CN110868838A - Uniform temperature plate radiator - Google Patents
Uniform temperature plate radiator Download PDFInfo
- Publication number
- CN110868838A CN110868838A CN201910965710.0A CN201910965710A CN110868838A CN 110868838 A CN110868838 A CN 110868838A CN 201910965710 A CN201910965710 A CN 201910965710A CN 110868838 A CN110868838 A CN 110868838A
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- Prior art keywords
- passage
- receiving unit
- channel
- radiating
- heat receiving
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- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000003466 welding Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 4
- 230000001754 anti-pyretic effect Effects 0.000 description 3
- 239000002221 antipyretic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a temperature-equalizing plate radiator which comprises a substrate and radiating fins, wherein a plurality of groups of radiating fins are arranged at one end of the outer wall of the substrate, the substrate is fixed with the radiating fins in a welding mode, the substrate comprises a first heated part and a second heated part, the first heated part and the second heated part are not communicated with each other, the interiors of the first heated part and the second heated part are both hollow tubular, the radiating fins comprise a first radiating part and a second radiating part, the first radiating part and the second radiating part are not communicated with each other, a first channel is arranged in the first radiating part, the first channel is communicated with the interior of the first heated part, a second channel is arranged in the second radiating part, and the second channel is communicated with the interior of the second heated part. Has the advantages that: compared with radiators with the same size and the same radiating area, the radiator is high in radiating efficiency and strong in practicability, and has very important significance.
Description
Technical Field
The invention relates to the technical field of uniform temperature plate heat dissipation, in particular to a uniform temperature plate heat radiator for efficiently dissipating heat of a large outdoor product.
Background
Large-scale outdoor power consumption product, for example LED advertising light board, sign and other open-air equipment can produce a large amount of heats when it uses, if not in time the effluvium then can influence its use, in order to prolong its life and normal use, often can install the radiator in large-scale outdoor product, utilizes the air convection of nature to dispel the heat usually.
However, the existing radiator has certain disadvantages in use:
1. at present, the base plate and the radiating fins of the radiator are fixed in riveting and other modes, so that the radiating efficiency is low;
2. at present, the substrate is radiated by a single channel, and the radiating effect close to the top end of the substrate is poor through test verification.
Aiming at the problems in the related art, a uniform temperature plate radiator is provided for efficient heat dissipation of large outdoor products.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides the uniform temperature plate radiator, which improves the radiating efficiency, enables a large outdoor product to radiate heat efficiently and further solves the problems in the background technology.
(II) technical scheme
In order to achieve the purpose, the invention adopts the following specific technical scheme:
the utility model provides a temperature-uniforming plate radiator, includes base plate and fin, the outer wall one end of base plate is provided with a plurality of groups of fin, and the base plate is fixed with the fin through the welding mode, the base plate includes first heated portion and second heated portion, first heated portion and second heated portion do not communicate with each other, and the inside of first heated portion and second heated portion is hollow tubulose, the fin includes first heat dissipation portion and second heat dissipation portion, first heat dissipation portion and second heat dissipation portion do not communicate with each other, the inside of first heat dissipation portion is provided with first passageway, first passageway communicates with each other with the inside of first heated portion, the inside of second heat dissipation portion is provided with the second passageway, the second passageway communicates with each other with the inside of second heated portion.
Furthermore, capillary structures are arranged in the first heated part and the second heated part of the substrate.
Further, the first channel comprises a first channel, a second channel and a third channel, the head and the tail of the first channel are respectively communicated with the second channel and the third channel, and the other ends of the second channel and the third channel are communicated with the interior of the first heated part.
Further, the second channel comprises a channel four, a channel five and a channel six, the head and the tail of the channel four are respectively communicated with the channel five and the channel six, and the other ends of the channel five and the channel six are communicated with the inside of the second heated part.
Further, the interiors of the first and second heat receiving units and the first and second passages are both vacuum.
Further, liquid working media are filled in the first heat receiving unit and the second heat receiving unit.
(III) advantageous effects
Compared with the prior art, the invention provides a uniform temperature plate radiator, which has the following beneficial effects:
the base plate and the radiating fins are connected together and are communicated internally, so that the thermal contact resistance between the base plate and the radiating fins is greatly reduced, the radiating efficiency is improved, and compared with a radiator with the same size and the same radiating area, the radiating efficiency of the product is high, and the practicability is high; the substrate is divided into a plurality of groups of structures according to the antipyretic power and the chip position, so that the problems of poor top heat dissipation and the like are solved, and the method has very important significance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a front view of a vapor plate heat sink according to an embodiment of the present invention;
FIG. 2 is a schematic upper partially exploded view according to FIG. 1;
FIG. 3 is a schematic view of the lower exploded structure according to FIG. 1;
FIG. 4 is a schematic diagram of a right side view of a vapor plate heat sink according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a top view of a vapor plate heat sink according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of the upper structure of FIG. 1 illustrating heat dissipation principles;
fig. 7 is a schematic view of the heat dissipation principle of the lower partial structure according to fig. 1.
In the figure:
1. a substrate; 2. a heat sink; 3. a first heat receiving unit; 4. a second heat receiving unit; 5. a first heat sink portion; 6. a second heat sink member; 71. a first channel; 72. a second channel; 73. a third channel; 81. a fourth channel; 82. a fifth channel; 83. and a sixth channel.
Detailed Description
For further explanation of the various embodiments, the drawings which form a part of the disclosure and which are incorporated in and constitute a part of this specification, illustrate embodiments and, together with the description, serve to explain the principles of operation of the embodiments, and to enable others of ordinary skill in the art to understand the various embodiments and advantages of the invention, and, by reference to these figures, reference is made to the accompanying drawings, which are not to scale and wherein like reference numerals generally refer to like elements.
According to an embodiment of the present invention, a vapor plate heat sink is provided.
The invention will now be further described with reference to the accompanying drawings and detailed description, as shown in figures 1 to 7:
the temperature-uniforming plate radiator of the embodiment comprises a substrate 1 and radiating fins 2, wherein one end of the outer wall of the substrate 1 is provided with a plurality of groups of radiating fins 2, the substrate 1 is fixed with the radiating fins 2 in a welding mode, the number of openings at the top end of the connecting surface of the radiating fins 2 and the substrate 1 is larger than the number of bottoms, the interiors of the substrate 1 and the radiating fins 2 are completely sealed, the substrate 1 comprises a first heated part 3 and a second heated part 4, the first heated part 3 and the second heated part 4 are not communicated with each other, the interiors of the first heated part 3 and the second heated part 4 are both in a hollow tubular shape, the radiating fins 2 comprise a first radiating part 5 and a second radiating part 6, the first radiating part 5 and the second radiating part 6 are not communicated with each other, a first channel is arranged in the first heated part 5, the first channel is communicated with the interior of the first heated part 3, and a second channel is arranged in the second radiating part 6, the second passage communicates with the inside of the second heat receiving unit 4.
In the vapor chamber heat sink of the present embodiment, capillary structures are disposed in both the first heat receiving unit 3 and the second heat receiving unit 4 of the substrate 1.
In the vapor-panel radiator of the present embodiment, the first passage includes a first passage 71, a second passage 72, and a third passage 73, the head and the tail of the first passage 71 are respectively communicated with the second passage 72 and the third passage 73, the other ends of the second passage 72 and the third passage 73 are communicated with the inside of the first heat receiving unit 3, and the first heat receiving unit 3, the first passage 71, the second passage 72, and the third passage 73 form a circulation loop.
In the vapor-panel radiator of the present embodiment, the second passage includes a fourth passage 81, a fifth passage 82, and a sixth passage 83, the head and the tail of the fourth passage 81 are respectively communicated with the fifth passage 82 and the sixth passage 83, the other ends of the fifth passage 82 and the sixth passage 83 are communicated with the inside of the second heat receiving unit 4, and the second heat receiving unit 4, the fourth passage 81, the fifth passage 82, and the sixth passage 83 form a loop.
In the vapor-panel radiator of the present embodiment, the interiors of the first heat receiving unit 3 and the second heat receiving unit 4 and the interiors of the first channel and the second channel are both vacuum.
In the uniform-temperature plate radiator of the present embodiment, the first heat receiving unit 3 and the second heat receiving unit 4 are both filled with a certain amount of liquid working medium.
The working principle is as follows: as shown in fig. 6 and 7, the left side of the substrate 1 is a heated surface, and the arrow points to the flow direction of the heated hot air flow of the internal working medium. The large outdoor product radiates heat by natural convection of air, so in order to improve the radiating efficiency, the interiors of a radiator substrate 1 and a radiating fin 2 are divided into a plurality of groups of parallel type separation structures, the substrate 1 is divided into two areas, namely a first heated part 3 and a second heated part 4, the radiating fin 2 is divided into two areas, namely a first radiating part 5 and a second radiating part 6, the internal structure and the radiating area are divided according to the magnitude of the antipyretic power so as to improve the radiating efficiency, the first heated part 3, a channel I71, a channel II 72 and a channel III 73 form a circulating loop, the second heated part 4, a channel IV 81, a channel V82 and a channel VI 83 form a loop, an internal liquid working medium flows along the direction indicated by an arrow in the figure when being heated, and the radiating fin 2 takes away heat through heat exchange.
The uniform temperature plate radiator of the embodiment connects the substrate 1 and the radiating fins 2 together, and the inner parts of the substrate 1 and the radiating fins 2 are communicated, so that the thermal contact resistance of the substrate 1 and the radiating fins 2 is greatly reduced, and the radiating efficiency is improved; the substrate 1 is divided into a plurality of groups of structures according to the antipyretic power and the chip position, so that the problems of poor top heat dissipation and the like are solved, and the method has very important significance.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "disposed," "connected," "secured," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; the terms may be directly connected or indirectly connected through an intermediate, and may be communication between two elements or interaction relationship between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (6)
1. The utility model provides a temperature-uniforming plate radiator, includes base plate (1) and fin (2), its characterized in that: a plurality of groups of radiating fins (2) are arranged at one end of the outer wall of the base plate (1), the base plate (1) is fixed with the radiating fins (2) in a welding mode, the substrate (1) comprises a first heat receiving unit (3) and a second heat receiving unit (4), the first heat receiving unit (3) and the second heat receiving unit (4) are not communicated with each other, the interiors of the first heat receiving unit (3) and the second heat receiving unit (4) are both hollow tubular, the heat sink (2) comprises a first heat sink part (5) and a second heat sink part (6), the first heat sink piece (5) and the second heat sink piece (6) are not communicated with each other, a first channel is arranged inside the first heat sink piece (5), the first channel is communicated with the interior of the first heated part (3), the second heat radiating part (6) is internally provided with a second channel, and the second channel is communicated with the interior of the second heated part (4).
2. A vapor plate heat sink according to claim 1, wherein a capillary structure is provided in each of the first heat receiving unit (3) and the second heat receiving unit (4) of the base plate (1).
3. A vapor-panel heat sink according to claim 2, wherein the first passage includes a first passage (71), a second passage (72) and a third passage (73), the first passage (71) communicates with the second passage (72) and the third passage (73) from the front to the rear, respectively, and the other ends of the second passage (72) and the third passage (73) communicate with the inside of the first heat receiving unit (3).
4. A vapor-panel heat sink according to claim 3, wherein the second passage includes a fourth passage (81), a fifth passage (82), and a sixth passage (83), the fourth passage (81) communicates with the fifth passage (82) and the sixth passage (83) from the front to the rear, respectively, and the other ends of the fifth passage (82) and the sixth passage (83) communicate with the interior of the second heat receiving unit (4).
5. A temperature-uniformed plate radiator according to claim 1, 2, 3 or 4, wherein the first heat receiving unit (3) and the second heat receiving unit (4) and the first passage and the second passage are evacuated.
6. A temperature-uniforming plate radiator as claimed in claim 5, wherein the interiors of the first heat receiving unit (3) and the second heat receiving unit (4) are filled with a liquid working medium.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201910965710.0A CN110868838A (en) | 2019-10-12 | 2019-10-12 | Uniform temperature plate radiator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910965710.0A CN110868838A (en) | 2019-10-12 | 2019-10-12 | Uniform temperature plate radiator |
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CN110868838A true CN110868838A (en) | 2020-03-06 |
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CN201910965710.0A Pending CN110868838A (en) | 2019-10-12 | 2019-10-12 | Uniform temperature plate radiator |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023159966A1 (en) * | 2022-02-25 | 2023-08-31 | 中兴通讯股份有限公司 | Heat dissipation module and heat dissipation device |
Citations (7)
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---|---|---|---|---|
CN1551971A (en) * | 2001-09-05 | 2004-12-01 | 昭和电工株式会社 | Heat sink, control device having the heat sink and machine tool provided with the device |
CN101943346A (en) * | 2010-09-30 | 2011-01-12 | 毛有强 | Lightweight high-efficient radiating LED lamp |
CN201844247U (en) * | 2010-09-30 | 2011-05-25 | 毛有强 | Light high-efficient radiating LED lamp |
CN202168313U (en) * | 2011-07-05 | 2012-03-14 | 国研高能(北京)稳态传热传质技术研究院有限公司 | Heat radiation device |
CN106091169A (en) * | 2016-06-06 | 2016-11-09 | 珠海格力电器股份有限公司 | Radiator, controller and air-conditioner |
CN106686947A (en) * | 2016-12-30 | 2017-05-17 | 华为机器有限公司 | Radiator and communication product |
CN210900129U (en) * | 2019-10-12 | 2020-06-30 | 太仓市华盈电子材料有限公司 | Uniform temperature plate radiator |
-
2019
- 2019-10-12 CN CN201910965710.0A patent/CN110868838A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1551971A (en) * | 2001-09-05 | 2004-12-01 | 昭和电工株式会社 | Heat sink, control device having the heat sink and machine tool provided with the device |
CN101943346A (en) * | 2010-09-30 | 2011-01-12 | 毛有强 | Lightweight high-efficient radiating LED lamp |
CN201844247U (en) * | 2010-09-30 | 2011-05-25 | 毛有强 | Light high-efficient radiating LED lamp |
CN202168313U (en) * | 2011-07-05 | 2012-03-14 | 国研高能(北京)稳态传热传质技术研究院有限公司 | Heat radiation device |
CN106091169A (en) * | 2016-06-06 | 2016-11-09 | 珠海格力电器股份有限公司 | Radiator, controller and air-conditioner |
CN106686947A (en) * | 2016-12-30 | 2017-05-17 | 华为机器有限公司 | Radiator and communication product |
CN210900129U (en) * | 2019-10-12 | 2020-06-30 | 太仓市华盈电子材料有限公司 | Uniform temperature plate radiator |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023159966A1 (en) * | 2022-02-25 | 2023-08-31 | 中兴通讯股份有限公司 | Heat dissipation module and heat dissipation device |
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