CN2375062Y

CN2375062Y - Radiator

Info

Publication number: CN2375062Y
Application number: CN 99235743
Authority: CN
Inventors: 林保龙; 郑年添; 刘恒智; 陈硕雄
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 1999-04-02
Filing date: 1999-04-02
Publication date: 2000-04-19
Anticipated expiration: 2009-04-02

Abstract

The utility model relates to a radiator, which is used for the heat dissipation of a memory body module, shielding and grounding. The radiator comprises a pair of clips and a pair of radiating fins made of aluminum metal with the same structure, wherein, the radiating fins are in a rectangular shape, and the middle parts of the radiating fins are slightly bulged out. Abutting plates recessed toward the memory body module are arranged on the central area of the middle parts along the lengthwise direction of the radiating fins, the inner side surfaces of the abutting plates are glued with heat conducting adhesive tapes, and thus the abutting plates can be glued on the surfaces of a plurality of chips in the memory body module. Concave parts are formed near the left and the right end edges of each of the middle parts for clamping the clips.

Description

Heat abstractor

The utility model is about a kind of heat abstractor, refer in particular to a kind of heat abstractor that is applied on the memory body module, it both had been convenient to assembling, can suitably discharge the heat that the memory body module produces again, and effectively bonding to prevent the electromagnetic interference (EMI) problem.

Electronic technology just at full speed develops, and is example with the computer, removes outside the speed and the continuous lifting of performance of central processing unit (Central ProcessUnit is called for short CPU), and the performance of other electronic components, capacity and speed etc. also promote thereupon.As the memory body module relevant (memory module) with the utility model, be a kind of several random access memories (Random Access Memory that is mounted with, abbreviation RAM) circuit board of wafer and associated electronic components, it is in the bayonet connector that is plugged on the motherboard, is used for temporary computer operational data.Because the demand of computer overall performance improves constantly, the capacity of memory body module and speed are also in continuous lifting, from early stage monolithic capacity is a few MB (MegaByte, megabyte) monolithic capacity till now surpasses 100 MB, from single pin position memory body module (Single In-lineMemory Module, SIMM) (Dual In-line MemoryModule, DIMM) etc., its renewal speed makes us too plenty for the eye to take it all in to double pin position memory body module.But the lifting of capacity and speed will inevitably make heat radiation and problems such as electromagnetic interference (EMI) become seriously, therefore, provide a kind of and be convenient to assemble, the heat abstractor of energy efficiently radiates heat and the good bonding effect of tool, and be the effective means that addresses this problem.

The purpose of this utility model is to provide a kind of have location holding structure and the respond well heat abstractor of bonding.

Another purpose of the present utility model is to provide a kind of heat abstractor with preferable radiating effect.

The technical solution of the utility model is: the utility model heat abstractor comprises a pair of structure identical and fin and a pair of clip that made by aluminum metal.Fin slightly is rectangle, microprotrusion slightly outwardly partly in the middle of it, the space that holds associated wafer and electronic component on the memory body module with formation.Substantial middle zone in the centre part, be provided with towards the jointing plate of memory body module depression along the fin longitudinally, post the heat conduction adhesive tape on the inner surface of jointing plate, on several wafer surface that fit in the memory body module, and, promote radiating effect in order to the conduction heat.Near two ora terminalis about the part of centre, be formed with a depressed part respectively, press from both sides for the clip embedding.This is to envelope the memory body module to fin, and has the metal material surf zone that the earth strip with the memory body module connects on its inner surface, constitute suitable grounding path, and provide the memory body module good bonding effect, prevent electromagnetic interference problem effectively.

After having adopted such structure, because two surperficial upper covers at the memory body module have the identical aluminum metal fin of a pair of structure, and fin is provided with towards the jointing plate of memory body module depression along longitudinally, on the inner surface of jointing plate and be fitted with the heat conduction adhesive tape, therefore the utlity model has good shield effectiveness and preferable radiating effect to fit with wafer surface.

Below in conjunction with the drawings and specific embodiments mode the utility model is described in further detail.

Fig. 1 is the isometric exploded view of the utility model heat abstractor and memory body module.

Fig. 2 is the three-dimensional assembled view of the utility model heat abstractor and memory body module, but wherein clip is not clamped fin and memory body module as yet.

See also Fig. 1, the utility model heat abstractor comprises a pair of structure identical and fin 1 and a pair of clip 2 that made by aluminum metal.Fin 1 slightly is rectangle, 10 microprotrusion slightly outwardly partly in the middle of it, the space that holds associated wafer and electronic component on the memory body module 3 with formation.Substantial middle zone in centre part 10, longitudinally along fin 1 is provided with towards the jointing plate 11 of memory body module 3 depressions, post heat conduction adhesive tape (figure does not show) on the inner surface of jointing plate 11, on several wafer 32 surfaces that fit in memory body module 3, and, promote radiating effect in order to the conduction heat.Near two ora terminalis about centre part 10, be formed with a depressed part 13 respectively, use for clip 2 embeddings folder (describing in detail after a while).

Fin 1 is near angle, upper limb two ends, form one first location hole 12 respectively, and the first outstanding positioning convex point 14 of memory body module 3 on one day, then be arranged with one second location hole 16 at the lower edge zone line, and the second outstanding positioning convex point 18 of memory body module 3 on one day, this second positioning convex point, 18 distances, first location hole 12 is nearer, and distance first positioning convex point 14 is far away.Decide the hole 16 and second positioning convex point 18 with respect to first location hole 12, first positioning convex point 14, second, memory body module 3 is provided with perforation 34 in the relevant position, interts for it and locatees.

Fin 1 in the part zone of inner surface 15 without anode treatment, it directly exposes for metal material, thereby has conductivity, when fin 1 and memory body module 3 are combined into one, the zone that metal material directly exposes is promptly corresponding to be resisted against on the earth strip 33 of memory body module 3, and forms suitable grounding path.

Clip 2 have a base portion 22 and a pair of from base portion 22 two ends the elastic clip 24 of diagonally extending inwardly in the same way, this elastic clip 24 terminal and outward crimp extension go out a guidance part 26.

Please consult Fig. 2 together, during assembling, this is placed the tow sides of memory body module 3 respectively to fin 1, and with

inner surface

15 and 3 applyings of memory body module, pass the correspondence perforation 34 of memory body module 3 by first positioning convex point 14 on the fin 1 and second positioning convex point 18, and be sticked in first location hole 12 on another fin 1 and the mode in second location hole 16, this is fixed on the memory body module 3 in advance to fin 1.Then, this is embedded in the depressed part 13 corresponding on the fin 1 clip 2, become one and fin 1 is fixed with memory body module 3.

Because this is to envelope memory body module 3 to fin 1, and the zone that metal material directly exposes on its inner surface 15 is that the earth strip 33 with memory body module 3 connects, constitute suitable grounding path, therefore can provide memory body module 3 good bonding effect, prevent electromagnetic interference problem effectively.Simultaneously, fin 1 is to fit by jointing plate 11 structures and associated wafer 32, so can discharge the heat that wafer 32 is produced effectively.

Claims

1. a heat abstractor uses for heat radiation of memory body module and bonding, comprises at least one fin and at least one clip; It is characterized in that: this fin slightly is rectangle, microprotrusion slightly outwardly partly in the middle of it, and the space that holds associated wafer and electronic component on the memory body module with formation, partly appropriate location is formed with a depressed part at least in the centre; This clip is that embedding is sandwiched in the depressed part of fin.

2. heat abstractor as claimed in claim 1 is characterized in that: it comprises the identical and fin that made by aluminum metal of a pair of structure, and this is the tow sides of memory body module of being placed in to fin.

3. heat abstractor as claimed in claim 1 wherein is characterised in that: near two ora terminalis about the middle part of fin, be formed with a depressed part respectively, for a pair of clip embedding folder.

4. as claim 1,2 or 3 described heat abstractors, it is characterized in that: clip have a base portion and a pair of from the base portion two ends elastic clip of diagonally extending inwardly in the same way, elastic clip terminal and outward crimp extension go out a guidance part.

5. as claim 1,2 or 3 described heat abstractors, it is characterized in that: fin forms one first location hole and first an outstanding positioning convex point respectively near angle, upper limb two ends.

6. heat abstractor as claimed in claim 5, it is characterized in that: fin further is arranged with one second location hole and second an outstanding positioning convex point at the lower edge zone line, second positioning convex point distance, first location hole is nearer, and distance first positioning convex point is far away, and its projected direction is identical with first positioning convex point.

7. as claim 1,2 or 3 described heat abstractor, it is characterized in that: partly substantial middle zone in the middle of fin, be provided with towards the jointing plate of memory body module depression along the longitudinally of fin, use for the heat radiation of memory body module.

8. as claim 1,2 or 3 described heat abstractors, it is characterized in that: fin is the metal material surface in the part of inner surface zone, in order to as grounding path.

9. heat abstractor as claimed in claim 8 is characterized in that: be directly expose on the metal material surface except the zone as grounding path on the fin, remaining surface has all been carried out anode treatment.