CN2478164Y - Radiator with shielding effect - Google Patents
Radiator with shielding effect Download PDFInfo
- Publication number
- CN2478164Y CN2478164Y CN 01211010 CN01211010U CN2478164Y CN 2478164 Y CN2478164 Y CN 2478164Y CN 01211010 CN01211010 CN 01211010 CN 01211010 U CN01211010 U CN 01211010U CN 2478164 Y CN2478164 Y CN 2478164Y
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- heat
- processing unit
- central processing
- motherboard
- heat radiating
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to heat elimination device which is provided with shielding effect, especially relates to a heat elimination device which is used for heat elimination of the notebook computer; the device is characterized in that a central processing unit is covered by a heat elimination metal cover, and the heat elimination metal cover is provided with a plurality of metal spring sheets and contacts a bare copper (PAD) on the mainboard; the metal spring sheets form a fence around the central processing unit to for grounding; the device can expand the area of dissipation of the central processing unit, and the fence-shaped metal spring sheet is provided with the function of radiation shield (EMI).
Description
The relevant a kind of heat abstractor that has shield effectiveness concurrently of the utility model, particularly a kind of be applied to notebook computer be provided with heat radiating metal lid that the polylith metal clips contacts with motherboard with central processing unit coat around, form ground connection, except that enlarging area of dissipation, also have the heat abstractor that the width of cloth is penetrated shielding (EMI) function concurrently.
In information prosperity, the flourishing modern society of science, computer has goed deep into each aspect of human lives and has formed inseparable relation, and science and technology more reaches, and human degree of dependence to computer is also just dark.In today, computer almost is exactly the synonym of science and technology and information.Along with science and technology is constantly progressive, the big computer of workstation before the arithmetic speed of its central processing unit of a PC (PC) (CPU) far wins more than ten years now, for asking easy to carry, notes type laptop computer (Notebook Computer) arises at the historic moment, and its development is more and more wide.
The purpose of notebook computer design is to make it compact and is easy to carry, its inner space is very limited, each element must reach maximum service efficiency with the volume of minimum, minimum weight, the central processing unit heat abstractor that its most significant example is exactly a notebook computer, the heat abstractor of the central processing unit of general PC are at device radiation sheet above the central processing unit and connect a radiator fan to strengthen radiating effect above heat radiator; Yet notebook computer is not suitable for installing aforesaid heat abstractor because the inner space is very limited.
As shown in Figure 1, commonly using the central processing unit heat abstractor of notebook computer, is to cover a thermal conductive metal plate 2 ' on central processing unit 6, and this thermal conductive metal plate 2 ' is generally the big and lightweight metal of heat-conduction coefficient, as aluminium (Al); Adhere to the heat-conducting glue 8 of one deck softness more thereon and contact with the sheet metal 51 of keyboard 5 bottoms, the heat that distributed of central processor 6 in this, but the mode of mat heat conduction (Heat Conduction), via sheet metal 2 ', the heat-conducting glue 8 and sheet metal 51 that reaches keyboard 5 bottoms is distributed in the atmosphere again, or offer air hole and heat is distributed in the atmosphere in convection current (Heat Convection) mode at computer chassis, because substance characteristics, via solid, metal particularly, its heat conducting radiating efficiency is high far beyond the convection current (Heat Convection) via air, therefore aforementioned by the heat conducting radiating mode of metal, be the main heat radiation approach of notebook computer central processing unit.
Yet along with the arithmetic speed of central processing unit improves day by day, the heat that it distributed is also more and more big, be subjected to the space constraint of the volume of notebook computer own again, so under the prerequisite that does not increase too much volume and weight, it is also more urgent to seek the better heat abstractor of a radiating efficiency; And the width of cloth that central processing unit distributed penetrates and can improve relatively, can cause harmful effect to external world.
The purpose of this utility model is to provide a kind of heat abstractor that has shielding action concurrently, makes the heat radiation of notebook computer central processing unit more effective, but also can constitute shielding to the electromagnetic radiation that central processing unit produces.
The purpose of this utility model is achieved in that
A kind of heat abstractor that has shield effectiveness concurrently is meant a kind of heat abstractor that is applied to the heat radiation of notebook computer central processing unit especially, it is characterized in that including:
One heat radiating metal lid, it is to contact with central processing unit, as the usefulness of heat radiation;
One motherboard, it is provided with a plurality of naked coppers (PAD);
The polylith metal clips be located at this heat radiating metal lid around, and around constituting paliform around this central processing unit, and this polylith metal clips all contacts with naked copper on the aforementioned motherboard.
This central processing unit is between aforementioned motherboard and this heat radiating metal lid.
The corner extends the double-screw bolt that is provided with screw thread in a plurality of around this heat radiating metal lid, and it is an individual lockhole interlocking mutually more than institute offers with this motherboard, and this heat radiating metal cover lock is located on the aforementioned motherboard.
These a plurality of naked coppers are on this motherboard surface that is arranged at around this central processing unit.
The free end system of this metal clips forms the butted portion of rubber-like to the level bending, and it contacts with this naked copper.
Offer one in the middle of this heat radiating metal lid and penetrate groove, stud with a coefficient of heat conductivity in it and be big derby, and this derby contacts with central processing unit than this heat radiating metal lid.
Below in conjunction with embodiment of the present utility model and accompanying drawing thereof, the utility model is described in further detail.
Fig. 1 is for commonly using the heat abstractor synoptic diagram of notebook computer.
Fig. 2 is a three-dimensional exploded view of the present utility model.
Fig. 3 is a side of the present utility model cut-away view.
Fig. 4 is the partial enlarged drawing of Fig. 3.
Fig. 5 is an enforcement illustration of the present utility model.
Fig. 6 is the second enforcement illustration of the present utility model.
As shown in Figure 2, the disclosed primary structure of the utility model includes: heat radiating metal lid 2 and be located at polylith metal clips 4 around this heat radiating metal lid 2.
The corner extends the double-screw bolt 21 that is provided with screw in a plurality of downwards around the heat radiating metal lid 2, pass offered on the motherboard 1 with the corresponding lockhole 13 of double-screw bolt 21 number equivalent, and heat radiating metal lid 2 is locked on the motherboard, and heat radiating metal lid 2 is contacted with central processing unit 6; And metal clips 4 free ends form butted 41 of rubber-like to level bending, and it contacts with set a plurality of naked coppers (PAD) 12 on the motherboard 1, make aforementioned polylith metal clips 4 be looped around this central processing unit 6 around and formation paliform.
As shown in Figure 3, Figure 4, the fence that around central processing unit 6, is constituted by aforementioned metal shell fragment 4, its with motherboard 1 on be looped around a plurality of naked coppers (PAD) 12 set around the central processing unit 6 and contact, can form the ground connection and the width of cloth and penetrate shielding effect (EMI), have the width of cloth of preventing and penetrate the function that leaks; And heat radiating metal lid 2 and metal clips 4 formed cans are coated on central processing unit 6 wherein, can increase the heat transfer area of central processing unit 6, both can improve radiating efficiency, can protect fragile electronic component again.
As shown in Figure 5, offering one in the middle of heat radiating metal lid 2 penetrates groove 22 and covers 2 materials than heat radiating metal and (as aluminium, Al) be big derby 61, as copper (Cu), silver-colored (Ag) etc., it is contacted with central processing unit 6 in order to be bumped into coefficient of heat conductivity; The reason that this derby 61 is provided with is that its heat-conduction coefficient is very big, heat conduction speed is fast, the heat that it can be distributed quickens to spread out of if it contacts with central processing unit 6, further improve radiating efficiency, but because its cost height, and, make it to be unsuitable for making the full wafer crown cap in order to cover whole central processing unit 6 than the great electronic component that damages by pressure easily; For example the proportion of aluminium is 2.8g/cm
3, coefficient of heat conductivity is 120~200W/m.K, is that the coefficient of heat conductivity of 401W/m.K and silver is 412W/m.K compared to the heat-conduction coefficient of copper, the rate of heat transfer of aluminium is all more aforementioned, and both are low; But if with copper or silver-colored in heat conductor, its proportion is respectively 8.9g/cm
3, 13.6g/cm
3, than the proportion 2.8g/cm of aluminium
3Exceed more than three times, weight will be strengthened, even compressing central processing unit 6 causes damage, therefore, the utility model is to adopt metallic combination (Al+Cu, Al+Ag) mode, is increasing under the limited weight and cost, reaches the purpose that improves radiating efficiency.
As shown in Figure 6, second of motherboard 1 with central processing unit 6 relative positions on one second heat radiating metal lid 3 is set, offer and the corresponding screw 31 of aforementioned double-screw bolt 21 number equivalent around it, with the double-screw bolt 21 of itself and heat radiating metal lid 2 interlocking mutually, the central part of this second heat radiating metal lid 3 is offered one second and is penetrated groove 32, put one second derby 61 ' in order to edge, it contacts with motherboard 1 under the central processing unit 6, and material and function are identical with aforementioned derby 61, central processing unit 6 down can be conducted in the heat of motherboard 1 and more quicken to derive, and cooperate with heat radiating metal lid 2, more enlarge area of dissipation, radiating efficiency is improved more; Be provided with polylith second metal clips 4 ' on every side at second heat radiating metal lid 3 again, the free end of second metal clips 4 ' forms second butted 41 ' of rubber-like to the level bending, it contacts with set a plurality of second naked coppers (PAD) 12 ' on the motherboard 1, constitute paliform, form ground connection, cooperate with the metal clips 4 around the heat radiating metal lid 2, will more strengthen the width of cloth and penetrate shielding effect (EMI).
The combination of aforementioned heat abstractor is used for the radiating mode of central processing unit incessantly again, as long as be applied to be all creation spirit of the present utility model and comprise on the electronic component of any meeting heating in the computer, should be protection domain of the present utility model.
In sum, can be surrounded on central processing unit by the disclosed heat abstractor of the utility model and constitute paliform on every side, form the width of cloth and penetrate shielding effect (EMI), and gather around, have preferable radiating efficiency with bigger area of dissipation; So practicality of the present utility model and progressive have both.
Claims (6)
1. a heat abstractor that has shield effectiveness concurrently is meant a kind of heat abstractor that is applied to the heat radiation of notebook computer central processing unit especially, it is characterized in that including:
One heat radiating metal lid, it is to contact with central processing unit, as the usefulness of heat radiation;
One motherboard, it is provided with a plurality of naked coppers (PAD);
The polylith metal clips be located at this heat radiating metal lid around, and around constituting paliform around this central processing unit, and this polylith metal clips all contacts with naked copper on the aforementioned motherboard.
2. the heat abstractor that has shield effectiveness concurrently according to claim 1 is characterized in that central processing unit is between aforementioned motherboard and this heat radiating metal lid.
3. the heat abstractor that has shield effectiveness concurrently according to claim 1, it is characterized in that heat radiating metal lid around the corner extend the double-screw bolt that is provided with screw thread in a plurality of, it is lockhole interlocking mutually more than institute offers with this motherboard, and this heat radiating metal cover lock is located on the aforementioned motherboard.
4. the heat abstractor that has shield effectiveness concurrently according to claim 1 is characterized in that these a plurality of naked coppers are on this motherboard surface that is arranged at around this central processing unit.
5. the heat abstractor that has shield effectiveness concurrently according to claim 1 is characterized in that the free end system of this metal clips forms the butted portion of rubber-like to the level bending, and it contacts with this naked copper.
6. the heat abstractor that has shield effectiveness concurrently according to claim 1 is characterized in that offering one in the middle of the heat radiating metal lid penetrates groove, stud with a coefficient of heat conductivity in it and be big derby than this heat radiating metal lid, and this derby contacts with central processing unit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01211010 CN2478164Y (en) | 2001-03-08 | 2001-03-08 | Radiator with shielding effect |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 01211010 CN2478164Y (en) | 2001-03-08 | 2001-03-08 | Radiator with shielding effect |
Publications (1)
Publication Number | Publication Date |
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CN2478164Y true CN2478164Y (en) | 2002-02-20 |
Family
ID=33630470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 01211010 Expired - Fee Related CN2478164Y (en) | 2001-03-08 | 2001-03-08 | Radiator with shielding effect |
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CN (1) | CN2478164Y (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100373116C (en) * | 2003-05-22 | 2008-03-05 | 乐金电子(天津)电器有限公司 | Radiating and electromagnetic wave shade structure for Internet electric refrigerator main controller |
CN100562241C (en) * | 2005-04-26 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | The electronic installation of anti-electromagnetic interference |
US7946712B2 (en) | 2006-09-05 | 2011-05-24 | Sanyo Electric Co., Ltd. | Projector apparatus equipped with a structure capable of shielding radiation and dissipating heat from a light source |
-
2001
- 2001-03-08 CN CN 01211010 patent/CN2478164Y/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100373116C (en) * | 2003-05-22 | 2008-03-05 | 乐金电子(天津)电器有限公司 | Radiating and electromagnetic wave shade structure for Internet electric refrigerator main controller |
CN100562241C (en) * | 2005-04-26 | 2009-11-18 | 鸿富锦精密工业(深圳)有限公司 | The electronic installation of anti-electromagnetic interference |
US7946712B2 (en) | 2006-09-05 | 2011-05-24 | Sanyo Electric Co., Ltd. | Projector apparatus equipped with a structure capable of shielding radiation and dissipating heat from a light source |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |