CN102625580A - Circuit board manufacturing process - Google Patents
Circuit board manufacturing process Download PDFInfo
- Publication number
- CN102625580A CN102625580A CN2011100333716A CN201110033371A CN102625580A CN 102625580 A CN102625580 A CN 102625580A CN 2011100333716 A CN2011100333716 A CN 2011100333716A CN 201110033371 A CN201110033371 A CN 201110033371A CN 102625580 A CN102625580 A CN 102625580A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- gold
- layer
- copper
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a circuit board manufacturing process and mainly provides the circuit board manufacturing process which can greatly reduce gold-plated cost. In the circuit board manufacturing process, a solder mask covers a non electrode joint of an outer copper foil substrate. Finally, gold-plated processing is performed on the outer copper foil substrate so that a gold-plated surface is established on the copper foil surface of the electrode joint which is not covered by the solder mask. Therefore, a gold-plated scope can be narrowed to the electrode joints, such as a bonding pad, a connecting line, an external electrode contact and the like. And a purpose of reducing the gold-plated cost can be achieved.
Description
Technical field
The manufacturing technology of the relevant a kind of circuit board of the present invention is meant a kind of circuit board manufacturing process that can significantly reduce gold-plated cost especially.
Background technology
Press, printed circuit board (PCB) [Printed circuit board (PCB)] nearly all can appear in each electronic equipment, except fixing various electronic building bricks, and the electric connection of each electronic building brick is provided.Common printed circuit board (PCB) can be divided into single sided board, double sided board, the above multi-layer sheet of four laminates and soft board at present.
Generally speaking, the electronic product function is more complicated, the loop distance is longer, contact pin number is many more, and the required number of plies of printed circuit board (PCB) is also many more, like high-order consumer electronics, information and communication product etc.; Secondly; Printed circuit board (PCB) is the chemoresistance of guaranteeing its electrode junction, oxidation resistance and physical property (for example metallic conductivity, welding character, hot pressing are binded character and is connected character with other), and how can select in the copper foil surface of electrode junction impose gold-plated, change gold, spray tin, prewelding or carbon ink processing.
Wherein, change gold and be with gold on the chemical reaction, the gold layer that it obtained be for soft gold not wear-resisting; As for, the gold-plated processing,, be used for guard electrode junction and good conduction is provided so be applied in the electrode junction of printed circuit board (PCB) because of the gold of the nickel dam that can produce high-hardness wear-resistant and high inactivity layer more.
Yet; Commonly use that the manufacturing process of printed circuit board (PCB) is many to be arranged in gold-plated step for the first time between copper and the second time copper; And it is gold-plated comprehensively to be used in copper clad laminate; Keep the Gold plated Layer of electrode junction again with the chemical agent etching, not only waste a large amount of golden salt materials, increase the gold-plated cost of printed circuit board (PCB) more relatively.
Summary of the invention
In view of this, the present invention is promptly providing a kind of circuit board manufacturing process that can significantly reduce gold-plated cost.
For reaching above-mentioned purpose, described circuit board manufacturing process of the present invention and need not weld or covers a welding resisting layer with non-electrode junction that external circuit is pegged graft in this copper clad laminate behind the line layer of accomplishing copper clad laminate; At last this outer copper foil substrate is imposed gold-plated processing, make copper foil surface construction one Gold plated Layer of the non-electrode junction that does not receive the welding resisting layer covering; Wherein, This line layer includes the weld pad of some confession welding electronic building bricks, the connection line that each electronic building brick of some formations connects, the outer electrode contact that some confessions are connected with external circuit, some gold-plated passages in inside that is connected between weld pad, connection line and the outer electrode contact; And one be connected in each inner gold-plated channel outside gold-plated channel; The gold-plated channel in this outside is located around being located at this copper clad laminate; Should be communicated with outside plating bath by the gold-plated passage in outside when carrying out gold-plated processing, thus can gold-plated scope be reduced to electrode junctions such as weld pad, connection line and outer electrode contact, and then reach the purpose of the gold-plated cost of reduction.
The present invention is when implementing; Said circuit board manufacturing process can be at least one internal layer copper clad laminate with after an outer copper foil substrate combines; Further accomplish the line conduction between this at least one internal layer copper clad laminate and this outer copper foil substrate; And the outer-layer circuit layer of accomplishing this outer copper foil substrate, and need not weld or cover a welding resisting layer with non-electrode junction that external circuit is pegged graft in this outer copper foil substrate; At last this outer copper foil substrate is imposed gold-plated processing, make copper foil surface construction one Gold plated Layer of the non-electrode junction that does not receive the welding resisting layer covering; Wherein, This outer-layer circuit layer includes the weld pad of some confession welding electronic building bricks, the connection line that each electronic building brick of some formations connects, the outer electrode contact that some confessions are connected with external circuit, some gold-plated passages in inside that is connected between weld pad, connection line and the outer electrode contact; And one be connected in each inner gold-plated channel outside gold-plated channel; The gold-plated channel in this outside is located around being located at this copper clad laminate; Should be communicated with outside plating bath by the gold-plated passage in outside when carrying out gold-plated processing, thus can gold-plated scope be reduced to electrode junctions such as weld pad, connection line and outer electrode contact, and then reach the purpose of the gold-plated cost of reduction.
The present invention is when implementing; Said circuit board manufacturing process is at each conducting duct construction conductive copper layer; Accomplish after the line conduction between this at least one internal layer copper clad laminate and this outer copper foil substrate; Further should at least one internal layer copper clad laminate and this outer copper foil substrate carry out the copper facing first time, to increase the thickness of Copper Foil and conductive copper layer.
The present invention is when implementing, and said circuit board manufacturing process is removed the outside gold-plated passage that is connected between each outer electrode contact after this outer copper foil substrate is imposed gold-plated processing.
The present invention is when implementing, and said circuit board manufacturing process is the corresponding plurality of circuits plate block that is provided with on this at least one internal layer copper clad laminate and this outer copper foil substrate, and after accomplishing circuit board process, with each circuit board block cutting and separating.
The present invention is when implementing, and said circuit board manufacturing process is except the line pattern outermost layer that is depicted as, and with the mode of direct photoresistance or indirect printing inner line figure is replicated on this at least one internal layer copper clad laminate.
The present invention is when implementing, and said circuit board manufacturing process uses etchant that the copper-clad surface that this at least one internal layer copper clad laminate is not covered by photoresistance is etched away, and uses Copper Foil part that resistance agent protection against corrosion needs reserved line with formation internal layer circuit layer.
The present invention is when implementing, and the alligatoring of said circuit board manufacturing process use copper face, film are fixed, hot pressing filler supervisor, should at least one internal layer copper clad laminate and outer copper foil substrate storehouse combination mutually.
The present invention is when implementing, and said circuit board manufacturing process uses electrolytic copper free worker method in each conducting duct construction conductive copper layer.
The present invention is when implementing; Said circuit board manufacturing process is after the outer-layer circuit figure of this outer copper foil substrate develops; Further the copper-clad surface that does not cover dry film is done to plate copper and tin lead for the second time, and after removing dry film, remove and formation outer-layer circuit layer with the ammoniacal liquor of alkalescence, the Copper Foil etching that the copper chloride mixed solution will expose out.
Compare in traditional located by prior art; Circuit board manufacturing process of the present invention mainly sees through planning, the design of whole work flow, and is able to the gold-plated step of circuit board reasonably to be transferred to after the anti-welding step of Copper Foil by between copper and the secondary copper; Let the use amount of gold-plated raw material " golden salt "; Copper Foil area by originally containing whole copper clad laminate size is reduced to electrode junctions such as weld pad, connection line, outer electrode contact, and gold-plated passage etc. is not gone up the part of welding resisting layer; Therefore be able to reduce significantly the consumption of " golden salt ", reduce the gold-plated cost of circuit board relatively.
Description of drawings
Fig. 1 makes the circuit board manufacturing flow chart of lamina one preferred embodiment for the present invention.
Fig. 2 is the single layer board semi-finished product structural plan figure of first embodiment of the invention.
Fig. 3 is the single layer board structural plan figure of first embodiment of the invention.
Fig. 4 makes the circuit board manufacturing flow chart of multi-layer sheet one preferred embodiment for the present invention.
Fig. 5 is the multilayer circuit boards half-finished product structural plan figure of second embodiment of the invention.
Fig. 6 is the multilayer circuit board structural plan figure of second embodiment of the invention.
Fig. 7 is the board structure of circuit plane graph of third embodiment of the invention.
Figure number explanation: 10 internal layer copper clad laminates; 111 internal circuits; 20 outer copper foil substrates; 212 weld pads; 213 connection lines; 214 outer electrode contacts; 215 inner gold-plated passages; 216 outside gold-plated passages; 30 conducting ducts; 40 copper clad laminates.
Embodiment
Circuit board process of the present invention can be in order to make single layer board or multilayer circuit board; With the single layer board is example; The present invention makes shown in the circuit board manufacturing flow chart of single layer board one preferred embodiment like Fig. 1, and circuit board manufacturing process of the present invention mainly includes the following step.
A., copper clad laminate is provided; This copper clad laminate can be cut into the size that is fit to factory's processing procedure in advance.
B. on this copper clad laminate, duplicate predetermined individual layer line pattern; With the line pattern that is depicted as, copy on the copper clad laminate with the mode of direct photoresistance or indirect printing.
C. the Copper Foil beyond the line pattern of this copper clad laminate is removed, made the individual layer line layer that on this copper clad laminate, forms by Copper Foil constituted; Can use etchant that the copper-clad surface that copper clad laminate is not covered by photoresistance is etched away; And use resistance agent protection against corrosion to need the Copper Foil of reserved line partly to form line layer; Please consult shown in Figure 2 simultaneously; This line layer includes the weld pad 212 of some confession welding electronic building bricks, the connection line 213 that each electronic building brick of some formations connects, the outer electrode contact 214 that some confessions are connected with external circuit, some gold-plated passages 215 of connection line 213 and the shared inside between the outer electrode contact 214 that is connected in weld pad 212, electronic building brick connection; And one be connected in each inner gold-plated channel 215 outside gold-plated channel 216, the gold-plated passage 216 in this outside is located around being located at this copper clad laminate 40.
I. cover a welding resisting layer to the non-electrode junction that is less than this copper clad laminate; The lacquer of available demand color hides the non-electrode junction that makes this outer copper foil substrate can be again by last tin.
J. this outer copper foil substrate is imposed gold-plated processing, make copper foil surface construction one Gold plated Layer that not covered by welding resisting layer promptly accomplish the manufacturing process of circuit board; Wherein, this gold-plated processing should be communicated with outside plating bath by the gold-plated passage in outside, and weld pad, connection line, outer electrode contact and the inner gold-plated channel surface construction of conveying this gold-plated channel connection in outside have Gold plated Layer.
And after the gold-plated processing, and should the outside gold-plated passage removes, and makes to obtain a board structure of circuit as shown in Figure 3.
In addition, the present invention makes shown in the circuit board manufacturing flow chart of multilayer circuit board one preferred embodiment like Fig. 4, and circuit board manufacturing process of the present invention mainly includes the following step.
A., at least one internal layer copper clad laminate is provided; Each internal layer copper clad laminate can be cut into the size that is fit to factory's processing procedure in advance.
B. on this at least one internal layer copper clad laminate, duplicate predetermined inner line figure; Except the inner line figure outermost layer that is depicted as, copy on each internal layer copper clad laminate with the mode of direct photoresistance or indirect printing.
C. the Copper Foil beyond the inner line figure of this at least one internal layer copper clad laminate is removed, made the internal layer circuit layer that on this at least one internal layer copper clad laminate, forms by Copper Foil constituted; Can use etchant that the copper-clad surface that each internal layer copper clad laminate is not covered by photoresistance is etched away, and use resistance agent protection against corrosion to need the Copper Foil of reserved line partly to form the internal layer circuit layer.
D. should at least one internal layer copper clad laminate and an outer copper foil substrate mutually storehouse combine; The alligatoring of use copper face, film are fixed, hot pressing filler supervisor, should at least one internal layer copper clad laminate and outer copper foil substrate storehouse combination mutually.
E. between this at least one internal layer copper clad laminate and this outer copper foil substrate, form at least one in order to constitute the conducting duct of line channel; The internal layer copper clad laminate and the outer copper foil substrate that can when boring, see through after the location hole that had before got out combines the phase storehouse with pin are fixed on the drilling machine, add that simultaneously smooth last lower bolster produces the boring burr to reduce.
F. in each conducting duct construction conductive copper layer, to accomplish the line conduction between this at least one internal layer copper clad laminate and this outer copper foil substrate; Can use electrolytic copper free worker method; Be utilized in the nonmetal mode that goes up adhesion metal; Resin surface is applied catalyst (palladium (pd)-tin compound); Immerse again in the solution of electrolytic copper free and separate out electrolytic copper free, form metal conduction copper layer simultaneously in the interlayer conduction duct, to accomplish the conducting of each interlayer circuit.
G. on this outer copper foil substrate, duplicate predetermined outer-layer circuit figure; It is made as above-mentioned mode of on this at least one internal layer copper clad laminate, duplicating inner line figure in the image transfer of duplicating the outer-layer circuit figure on the outer copper clad laminate.
H. the Copper Foil beyond the outer-layer circuit figure of this outer copper foil substrate is removed, made the outer-layer circuit layer that on this outer copper foil substrate, forms by Copper Foil constituted; It can adopt two kinds of modes of production of positive and negative film in the mode that the Copper Foil beyond the outer-layer circuit figure of this outer copper foil substrate is removed.Wherein, the negative film mode is identical with internal layer circuit layer production method, and directly etching, striping are promptly calculated completion after development.As for; Positive sheet mode is after the outer-layer circuit figure of this outer copper foil substrate develops; Further the copper-clad surface that does not cover dry film is done to plate copper and tin lead for the second time, and after removing dry film, remove and formation outer-layer circuit layer with the ammoniacal liquor of alkalescence, the Copper Foil etching that the copper chloride mixed solution will expose out.
I. cover a welding resisting layer to the non-electrode junction that is less than this outer copper foil substrate; The lacquer of available demand color hides the non-electrode junction that makes this outer copper foil substrate can be again by last tin.
J. this outer copper foil substrate is imposed gold-plated processing, make copper foil surface construction one Gold plated Layer that not covered by welding resisting layer promptly accomplish the manufacturing process of circuit board.
Moreover; Circuit board manufacturing process of the present invention is at each conducting duct construction conductive copper layer; Accomplish after the line conduction between this at least one internal layer copper clad laminate and this outer copper foil substrate; Further should at least one internal layer copper clad laminate and this outer copper foil substrate carry out the copper facing second time, to increase the thickness of Copper Foil and conductive copper layer.
Please cooperate simultaneously with reference to shown in Figure 5, circuit board manufacturing process of the present invention is when implementing, and the internal layer circuit layer on said each internal layer copper clad laminate 10 is main with the internal circuit 111 that is connected between the conducting duct 30; As for; Outer-layer circuit layer on this outer copper foil substrate 20 includes the weld pad 212 of some confession welding electronic building bricks, the connection line 213 that each electronic building brick of some formations connects, the outer electrode contact 214 that some confessions are connected with external circuit, some gold-plated passages 215 in inside that is connected between weld pad 212, connection line 213 and the outer electrode contact 214; And one be connected in each inner gold-plated channel 215 outside gold-plated channel 216, the gold-plated passage 216 in this outside is located around being located at this copper clad laminate 30.
Certainly, take off among the embodiment shown in Figure 5 last, circuit board manufacturing process of the present invention should the gold-plated passage 216 in outside after this outer copper foil substrate 20 is imposed gold-plated processing, makes to obtain a board structure of circuit as shown in Figure 6.
And; Circuit board manufacturing process of the present invention can be on this copper clad laminate the corresponding plurality of circuits plate block that is provided with, and after accomplishing circuit board process, with each circuit board block cutting and separating; Perhaps can be as shown in Figure 7; The corresponding plurality of circuits plate block (for example being provided with a plurality of circuit board blocks as shown in Figure 5) that is provided with on this at least one internal layer copper clad laminate 10 and this outer copper foil substrate 20, and after accomplishing circuit board process, with each circuit board block cutting and separating.
Compare in traditional located by prior art; Circuit board manufacturing process of the present invention mainly sees through planning, the design of whole work flow, and is able to the gold-plated step of circuit board reasonably to be transferred to after the anti-welding step of Copper Foil by between copper and the secondary copper; Let the use amount of gold-plated raw material " golden salt "; Copper Foil area by originally containing whole copper clad laminate size is reduced to electrode junctions such as weld pad, connection line, outer electrode contact, and gold-plated passage etc. is not gone up the part of welding resisting layer; Therefore be able to reduce significantly the consumption of " golden salt ", reduce the gold-plated cost of circuit board relatively.
Claims (10)
1. a circuit board manufacturing process is characterized in that, comprises the following steps: in regular turn
A., one copper clad laminate is provided;
B. on this copper clad laminate, duplicate predetermined line pattern;
C. the Copper Foil beyond the line pattern of this copper clad laminate is removed; Make the line layer that on this copper clad laminate, forms by Copper Foil constituted; This line layer includes the weld pad of some confession welding electronic building bricks, the connection line that each electronic building brick of some formations connects, the outer electrode contact that some confessions are connected with external circuit, some weld pad, the connection line of electronic building brick connection and gold-plated passages in shared inside between the outer electrode contact of being connected in; And one be connected in each inner gold-plated channel outside gold-plated channel, the gold-plated channel in this outside is located around being located at this copper clad laminate;
I. cover a welding resisting layer to the non-electrode junction that is less than this copper clad laminate;
J. this copper clad laminate is imposed gold-plated processing, should be communicated with outside Gold plated Layer by the gold-plated passage in outside, make copper foil surface construction one Gold plated Layer that not covered by welding resisting layer promptly accomplish the manufacturing process of circuit board.
2. circuit board manufacturing process as claimed in claim 1; It is characterized in that; This circuit board manufacturing process should be removed by the gold-plated channel in outside after gold-plated processing, and this circuit board manufacturing process is the corresponding plurality of circuits plate block that is provided with on this copper clad laminate; And after accomplishing circuit board process, with each circuit board block cutting and separating.
3. a circuit board manufacturing process is characterized in that, comprises the following steps: in regular turn
A., at least one internal layer copper clad laminate is provided;
B. on this at least one internal layer copper clad laminate, duplicate predetermined inner line figure;
C. the Copper Foil beyond the inner line figure of this at least one internal layer copper clad laminate is removed, made the internal layer circuit layer that on this at least one internal layer copper clad laminate, forms by Copper Foil constituted;
D. should at least one internal layer copper clad laminate and an outer copper foil substrate mutually storehouse combine;
E. between this at least one internal layer copper clad laminate and this outer copper foil substrate, form at least one in order to constitute the conducting duct of line channel;
F. in each conducting duct construction conductive copper layer, to accomplish the line conduction between this at least one internal layer copper clad laminate and this outer copper foil substrate;
G. on this outer copper foil substrate, duplicate predetermined outer-layer circuit figure;
The outer-layer circuit figure Copper Foil in addition that h. will be somebody's turn to do outer internal layer copper clad laminate is removed; Make the outer-layer circuit layer that on this outer copper foil substrate, forms by Copper Foil constituted; This outer-layer circuit layer includes the weld pad of some confession welding electronic building bricks, the connection line that each electronic building brick of some formations connects, the outer electrode contact that some confessions are connected with external circuit, some gold-plated passages in inside that is connected between weld pad, connection line and the outer electrode contact; And one be connected in each inner gold-plated channel outside gold-plated channel, the gold-plated channel in this outside is located around being located at this copper clad laminate;
I. cover a welding resisting layer to the non-electrode junction that is less than this outer copper foil substrate;
J. this outer copper foil substrate is imposed gold-plated processing, should be communicated with outside plating bath by the gold-plated passage in outside, make copper foil surface construction one Gold plated Layer that not covered by welding resisting layer promptly accomplish the manufacturing process of circuit board.
4. circuit board manufacturing process as claimed in claim 3; It is characterized in that; This circuit board manufacturing process is at each conducting duct construction conductive copper layer; Accomplish after the line conduction between this at least one internal layer copper clad laminate and this outer copper foil substrate, further should at least one internal layer copper clad laminate and this outer copper foil substrate carry out the copper facing second time, to increase the thickness of Copper Foil and conductive copper layer.
5. circuit board manufacturing process as claimed in claim 3 is characterized in that, this circuit board manufacturing process should be removed by the gold-plated passage in outside after gold-plated processing.
6. like claim 3,4 or 5 described circuit board manufacturing process; It is characterized in that; This circuit board manufacturing process is the corresponding plurality of circuits plate block that is provided with on this at least one internal layer copper clad laminate and this outer copper foil substrate; And after accomplishing circuit board process, with each circuit board block cutting and separating.
7. like claim 3,4 or 5 described circuit board manufacturing process; It is characterized in that; This circuit board manufacturing process is except the line pattern outermost layer that is depicted as, and with the mode of direct photoresistance or indirect printing inner line figure is replicated on this at least one internal layer copper clad laminate.
8. like claim 3,4 or 5 described circuit board manufacturing process; It is characterized in that; This circuit board manufacturing process uses etchant that the copper-clad surface that this at least one internal layer copper clad laminate is not covered by photoresistance is etched away, and uses Copper Foil part that resistance agent protection against corrosion needs reserved line with formation internal layer circuit layer.
9. like claim 3,4 or 5 described circuit board manufacturing process, it is characterized in that this circuit board manufacturing process use copper face alligatoring, film are fixed, hot pressing filler supervisor, should at least one internal layer copper clad laminate and outer copper foil substrate storehouse combination mutually.
10. like claim 3,4 or 5 described circuit board manufacturing process, it is characterized in that this circuit board manufacturing process uses electrolytic copper free worker method in each conducting duct construction conductive copper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100333716A CN102625580A (en) | 2011-01-31 | 2011-01-31 | Circuit board manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100333716A CN102625580A (en) | 2011-01-31 | 2011-01-31 | Circuit board manufacturing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102625580A true CN102625580A (en) | 2012-08-01 |
Family
ID=46565191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100333716A Pending CN102625580A (en) | 2011-01-31 | 2011-01-31 | Circuit board manufacturing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102625580A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105346B (en) * | 2013-04-15 | 2018-01-30 | 上海嘉捷通电路科技股份有限公司 | A kind of manufacture method with bump pad printed board |
| CN107769395A (en) * | 2016-08-19 | 2018-03-06 | 长春石油化学股份有限公司 | The wireless charging method of surface-treated electro-deposited copper foil and flexible printed wiring board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW540284B (en) * | 2001-09-05 | 2003-07-01 | Zeon Corp | Process for manufacturing multi-layer circuit substrate |
| US6745463B1 (en) * | 2000-10-24 | 2004-06-08 | Unitech Printed Circuit Board Corp. | Manufacturing method of rigid flexible printed circuit board |
| TW201012867A (en) * | 2008-05-26 | 2010-04-01 | Mitsui Mining & Smelting Co | Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board |
| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
-
2011
- 2011-01-31 CN CN2011100333716A patent/CN102625580A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6745463B1 (en) * | 2000-10-24 | 2004-06-08 | Unitech Printed Circuit Board Corp. | Manufacturing method of rigid flexible printed circuit board |
| TW540284B (en) * | 2001-09-05 | 2003-07-01 | Zeon Corp | Process for manufacturing multi-layer circuit substrate |
| TW201012867A (en) * | 2008-05-26 | 2010-04-01 | Mitsui Mining & Smelting Co | Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board |
| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105346B (en) * | 2013-04-15 | 2018-01-30 | 上海嘉捷通电路科技股份有限公司 | A kind of manufacture method with bump pad printed board |
| CN107769395A (en) * | 2016-08-19 | 2018-03-06 | 长春石油化学股份有限公司 | The wireless charging method of surface-treated electro-deposited copper foil and flexible printed wiring board |
| CN107769395B (en) * | 2016-08-19 | 2020-11-17 | 长春石油化学股份有限公司 | Surface-treated electrolytic copper foil and wireless charging method for flexible printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101695218B (en) | Method for manufacturing printed circuit board with half-edge hole | |
| CN105722302B (en) | It is embedded in the circuit board and its processing method of boss Metal Substrate | |
| CN201499370U (en) | Metal-based circuit board for etched metal heat dissipating surface | |
| CN108901146A (en) | Circuit board and its selective electroplating technique, manufacture craft | |
| TWI422302B (en) | Method for manufacturing multilayer flexible printed wiring board | |
| CN109413894B (en) | Manufacturing method of bottom graph of stepped groove | |
| TW200524502A (en) | Method of providing printed circuit board with conductive holes and board resulting therefrom | |
| CN105704948B (en) | The production method of ultra-thin printed circuit board and ultra-thin printed circuit board | |
| CN103687344A (en) | Circuit board manufacturing method | |
| CN104244582A (en) | Embedded type high-density interconnection printed circuit board and manufacturing method of embedded type high-density interconnection printed circuit board | |
| CN110557905A (en) | Circuit board manufacturing method based on no-flow PP structure | |
| CN110691466A (en) | HDI board manufacturing method and device | |
| CN101389190B (en) | Multilayer printed wiring board production method | |
| CN104302109A (en) | Camera soft and hard combination board manufacturing method | |
| CN102082335A (en) | USB (universal serial bus) plug connector based on circuit board technology and a manufacturing process thereof | |
| CN102625580A (en) | Circuit board manufacturing process | |
| JP2009111331A (en) | Printed-circuit substrate and manufacturing method therefor | |
| CN109246935B (en) | Manufacturing method of stepped groove with non-metalized side wall | |
| CN103781292B (en) | Circuit board and preparation method thereof | |
| CN201234401Y (en) | Nickel partial electroplating printed circuit board | |
| CN102036498B (en) | Built-in assembly base plate structure and manufacture method thereof | |
| CN201805023U (en) | Circuit board process-based USB plug connector | |
| CN109379840A (en) | A kind of processing method and circuit board of hanging golden finger | |
| CN101641461B (en) | Multilayer printed wiring boards with copper filled through-holes | |
| CN2501657Y (en) | Surface double-layer board special for multi-layer distributing base board drilling work |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20120801 |