CN221026109U - Automatic material arranging mechanism for stamping IGBT (insulated Gate Bipolar transistor) substrate - Google Patents

Abstract

The utility model discloses an automatic material arranging mechanism for stamping an IGBT (insulated gate bipolar transistor) substrate, which comprises a frame, a blanking assembly, a material arranging assembly and a plurality of groups of movable material arranging table assemblies, wherein the material arranging assembly is arranged at the discharging end of the blanking assembly, the plurality of movable material arranging table assemblies are arranged at the side edge of the discharging end of the blanking assembly and used for accommodating a material tray, and the material arranging assembly grabs the substrate on the blanking assembly and places the substrate in the material tray of the movable material arranging table assembly. The automatic material arranging device can replace manual material arranging or single-piece blanking, realizes automatic material arranging, can greatly improve material arranging efficiency, saves labor force and is beneficial to realizing full-automatic safe production.

Description

Automatic material arranging mechanism for stamping IGBT (insulated Gate Bipolar transistor) substrate

Technical Field

The utility model relates to the field of substrate production equipment, in particular to an automatic material arranging mechanism for stamping an IGBT substrate.

Background

IGBT (insulated Gate Bipolar transistor) is used as a power semiconductor device, is widely applied to the fields of rail transit, intelligent power grid, industrial energy conservation, electric automobile, new energy equipment and the like, and has the characteristics of energy conservation, convenient installation, convenient maintenance, stable heat dissipation and the like. The bottom of IGBT module is the radiating substrate, and the main objective is the heat that produces in the quick transfer IGBT switch process.

In the electronic equipment, the requirement on the quality of the substrate is high, and meanwhile, in order to facilitate the subsequent substrate processing, the substrate needs to be separated and laid in the production and processing process of the substrate, and the centralized stacking type blanking cannot be performed. In the conventional substrate processing process, manual blanking and material placing are generally adopted, and substrates are stacked in a material tray, so that the substrate processing efficiency is low and the labor cost is high; or the manipulator is used for carrying out single-chip blanking on the substrate, so that the substrate can not be stacked, the subsequent processing of the ceramic substrate is affected, and the processing efficiency still has a great room for improvement.

Disclosure of utility model

In order to solve the problems, the utility model provides an automatic material arranging mechanism for stamping an IGBT substrate, which can replace manual material arranging, realize automatic material arranging, greatly improve material arranging efficiency, save labor force and be beneficial to realizing full-automatic safe production.

The technical scheme adopted in the utility model is as follows:

An automatic material arranging mechanism for stamping an IGBT (insulated gate bipolar transistor) substrate comprises a frame, and further comprises a blanking assembly, a material arranging assembly and a plurality of groups of movable material arranging table assemblies, wherein the material arranging assembly is arranged at the discharge end of the blanking assembly, the movable material arranging table assemblies are arranged at the side edges of the discharge end of the blanking assembly and used for accommodating a material tray, and the material arranging assembly grabs the substrate on the blanking assembly and is arranged in the material tray of the movable material arranging table assemblies.

Preferably, the automatic feeding device further comprises a transfer component which is slidably mounted on the frame and moves linearly in a reciprocating manner along the movement direction of the substrate, and the discharging end of the transfer component is located right above the receiving end of the discharging component.

Preferably, the material placing component comprises a beam frame, a first linear driving component, a linear guide rail, a linear sliding block, a transverse moving mounting plate, a lifting component, a lifting plate and a vacuum adsorption device, wherein the beam frame is fixedly mounted on a frame and located above a discharge end of the material discharging component, the linear guide rail is fixedly mounted on the beam frame, the linear guide rail is arranged along a direction perpendicular to the movement direction of the substrate, the linear sliding block is mounted on the linear guide rail and moves along the linear guide rail, the first linear driving component is mounted on the beam frame and is in driving connection with the linear sliding block, the transverse moving mounting plate is fixedly mounted on the linear sliding block, the lifting component is fixedly mounted on the transverse moving mounting plate, the lifting plate is in driving connection with the lifting component, and the vacuum adsorption device is mounted at the bottom end of the lifting plate and is used for adsorbing the substrate.

Preferably, the lifting assembly comprises a lifting driving motor and a driving gear, a rack groove arranged along the vertical direction is formed in the back surface of the lifting plate, the driving gear is installed in the rack groove in a matched mode, the lifting driving motor is fixedly installed at the bottom of the transversely-moving mounting plate, and the output end of the lifting driving motor is in driving connection with the driving gear.

Preferably, the movable table assembly comprises a movable plate, a table, a linear guide rail assembly and a second linear driving assembly, the table is installed on the top surface of the movable plate, the bottom surface of the movable plate is slidably installed on the linear guide rail assembly, the second linear driving assembly is installed below the movable plate, the second linear driving assembly is in driving connection with the movable plate, the second linear driving assembly drives the movable plate to move along the linear guide rail assembly, and the moving direction of the movable plate is parallel to the substrate conveying direction of the blanking assembly.

Preferably, the movable table assembly further includes a proximity switch mounted on the frame and located at an end of the movable position of the movable plate to sense the position of the table by touching the movable plate.

Preferably, the transfer assembly comprises a third linear driving assembly, a transfer connecting plate, a transfer driving assembly and a transfer conveying assembly, wherein the third linear driving assembly is in driving connection with the transfer connecting plate, the transfer connecting plate is driven by the third linear driving assembly to do linear reciprocating motion along the movement direction of the substrate, the transfer driving assembly and the blanking end of the transfer conveying assembly are both arranged on the transfer connecting plate, and the transfer driving assembly is in driving connection with the driving wheel of the transfer conveying assembly.

Preferably, the unloading subassembly includes base plate conveying subassembly and spacing subassembly, spacing subassembly includes two width limiting plates and high limiting plate, two the width limiting plate symmetry is installed in base plate conveying subassembly's discharge end both sides, and every the end of width limiting plate is equipped with a spacing lug for spacing base plate motion, the both ends of high limiting plate are installed respectively two the top surface of width limiting plate is used for spacing through the base plate height.

Preferably, the tail end of the limiting component is located right below the vacuum adsorption device, and the two width limiting plates are matched to form a containing groove for containing exactly one substrate.

Preferably, the material arranging assembly further comprises a wire protecting drag chain, the wire protecting drag chain is arranged on the beam frame, one end of the wire protecting drag chain is connected with the transverse moving mounting plate, and the wire protecting drag chain moves along with the transverse moving mounting plate.

The beneficial effects are that: the utility model provides an automatic material arranging mechanism for stamping an IGBT substrate, which has the following advantages:

(1) According to the automatic blanking device, the transfer component is used for driving the swing component to be matched with the IGBT substrate, so that automatic continuous blanking can be carried out on the IGBT substrate, and compared with traditional manual blanking or single-piece blanking, the blanking efficiency of the IGBT substrate can be effectively improved, and the continuity of subsequent processing of the substrate is ensured;

(2) According to the utility model, the material placing component and the movable platform component are matched, so that double-station substrate stacking is realized, the loading and unloading free time between the material trays is saved, and the substrate stacking efficiency is further improved.

(3) According to the utility model, the limiting assembly is used for limiting the substrate, so that the problem of overlapping of the substrate caused by earlier processing errors is avoided, the single substrate transportation of the material placing assembly is ensured, and the problem of stacking and overlapping of the substrates is prevented.

Drawings

FIG. 1 is a schematic view showing the overall structure installation of embodiment 1;

FIG. 2 is a schematic diagram of a material arranging assembly according to embodiment 1;

fig. 3 is a schematic view of a transfer assembly according to embodiment 1;

In the figure: the device comprises a frame 1, a transfer assembly 2, a third linear driving assembly 2-1, a transfer connecting plate 2-2, a transfer driving assembly 2-3, a transfer conveying assembly 2-4, a blanking assembly 3, a substrate conveying assembly 3-1, a limiting assembly 3-2, a width limiting plate 3-21, a height limiting plate 3-22, a limiting lug 3-23, a swinging assembly 4, a beam frame 4-1, a first linear driving assembly 4-2, a linear guide rail 4-3, a linear slide block 4-4, a transverse moving mounting plate 4-5, a lifting assembly 4-6, a lifting plate 4-7, a vacuum adsorption device 4-8, a wire protecting drag chain 4-9, a moving swinging platform assembly 5, a moving plate 5-1, a swinging platform 5-2, a linear guide rail assembly 5-3, a proximity switch 5-4 and a punching machine 6.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. The following description of the embodiments is merely exemplary in nature and it is to be understood that the embodiments described herein are merely illustrative of the utility model, and are in no way intended to limit the utility model, its application, or uses.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. In contrast, when an element is referred to as being "directly connected" to another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

In the description of the present utility model, it should be understood that the terms "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Example 1:

An automatic material arranging mechanism for stamping IGBT (insulated gate bipolar transistor) substrates comprises a frame 1, a transfer assembly 2, a blanking assembly 3, a material arranging assembly 4 and two groups of movable material arranging table assemblies 5, wherein the transfer assembly 2 is slidably mounted on the frame 1 and moves in a reciprocating linear motion along the substrate moving direction, the blanking end of the transfer assembly 2 is positioned right above the material receiving end of the blanking assembly 3, the material arranging assembly 4 is mounted at the discharging end of the blanking assembly 3, the two groups of movable material arranging table assemblies 4 are mounted at two sides of the discharging end of the blanking assembly 3 respectively and used for accommodating material trays, and the material arranging assembly 4 absorbs substrates on the blanking assembly 3 to be arranged in the material trays of the movable material arranging table assemblies 5.

In this embodiment, the material placing component 4 includes a beam frame 4-1, a first linear driving component 4-2, a linear guide rail 4-3, a linear slider 4-4, a traverse mounting plate 4-5, a lifting component 4-6, a lifting plate 4-7 and a vacuum adsorption device 4-8, wherein the beam frame 4-1 is fixedly mounted on the frame 1 and is located above a discharge end of the material placing component 3, the linear guide rail 4-3 is fixedly mounted on the beam frame 4-1, the linear guide rail 4-3 is arranged along a direction perpendicular to a movement direction of the substrate, the linear slider 4-4 is mounted on the linear guide rail 4-3, moves along the linear guide rail 4-3, the first linear driving component 4-2 is mounted on the beam frame 4-1 and is in driving connection with the linear slider 4-4, the traverse mounting plate 4-5 is fixedly mounted on the linear slider 4-4, the lifting component 4-6 is fixedly mounted on the traverse mounting plate 4-5, and the lifting component 4-6 is connected with the lifting plate 4-6 and is used for adsorbing the vacuum adsorption device 4-6.

In this embodiment 1, the lifting assembly 4-6 includes a lifting driving motor and a driving gear, a rack slot arranged along a vertical direction is provided on the back of the lifting plate 4-7, the driving gear is mounted in the rack slot in a matching manner, the lifting driving motor is fixedly mounted at the bottom of the lateral movement mounting plate 4-5, and the output end of the lifting driving motor is in driving connection with the driving gear.

In this embodiment 1, the moving table assembly 5 includes a moving plate 5-1, a table 5-2, a linear guide rail assembly 5-3 and a second linear driving assembly, the table 5-2 is mounted on the top surface of the moving plate 5-1, the bottom surface of the moving plate 5-1 is slidably mounted on the linear guide rail assembly 5-3, the second linear driving assembly 5-3 is mounted below the moving plate 5-1, and the second linear driving assembly is in driving connection with the moving plate 5-1, the second linear driving assembly drives the moving plate 5-1 to move along the linear guide rail assembly 5-3, and the moving direction of the moving plate 5-1 is parallel to the substrate conveying direction of the blanking assembly 3.

In this embodiment 1, the movable table assembly 5 further includes a proximity switch 5-4, where the proximity switch 5-4 is mounted on the frame 1 and located at the end of the moving position of the movable plate 5-1, and the position of the table 5-2 is sensed by touching the movable plate 5-1.

In this embodiment 1, the material placing component 4 further includes a wire-protecting drag chain 4-9, the wire-protecting drag chain 4-9 is mounted on the beam frame 4-1, and one end of the wire-protecting drag chain 4-9 is connected with the traversing mounting plate 4-5 and moves along with the traversing mounting plate 4-5.

In this embodiment 1, the transfer assembly 2 includes a third linear driving assembly 2-1, a transfer connecting plate 2-2, a transfer driving assembly 2-3 and a transfer conveying assembly 2-4, the third linear driving assembly 2-1 is in driving connection with the transfer connecting plate 2-2, the transfer connecting plate 2-2 is driven by the third linear driving assembly 2-1 to reciprocate linearly along the substrate moving direction, the transfer driving assembly 2-1 and the discharging end of the transfer conveying assembly 2-4 are both mounted on the transfer connecting plate 2-2, and the transfer driving assembly 2-3 is in driving connection with the driving wheel of the transfer conveying assembly 2-4.

In this embodiment 1, the blanking assembly 3 includes a substrate conveying assembly 3-1 and a limiting assembly 3-2, the limiting assembly 3-2 includes two width limiting plates 3-21 and two height limiting plates 3-22, the two width limiting plates 3-21 are symmetrically installed at two sides of a discharging end of the substrate conveying assembly 3-1, and each end of the width limiting plate 3-21 is provided with a limiting bump 3-23 for limiting movement of the substrate, and two ends of the height limiting plates 3-22 are respectively installed at two top surfaces of the width limiting plates 3-21 for limiting height of the passing substrate.

In this embodiment 1, the end of the limiting component 3-2 is located under the vacuum adsorption device 4-8, and two width limiting plates 3-21 are matched to form a containing groove for exactly containing one substrate.

In the utility model, the first linear driving assembly, the second linear driving assembly and the third linear driving assembly are all existing driving devices capable of realizing linear motion, and belong to conventional technical means known by those skilled in the art, so the driving devices are not described in detail.

The working principle of the utility model is as follows:

As shown in fig. 1, the material placing mechanism is mounted in cooperation with the punching machine 6, wherein the transfer component 2 is driven by the third linear driving component 2-1 to make telescopic movement between the upper die and the lower die of the punching machine 6. The specific material placing process is as follows: after the punching machine 6 completes the punching of the substrate, the third linear driving assembly 2-1 is controlled to operate to drive the transferring and conveying assembly 2-4 to move until the material receiving end of the transferring and conveying assembly 2-4 is positioned between the upper die and the lower die, then the substrate (the punching machine is provided with a demolding ejection device) which is ejected from the upper die 4-1 falls on the transferring and conveying assembly 2-4, and then the third linear driving assembly 2-1 drives the transferring and conveying assembly 2-4 to return to the original position. Meanwhile, the transfer driving assembly 2-3 is controlled to drive the belt on the transfer conveying assembly 2-4 to carry out circulating conveying, the substrate on the transfer conveying assembly 2-4 is conveyed to the blanking end until the substrate falls on the blanking assembly 3, and the substrate conveying assembly 3-1 drives the substrate to move into the accommodating groove. At this time, the lifting assembly 4-6 above the accommodating groove is controlled to drive the lifting plate 4-7 to drive the vacuum adsorption device 4-8 to move downwards to a preset position, after the vacuum adsorption device 4-8 is utilized to adsorb the substrate, the first linear driving assembly 4-2 is controlled to drive the vacuum adsorption device 4-8 on the lifting plate 4-7 to move towards the left/right side of the movable swing table assembly 5 through the transverse moving mounting plate 4-5 until the vacuum adsorption device 4-8 moves to the position right above the swing table 5-2, and then the adsorption of the vacuum adsorption device 4-8 to the substrate is released to enable the substrate to fall into a material tray of the swing table 5-2. The vacuum suction device 4-8 is then returned to its original position by the first linear driving assembly 4-2 to suck the next plate.

When the substrate is fully arranged in one row of the material tray on the swinging table 5-2, the second linear driving assembly can be controlled to drive the swinging table 5-2 to move, so that the spare row of the swinging table 5-2 moves to the discharging position. When the swinging table 5-2 moves to touch the proximity switch 5-4, the material tray on the swinging tray is fully swung, and a control system informs a worker to take the material tray.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (10)

1. An automatic material arranging mechanism for stamping an IGBT (insulated gate bipolar transistor) substrate comprises a frame and is characterized by further comprising a blanking component, a material arranging component and a plurality of groups of movable material arranging table components, wherein the material arranging component is arranged at the discharge end of the blanking component, the movable material arranging table components are arranged at the side edge of the discharge end of the blanking component and used for accommodating a material tray, and the material arranging component grabs the substrate on the blanking component and is arranged in the material tray of the movable material arranging table component.

2. The automated swing mechanism for stamping an IGBT substrate according to claim 1, further comprising a transfer assembly slidably mounted on the frame and configured to reciprocate linearly along the direction of substrate movement, and wherein the blanking end of the transfer assembly is located directly above the receiving end of the blanking assembly.

3. The automated swing mechanism for stamping an IGBT substrate according to claim 2, wherein the swing assembly comprises a beam frame, a first linear driving assembly, a linear guide rail, a linear slider, a traverse mounting plate, a lifting assembly, a lifting plate and a vacuum adsorption device, wherein the beam frame is fixedly mounted on a frame and is located above a discharge end of the blanking assembly, the linear guide rail is fixedly mounted on the beam frame, and the linear guide rail is arranged along a direction perpendicular to a substrate movement direction, the linear slider is mounted on the linear guide rail, moves along the linear guide rail, the first linear driving assembly is mounted on the beam frame and is in driving connection with the linear slider, the traverse mounting plate is fixedly mounted on the linear slider, the lifting assembly is fixedly mounted on the traverse mounting plate, the lifting plate is in driving connection with the lifting assembly, and the vacuum adsorption device is mounted at a bottom end of the lifting plate for adsorbing the substrate.

4. The automatic material arranging mechanism for stamping of the IGBT substrate according to claim 3, wherein the lifting assembly comprises a lifting driving motor and a driving gear, a rack groove arranged in the vertical direction is formed in the back surface of the lifting plate, the driving gear is mounted in the rack groove in a matched mode, the lifting driving motor is fixedly mounted at the bottom of the transversely-moving mounting plate, and the output end of the lifting driving motor is in driving connection with the driving gear.

5. The automatic material arranging mechanism for stamping an IGBT substrate according to claim 1, wherein the movable table assembly comprises a movable plate, a table, a linear guide rail assembly and a second linear driving assembly, the table is arranged on the top surface of the movable plate, the bottom surface of the movable plate is slidably arranged on the linear guide rail assembly, the second linear driving assembly is arranged below the movable plate and is in driving connection with the movable plate, the movable plate is driven by the second linear driving assembly to move along the linear guide rail assembly, and the moving direction of the movable plate is parallel to the substrate conveying direction of the blanking assembly.

6. The automated swing mechanism for stamping an IGBT substrate of claim 5 wherein the movable swing assembly further comprises a proximity switch mounted on the frame and located at an end of the movable position of the movable plate to sense the position of the swing by touching the movable plate.

7. The automatic material arranging mechanism for stamping the IGBT substrate according to claim 2, wherein the transferring assembly comprises a third linear driving assembly, a transferring connecting plate, a transferring driving assembly and a transferring conveying assembly, the third linear driving assembly is in driving connection with the transferring connecting plate, the transferring connecting plate is driven by the third linear driving assembly to do linear reciprocating motion along the substrate moving direction, the transferring driving assembly and the discharging end of the transferring conveying assembly are both arranged on the transferring connecting plate, and the transferring driving assembly is in driving connection with the driving wheel of the transferring conveying assembly.

8. The automatic material arranging mechanism for stamping the IGBT substrate according to claim 1, wherein the blanking assembly comprises a substrate conveying assembly and a limiting assembly, the limiting assembly comprises two width limiting plates and a height limiting plate, the two width limiting plates are symmetrically arranged on two sides of a discharging end of the substrate conveying assembly, a limiting projection is arranged at the tail end of each width limiting plate and used for limiting movement of the substrate, and two ends of the height limiting plate are respectively arranged on the top surfaces of the two width limiting plates and used for limiting height of the passing substrate.

9. The automatic material arranging mechanism for stamping an IGBT substrate according to claim 8, wherein the tail end of the limiting assembly is located right below the vacuum adsorption device, and two width limiting plates are matched to form a containing groove for containing exactly one substrate.

10. The automated swing mechanism for stamping an IGBT substrate of claim 3 wherein the swing assembly further comprises a guard wire drag chain mounted on the cross beam frame and having one end connected to the traversing mounting plate for movement therewith.