CN2561002Y - 散热片卡接结构 - Google Patents

散热片卡接结构 Download PDF

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CN2561002Y
CN2561002Y CN02263890.3U CN02263890U CN2561002Y CN 2561002 Y CN2561002 Y CN 2561002Y CN 02263890 U CN02263890 U CN 02263890U CN 2561002 Y CN2561002 Y CN 2561002Y
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button bit
flanging
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叶元璋
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Kunshan Disheng Electronics Co ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029Heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Condensed Matter Physics & Semiconductors (AREA)
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热片卡接结构,每个散热片单元的两个相对侧边上分别设有折边[2],其特征是:折边[2]上冲设形扣位孔,该孔随折边[2]折弯后其上端凹缺部为扣位槽[3],下端凸起部为扣位片[4],扣位槽[3]设在折边[2]顶部并使折边[2]局部上凸,扣位片[4]设在折边[2]根部交界处的基片[5]上并且凸起部朝外;本单元扣位槽[3]与前一单元扣位片[4]结合,本单元扣位片[4]与后一单元扣位槽[3]结合,各单元彼此前后叠加卡接成排。本实用新型能以连续冲模方式快速将各散热片单元卡接成排,与同类散热片相比优点是:1.卡接结构简单,折弯方向少;2.模具成本相对较低;3.节省材料;4.拆卸方便。

Description

散热片卡接结构
                          技术领域
本实用新型涉及一种能以连续冲模方式快速将各散热片单元卡接成排的散热器,特别涉及这种散热器中散热片之间的卡接结构。
                          背景技术
对电子元器件、集成电路及微型组件进行散热是计算机以及电子设备向小型化、便携式方向发展的重要问题。近年来,由于技术进步散热器结构也相应发生了很大变化,其中具有代表性的是一种能以连续冲模方式快速将各散热片单元卡接成排的散热器。如台湾专利公报于2001年12月11日公告了一件名称为《散热片卡接结构》,公告编号为468931,申请案号为090208102,申请日为2001年5月18日的新型专利申请案。该申请的主要内容是在散热片上下端缘分别设置短折边,而在短折边的角落分别冲设勾部,并且在各短折边与散热片交接处的相关位置冲设长槽孔,从而使各角落形成能以连续冲模制成卡接结构,并使所有散热片能快而稳固的组接成排状结构。该新型专利申请案尽管与以往散热片单元之间通过凹、凸点彼此相接定位成排的散热器相比有了很大进步,但不足之处在于:1、由于勾部结构复杂,折弯方向多,相应的制造工艺复杂;2、由于勾部结构复杂,折弯方向多,相应模具结构复杂成本大;3、由于散热片展开坯料尺寸较大,材料消耗增加;4、由于勾部卡死在长槽孔中散热片排组拆卸不方便。为此,本实用新型从改进结构角度出发,提供一种简单可靠,而且更适合于连续冲模方式快速卡接成排的散热片卡接结构,以克服上述不足。
                              发明内容
为达到上述目的,本实用新型采用技术方案是:一种散热片卡接结构,每个散热片单元的两个相对侧边上分别设有折边,折边至基片的一段片体上冲设
Figure Y0226389000031
形扣位孔,该孔随折边折弯后其上端凹缺部为扣位槽,下端凸起部为扣位片,扣位槽设在折边顶部并使折边局部上凸,扣位片设在折边根部交界处的基片上并且凸起部朝外,扣位槽与扣位片位置对齐,宽度匹配;本单元扣位槽与前一单元扣位片结合,本单元扣位片与后一单元扣位槽结合,各单元彼此前后叠加卡接成排。
上述技术方案中的有关内容和变化解释如下:
1、所述“散热片单元”是指重复出现的而且结构相同的基本散热片结构。所述“基片”是指散热片除折边以外的主体部分或主片体。
2、上述技术方案中关于卡接结构的数量设置问题,可以在散热片单元每侧设置一对、两对或三对及三对以上,也可以在散热片的一侧设置奇数,而在另一侧设置偶数,但其中比较好的做法是在每侧相隔设有两对或三对扣位槽和扣位片。如果在散热片每侧设置两对扣位槽和扣位片,一般情况下采用相隔对称设置的方案;如果在每侧设置三对扣位槽和扣位片,一般通常采用左、中、右布置的方案。
3、上述技术方案中关于折边结构通常可以有下列两种做法,一种是散热片两个相对侧边上的折边均为整条结构,这种形式适合于强制通风的散热;另一种是散热片两个相对侧边上的折边中一条为整条结构,另一条为局部折边结构,这种形式适合于普通散热器,整条折边通常与热源接触,这样可以增加接触面,而局部折边的作用只是提供卡接结构。
上述内容和变化均包含在本实用新型要求保护的范围之内。
本实用新型工作原理是:采用
Figure Y0226389000041
形冲压孔通过折弯在折边处形成一对扣位槽和扣位片,然后利用前、后散热片上扣位槽与扣位片的位置关系,在连续冲模配合下直接将各散热片连续卡接成排。整个冲压组装的动作过程为:冲定位孔→冲扣位孔→外形下料→扣位凸缘折角→折边成型→卡接组装。
由于上述技术方案运用,本实用新型与现有技术相比具有下列优点和效果:
1、本实用新型卡接结构简单,折弯方向少,因此相应的制造工艺简单。
2、本实用新型卡接结构在制造上只要6个动作,而现有技术至少需要8个动作。
3、由于卡接结构相对简单,相应的模具也比现有技术采用模具简单,因此可以相应降低模具成本。
4、在外形尺寸相同的条件下,由于本实用新型散热片展开尺寸小于现有技术散热片,因此节省材料。
5、本实用新型卡接结构不仅连接可靠,而且拆卸更方便。
                          附图说明
附图1为本实用新型实施例散热片单元立体图;
附图2为本实用新型两片散热片单元叠加卡接成排的立体图;
附图3为本实用新型散热片单元中卡接结构部位的放大图;
附图4为本实用新型两片散热片卡接装配局部放大图。
以上附图中:1、凸缘边;2、折边;3、扣位槽;4、扣位片;5、基片。
                      具体实施方式
下面结合附图及实施例对本实用新型作进一步描述:
实施例一:参见附图1~图4所示,一种散热片卡接结构,每个散热片单元的两个相对侧边上分别设有整段折边2,每条折边2至基片5的一段片体上相隔冲设两个 形扣位孔,该孔随折边2折弯后其上端凹缺部为扣位槽3,下端凸起部为扣位片4,扣位槽3设在折边2顶部并使折边2局部上凸呈凸缘边1,扣位片4设在折边2根部交界处的基片5上并且凸起部朝外,扣位槽3与扣位片4位置对齐,宽度相等。卡接时本单元所有扣位槽3与前一单元扣位片4结合,本单元所有扣位片4与后一单元扣位槽3结合,各单元彼此前后叠加卡接成排状散热器结构。采用连续冲模方式生产时接以下次序冲压和组装:冲定位孔→冲扣位孔→外形下料→扣位凸缘折角→折边成型→卡接组装。
实施例二:一种散热片卡接结构,每个散热片单元的两个相对侧边上分别设有整段折边2,每条折边2至基片5的一段片体上相隔冲设三个
Figure Y0226389000052
形扣位孔,以此构成每条折边2上左、中、右分布的三对扣位槽3和扣位片4。其它与实施例一相同。
实施例三:一种散热片卡接结构,每个散热片单元的两个相对侧边上一条为整段折边2结构,另一条为分开的两段折边2结构,其中整段折边2上相隔设有两对扣位槽3和扣位片4,分开的两段折边2上分别设有一对扣位槽3和扣位片4。其它与实施例一相同。
实施例四:一种散热片卡接结构,每个散热片单元的两个相对侧边上分别设有整段折边2,其中一条折边2上相隔设有两对扣位槽3和扣位片4,另一条折边2上设有一对扣位槽3和扣位片4。其它与实施例一相同。

Claims (6)

1、一种散热片卡接结构,每个散热片单元的两个相对侧边上分别设有折边[2],其特征在于:折边[2]至基片[5]的一段片体上冲设 形扣位孔,该孔随折边[2]折弯后其上端凹缺部为扣位槽[3],下端凸起部为扣位片[4],扣位槽[3]设在折边[2]顶部并使折边[2]局部上凸,扣位片[4]设在折边[2]根部交界处的基片[5]上并且凸起部朝外,扣位槽[3]与扣位片[4]位置对齐,宽度匹配;本单元扣位槽[3]与前一单元扣位片[4]结合,本单元扣位片[4]与后一单元扣位槽[3]结合,各单元彼此前后叠加卡接成排。
2、根据权利要求1所述的散热片卡接结构,其特征在于:所述散热片单元每侧折边[2]上相隔设有两对扣位槽[3]和扣位片[4]。
3、根据权利要求1所述的散热片卡接结构,其特征在于:所述散热片单元每侧折边[2]上相隔设有三对扣位槽[3]和扣位片[4]。
4、根据权利要求1所述的散热片卡接结构,其特征在于:所述散热片单元一条折边[2]上相隔设有两对扣位槽[3]和扣位片[4],另一条折边[2]上设有一对扣位槽[3]和扣位片[4]。
5、根据权利要求1所述的散热片卡接结构,其特征在于:所述两个相对侧边上的折边[2]均为整条结构。
6、根据权利要求1所述的散热片卡接结构,其特征在于:所述两个相对侧边上的折边[2]中一条为整条结构,另一条为局部折边结构。
CN02263890.3U 2002-08-14 2002-08-14 散热片卡接结构 Expired - Fee Related CN2561002Y (zh)

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CNB021423326A CN1176300C (zh) 2002-08-14 2002-09-09 一种铸铁氮化平台网纹气缸套
US10/644,448 US20040104013A1 (en) 2002-08-14 2003-08-19 Engaging structure for heat sink

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