrate (1) comprises a first heat receiving unit (3) and a second heat receiving unit (4), the first heat receiving unit (3) and the second heat receiving unit (4) are not communicated with each other, the interiors of the first heat receiving unit (3) and the second heat receiving unit (4) are both hollow tubular, the heat sink (2) comprises a first heat sink part (5) and a second heat sink part (6), the first heat sink piece (5) and the second heat sink piece (6) are not communicated with each other, a first channel is arranged inside the first heat sink piece (5), the first channel is communicated with the interior of the first heated part (3), the second heat radiating part (6) is internally provided with a second channel, and the second channel is communicated with the interior of the second heated part (4).
2. A vapor plate heat sink according to claim 1, wherein a capillary structure is provided in each of the first heat receiving unit (3) and the second heat receiving unit (4) of the base plate (1).
3. A vapor-panel heat sink according to claim 2, wherein the first passage includes a first passage (71), a second passage (72) and a third passage (73), the first passage (71) communicates with the second passage (72) and the third passage (73) from the front to the rear, respectively, and the other ends of the second passage (72) and the third passage (73) communicate with the inside of the first heat receiving unit (3).
4. A vapor-panel heat sink according to claim 3, wherein the second passage includes a fourth passage (81), a fifth passage (82), and a sixth passage (83), the fourth passage (81) communicates with the fifth passage (82) and the sixth passage (83) from the front to the rear, respectively, and the other ends of the fifth passage (82) and the sixth passage (83) communicate with the interior of the second heat receiving unit (4).
5. A temperature-uniformed plate radiator according to claim 1, 2, 3 or 4, wherein the first heat receiving unit (3) and the second heat receiving unit (4) and the first passage and the second passage are evacuated.
6. A temperature-uniforming plate radiator as claimed in claim 5, wherein the interiors of the first heat receiving unit (3) and the second heat receiving unit (4) are filled with a liquid working medium.
CN201910965710.0A 2019-10-12 2019-10-12 Uniform temperature plate radiator Pending CN110868838A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910965710.0A CN110868838A (en) 2019-10-12 2019-10-12 Uniform temperature plate radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910965710.0A CN110868838A (en) 2019-10-12 2019-10-12 Uniform temperature plate radiator

Publications (1)

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CN110868838A true CN110868838A (en) 2020-03-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023159966A1 (en) * 2022-02-25 2023-08-31 中兴通讯股份有限公司 Heat dissipation module and heat dissipation device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1551971A (en) * 2001-09-05 2004-12-01 昭和电工株式会社 Heat sink, control device having the heat sink and machine tool provided with the device
CN101943346A (en) * 2010-09-30 2011-01-12 毛有强 Lightweight high-efficient radiating LED lamp
CN201844247U (en) * 2010-09-30 2011-05-25 毛有强 Light high-efficient radiating LED lamp
CN202168313U (en) * 2011-07-05 2012-03-14 国研高能(北京)稳态传热传质技术研究院有限公司 Heat radiation device
CN106091169A (en) * 2016-06-06 2016-11-09 珠海格力电器股份有限公司 Radiator, controller and air-conditioner
CN106686947A (en) * 2016-12-30 2017-05-17 华为机器有限公司 Radiator and communication product
CN210900129U (en) * 2019-10-12 2020-06-30 太仓市华盈电子材料有限公司 Uniform temperature plate radiator

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1551971A (en) * 2001-09-05 2004-12-01 昭和电工株式会社 Heat sink, control device having the heat sink and machine tool provided with the device
CN101943346A (en) * 2010-09-30 2011-01-12 毛有强 Lightweight high-efficient radiating LED lamp
CN201844247U (en) * 2010-09-30 2011-05-25 毛有强 Light high-efficient radiating LED lamp
CN202168313U (en) * 2011-07-05 2012-03-14 国研高能(北京)稳态传热传质技术研究院有限公司 Heat radiation device
CN106091169A (en) * 2016-06-06 2016-11-09 珠海格力电器股份有限公司 Radiator, controller and air-conditioner
CN106686947A (en) * 2016-12-30 2017-05-17 华为机器有限公司 Radiator and communication product
CN210900129U (en) * 2019-10-12 2020-06-30 太仓市华盈电子材料有限公司 Uniform temperature plate radiator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023159966A1 (en) * 2022-02-25 2023-08-31 中兴通讯股份有限公司 Heat dissipation module and heat dissipation device

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