CN210537194U - Heat dissipation device for vehicle-mounted external power amplifier and vehicle-mounted electronic equipment - Google Patents
Heat dissipation device for vehicle-mounted external power amplifier and vehicle-mounted electronic equipment Download PDFInfo
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- CN210537194U CN210537194U CN201921065023.5U CN201921065023U CN210537194U CN 210537194 U CN210537194 U CN 210537194U CN 201921065023 U CN201921065023 U CN 201921065023U CN 210537194 U CN210537194 U CN 210537194U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 103
- 238000009792 diffusion process Methods 0.000 claims abstract description 33
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- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 description 4
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- 230000005855 radiation Effects 0.000 description 3
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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Abstract
The utility model provides a heat abstractor and vehicle-mounted electronic equipment for on-vehicle external power amplifier relates to vehicle-mounted power amplifier technical field. This a heat abstractor for on-vehicle external power amplifier includes mainboard and radiator, and wherein, the mainboard includes the base plate, sets up power amplifier chip and CPU chip radiator on the base plate, and the radiator includes the heat dissipation diffusion face, sets up on the heat dissipation diffusion face and with the relative heat-conduction structure that sets up of power amplifier chip and CPU chip. And the heat conduction structure also comprises a heat dissipation contact surface and a heat dissipation conduction surface, the heat dissipation contact surface is in contact with the power amplifier chip and the CPU chip, and the heat dissipation conduction surface is surrounded at the edge of the heat dissipation contact surface and is connected with the heat dissipation diffusion surface. The heat dissipation contact surface is contacted with the power amplifier chip and the CPU chip, and the heat generated by the power amplifier chip and the CPU chip is transferred to the heat dissipation diffusion surface through the heat dissipation conduction surface, so that the power amplifier chip and the CPU chip can work stably and reliably, and the service lives of the power amplifier chip and the CPU chip are prolonged.
Description
Technical Field
The utility model relates to an on-vehicle power amplifier technical field especially relates to a heat abstractor and vehicle-mounted electronic equipment for on-vehicle external power amplifier.
Background
Along with the improvement of the technological level, the functions of the external power amplifier chip are more and more complex and intelligent, and the external power amplifier chip no longer only provides basic functions such as sound amplification. At present, along with the integration of intelligent elements into an external power amplifier chip, the external power amplifier chip becomes more and more intelligent and diversified. For example, the external power amplifier chip can provide functions such as adjustable sound effect, 3D surround, active noise reduction and the like. However, as the external power amplifier chip performs more and more functions, the power consumption requirement is greater and greater, and the external power amplifier chip also generates more heat. Traditional heat radiation structure is difficult outside dispersing the casing with the heat, can't solve the heat dissipation problem of external power amplifier chip under the state of high-power consumption to lead to external power amplifier chip temperature to surpass rule, unable normal work has also influenced the inside components and parts performance of external power amplifier chip, has reduced the life of components and parts.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, the present invention is provided to provide a heat dissipation device for an on-vehicle external power amplifier and an on-vehicle electronic device, which overcome the above problems or at least partially solve the above problems.
According to the utility model discloses an aspect provides a heat abstractor for on-vehicle external power amplifier, include:
the mainboard comprises a substrate, and a power amplifier chip and a CPU chip which are arranged on the substrate;
the radiator comprises a heat dissipation diffusion surface and a heat conduction structure arranged on the heat dissipation diffusion surface and oppositely arranged with the power amplifier chip and the CPU chip, wherein the heat conduction structure comprises a heat dissipation contact surface and a heat dissipation conduction surface, the heat dissipation contact surface is in contact with the power amplifier chip and the CPU chip, and the heat dissipation conduction surface is surrounded on the edge of the heat dissipation contact surface and is connected with the heat dissipation diffusion surface.
Optionally, an included angle of a preset angle is formed between the heat dissipation conduction surface and the heat dissipation diffusion surface, and the included angle of the preset angle is an acute angle.
Optionally, the heat dissipation conducting surface is an isosceles trapezoid, and a side length of a connecting side of the heat dissipation conducting surface and the heat dissipation contact surface is smaller than a side length of the other opposite side.
Optionally, the heat sink further includes a plurality of heat dissipation fins disposed on another surface opposite to the heat dissipation diffusion surface;
the plurality of radiating fins are arranged at equal intervals.
Optionally, the heat dissipation device for the vehicle-mounted external power amplifier further includes:
and the heat-conducting gel is arranged on the power amplifier chip and the CPU chip and is contacted with the heat-radiating contact surface.
Optionally, the heat sink further includes a frame surrounding the edge of the heat dissipation diffusion surface and extending toward the motherboard, and a positioning column is disposed on the heat dissipation diffusion surface at a position close to the frame;
the base plate is provided with a first hole site corresponding to the positioning column of the radiator.
Optionally, the heat dissipation device for the vehicle-mounted external power amplifier further includes:
the lower shell is provided with a containing cavity, a second hole site corresponding to the positioning column of the radiator is arranged in the containing cavity, and the positioning column sequentially penetrates through the first hole site of the substrate and the second hole site of the shell to fixedly connect the radiator, the substrate and the shell.
Optionally, the heat dissipation diffusion surface of radiator is provided with the screw post, the base plate be provided with the first screw hole that the screw post corresponds, the casing be provided with down with the second screw hole that the screw post corresponds, the screw post passes in proper order the first screw hole of base plate with the second screw hole of casing down will radiator, base plate, casing fixed connection down.
Optionally, a fixer is arranged outside the frame and configured to fix the radiator at a designated position of the vehicle.
According to the utility model discloses an on the other hand still provides a vehicle-mounted electronic equipment, including vehicle-mounted electronic equipment body and arbitrary embodiment of the above a heat abstractor for on-vehicle external power amplifier.
The embodiment of the utility model provides an in, a heat dissipation contact surface for on-vehicle external power amplifier's heat abstractor's heat radiation structure gathers the heat that comes from power amplifier chip and CPU chip, transmits the heat diffusion face that dispels the heat fast through heat radiation structure, has realized thermal quick transmission to the heat diffusion face through the radiator carries out the large tracts of land heat dissipation, with the heat diffusion outside fast, ensures the reliable and stable work of power amplifier chip and CPU chip, has also prolonged the working life of chip.
The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the present invention is given.
The above and other objects, advantages and features of the present invention will become more apparent to those skilled in the art from the following detailed description of specific embodiments thereof, taken in conjunction with the accompanying drawings.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
fig. 1 shows a schematic diagram of a heat sink for a vehicle-mounted external power amplifier according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a main board of a heat dissipation device for a vehicle-mounted external power amplifier according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a heat sink of a heat dissipation device for a vehicle-mounted external power amplifier according to another embodiment of the present invention;
fig. 4 is a schematic view of a lower housing for a vehicle-mounted external power amplifier according to an embodiment of the present invention;
fig. 5 shows a schematic diagram of an in-vehicle electronic device according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
In order to solve the technical problem, an embodiment of the utility model provides a heat abstractor for on-vehicle external power amplifier. Referring to fig. 1 and 2, the heat dissipation device for a vehicle-mounted external power amplifier includes a main board 30 and a heat sink 10, wherein the main board 30 includes a substrate 33, and a power amplifier chip 31 and a CPU chip (not shown in the figure) disposed on the substrate 33, and the heat sink 10 includes a heat dissipation diffusion surface 17 and a heat conduction structure 23 disposed on the heat dissipation diffusion surface 17 and opposite to the power amplifier chip 31 and the CPU chip. And, the heat conduction structure 23 further includes a heat dissipation contact surface 14 and a heat dissipation conduction surface 15, the heat dissipation contact surface 14 contacts with the power amplifier chip 31 and the CPU chip, and the heat dissipation conduction surface 15 surrounds the edge of the heat dissipation contact surface 14 and is connected with the heat dissipation diffusion surface 17.
The embodiment of the utility model provides an in, heat conduction structure 23 through radiator 10 produces heat transfer to heat dissipation diffusion surface 17 with the chip, has realized thermal quick transfer to carry out the large tracts of land heat dissipation through heat dissipation diffusion surface 17 of radiator 10, with the heat spread the outside fast, ensure the reliable and stable work of power amplifier chip 31 and CPU chip, prolonged the working life of chip.
The heat dissipation contact surface 14 of the heat dissipation device for the vehicle-mounted external power amplifier is in contact with the power amplifier chip 31 and the CPU chip, heat generated by the power amplifier chip 31 and the CPU chip is transferred to the heat dissipation diffusion surface 17 through the heat dissipation conduction surface 15, the heat dissipation efficiency is improved, the temperatures of the power amplifier chip 31 and the CPU chip are reduced, the power amplifier chip 31 is ensured to work reliably and stably under high power, and the service lives of the power amplifier chip 31 and the CPU chip are prolonged.
With continued reference to fig. 1 and fig. 2, in an embodiment of the present invention, a predetermined angle is formed between the heat dissipation conducting surface 15 and the heat dissipation diffusing surface 17, and the predetermined angle is an acute angle. Alternatively, the heat dissipation conducting surface 15 may be an isosceles trapezoid, and the side length of the connection edge of the heat dissipation conducting surface 15 and the heat dissipation contact surface 14 is less than the opposite side length, and the heat dissipation contact surface 14 is a rectangle. Of course, the heat dissipation conduction surface 15 and the heat dissipation contact surface 14 may have other shapes, and are not limited herein.
In this embodiment, an included angle with a preset angle as an acute angle is formed between the heat conducting and dissipating surface 15 and the heat diffusing surface 17, and the side length of the connecting side of the heat conducting and dissipating surface 15 and the heat contact surface 14 is smaller than the opposite side length, so that the contact surface (not shown) between the heat conducting structure 23 and the heat diffusing surface 17 is larger than the heat contact surface 14, thereby increasing the speed of heat transfer to the heat diffusing surface 17 and improving the heat dissipation efficiency.
Referring to fig. 3, in an embodiment of the present invention, the heat sink 10 further includes a plurality of heat dissipation fins 22, the heat dissipation fins 22 are disposed on the other side opposite to the heat dissipation diffusion surface 17, and the plurality of heat dissipation fins 22 may be arranged at equal intervals.
In this embodiment, by providing the heat dissipating fins 22 in the heat sink 10, the heat sink 10 can dissipate heat more quickly. Wherein, the fin heights of the adjacent heat dissipating fins 22 may be set to different heights, thereby further improving the heat dissipating efficiency of the heat dissipating fins 22. The height of the heat dissipation fins 22 and the distance between the heat dissipation fins 22 can be adjusted adaptively according to the amount of heat generated by the power amplifier chip 31 and the CPU chip, and the utility model discloses do not specifically limit this.
The utility model discloses an embodiment, a heat abstractor for on-vehicle external power amplifier is still including setting up the heat conduction gel (not shown in the figure) on power amplifier chip 31 and CPU chip, and heat conduction gel can paste the dress and contact with heat dissipation contact surface 14 on power amplifier chip 31 and CPU chip.
In this embodiment, the heat conducting gel can make the power amplifier chip 31 and the CPU chip more closely contact with the heat dissipation contact surface 14, reduce the gap between the power amplifier chip and the heat dissipation contact surface 14, and improve the heat dissipation efficiency. The heat-conducting gel has good viscosity and long service life, and can be fixed on the power amplifier chip 31 and the CPU chip in an automatic mode, so that the heat-conducting gel is prevented from being fixed in a manual mode, the efficiency of fixing the heat-conducting gel is improved, and the cost is saved.
Referring to fig. 1 to 4, in an embodiment of the present invention, the heat sink 10 further includes a frame 19 surrounding the edge of the heat dissipation diffusion surface 17 and extending toward the motherboard, a positioning column 18 is disposed at a position on the heat dissipation diffusion surface 17 close to the frame 19, and the substrate 33 is provided with a first hole (not shown in the figure) corresponding to the positioning column 18 of the heat sink 10.
In this embodiment, the positioning posts 18 pass through the first holes to fix the substrate 33 and the heat sink 10. The number of the positioning columns 18 can be one or more, and preferably two.
With reference to fig. 1 to 4, in an embodiment of the present invention, the heat dissipation device for a vehicle-mounted external power amplifier further includes a lower housing 40, and the lower housing 40 has a containing cavity 43, a second hole (not shown in the figure) corresponding to the positioning pillar 18 of the heat sink 10 is disposed in the containing cavity 43, and the positioning pillar 18 sequentially passes through the first hole of the substrate 33 and the second hole of the lower housing 40, so as to fixedly connect the heat sink 10, the substrate 33, and the housing.
In this embodiment, the accommodating cavity 43 accommodates and protects the power amplifier chip 31 and the CPU chip.
In an embodiment of the present invention, the heat dissipation diffusion surface 17 of the heat sink 10 is provided with the screw post 13, the substrate 33 is provided with the first screw hole 32 corresponding to the screw post 13, the lower housing 40 is provided with the second screw hole 41 corresponding to the screw post 13, and the screw post 13 sequentially passes through the first screw hole 32 of the substrate 33 and the second screw hole 41 of the lower housing 40, so as to fixedly connect the heat sink 10, the substrate 33 and the lower housing 40.
In this embodiment, the number of the screw columns 13 may be one or more, preferably ten. Alternatively, a composite screw driving method may be adopted, in which screws (not shown) are driven onto the screw posts 13 of the heat sink 10, and the substrate 33 and the lower case 40 are fixed to the heat sink 10. Further, a protruding structure 42 is disposed around the first screw hole 32, and the protruding structure 42 may be formed by recessing the other side facing the accommodating cavity 43 of the lower housing 40 corresponding to the accommodating cavity 43. The protrusion 42 can fix the screw post 13 more firmly, and the recess (not shown) corresponding to the protrusion 42 can accommodate the screw post 13 and the screw, so that the other surface of the lower housing 40 corresponding to the accommodating cavity 43 is more tidy, and the screw is prevented from scratching other devices. It can be understood that the lower case 40 and the heat sink 10 protect the substrate 33 and the power amplifier chip 31 and the CPU chip disposed on the substrate 33. The substrate 33 is a PCB, the main board 30 is a PCBA, and the main board 30 includes the substrate 33, the power amplifier chip 31 and a CPU chip. Of course, the main board 30 may further include other chips such as a video chip (not shown in the figure), a GPS chip (not shown in the figure), and the present invention is not limited to this.
In an embodiment of the present invention, a fixing device 25 is disposed outside the frame 19, and the fixing device 25 fixes the heat sink 10 at a designated position of the vehicle.
In this embodiment, the holder 25 includes a fixing surface 11 perpendicularly connected to the rim 19, and a fixing hole 12 provided in the fixing surface 11. A fixing plate 21 is further disposed outside an included angle formed between the fixing surface 11 and the frame 19, and the fixing plate 21 fixes the fixing surface 11 and the frame 19 to prevent the deformation of the fixing device 25. The retainer 25 may fix the radiator 10 in the vehicle.
Referring to fig. 5, based on the same concept, the embodiment of the present invention further provides a vehicle-mounted electronic device, which includes a vehicle-mounted electronic device body 50 and a heat dissipation device 51 introduced in any of the above embodiments and used for a vehicle-mounted external power amplifier.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments can be modified or some or all of the technical features can be equivalently replaced within the spirit and principle of the present invention; such modifications or substitutions do not depart from the scope of the present invention.
Claims (10)
1. The utility model provides a heat abstractor for on-vehicle external power amplifier which characterized in that includes:
the mainboard comprises a substrate, and a power amplifier chip and a CPU chip which are arranged on the substrate;
the radiator comprises a heat dissipation diffusion surface and a heat conduction structure arranged on the heat dissipation diffusion surface and oppositely arranged with the power amplifier chip and the CPU chip, wherein the heat conduction structure comprises a heat dissipation contact surface and a heat dissipation conduction surface, the heat dissipation contact surface is in contact with the power amplifier chip and the CPU chip, and the heat dissipation conduction surface is surrounded on the edge of the heat dissipation contact surface and is connected with the heat dissipation diffusion surface.
2. The heat dissipation device for the vehicle-mounted external power amplifier according to claim 1,
the heat dissipation conducting surface and the heat dissipation diffusion surface form an included angle of a preset angle, and the included angle of the preset angle is an acute angle.
3. The heat dissipation device of claim 2, wherein the heat dissipation conductive surface is an isosceles trapezoid, and a side of the heat dissipation conductive surface connected to the heat dissipation contact surface is shorter than an opposite side.
4. The heat dissipation device for the vehicle-mounted external power amplifier according to claim 1,
the radiator also comprises a plurality of radiating fins which are arranged on the other surface opposite to the radiating diffusion surface;
the plurality of radiating fins are arranged at equal intervals.
5. The heat dissipation device for the vehicle-mounted external power amplifier according to any one of claims 1 to 4, further comprising:
and the heat-conducting gel is arranged on the power amplifier chip and the CPU chip and is contacted with the heat-radiating contact surface.
6. The heat dissipation device for the vehicular external power amplifier according to any one of claims 1 to 4,
the radiator also comprises a frame which is arranged around the edge of the radiating diffusion surface and extends towards the direction of the main board, and a positioning column is arranged on the radiating diffusion surface close to the frame;
the base plate is provided with a first hole site corresponding to the positioning column of the radiator.
7. The heat dissipation device for the vehicle-mounted external power amplifier according to claim 6, further comprising:
the lower shell is provided with a containing cavity, a second hole site corresponding to the positioning column of the radiator is arranged in the containing cavity, and the positioning column sequentially penetrates through the first hole site of the substrate and the second hole site of the shell to fixedly connect the radiator, the substrate and the lower shell.
8. The heat dissipation device for the vehicle-mounted external power amplifier according to claim 7,
the heat dissipation diffusion face of radiator is provided with the screw post, the base plate be provided with the first screw hole that the screw post corresponds, down the casing be provided with the second screw hole that the screw post corresponds, the screw post passes in proper order the first screw hole of base plate with the second screw hole of casing down will radiator, base plate, casing fixed connection down.
9. The heat dissipation device for the vehicle-mounted external power amplifier according to claim 6,
and a fixer is arranged on the outer side of the frame and is configured to fix the radiator at a specified position of the vehicle.
10. A vehicle-mounted electronic device, comprising a vehicle-mounted electronic device body and the heat dissipation device for a vehicle-mounted external power amplifier of any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921065023.5U CN210537194U (en) | 2019-07-09 | 2019-07-09 | Heat dissipation device for vehicle-mounted external power amplifier and vehicle-mounted electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921065023.5U CN210537194U (en) | 2019-07-09 | 2019-07-09 | Heat dissipation device for vehicle-mounted external power amplifier and vehicle-mounted electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210537194U true CN210537194U (en) | 2020-05-15 |
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ID=70597167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921065023.5U Active CN210537194U (en) | 2019-07-09 | 2019-07-09 | Heat dissipation device for vehicle-mounted external power amplifier and vehicle-mounted electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210537194U (en) |
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2019
- 2019-07-09 CN CN201921065023.5U patent/CN210537194U/en active Active
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| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20220321 Address after: 430051 No. b1336, chuanggu startup area, taizihu cultural Digital Creative Industry Park, No. 18, Shenlong Avenue, Wuhan Economic and Technological Development Zone, Wuhan, Hubei Province Patentee after: Yikatong (Hubei) Technology Co.,Ltd. Address before: No.c101, chuanggu start up area, taizihu cultural Digital Industrial Park, No.18 Shenlong Avenue, Wuhan Economic Development Zone, Hubei Province Patentee before: HUBEI ECARX TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right |