CN2578977Y - Improved structure of radiating fins - Google Patents

Abstract

The utility model relates to improved structure of a cooling rib. The utility model is characterized in that a base is arranged at the bottom of the cooling rib, and a plurality of heat dissipation fins are vertically arranged on the base; heat dissipation passages are formed between every two heat dissipation fins; air guiding inclined planes which are inclined downwards to both sides of the base are formed in positions of the base corresponding to every heat dissipation passage; every heat dissipation fin extends a certain distance to both outer sides of the base from the air guiding inclined planes of the base, and thus parts of the heat dissipation fins are hollow under two sides of the utility model without the base. When the lower part of the base of the cooling rib tightly contacts wafers, cold air blown by a fan downwards blows the air guiding inclined planes of the base and space under the air guiding inclined planes through the heat dissipation passages for heat dissipation. The whole improved structure has light weight, and the utility model can reduce the windage and the noise of the fan during the process of heat dissipation and can rapidly discharge heat of the wafers under the cooling rib and electronic elements round the wafers.

Description

The structure-improved of fin

Technical field

The utility model relates to fin, especially the pedestal and the plurality of radiating fins on the pedestal that refer to a kind of fin are cross-shaped, and be formed with the wind-guiding inclined-plane that two side direction have a down dip on the pedestal, and make radiating fin be Openworks shape at two side-lowers that do not have pedestal, allow cold wind when fin blows, can effectively reduce windage and reduce noise, and can alleviate overall weight, and the dispel the heat structure-improved of fin of quick effect of tool.

Background technology

The computer calculation function is more powerful now, and its speed also promotes rapidly, and its global shape, structure reaches with the motherboard connected mode breaks through traditional stereotype especially, it is the major reform of computer industry, more because the calculation function that wafer of new generation (as central processing unit) is carried under one's arms and exceeded the speed limit, the temperature that wafer (as central processing unit) is produced when handling operational order is higher, and the size of general computer or notebook computer is all towards gently, thin, short, little direction develops, so how to utilize good cooling system to make wafer (as central processing unit) operate as normal under the temperature that it allowed, be considered as epochmaking problem by industry, and universalness because of computer, make fin day by day towards gently, thin, short, little direction develops, therefore, fin fin density must increase, and reduce its manufacturing cost, can be widely used on general computer and the notebook computer.

Referring to Fig. 9, general known fin A directly upwards vertically is provided with the plural number fin A2 of shape at interval by horizontal base A1 mostly, and fin A top is positioned with a fan C, after wafer B1 that fin A is installed in circuit board B goes up, pedestal A1 is fitted tightly in wafer B1 surface, begin computing action and send high when hot at wafer B1, the pedestal A1 of its fin A just begins to absorb the heat that wafer B1 is sent, and heat is conducted towards plural fin A2 place by pedestal A1, blowing cold wind down by the fan C above the fin A again dispels the heat, wind after the heat radiation can outwards be overflowed, in order to the heat among the wafer B1 is got rid of by the passage in adjacent fin A2 gap; But the heat conducted state on this kind fin A is also inhomogeneous, and because of fin A pedestal A1 and wafer B1 fit among between to partially absorb heat more, again with all around conduction of heat toward pedestal A1 and the plural fin A2 of fin A, yet, the fin A2 of its pedestal A1 central authorities can be than the faster absorption heat of fin A2 around the pedestal A1, and why fin A sets up plural fin A2 on pedestal A1, be in order to increase the integral heat sink area of fin A, being beneficial to fan C blows cold wind downwards fin A is dispelled the heat, but there is following shortcoming in radiating mode so:

(1) the high heat of its wafer B1 concentrates on the mid portion of pedestal A1, and when fan C blows cold wind, only can dispel the heat to the part of fin A, heat is hoarded in the central authorities of fin A, and can't effectively bring into play the integral heat sink area of fin A, and it is slack-off and radiating effect is also relatively poor to produce radiating rate.

(2) its fan C blows cold wind downwards and comes fin A is dispelled the heat, but the cold wind direction that fan C is blowed can be stopped by the pedestal A1 of fin A, when cold wind strikes pedestal A1, just can form windage, and produce great noise, the fan C life-span is reduced, and the integral heat sink effect is affected.

(3) the horizontal base A1 of its fin A is covered with plural number shape fin A2 at interval, whole formed volume is bigger and heavier, on the wafer B1 of restricted load capacity, just can't use, and when being installed in computer, as be subjected to external force collision, just can make fin A bump wafer B1 and damage or make fin A can't fit in surface on the wafer B1, and can't dispel the heat.

Above-mentioned known fin have really can be to be improved the space, remain to be engaged in this journey dealer and do further research and development and improvement, with the use needs of the wafer (as central processing unit) that adapts to the hypervelocity calculation function of carrying under one's arms now.

Therefore, I am because the shortcoming of above-mentioned known fin, based on being engaged in the experience that the industry is researched and developed for many years, and studying and test through repeatedly actual, develop the utility model finally.

Summary of the invention

Main purpose of the present utility model, be to provide a kind of structure-improved of fin, vertically be provided with plurality of radiating fins on the pedestal of this fin, and pedestal and radiating fin are staggered state, be formed with the wind-guiding inclined-plane of inclination under pedestal two side direction, each radiating fin is extended with a distance by pedestal wind-guiding inclined-plane to two outsides, make radiating fin be a hollow out state at two side-lowers that do not have pedestal, to guide the cold wind that fan blows downwards, can blow away toward the below and the both sides of fin fast, so that quick heat radiating, reduce windage and noise, and the effect that tool weight is lighter.

For reaching above-mentioned purpose, the structure-improved of a kind of fin of the present utility model, it is characterized in that: mainly be the staggered plurality of radiating fins of setting up on pedestal and the pedestal being provided with on the fin, and be formed with heat dissipation channel between each radiating fin, and be directed downwards towards two side heat dissipation channels in pedestal top and be formed with the wind-guiding inclined-plane, and the outside of each radiating fin is outward extended with a distance by the place, wind-guiding inclined-plane of pedestal, makes radiating fin be a hollow out state at two side-lowers that do not have pedestal.Wherein:

The quadrate part branch is engaged in the top, wind-guiding inclined-plane of pedestal under the nearly central authorities of described plurality of radiating fins.

The cross section of the pedestal of described fin shape triangular in shape.

The wind-guiding inclined-plane of the pedestal of described fin is the cambered surface of indent.

The radiating fin of described fin is provided with plural louvre.

The radiating fin of described fin is provided with plural number heat radiation groove.

Described fin top is provided with fan.

Fin of the present utility model in use has the following advantage:

(1) pedestal bottom the fin of the present utility model is provided with the wind-guiding inclined-plane, and the cold wind that utilizes this inclined-plane fan can be blowed is directed to the fin bottom fast, blows to the circuit board wafer, and the heat that electronic component around the wafer produces is got rid of in the lump.

(2) pedestal of fin of the present utility model bottom is provided with the wind-guiding inclined-plane, the heat on can the fast Absorption wafer, and, fill part thermolysis of performance radiating fin entire area with heat delivered each position to radiating fin, reach the effect of quick heat radiating.

(3) fin of the present utility model is Openworks shape in the outside of bottom base, and the cold wind that fan is blowed blows fast to the radiating fin below, can reduce the generation of windage and noise.

(4) the employed material of fin of the present utility model is less, so can reduce material cost and manufacturing cost.

In sum, when the utility model uses, can effectively absorb the heat of wafer on the circuit board, and the heat of electronic component around the wafer can be got rid of in the lump, and the windage and the noise that in the heat radiation process, can reduce fan simultaneously and produced.

Description of drawings

Fig. 1, be three-dimensional exploded view of the present utility model.

Fig. 2, be the end view of the utility model fin.

Fig. 3, be the front view of the utility model fin.

Fig. 4, be the vertical view of the utility model fin.

Fig. 5, the schematic side view when absorbing the wafer heat for the utility model fin.

Fig. 6, be the schematic side view of the utility model fan when fin is blown.

Fig. 7, be the three-dimensional exploded view of another embodiment of the utility model.

Fig. 8, be the three-dimensional exploded view of the another embodiment of the utility model.

Fig. 9, for commonly using the three-dimensional exploded view of fin.

Embodiment

Further to understand and be familiar with in order to have, enumerate several preferred embodiments now, and conjunction with figs. is described in detail as follows the purpose of this utility model, technical characterictic and effect thereof:

Referring to Fig. 1-4, be embodiment 1, a kind of structure-improved of fin, this fin 1 is provided with the plurality of radiating fins 12 that vertically is provided with on pedestal 11 and the pedestal 11, and make and be staggered between radiating fin 12 and the pedestal 11 and combine, and 12 of adjacent radiating fins are formed with heat dissipation channel 121, be formed with the wind-guiding inclined-plane 111 that has a down dip towards two side direction on the pedestal 11 of each heat dissipation channel 121 bottom, and make plurality of radiating fins 12 nearly middle bodies be engaged in 111 tops, wind-guiding inclined-plane of pedestal 11, each radiating fin 12 is extended with a distance by pedestal 11 wind-guiding inclined-planes 111 to two outsides, makes radiating fin 12 be a hollow out state at two side-lowers that do not have pedestal 11.

Referring to Fig. 1,5,6, wherein fin 1 top is equiped with fan 3, bottom base 11 then fits in wafer 21 upper surfaces of circuit board 2, produce when wafer 21 running have high when hot, its heat absorbs via pedestal 11 and outwards conducts diffusion by each radiating fin 12, at this moment, because pedestal 11 cross sections shape triangular in shape, so the thickness of pedestal 11 is successively decreased toward both sides by central authorities and forms wind-guiding inclined-plane 111, after the bottom 1111 on wind-guiding inclined-plane 111 absorbs the heat of wafer 21, one part heat conducts to top 1112 by pedestal 11 central authorities, conduct to the middle position 124 of radiating fin 12 again by top 1112, formed path is long and the time that need is also longer, another part heat is then by the wind-guiding inclined-plane 111 that successively decreases towards both sides, heat comparatively fast can be conducted to two outsides 122 of radiating fin 12,123, because the time difference that 111 bottoms 1111, wind-guiding inclined-plane and top 1112 heat conduction are produced, and make the outside 122 of each radiating fin 12,123 can bear uniformly heat with middle position 124 each position, when blowing cold wind fin 1 is dispelled the heat, has preferable radiating effect to reach fan 3.

Yet, when its fan 3 blows cold wind to the pedestal 11 of the heat dissipation channel 121 of fin 1 and fin 1 bottom down, part cold wind can quicken toward both sides along the wind-guiding inclined-plane 111 of pedestal 11 to blow away, another part then can directly be blown away toward the below by the heat dissipation channel 121 of adjacent radiating fin 12, make cold wind that the heat that absorbed on the radiating fin 12 of fin 1 can blow with fan 3 fast toward two outsides 122, blow away 123 belows, to realize getting rid of fast the effect of heat: the dual-side place because of the pedestal 11 of fin 12 all is Openworks shape again, therefore the wind after 1 heat radiation of 3 pairs of fin of fan can directly blow to wafer 21, and side and wafer 21 heat that electronic component produced all around around the wafer 21 can be discharged together outward, make wafer 21 and other electronic component on the circuit board 2 can realize quick cooling purpose simultaneously.

Moreover, the both sides of the bottom base 11 of each radiating fin 12 are Openworks shape, therefore when fan 3 blows cold wind toward fin 1, its cold wind can be smoothly be directed to the bottom by the heat dissipation channel 121 of fin 1 toward the wind-guiding inclined-plane 111 of pedestals 11, and send towards fin 1 outside, it is very smooth that its fan 3 blows the process of cold wind, and whole windage is diminished, and can suppress the noise that fan 3 is produced, it is minimum that it is reduced to.

Referring to Fig. 7,8, structure for embodiment 2,3, its structure is substantially the same manner as Example 1, difference is: can be provided with variations such as plural number heat radiation groove 125 or louvre 126 on the radiating fin 12 of its fin 1, above-mentioned easy structural design all can realize even quick heat radiating, reduce the purpose of noise.

Referring to Fig. 7, the wind-guiding inclined-plane 111 of the pedestal 11 of its fin 1 also can be made as the cambered surface of indent or make the stepped (not shown) in cross section of pedestal 11.

In addition, fin 1 of the present utility model can be formed in one or be installed with plurality of radiating fins 12 on pedestal 11, and fin 1 can adopt single aluminium, copper, or the Heat Conduction Material of aluminium, copper combination makes, and the simple and easy conversion on other Heat Conduction Material does not also break away from patent claim of the present utility model.

In addition, the fan 3 of above-mentioned fin 1 top also can be arranged at (not shown) on the general computer chassis, so fin 1 only needs to blow cold wind down by top or the fan 3 that defaults in the computer chassis place, can reach the purpose of this utility model; And fin 1, wafer 2 and fan 3 triangular fixed forms, it or not emphasis that the utility model is told, so the utility model does not describe its fixed form in detail, such as utilize other various fixed forms such as fastener, anchor clamps or gummed, all fin of the present utility model, wafer and combination of fans can be fixed and all can.

The above only is a few preferred embodiment of the present utility model; be not in order to limit practical range of the present utility model; not all disengaging under spirit of the present utility model and the principle; that has done various impartially changes and modifies, and all should be covered by within the patent protection category that the utility model claims are defined.

Claims (7)

1, a kind of structure-improved of fin, it is characterized in that: mainly be the staggered plurality of radiating fins of setting up on pedestal and the pedestal being provided with on the fin, and be formed with heat dissipation channel between each radiating fin, and be directed downwards towards two side heat dissipation channels in pedestal top and be formed with the wind-guiding inclined-plane, and the outside of each radiating fin is outward extended with a distance by the place, wind-guiding inclined-plane of pedestal, makes radiating fin be a hollow out state at two side-lowers that do not have pedestal.

2, according to the structure-improved of the described fin of claim 1, it is characterized in that: the quadrate part branch is engaged in the top, wind-guiding inclined-plane of pedestal under the nearly central authorities of described plurality of radiating fins.

3, according to the structure-improved of the described fin of claim 1, it is characterized in that: the cross section of the pedestal of described fin shape triangular in shape.

4, according to the structure-improved of the described fin of claim 1, it is characterized in that: the wind-guiding inclined-plane of the pedestal of described fin is the cambered surface of indent.

5, according to the structure-improved of the described fin of claim 1, it is characterized in that: the radiating fin of described fin is provided with plural louvre.

6, according to the structure-improved of the described fin of claim 1, it is characterized in that: the radiating fin of described fin is provided with plural number heat radiation groove.

7, according to the structure-improved of the described fin of claim 1, it is characterized in that: described fin top is provided with fan.

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