CN2572557Y - Chip test machine - Google Patents

Chip test machine Download PDF

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Publication number
CN2572557Y
CN2572557Y CN 02254453 CN02254453U CN2572557Y CN 2572557 Y CN2572557 Y CN 2572557Y CN 02254453 CN02254453 CN 02254453 CN 02254453 U CN02254453 U CN 02254453U CN 2572557 Y CN2572557 Y CN 2572557Y
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CN
China
Prior art keywords
rotary table
feed rotary
wafer
fixedly arranged
stepping motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 02254453
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Chinese (zh)
Inventor
卢镜来
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
All Ring Tech Co Ltd
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All Ring Tech Co Ltd
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Publication date
Application filed by All Ring Tech Co Ltd filed Critical All Ring Tech Co Ltd
Priority to CN 02254453 priority Critical patent/CN2572557Y/en
Application granted granted Critical
Publication of CN2572557Y publication Critical patent/CN2572557Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

The utility model relates to a wafer testing machine which is equipment for producing semiconductors, and has high testing efficiency and wide range of application. The utility model comprises a machine table, feed structures for distributing wafers on the machine table, a delivery rotary disk group which is provided with delivery slots for bearing wafer holes, a testing structure provided with an upper probe and a lower probe, and discharge structures for delivering wafers which are tested, wherein the delivery rotary disk group comprises two delivery rotary disks assembled in parallel, transmission structures and a stepping motor. The stepping motor is connected with the two delivery rotary disks and drives the two delivery rotary disks to rotate synchronously and intermittently in the opposite direction via the transmission structures to bear the wafers which are prepared to be tested, the wafers are delivered into the testing structure in the sequence of the feed structures in a single group, the wafers on the delivery slots of the two delivery rotary disks are tested, and the wafers are classified, delivered, and led into collection slots by the discharge structures at two sides.

Description

Wafer tester
Technical field
The utility model belongs to semiconductor production equipment, particularly a kind of wafer tester.
Background technology
Many now wafer testers by the high testing efficiency of tool such as the test of the inductance of general various wafer, electric capacity and resistance value etc. carry out, and handle by self-feeding, test, the classification of wafer tester, automation such as gather materials, the test jobs that makes wafer is more fast and guarantee that the wafer quality of dispatching from the factory can obtain good management and control.
As shown in figure 10, the wafer tester of commonly using comprises board 10, is arranged at control group 101, pan feeding structure 102, feed rotary table 103, test structure 104, discharging structure 105 and material collecting tank 106 on the board 10.
During use, after wafer to be tested is sent into feed rotary table 103 by pan feeding structure 102, promptly deliver to upper and lower probe in the test structure 104 and contact every numerical value with wafer with testing wafer by the rotation of feed rotary table 103; And then be divided into after the peer group not sending into respectively in the material collecting tank 106 of corresponding grade according to actual test value and collect with pending by discharging structure 105.
For another application number is that 02237055.2 patent application is described, for improving the efficient of test, can be provided with multiple tracks on the feed rotary table 103 and supply ccontaining for counting the more groove of polycrystalline sheet; And the upper and lower probe of test structure 104 can be adjusted to each other distance according to the size of wafer, testing wafer all can be by upper and lower probe the time suitably be contacted with wafer measure every numerical value.
Yet, though above-mentioned wafer tester can reach the application target and the result of use of expection, along with the trend of wafer microminiaturization day by day obviously after, in use there are the following problems for known wafer tester:
1, because the design of wafer microminiaturization day by day, it is frivolous that the design of feed rotary table also becomes, but because of glass fibre (FRP) material is used in the making of feed rotary table mostly, the situation of warpage and the feed rotary table that these materials are made easily deforms under the big more and thin more situation of size and have a strong impact on stable testing degree and testing efficiency; Moreover the factor of consideration production test efficient, bearing material on the feed rotary table can not be very little with groove number, so be out of shape under the possible Consideration misgivings in feed rotary table, cause the quantity of groove can't increase even need reduce to avoid feed rotary table to cross thin situation generation of being out of shape because of thickness.So, with the bottleneck place that testing efficiency can't further be improved and cause output to promote again.
2,, therefore, as take production capacity into account and can cause and to deform when increasing bearing material on the feed rotary table, so can't test less wafer with groove because feed rotary table easily produces the situation of distortion; And as the number that need reduce groove during the less wafer of test to reduce the size of feed rotary table, with the situation of avoiding being out of shape; But all can't taking into account, both produce puzzlement to the dealer.
Summary of the invention
The purpose of this utility model provides a kind of testing efficiency, wafer tester applied widely of improving.
The utility model comprises board, be arranged at the pan feeding structure of the distribution wafer on the board, be provided with the feed rotary table group of accepting wafer hole feeding groove, be provided with the test structure of upper and lower probe and send the discharging structure of test back wafer; The feed rotary table group comprises arranged side by side group of two feed rotary table, drive mechanism and the stepping motor established; Stepping motor connects and drives two feed rotary table through drive mechanism to be done the synchronous intermittence of switched in opposite and rotates, to accept wafer to be tested that single group pan feeding structural order sends into, to enter that single group test structure counts on the feeding groove to two feed rotary table that wafer is done test synchronously and classify by the discharging structure of its both sides and send in the importing material collecting tank.
Wherein:
Two feed rotary table top is covered with the guide guard shield.
The guide guard shield is provided with several transparent windows.
The drive mechanism of feed rotary table group comprises the active belt gear that is fixedly arranged on the stepping motor, be fixedly arranged on the passive belt gear in the feed rotary table rotating shaft, winding is engaged in the master, Timing Belt between passive belt teeth, be fixedly arranged on the timing gears of a feed rotary table rotating shaft end, be positioned at that the timing gears side is fixedly arranged in the little rotating shaft and with the spur gear of timing gears engagement, be fixedly arranged on transmission belt gear in the little rotating shaft with spur gear is coaxial, be fixedly arranged on the driving belt gear of another feed rotary table rotating shaft end and winding and be engaged in Timing Belt between two belt gears; To make stepping motor drive the synchronous rotation at intermittence that two feed rotary table are made switched in opposite through drive mechanism.
Because the utility model comprises board, be arranged at the distribution wafer on the board the pan feeding structure, be provided with the feed rotary table group of accepting wafer hole feeding groove, be provided with the test structure of upper and lower probe and send the discharging structure of test back wafer; The feed rotary table group comprises arranged side by side group of two feed rotary table, drive mechanism and the stepping motor established; Stepping motor connects and drives two feed rotary table through drive mechanism to be done the synchronous intermittence of switched in opposite and rotates, to accept wafer to be tested that single group pan feeding structural order sends into, to enter that single group test structure counts on the feeding groove to two feed rotary table that wafer is done test synchronously and classify by the discharging structure of its both sides and send in the importing material collecting tank.During operation, wafer to be tested is assigned to each feeding groove top of two feed rotary table by the pan feeding structure, the stepping motor of feed rotary table group drives two feed rotary table through drive mechanism and does synchronous intermittence of switched in opposite and rotate, to accept wafer to be tested that single group pan feeding structural order sends into, to enter that single group test structure counts on the feeding groove to two feed rotary table that wafer is done test synchronously and classify by the discharging structure of its both sides and send in the importing material collecting tank; To be the utility model can drive two feed rotary table synchronously with a stepping motor transmits wafer and advances, and do wafer assign action and one group of test structure are done test synchronously to wafer on two feed rotary table action with one group of pan feeding structure, therefore, can be issued to the testing efficiency and the production capacity of the wafer tester twice of commonly using in the design of simplifying most; The designer trends of corresponding wafer microminiaturization, can be on not strengthening under the feed rotary table apparent size situation with it feeding groove number design optimization, take place with the situation of avoiding feed rotary table to produce distortion, and cooperate the use of two feed rotary table, its testing efficiency and production capacity can not descended promote on the contrary; Can promote production capacity and testing efficiency because of the size of feed rotary table being strengthened, thereby be applicable to the test jobs of more small wafer.Not only improve testing efficiency, and applied widely, thus reach the purpose of this utility model.
Description of drawings
Fig. 1, be the utility model structural representation end view.
Fig. 2, be the utility model structural representation front view.
Fig. 3, be the utility model structural representation vertical view.
Fig. 4, be the utility model pan feeding architecture diagrammatic top view.
Fig. 5, be the utility model feed rotary table group structural representation front view.
Fig. 6, be the utility model feed rotary table transmission schematic diagram.
Fig. 7, be the utility model test structure structural representation end view.
Fig. 8, be the utility model feed rotary table action schematic diagram.
Fig. 9, be the utility model feed rotary table group and other structural arrangements schematic diagrames.
Figure 10, be known wafer tester structural representation stereogram.
Embodiment
As Fig. 1, Fig. 2, shown in Figure 3, the utility model comprise be provided with before swash plate 11 board 1, be arranged at pan feeding structure 2 on the board 1, feed rotary table group 3, test structure 4 and discharging structure 5.
As Fig. 1, shown in Figure 4, pan feeding structure 2 comprises using and is arranged at the support 21 that is provided with vertical slide rail 211 on the board 1 before the feed rotary table group 3, the bottom surface is provided with Slide Group and is located at slide 221 that moves/locate with front and back on the support 21 vertical slide rails 211 and the base 22 that is provided with horizontal slide rail 252 in front end, be mounted on the base 22 hopper 23 with ccontaining numerous wafer to be tested, arrival end just is positioned at the vibration chute feeder 24 of hopper 23 outlet belows, rear end bottom is established the batch hopper 25 that is sheathed on base 22 front end sideslip rails 252 upper saddles 251 and is connected and drive batch hopper 25 through Timing Belt 261 and makes laterally the stepping motor 26 that reciprocal fixed point moves/stops.
Vibration chute feeder 24 is provided with to be used vibration and makes the wafer to be tested thereon vibrator 241 that continues to advance.
As Fig. 5, Fig. 6, shown in Figure 7, feed rotary table group 3 is to be skewed to be arranged at before the board 1 on the swash plate 11, and it comprises two first and second feed rotary table 31,32, guide guard shield 33, drive mechanism 34 and stepping motors 341 arranged side by side.
First and second feed rotary table 31,32 is to be left and right to be oppositely arranged and for same structure.As Fig. 2, shown in Figure 5, be equipped with several feeding grooves 311,321 on first and second feed rotary table 31,32, and on each feeding groove 311,321, be provided with concentric shape and be equally spaced for the hole 3111,3211 of ccontaining wafer.
As Fig. 7, shown in Figure 8, guide guard shield 33 is covered on first and second feed rotary table 31,32 tops, and whether for visual examination first and second feed rotary table 31,32 each grooves 311,321 on wafer have the transparence observation window 331 of get stuck phenomenon, it is porch 332,334 corresponding to first and second feed rotary table 31,32 relative inner if which is provided with several.
Stepping motor 26 is done 332,334 tops, feeding groove 311,321 porch that laterally reciprocal fixed point move/rests on first and second feed rotary table 31,32 through the batch hopper 23 that Timing Belt 261 drives pan feeding structure 2, be placed in feeding groove 311,321 so that wafer falls into, and advance by first and second feed rotary table 31,32 drives.
As shown in Figure 6, drive mechanism 34 comprises the active belt gear 3411 that is fixedly arranged on the stepping motor 341, be fixedly arranged on the passive belt gear 313 in 31 rotating shafts 312 of first feed rotary table, winding is engaged in the master, passive belt gear 3411,313 Timing Belt 314, be fixedly arranged on the timing gears 342 of first feed rotary table, 31 rotating shafts, 312 ends, be positioned at that timing gears 342 sides are fixedly arranged in the little rotating shaft 344 and with the spur gear 343 of timing gears 342 engagements, be fixedly arranged on transmission belt gear 345 in the little rotating shaft 344 with spur gear 343 is coaxial, the driving belt gear 323 and the winding that are fixedly arranged on second feed rotary table, 32 rotating shafts, 322 ends are engaged in two belt gears 345,323 Timing Belt 324.
Stepping motor 341 is through drive mechanism 34 connections and drive the synchronous rotation at intermittence that first and second feed rotary table 31,32 is made switched in opposite.
As Fig. 5, Fig. 6, Fig. 7, Fig. 8, shown in Figure 9, test structure 4 is to be arranged at 31,32 top sides of first and second feed rotary table, and it comprises the pedestal 41 that is fixedly arranged on the board 1, the arc plate 42 that is hubbed at pedestal 41 bottom sides, slide 43, slide rail 44 and micro actuator 45.
The arc plate 42 that is hubbed at pedestal 41 bottom sides just can be covered in simultaneously first and second feed rotary table 31,32 tops and relatively pedestal 41 upwards start or be fixed on the pedestal 41, and the setting of cooperation slide 43, slide rail 44 and micro actuator 45 is to finely tune between itself and first and second feed rotary table 31,32 distance.
Arc plate 42 be provided with first and second feed rotary table 31,32 on probe 421 on the array of feeding groove 311,321 corresponding quantity and position, and in board 1 be provided with array on probe 422 under the probe 421 corresponding arrays, tested in 421,422 o'clock by upper and lower probe with the wafer that order is placed on first and second feed rotary table 31,32 feeding grooves 311,321.
As Fig. 6, Fig. 7, Fig. 8, shown in Figure 9, discharging structure 5 is arranged at 31,32 liang of first and second feed rotary table outside relatively respectively, and it comprises and is provided with many jack 511,521 cover plates 51,52 portable plates 54, slide rail 541 and is arranged at the material collecting tank 53 that board 1 is connected with jack 511,521 through conduit.
Cover plate 51,52 is fixedly arranged on portable plate 54 bottoms and is hubbed on the board 1 with its bottom, outwards raises with board 1 relatively.
Portable plate 54 is to be sheathed on the slide rail 541 can adjust/distance of 31,32 of securing cover plate 51,52 and first and second feed rotary table, can send in each corresponding material collecting tank 53 via conduit really for the wafer behind the test grading.
During operation, fall in the hopper 23 of wafer to be tested by pan feeding structure 2 in the vibration chute feeder 24, and before in vibration chute feeder 24 and then fall to by stepping motor 26 and drive on the batch hopper 25 that moves, wafer to be tested is assigned to first and second feed rotary table 31,32 each feeding groove 311,321 tops, so that the wafer mean allocation is in feeding groove 311,321; The stepping motor 341 of feed rotary table group 3 drives the synchronous rotation at intermittence that first and second feed rotary table 31,32 is made switched in opposite through drive mechanism 34, thereby the wafer that drives carrying on it advances toward test structure 4 directions.When the wafer on first and second feed rotary table 31,32 arrives test structure 4 and pass through between the upper and lower probe 421,422, can do test and record classification to wafer; And the wafer after the test continues intermittently to rotate to transmit rearward by first and second feed rotary table 31,32 again; When the wafer after the classification that transmits rearward arrived discharging structure 5, grade was sent in the material collecting tank 53 of each corresponding grade through conduit during promptly according to first Pretesting; Passing hole 3111,3211 and can send into wafer again for batch hopper 23 on first and second feed rotary table 31,32 on the feeding groove 311,321; So, by first and second feed rotary table 31,32 conveyings of continue doing relatively intermittently to rotate on it wafer test, can carry out high efficiency wafer sort and classification collection operation.
The utility model is compared with the wafer tester of a known feed rotary table of use has following advantage:
1, the utility model can drive synchronously two feed rotary table with a stepping motor and transmits wafer and advance, And make the wafer assign action and one group of test structure is done wafer on two feed rotary table synchronously with one group of feeding structure Therefore the action of test, can be issued in the design of simplifying most the test effect of the wafer tester twice of commonly using Rate and production capacity.
2, the designer trends of corresponding wafer microminiaturization can not strengthen general under the feed rotary table apparent size situation Feeding groove number design optimization on it takes place with the situation of avoiding feed rotary table to produce distortion, and joins Close the use of two feed rotary table, its testing efficiency and production capacity can not descended promote on the contrary.
3, can promote production capacity and testing efficiency because the size of feed rotary table being strengthened, thereby avoid sending The situation of material rotating disk distortion takes place, therefore can be at certain size, even design feed rotary table under the littler situation, Thereby be applicable to the test jobs of more small wafer.

Claims (4)

1, a kind of wafer tester, it comprises board, be arranged at the pan feeding structure of the distribution wafer on the board, be provided with the feed rotary table group of accepting wafer hole feeding groove, be provided with the test structure of upper and lower probe and send the discharging structure of test back wafer; It is characterized in that described feed rotary table group comprises arranged side by side group of two feed rotary table, drive mechanism and the stepping motor of establishing; Stepping motor connects and drives two feed rotary table through drive mechanism to be done the synchronous intermittence of switched in opposite and rotates, to accept wafer to be tested that single group pan feeding structural order sends into, to enter that single group test structure counts on the feeding groove to two feed rotary table that wafer is done test synchronously and classify by the discharging structure of its both sides and send in the importing material collecting tank.
2, wafer tester according to claim 1 is characterized in that described two feed rotary table top is covered with the guide guard shield.
3, wafer tester according to claim 2 is characterized in that described guide guard shield is provided with several transparent windows.
4, wafer tester according to claim 1 is characterized in that the drive mechanism of described feed rotary table group comprises the active belt gear that is fixedly arranged on the stepping motor, be fixedly arranged on the passive belt gear in the feed rotary table rotating shaft, winding is engaged in the master, Timing Belt between passive belt teeth, be fixedly arranged on the timing gears of a feed rotary table rotating shaft end, be positioned at that the timing gears side is fixedly arranged in the little rotating shaft and with the spur gear of timing gears engagement, be fixedly arranged on transmission belt gear in the little rotating shaft with spur gear is coaxial, be fixedly arranged on the driving belt gear of another feed rotary table rotating shaft end and winding and be engaged in Timing Belt between two belt gears; To make stepping motor drive the synchronous rotation at intermittence that two feed rotary table are made switched in opposite through drive mechanism.
CN 02254453 2002-09-25 2002-09-25 Chip test machine Expired - Lifetime CN2572557Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 02254453 CN2572557Y (en) 2002-09-25 2002-09-25 Chip test machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 02254453 CN2572557Y (en) 2002-09-25 2002-09-25 Chip test machine

Publications (1)

Publication Number Publication Date
CN2572557Y true CN2572557Y (en) 2003-09-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 02254453 Expired - Lifetime CN2572557Y (en) 2002-09-25 2002-09-25 Chip test machine

Country Status (1)

Country Link
CN (1) CN2572557Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108156820A (en) * 2015-04-28 2018-06-12 新东工业株式会社 Check device and inspection method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108156820A (en) * 2015-04-28 2018-06-12 新东工业株式会社 Check device and inspection method
US10578663B2 (en) 2015-04-28 2020-03-03 Sintokogio, Ltd. Inspection device and inspection method for performing dynamic and static characteristics tests
CN108156820B (en) * 2015-04-28 2020-07-14 新东工业株式会社 Inspection apparatus and inspection method

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20120925

Granted publication date: 20030910