CN2501657Y - Surface double-layer board special for multi-layer distributing base board drilling work - Google Patents
Surface double-layer board special for multi-layer distributing base board drilling work Download PDFInfo
- Publication number
- CN2501657Y CN2501657Y CN 01267245 CN01267245U CN2501657Y CN 2501657 Y CN2501657 Y CN 2501657Y CN 01267245 CN01267245 CN 01267245 CN 01267245 U CN01267245 U CN 01267245U CN 2501657 Y CN2501657 Y CN 2501657Y
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- China
- Prior art keywords
- foil layer
- copper foil
- layer
- wiring board
- doubling plate
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- Expired - Fee Related
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- Drilling And Boring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model discloses a surface doubling plate for drilling operation of multi-layer wiring substrate, aiming at the copper foil layer which is arranged on the surface of the multi-layer wiring substrate. The utility model is characterized in that a medium interlayer is utilized in advance to tightly coupling with an aluminum foil of appropriate thickness into a doubling plate of uniform thickness on the original copper foil layer, and make the doubling plate be integrally pressed on the surface of the multi-layer wiring substrate. When the drilling working, the close-covering function of the aluminum foil layer on the copper foil layer can avoid the existing shortcoming of that the drilling knife causes raw edges on the copper foil layer in the drilling operation, also avoid the subsequent procedure of de-burr, so as to simplify the drilling operation procedure and improve the drilling quality. The load-bearing function of the aluminum foil can make the original copper foil layer of more refinement, thus effectively improving the precision of the line of the wiring layer. After finishing the drilling operation, the medium interlayer can separate the aluminum foil layer from the copper foil layer and just leaves the copper foil layer on the surface of the multi-layer wiring substrate, which is easily recovered to the original substrate structure for supplying the following process and has practicability.
Description
Technical field
The utility model relates to a kind of multilayer board, particularly a kind of surperficial doubling plate that is exclusively used in the multi-layered wiring board bore operation.
Background technology
The design of various e-machines in recent years is thin, light, short and small day by day, cause various electronic components or in order to wiring substrate (the wiring board that these electronic components are used to be installed, or title printing board PCB, Printed Circuit Board) also miniaturization and lightweight relatively, therefore the densification of wiring substrate requires to improve day by day, and desire to reach the densification of wiring substrate, can utilize the method that the distribution density of wiring layer is improved, or utilize wiring layer to be stacked into multilayer and form the method for multi-layered wiring board.
The method of making multi-layered wiring board can generally be divided into laminated type and lamination type, wherein laminated type is after forming wiring layer respectively on most substrates, be per two internal substrates with each with heat insulating lamina (resin adds the film that glass fibre forms) as intermediary layer, and the multilager base plate heating is pressed into a multiple field wiring substrate; Lamination type is to form heat insulating lamina on the base material that is formed with the distribution pattern, and then forms another distribution pattern on heat insulating lamina again, is concatenated to form heat insulating lamina and distribution pattern so in regular turn, and is stacked into the multi-layered wiring board structure.
Being necessary to make up and down in the line design of multi-layered wiring board, the part contact between each layer wiring layer produces electrical communication, and the manufacture of electrical communication is existing multiple at present, be connected to the contact place of another wiring layer as on a wiring layer, producing solid copper pin in the processing procedure, or on hole wall, form the electrodeposited coating that one deck electrical communication is used again with laser scorification mode location drilling (perforation or blind hole) in the processing procedure, or on hole wall, form the electrodeposited coating that one deck electrical communication is used again to bore the cutter location drilling in the processing procedure with electro-plating method with electro-plating method.
And wherein, all be covered with the about 35 μ m of a layer thickness～70 μ m (1 μ m=10 on the upper and lower surface of the multi-layered wiring board of general laminated type moulding
-6M) copper foil layer, and because copper material has high ductibility, when in processing procedure, carrying out bore operation, bore cutter and directly pierce the as easy as rolling off a log burr that produce at the boring surface place of copper foil layer, so general bore operation utilizes aluminium (alloy) paper tinsel of the about 0.15mm～0.2mm of a layer thickness to cover on this copper foil layer all earlier, this aluminium foil laminate is on copper foil layer and minimizing or avoid producing burr; But, when covering on the copper foil layer, can't reach aluminium foil layer absolutely seamless closed intensity, bore operation still can produce burr, all must carry out unhairing limit (de-burr) program again after making bore operation, not only make the bore operation program numerous and diverse, although carried out unhairing limit program, but can't guarantee the operation quality of unhairing limit (de-burr) program, so still can have influence on the moulding quality of boring, and then have influence on follow-up on hole wall electroplating activity and the quality of conductive communication, so the generation of burr is necessary to be overcome and improve.
In addition, the densification of wiring substrate is to utilize the method that the distribution density of wiring layer is improved to reach, and that the distribution density of wiring layer improves is closely bound up with the thickness of copper foil layer, and the thickness of copper foil layer is often with Unit Weight oz/in
2(ounce per square inch) is unit of account, as 0.5oz/in
2The about 0.7mil of the thickness of copper foil layer (1mil is a mil), i.e. about 17.5 μ m of thickness, and copper foil layer thickness minimum is about 0.5oz/in on the general at present laminated type multi-layered wiring board that uses
2, or above loz/in
2, 2oz/in
2, 3oz/in
2Or the like, this be because of copper foil layer thickness if thin excessively, then influence the pressing and forming processing procedure of multi-layered wiring board, wherein this copper foil layer is difficult for smooth covering on the surface of multi-layered wiring board; Yet minimum only can reach 0.5oz/in
2Copper foil layer, obviously fine inadequately again, make the line density of wiring layer also can't effectively bring up to meticulousr program, in other words, if can adopt the copper foil layer of littler thickness, as 1/3～1/4oz/in
2, can effectively improve the line density of wiring layer, foot makes these 1/3～1/4oz/in again
2Copper foil layer in processing procedure, can be flattened and be pressed together on the substrate surface, be to be necessary to be studied and to improve.
Summary of the invention
The utility model is that a kind of surperficial doubling plate that is exclusively used in the multi-layered wiring board bore operation will be provided, avoid copper foil layer in boring the cutter bore operation, to produce burr with solution, and simplify the bore operation program, effectively improve the technical problem of copper foil layer and circuit precision thereof.
It is such solving the problems of the technologies described above the technical scheme that is adopted:
A kind of surperficial doubling plate that is exclusively used in the multi-layered wiring board bore operation, it is the copper foil layer that is covered on the multi-layered wiring board surface, it is characterized in that: this doubling plate comprises this copper foil layer and one deck aluminium foil layer, then is provided with one between copper foil layer and the aluminium foil layer and makes copper foil layer and aluminium foil layer combine closely into the middle interlayer of a uniform thickness;
The aluminium foil layer thickness of this doubling plate can be 0.05mm～0.15mm;
Should middle interlayer be a kind of adhesive agent.
The utility model is to utilize interlayer in advance and combine closely into the double panel structure of a uniform thickness with the aluminium foil of a suitable thickness on the original surface copper foil layer, make complete driving fit between copper foil layer and aluminium foil layer and do not have any gap, on copper foil layer, produce burr in boring the cutter bore operation, avoiding boring cutter, to simplify the bore operation program and to improve the wiring layer quality; Make the carrying effect of this aluminium foil layer again, reach the more miniaturization of former copper foil layer, and then effectively improve the precision of wiring layer circuit; With the buffer action of interlayer in this, make after bore operation is finished simultaneously, make aluminium foil layer simple and easy removing on copper foil layer by interlayer in this, and only keep somewhere copper foil layer on the surface of multi-layered wiring board, make the simple and easy original substrate structure that reverts to for descending continuous processing procedure; Avoid copper foil layer in boring the cutter bore operation, to produce burr thereby solved, and simplify the bore operation program, effectively improve the technical problem of Copper Foil and circuit precision thereof.
The utility model is simple in structure, it is a kind of double panel structure that on former copper foil layer, forms uniform thickness in conjunction with the aluminium foil layer of one deck suitable thickness, during use, utilize this doubling plate to replace original single copper foil layer and be pressed together on the surface of a multi-layered wiring board, make and when bore operation, avoid boring the boring peripheral region generation burr of cutter at copper foil layer, and simplify the bore operation program, and effectively improve the measure of precision of copper foil layer and circuit thereof, and the tool practicality.
Description of drawings
Fig. 1 is the structure cross-sectional schematic of known laminated type multi-layered wiring board before pressing;
Fig. 2 is the structure cross-sectional schematic of known laminated type multi-layered wiring board after pressing;
Fig. 1 is that three of known laminated type multi-layered wiring boards make to bore cutter bore operation cross-sectional schematic together;
Fig. 4 is that cross-sectional schematic is amplified in Fig. 3 part that the position produces burr of holing behind bore operation;
Fig. 5 is a structure cross-sectional schematic of the present utility model;
Fig. 6 is that the utility model is used in the structure cross-sectional schematic before pressing on the laminated type multi-layered wiring board;
Fig. 7 is that the utility model is used in the structure cross-sectional schematic after pressing on the laminated type multi-layered wiring board;
Fig. 8 is the cross-sectional schematic of Fig. 7 pressing multi-layered wiring board after boring the cutter bore operation;
Fig. 9 is that Fig. 7 removes aluminium foil layer and only keeps somewhere copper foil layer in the lip-deep cross-sectional schematic of multi-layered wiring board behind bore operation.
Embodiment
As shown in Figure 1, 2, multi-layered wiring board 1 is known a kind of laminated type multi-layered wiring board, overall structure mainly includes the copper foil layer (Cu Foil) 2,3 of each the about 35 μ m of a layer thickness～70 μ m on upper and lower two outer surfaces and two-layer internal substrate (Thin Core) 4,5 therebetween, and the upper and lower surface of each internal substrate 4,5 respectively is provided with one deck copper foil layer 6,7,8,9, and this different copper foil layer 6,7,8,9 also has been etched into different distribution patterns; Again in surperficial copper foil layer 2,3 and internal substrate 4, each is by insulating barrier film (being glass fiber resin) 10 between 5,11,12 as intermediary layer, have 2 altogether and heat to be pressed into, 3,6,7,8, the multi-layered wiring board 1 of 9 six layers of copper foil layer, as shown in Figure 2, this copper foil layer 2,3 are etched into the distribution pattern again, be necessary to make six layers of copper foil layer 2 again in the line design of multi-layered wiring board 1,3,6,7,8,9 up and down the part contact between each layer wiring layer (the contact number is decided according to line design) produce electrical communication, therefore must utilize drill bit 13 to be drilled with a plurality of borings 14 (only with a boring expression) at this place, contact location in the processing procedure, for can on the wall of boring 14, forming the copper plate that one deck electrical communication is used with electro-plating method.
Utilize the aluminium foil layer 15 of the about 0.15mm～0.2mm of a layer thickness to cover on this copper foil layer 2 before the general bore operation all earlier, this aluminium foil layer 15 is compressed on the copper foil layer 2 to reduce or to avoid producing burr (Burr), and general bore operation is often located two or three multiple field wiring substrate 1 stacked, and with the urea material plate of the about 1.5mm～2mm of a thickness make heelpiece 16 and once simultaneously boring, as shown in Figure 3, to improve bore operation efficient.But the drawing method that adopts this kind aluminium foil layer 15 to cover (shown in Fig. 2,3) on the copper foil layer 2 still can't prevent to produce burr 17 at boring 14 aperture peripheral region fully, shown in 4 figure, still must carry out unhairing limit (de-burr) program again after causing bore operation.
As shown in Figure 5, the utility model " is exclusively used in the surperficial doubling plate of multi-layered wiring board bore operation " and is improved at the copper foil layer 2,3 that is covered on the surface of multi-layered wiring board 1, this doubling plate 18 comprises the aluminium foil layer 20 of one deck copper foil layer 19 and the about 0.05mm～0.15mm of one deck suitable thickness, then can utilize interlayer 21 between copper foil layer 19 and the aluminium foil layer 20 so that copper foil layer 19 and aluminium foil layer 20 are combined closely into the doubling plate structure of a uniform thickness.
During use, shown in Fig. 6,7, be to utilize these doubling plate 18 structures to replace original simple layer copper foil layer 2,3, and be pressed together on the surface of a multi-layered wiring board 1A; Then when bore operation, as shown in Figure 8, not only needn't re-use one deck aluminium foil layer 15 covers on this copper foil layer 2, and can be by the covering effect of driving fit fully on copper foil layer 19 of aluminium foil layer 20 in the doubling plate 18, make the aperture peripheral region of the boring 22 of copper foil layer 19 can not produce burr, and exempt follow-up unhairing limit (de-burr) program, can simplify the bore operation program and to improve the boring quality.The carrying effect of this aluminium foil layer 20 again makes copper foil layer 19 comparable former simple layer copper foil layer 2, the 3 more miniaturizations that are attached on the aluminium foil layer 20, and then can effectively improve the precision of wiring layer circuit.
In addition, multi-layered wiring board 1A is after bore operation is finished, this doubling plate 18 can be by wherein middle interlayer 21 and its aluminium foil layer 20 is separated on copper foil layer 19 and is removed, and only keep somewhere copper foil layer 19 on the surface of multi-layered wiring board 1A, as shown in Figure 9, make that multi-layered wiring board 1A is simple and easy to revert to the original substrate structure and for descending continuous processing procedure; Again should in interlayer 21 can be a kind of adhesive agent, make doubling plate 18 be able in interlayer 21 and remove aluminium foil layer 20, and the mode that removes aluminium foil layer 20 is not difficult technology, is attainable according to relevant at present adhesive agent or mount technology, so repeat no more in this.
In sum, the utility model " be exclusively used in the surperficial doubling plate of multi-layered wiring board bore operation " though structure and technological means thereof non-difficult, but do not see have same structure to be disclosed in before, and can reach the use effect of expection again really, so should have novelty and advance, and meet the utility application important document, so utility application is proposed in accordance with the law.
Claims (3)
1, a kind of surperficial doubling plate that is exclusively used in the multi-layered wiring board bore operation, it is the copper foil layer that is covered on the multi-layered wiring board surface, it is characterized in that: this doubling plate comprises this copper foil layer and one deck aluminium foil layer, then is provided with one between copper foil layer and the aluminium foil layer and makes copper foil layer and aluminium foil layer combine closely into the middle interlayer of a uniform thickness.
2, the surperficial doubling plate that is exclusively used in the multi-layered wiring board bore operation according to claim 1, it is characterized in that: the aluminium foil layer thickness of this doubling plate can be 0.05mm～0.15mm.
3, the surperficial doubling plate that is exclusively used in the multi-layered wiring board bore operation according to claim 1, it is characterized in that: interlayer is a kind of adhesive agent in this.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01267245 CN2501657Y (en) | 2001-10-26 | 2001-10-26 | Surface double-layer board special for multi-layer distributing base board drilling work |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01267245 CN2501657Y (en) | 2001-10-26 | 2001-10-26 | Surface double-layer board special for multi-layer distributing base board drilling work |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2501657Y true CN2501657Y (en) | 2002-07-24 |
Family
ID=33673672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01267245 Expired - Fee Related CN2501657Y (en) | 2001-10-26 | 2001-10-26 | Surface double-layer board special for multi-layer distributing base board drilling work |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2501657Y (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107768222A (en) * | 2014-08-29 | 2018-03-06 | 朗姆研究公司 | Ion shower and lens combination for ion beam grinding |
| US10483085B2 (en) | 2014-10-21 | 2019-11-19 | Lam Research Corporation | Use of ion beam etching to generate gate-all-around structure |
| US10580628B2 (en) | 2014-08-12 | 2020-03-03 | Lam Research Corporation | Differentially pumped reactive gas injector |
| US10825652B2 (en) | 2014-08-29 | 2020-11-03 | Lam Research Corporation | Ion beam etch without need for wafer tilt or rotation |
| US11289306B2 (en) | 2016-02-25 | 2022-03-29 | Lam Research Corporation | Ion beam etching utilizing cryogenic wafer temperatures |
| CN116916538A (en) * | 2023-09-11 | 2023-10-20 | 圆周率半导体(南通)有限公司 | Machining method for removing burrs of drilled hole |
| CN116981177A (en) * | 2023-09-20 | 2023-10-31 | 圆周率半导体(南通)有限公司 | Processing method for rapidly producing PCB |
-
2001
- 2001-10-26 CN CN 01267245 patent/CN2501657Y/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10580628B2 (en) | 2014-08-12 | 2020-03-03 | Lam Research Corporation | Differentially pumped reactive gas injector |
| CN107768222A (en) * | 2014-08-29 | 2018-03-06 | 朗姆研究公司 | Ion shower and lens combination for ion beam grinding |
| CN107768222B (en) * | 2014-08-29 | 2020-08-18 | 朗姆研究公司 | Ion injector and lens system for ion beam milling |
| US10825652B2 (en) | 2014-08-29 | 2020-11-03 | Lam Research Corporation | Ion beam etch without need for wafer tilt or rotation |
| US10998167B2 (en) | 2014-08-29 | 2021-05-04 | Lam Research Corporation | Ion beam etch without need for wafer tilt or rotation |
| US11062920B2 (en) | 2014-08-29 | 2021-07-13 | Lam Research Corporation | Ion injector and lens system for ion beam milling |
| US10483085B2 (en) | 2014-10-21 | 2019-11-19 | Lam Research Corporation | Use of ion beam etching to generate gate-all-around structure |
| US11289306B2 (en) | 2016-02-25 | 2022-03-29 | Lam Research Corporation | Ion beam etching utilizing cryogenic wafer temperatures |
| CN116916538A (en) * | 2023-09-11 | 2023-10-20 | 圆周率半导体(南通)有限公司 | Machining method for removing burrs of drilled hole |
| CN116916538B (en) * | 2023-09-11 | 2023-12-22 | 圆周率半导体(南通)有限公司 | Machining method for removing burrs of drilled hole |
| CN116981177A (en) * | 2023-09-20 | 2023-10-31 | 圆周率半导体(南通)有限公司 | Processing method for rapidly producing PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |