CN221306226U - Domain controller and vehicle thereof - Google Patents

Abstract

The utility model provides a domain controller and a vehicle thereof. The domain controller includes: a domain controller first housing including a first mounting surface and a second mounting surface opposite each other; a printed circuit board arranged on the first mounting surface; the air blowing fan is arranged on the second installation surface and comprises radiating fins and an air outlet; the heat dissipation fins comprise first heat dissipation fins and second heat dissipation fins, heat dissipation channels are formed at the positions, adjacent to the first heat dissipation fins, of the second heat dissipation fins, air outlets of the blower fans face the heat dissipation channels, and the heat dissipation fins cover all the printed circuit boards. The utility model solves the problem that the heat dissipation efficiency of the heat dissipation module of the domain controller can be increased while the safety is ensured.

Description

Domain controller and vehicle thereof

Technical Field

The utility model relates to the technical field of electric control equipment, in particular to a domain controller and a vehicle thereof.

Background

Along with the gradual development of automatic driving of the automobile, various sensors for providing scenes and vehicle information are additionally arranged at the front end of the automobile, wherein the sensors comprise a visual camera, a millimeter wave radar, an ultrasonic radar, a laser radar, an odometer, a high-precision positioning sensor, an inertial device sensor and a high-precision map, so that an automatic driving mode can be stably operated; the sharply increased number of sensors and complexity of wiring harnesses pose a great challenge to the ECU (Electronic ControlUnit ) and electronic-electric architecture in the traditional automotive field, gradually replacing the distributed architecture with a centralized architecture scheme has become the main stream direction of future development of the automotive architecture, and replacing the traditional ECU with a highly integrated and high-computing-power ADAS (ADVANCEDDRIVERASSISTANCESYSTEM, driving assistance system) domain controller is a solution at the present stage. The higher the computational power of the ADAS domain controller, the greater the energy consumption, thereby placing a higher demand on the heat dissipation of the core processing chip.

Currently, the automobile industry mainly has three main stream heat dissipation schemes of water cooling heat dissipation, air cooling heat dissipation and natural heat dissipation aiming at a high-power chip; the natural heat dissipation efficiency is low, and the air is not circulated; the condensation risk exists in the water cooling heat dissipation, and the requirement on the whole vehicle arrangement is high; the installation environment requirement of air cooling heat dissipation is high, and the heat dissipation efficiency is lower than water cooling heat dissipation.

Therefore, the prior art is a great difficulty in solving the problem that the heat dissipation efficiency of the heat dissipation module of the domain controller can be increased while ensuring the safety.

Disclosure of utility model

Therefore, the utility model provides the domain controller, which not only solves the problem of low safety coefficient of the heat dissipation module of the domain controller, but also can increase the heat dissipation efficiency.

To solve the above problems, the present utility model provides a domain controller comprising: a domain controller first housing including a first mounting surface and a second mounting surface opposite each other; a printed circuit board arranged on the first mounting surface; the air blowing fan is arranged on the second installation surface and comprises radiating fins and an air outlet; the heat dissipation fins comprise first heat dissipation fins and second heat dissipation fins, heat dissipation channels are formed at the positions, adjacent to the first heat dissipation fins, of the second heat dissipation fins, air outlets of the blower fans face the heat dissipation channels, and the heat dissipation fins cover the printed circuit board.

Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: when the radiating fins are arranged on the first mounting surface and cover the printed circuit board, the printed circuit board generates heat during operation and is directly transmitted to the first shell of the domain controller, and then the heat is blown out of the domain controller from the radiating channel by means of air convection generated by the blower fan, so that air cooling and heat dissipation are realized; meanwhile, the air outlet of the blower fan faces the heat dissipation channels of the two adjacent heat dissipation fins to form a lateral heat dissipation structure, so that wind resistance can be effectively reduced, wind pressure is reduced, more wind quantity is facilitated to be obtained to take away heat, and heat dissipation effect is enhanced; meanwhile, as the blower fan is arranged on the second mounting surface of the first shell of the domain controller, the problems of high cost of parts, complex assembly process, large tolerance dimension chain of heat dissipation contact points and low sealing performance of the domain controller in independent unpacking of the fan heat dissipation block are solved, the heat dissipation module of the domain controller is convenient to check in time, and the safety coefficient of the heat dissipation module is improved.

In one aspect of the present utility model, the domain controller first housing includes: and a recess for accommodating the blower fan.

Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the arrangement of the concave part embeds the fan into the first shell of the domain controller, thereby increasing the utilization rate of space, shortening the heat transmission distance, directly blowing the heat from the heat dissipation channel to the outside of the domain controller by means of air convection generated by the fan in the concave part, and playing a heat dissipation effect on the printed circuit board; the concave part can avoid the influence of external wind on the heat dissipation wind pressure of the domain controller caused by false entering, so that the air outlet of the blower fan can efficiently blow away heat from the side surface, and invalid heat dissipation is avoided; simultaneously, the depressed part can also isolate the noise to a certain extent, improves user experience.

In one aspect of the present utility model, the domain controller first housing includes: and the fan cover covers the inner side surface of the blower fan, which is far away from the concave part.

Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the arrangement of the fan cover can protect the internal fan and prevent the fan from being damaged due to extrusion collision; meanwhile, the design of the fan cover can play a role in dust prevention, so that the service life of the fan is prolonged, a heat dissipation channel is convenient to clean after the fan cover is disassembled, and the fan is maintained and replaced; and the fan cover covers the heat dissipation channel, and air flow can flow out from the side after the fan cover is installed, so that the air flow can pass through the chip position and cannot escape from the front side.

In one aspect of the present utility model, the domain controller first housing further includes: the separation baffle plate is arranged around the first radiating fins and the fan, at least one side of the separation baffle plate is provided with a radiating opening, and the outer side of the separation baffle plate is provided with a second radiating fin.

Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the baffle is arranged on the first radiating fins and the fan, at least one side of the baffle is provided with a radiating opening, and the position of the air inlet and outlet can be planned, so that the air blown out by the fan can be discharged according to the heat quantity, the radiating path is changed, and the radiating efficiency is further improved.

In one aspect of the present utility model, a domain controller includes: the heat dissipation block is embedded in the first shell of the domain controller and is connected with the heat dissipation fins and the printed circuit board.

Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the heat radiating fins and the printed circuit board are connected in the first shell of the embedded domain controller of the heat radiating block, so that heat generated by the electric brush board can be transmitted to the heat radiating block, and the fan can radiate the heat independently through the heat radiating fins in a targeted manner, thereby improving the heat radiating efficiency.

In one technical scheme of the utility model, heat-dissipating glue is arranged between the heat-dissipating block and the heat-dissipating fins.

Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the heat dissipation glue is filled between the heat dissipation block and the heat dissipation fins, so that the high flexibility of the heat dissipation glue can be utilized to reduce the pressure required between the heat dissipation block and the heat dissipation fins, and the micro uneven surface is covered at the same time, so that components are fully contacted, and the heat conduction efficiency is improved.

In one aspect of the present utility model, a heat dissipating block includes: and one end of the radiating tube, which is far away from the radiating fins, extends to the first shell of the domain controller.

Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: one end of the radiating tube far away from the radiating fin extends to the first shell of the domain controller, heat around the heat source is quickly and uniformly distributed on the first shell of the domain controller, radiating efficiency is improved, and the problem of expansibility under the condition of different power consumption chips of air cooling radiating is solved.

In one aspect of the present utility model, a printed circuit board includes: and the grounding area is provided with a chip, and the chip is in direct contact with the first mounting surface of the first shell of the domain controller.

Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the grounding area on the printed circuit board is arranged, so that the ground wire impedance is reduced, and the anti-interference capability is improved; voltage drop is reduced, and power efficiency is improved; the loop area can be reduced by connecting the ground wire; the grounding area is provided with a chip, the chip is a main factor for generating a heat source, and the generated heat of the chip directly contacts with the first mounting surface, so that the heat transfer distance is reduced, and the heat dissipation efficiency is improved.

In one aspect of the present utility model, a domain controller includes: the domain controller second shell is contacted with one side of the printed circuit board, which is opposite to the chip; wherein, the surface of the second shell of the domain controller, which is contacted with the printed circuit board, is provided with conductive silica gel.

Compared with the prior art, the technical effect achieved by adopting the technical scheme is as follows: the conductive silica gel is arranged on the surface of the second shell of the domain controller, which is contacted with the printed circuit board, and has excellent heat resistance and cold resistance, good electrical property and long service life; and a certain gap is reserved between the second shell of the time domain controller and the printed circuit board, and effective contact can be better ensured through filling of conductive silica gel.

In one aspect of the present utility model, a vehicle includes any of the domain controllers described above.

Compared with the prior art, the domain controller of the vehicle has the beneficial effects of any one of the technical schemes, and the description is omitted herein.

After the technical scheme of the utility model is adopted, the following technical effects can be achieved:

(1) The radiating fins of the fan are arranged on the first shell of the domain controller, so that the radiating efficiency is improved; meanwhile, as the air outlet of the fan faces the heat dissipation channel, the heat transmission distance is reduced, the heat dissipation speed is improved, the wind resistance is effectively reduced, the wind pressure is reduced, more wind quantity is facilitated to be obtained to take away heat, and the heat dissipation effect is enhanced;

(2) The arrangement of the concave part not only increases the utilization rate of space, but also can avoid the influence of external wind on the heat dissipation wind pressure of the domain controller caused by false entering, and ensures that the air outlet of the blower fan can efficiently blow away heat from the side surface, thereby avoiding ineffective heat dissipation; meanwhile, the concave part can isolate noise to a certain extent, so that user experience is improved;

(3) According to different energy consumption of the chip, the radiating pipes are arranged on the radiating block, so that the radiating efficiency is improved, and the problem of expansibility of the air-cooled radiating chip with different power consumption is solved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings to be used in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art;

FIG. 1 is a front view of a domain controller provided in an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a front shell of a domain controller according to an embodiment of the present utility model;

fig. 3 is a front view of a printed circuit board according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram of a printed circuit board and a rear housing of a domain controller according to an embodiment of the present utility model;

Reference numerals illustrate:

100: domain controller first housing, 110: first mounting face, 120: second mounting face, 130: recess, 200: printed circuit board, 210: ground area, 211: chip, 300: blower fan, 310: heat radiation fins, 311: first heat sink fin, 312: second heat sink fin, 313: heat dissipation channel, 320: air outlet, 330: fan cover, 340: baffle, 341: heat dissipation port, 400: heat dissipation block, 410: radiating pipe, 500: and a domain controller second housing.

Detailed Description

In order to make the above objects, features and advantages of the present utility model more comprehensible, embodiments accompanied with present utility model are described in detail with embodiments of the present utility model including only some but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The present embodiment provides a domain controller including: a domain controller first housing 100, the domain controller first housing 100 including a first mounting surface 110 and a second mounting surface 120 opposite each other; a printed circuit board 200, the printed circuit board 200 being provided on the first mounting surface 110; the blower fan 300, the blower fan 300 is disposed on the second mounting surface 120, and the blower fan 300 includes a heat sink fin 310 and an air outlet 320; the heat dissipation fins 310 include a first heat dissipation fin 311 and a second heat dissipation fin 312, a heat dissipation channel 313 is formed at a position where the first heat dissipation fin 311 is adjacent to the second heat dissipation fin 312, an air outlet 320 of the blower fan 300 faces the heat dissipation channel 313, and the heat dissipation fins 310 cover the printed circuit board 200.

Preferably, as shown in fig. 1 to 4, when the heat dissipation fins 310 are disposed on the first mounting surface 110 and cover the printed circuit board 200, the printed circuit board 200 generates heat during operation, and directly transmits the heat to the first housing of the domain controller, and then the heat is blown out of the heat dissipation channel 313 to the outside of the domain controller by means of air convection generated by the blower fan 300, so as to realize air cooling heat dissipation, and compared with water cooling heat dissipation, the heat dissipation has a high safety factor;

Further, the plurality of heat dissipation fins 310 may be arranged at equal intervals or unequal intervals; the heat dissipation fins 310 are arranged by CAE simulation and actual measurement so that the distance between the heat dissipation fins 310 is 3mm-7mm, preferably 5mm; the bottom thickness of the heat sink fins 310 is 1mm-3mm, preferably 2mm; the top thickness of the heat sink fins 310 is 1mm-2mm, preferably 1.2mm; the contact area between the air and the air is enlarged, so that the fluidity of the air can be improved, and the heat dissipation effect is enhanced;

The first shell 100 of the domain controller can be preferably made of die-casting aluminum alloy, and the shell has the advantages of high heat quantity, fast heat dissipation, high efficiency, metal utilization rate, low price and suitability for mass production; the front surface of the first shell 100 of the die-casting aluminum alloy domain controller is not completely sealed, no slot is formed, and the open hole is led into the domain controller, so that the domain controller can reach the IP54 protection level;

Preferably, the air outlet 320 of the blower fan 300 faces the heat dissipation channels 313 of the two adjacent heat dissipation fins 310 to form a lateral heat dissipation structure, so that wind resistance can be effectively reduced, wind pressure is reduced, more wind quantity is facilitated to be obtained to take away heat, and heat dissipation effect is enhanced; meanwhile, as the blower fan 300 is arranged on the second mounting surface 120 of the first shell 100 of the domain controller, the problems of high cost of parts, complex assembly process, large tolerance dimension chain of heat dissipation contact points and low sealing performance of the domain controller in independent unpacking of the fan heat dissipation block 400 are solved, so that the heat dissipation module of the domain controller can be conveniently checked in time, and the safety coefficient of the heat dissipation module is improved.

In practical applications, a person skilled in the art may select the blower fan 300 with low rotation speed and low noise, so as to reduce the noise generated by the blower fan 300 while ensuring the working efficiency of the blower fan 300; preferably, the blower fan 300 is a double-sided air intake type centrifugal fan having a waterproof function, and the double-sided air intake type centrifugal fan sucks fluid from an axial direction of the blower fan 300 and then throws the fluid out from a circumferential direction by using centrifugal force, so that the blower fan 300 is relatively low in height, thereby saving space.

In one embodiment of the present utility model, the domain controller first housing 100 includes: the recess 130, the recess 130 is for accommodating the blower fan 300.

Preferably, as shown in fig. 2, the arrangement of the recess 130 embeds the fan in the first housing of the domain controller, which increases the space utilization rate and shortens the heat transmission distance, so that the heat can be directly blown from the heat dissipation channel 313 to the outside of the domain controller by means of the air convection generated by the fan, thereby achieving the heat dissipation effect on the printed circuit board 200;

The concave part 130 can avoid the influence of external wind on the heat dissipation wind pressure of the domain controller caused by false entering, so that the air outlet 320 of the blower fan 300 can efficiently blow away heat from the side surface, and invalid heat dissipation is avoided; meanwhile, the concave portion 130 can isolate noise to a certain extent, and user experience is improved.

In one embodiment of the present utility model, the domain controller first housing 100 includes: and a fan cover 330, the fan cover 330 covering an inner side surface of the blower fan 300 remote from the recess 130.

Preferably, the fan cover 330 is provided to protect the inner fan 300 from damage to the fan 300 due to extrusion collision; meanwhile, the design of the fan cover 330 can play a role in dust prevention, so that the service life of the fan 300 is prolonged, the cooling channel 313 is convenient to clean after the fan cover 330 is disassembled, and the fan 300 is maintained and replaced; and the fan cover 330 covers the heat dissipation channel 313, air flows out from the side after the fan cover 330 is installed, and can pass through the chip position, and the air cannot escape from the front side.

In one embodiment of the present utility model, the domain controller first housing 100 further includes: the baffle 340 is disposed around the first heat dissipation fins 311 and the fan, at least one side of the baffle 340 has a heat dissipation opening 341, and the outer side of the baffle 340 is provided with a second heat dissipation fin 312.

Preferably, the baffle 340 is disposed between the first heat dissipation fin 311 and the fan, and at least one side of the baffle has a heat dissipation opening 341, so that the position of the air inlet and outlet can be planned, the air blown by the fan can be discharged according to the heat, the heat dissipation path is changed, and the heat dissipation efficiency is further improved.

In one embodiment of the present utility model, a domain controller includes: the heat sink 400 is embedded in the first housing 100 of the domain controller, and the heat sink 400 connects the heat sink fins 310 and the printed circuit board 200.

Preferably, the heat radiating fins 310 are connected with the printed circuit board 200 in the first shell of the embedded domain controller of the heat radiating block 400, so that heat generated by the electric brush board can be transmitted into the heat radiating block 400, and the fan can radiate the heat independently through the heat radiating fins 310 in a targeted manner, thereby improving the heat radiating efficiency;

Furthermore, the heat dissipation block 400 can be embedded in the first shell 100 of the domain controller through hot riveting, and the riveted welding spots are attractive and firm and have no phenomenon of wire hanging and material sticking; the rivet head has high smoothness, high forming speed and difficult embrittlement.

In one embodiment of the present utility model, a heat-dissipating glue is provided between the heat sink 400 and the heat sink fins 310.

Preferably, the heat dissipation glue is filled between the heat dissipation block 400 and the heat dissipation fins 310, so that the pressure required between the heat dissipation block 400 and the heat dissipation fins 310 can be reduced by utilizing the high flexibility of the heat dissipation glue, and the micro uneven surface is covered, so that the components are fully contacted, and the heat conduction efficiency is improved.

In one embodiment of the present utility model, the heat sink block 400 includes: the heat dissipating tube 410, one end of the heat dissipating tube 410 away from the heat dissipating fin 310 extends to the domain controller first housing 100.

Preferably, one end of the radiating tube 410 far away from the radiating fin 310 extends to the first housing 100 of the domain controller, so that heat around the heat source is quickly distributed on the first housing of the domain controller, the radiating efficiency is improved, and the problem of expansibility under the condition of radiating chips 211 with different power consumption by air cooling is solved.

In one embodiment of the present utility model, the printed circuit board 200 includes: the grounding region 210, the grounding region 210 is provided with a chip 211, and the chip 211 is directly contacted with the first mounting surface 110 of the first housing 100 of the domain controller.

Preferably, as shown in fig. 3, the ground area 210 on the printed circuit board 200 is configured to reduce ground impedance and improve anti-interference capability; voltage drop is reduced, and power efficiency is improved; the loop area can be reduced by connecting the ground wire; the chip 211 is disposed on the grounding region 210, and the chip 211 is a main factor for generating a heat source, and the generated heat of the chip 211 directly contacts the first mounting surface 110, so that the heat transfer distance is reduced, and the heat dissipation efficiency is improved.

In one embodiment of the present utility model, a domain controller includes: the domain controller second case 500, the domain controller second case 500 contacts with the printed circuit board 200 at a side opposite to the chip 211; wherein, the conductive silica gel is disposed on the surface of the domain controller second housing 500 contacting the printed circuit board 200.

Preferably, the conductive silica gel is disposed on the surface of the second housing 500 of the domain controller, which contacts the printed circuit board 200, and has excellent heat resistance and cold resistance, good electrical properties, and long service life;

Further, as shown in fig. 4, the printed circuit board 200 and the domain controller second housing 500 are spaced apart from each other by a certain gap, the gap is filled with conductive silicone, the conductive silicone is coated on the grounding region 210 of the domain controller second housing 500 corresponding to the printed circuit board 200 through a dispensing process, the height of the conductive silicone is greater than the gap between the rear case and the printed circuit board 200, and the thickness tolerance of the printed circuit board 200 is consumed by compression of the conductive silicone, so that effective contact can be ensured.

In one embodiment of the utility model, a vehicle includes any of the domain controllers described above.

Compared with the prior art, the domain controller of the vehicle has the beneficial effects of any one of the embodiments, and is not described herein.

Furthermore, the domain controller can be applied to products in other technical fields, such as notebook computers, mobile phones, game machines and the like, and the air cooling heat dissipation scheme of the utility model is referred to according to industry specifications to implement air cooling heat dissipation.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (9)

1. A domain controller, the domain controller comprising:

A domain controller first housing (100), the domain controller first housing (100) comprising a first mounting face (110) and a second mounting face (120) that are opposite;

a printed circuit board (200), the printed circuit board (200) being provided on the first mounting surface (110);

A blower fan (300), wherein the blower fan (300) is arranged on the second mounting surface (120), and the blower fan (300) comprises a radiating fin (310) and an air outlet (320);

The heat dissipation fins (310) comprise first heat dissipation fins (311) and second heat dissipation fins (312), heat dissipation channels (313) are formed at the positions, adjacent to the second heat dissipation fins (312), of the first heat dissipation fins (311), the air outlets (320) of the blower fan (300) face the heat dissipation channels (313), and the heat dissipation fins (310) cover all the printed circuit boards (200);

The separation baffle (340), separate the separation baffle (340) around set up in first fin (311) with fan (300), there is cooling hole (341) at least one side, just separate the separation baffle (340) outside is second fin (312).

2. The domain controller according to claim 1, wherein the domain controller first housing (100) comprises:

-a recess (130), the recess (130) being adapted to accommodate the blower fan (300).

3. The domain controller according to claim 2, wherein the domain controller first housing (100) comprises:

A fan cover (330), the fan cover (330) covering an inner side surface of the blower fan (300) remote from the recess (130).

4. The domain controller of claim 1, wherein the domain controller comprises:

And the heat dissipation block (400) is embedded in the first shell (100) of the domain controller, and the heat dissipation block (400) is connected with the heat dissipation fins (310) and the printed circuit board (200).

5. The domain controller according to claim 4, wherein a heat-dissipating glue is provided between the heat-dissipating block (400) and the heat-dissipating fins (310).

6. The domain controller according to claim 4, wherein the heat sink block (400) comprises:

-a radiating tube (410), an end of the radiating tube (410) remote from the radiating fin (310) extending to the domain controller first housing (100).

7. The domain controller according to claim 1, wherein the printed circuit board (200) comprises:

And the grounding area (210), wherein a chip (211) is arranged on the grounding area (210), and the chip (211) is directly contacted with the first mounting surface (110) of the domain controller first shell (100).

8. The domain controller of claim 7, wherein the domain controller comprises:

-a domain controller second housing (500), the domain controller second housing (500) being in contact with a side of the printed circuit board (200) opposite the chip (211);

Wherein, the surface of the second shell (500) of the domain controller, which is contacted with the printed circuit board (200), is provided with conductive silica gel.

9. A vehicle comprising a domain controller according to any one of claims 1-8.