CN221023341U - TEC water-cooling fills electric pile - Google Patents
TEC water-cooling fills electric pile Download PDFInfo
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- CN221023341U CN221023341U CN202323272201.0U CN202323272201U CN221023341U CN 221023341 U CN221023341 U CN 221023341U CN 202323272201 U CN202323272201 U CN 202323272201U CN 221023341 U CN221023341 U CN 221023341U
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- cooling
- charging pile
- water
- tec
- cooling box
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- 238000001816 cooling Methods 0.000 title claims abstract description 98
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 55
- 239000004065 semiconductor Substances 0.000 claims abstract description 31
- 230000017525 heat dissipation Effects 0.000 claims abstract description 23
- 238000007789 sealing Methods 0.000 claims abstract description 7
- 238000005192 partition Methods 0.000 claims abstract description 5
- 230000005855 radiation Effects 0.000 claims description 12
- 229920000742 Cotton Polymers 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000110 cooling liquid Substances 0.000 abstract description 22
- 230000000694 effects Effects 0.000 abstract description 16
- 238000013021 overheating Methods 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 description 22
- 239000007788 liquid Substances 0.000 description 22
- 238000005057 refrigeration Methods 0.000 description 12
- 238000000605 extraction Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The application relates to a TEC water-cooling charging pile, which belongs to the technical field of charging piles and comprises a charging pile, wherein a control panel is fixedly arranged on the front surface of the charging pile, cooling boxes are fixedly arranged on two sides of the charging pile, a sealing cover is fixedly arranged on one side, close to the charging pile, of each cooling box, a partition plate is fixedly arranged on the inner side of each cooling box, two first radiating fins are fixedly arranged on the inner side wall of each cooling box, a water inlet is communicated with the top of each cooling box, a water outlet positioned on the right side of the water inlet is communicated with the top of each cooling box, a refrigerating mechanism is arranged on one side, far away from the charging pile, of each cooling box, and a second radiating fin is fixedly arranged on one side, far away from the charging pile, of each cooling box. The TEC water-cooling charging pile can prevent the TEC semiconductor refrigerating plate from being damaged due to overheating, and the TEC semiconductor refrigerating plate can rapidly cool the cooling liquid in the cooling box, so that the cooling liquid has a better heat dissipation effect on the charging pile.
Description
Technical Field
The application relates to the technical field of charging piles, in particular to a TEC water-cooling charging pile.
Background
The function of the electric pile is similar to that of an oiling machine in a gas station, the electric pile can be fixed on the ground or a wall, is installed in public buildings (public buildings, malls, public parking lots and the like) and parking lots or charging stations of residential areas, can charge electric vehicles of various types according to different voltage levels, the input end of the electric pile is directly connected with an alternating current power grid, and the output end of the electric pile is provided with a charging plug for charging the electric vehicles.
When the existing charging pile performs water cooling, the water cooling radiator mostly uses a fan to cool the water cooling row, however, heat higher than the ring temperature is taken away in a heat convection and radiation mode, when the water temperature in the radiator is greatly higher than the ring temperature, the fan has a larger effect, but when the water temperature in the radiator is close to or equal to the ring temperature, the fan has a smaller effect, the temperature of cooling liquid is easy to be too high, so that the cooling liquid has poor heat dissipation effect on the charging pile, and the TEC water cooling charging pile is provided to solve the technical problems.
Disclosure of utility model
Aiming at the defects of the prior art, the application provides a TEC water-cooling charging pile which has the advantages of improving the heat dissipation effect and the like and solves the problem of low heat dissipation efficiency of cooling liquid in the existing radiator.
In order to achieve the above purpose, the present application provides the following technical solutions: the TEC water-cooling charging pile comprises a charging pile, wherein a control panel is fixedly arranged on the front surface of the charging pile, cooling boxes are fixedly arranged on two sides of the charging pile, a sealing cover is fixedly arranged on one side, close to the charging pile, of each cooling box, a partition plate is fixedly arranged on the inner side of each cooling box, and two first radiating fins are fixedly arranged on the inner side wall of each cooling box;
The top of the cooling box is communicated with a water inlet, the top of the cooling box is communicated with a water outlet positioned on the right side of the water inlet, and one side of the cooling box, which is far away from the charging pile, is provided with a refrigerating mechanism;
The cooling box is characterized in that a second radiating fin is fixedly arranged on one side, far away from the charging pile, of the cooling box, a blower is fixedly arranged on one side, far away from the charging pile, of the second radiating fin, a wind scooper is fixedly arranged on one side, far away from the charging pile, of the second radiating fin, and a radiating mechanism is arranged on the cooling box.
Through adopting above-mentioned technical scheme, first raceway is used to the water pump through control panel control, carry out the extraction with the coolant liquid in the cooling tank, the water pump uses the second raceway to send into the coiled pipe with the coolant liquid, the coiled pipe is through hugging closely charging pile, the charging pile is when producing heat, the heat can be absorbed by the coolant liquid in the coiled pipe, the coolant liquid of absorption heat can get back to the cooling tank, TEC semiconductor refrigeration piece can cool down first radiator fin, first radiator fin of cooling can dispel the heat to the coolant liquid in the cooling tank, the temperature of control coolant liquid that just so can be better, thereby reach the coolant liquid and to charging pile radiating effect good purpose, the second radiator fin can absorb the temperature of TEC semiconductor heating surface, the blowing opportunity draws air and carries out the heat dissipation to the second radiator fin, can avoid TEC semiconductor refrigeration piece to damage because of the overheat like this, can cool down the coolant liquid in the cooling tank fast through the TEC semiconductor refrigeration piece, thereby make the coolant liquid to charge pile radiating effect better.
Further, the first heat radiation fins are fixedly arranged in the cooling box, and the first heat radiation fins are in contact with the refrigerating surface of the TEC semiconductor refrigerating sheet.
Through adopting above-mentioned technical scheme, TEC semiconductor refrigeration piece is better through first heat radiation fin to the coolant liquid cooling effect in the cooling tank like this.
Further, the heat dissipation mechanism comprises a connecting plate fixedly arranged at the top of the second heat dissipation fin, a water pump is fixedly arranged on one side, away from the charging pile, of the connecting plate, a plurality of buckles are fixedly arranged on one side, close to the charging pile, of the sealing cover, a plurality of tray-shaped pipes are fixedly arranged between the inner sides of the buckles, a water outlet is communicated with a first water pipe communicated with the input end of the water pump, and the output end of the water pump is communicated with a second water pipe communicated with the tray-shaped pipes.
Through adopting above-mentioned technical scheme, just so can dispel the heat to charging the stake fast to improve the operating efficiency who fills electric stake.
Further, the output end of the coiled pipe is communicated with the water inlet.
By adopting the technical scheme, the cooling liquid in the coiled pipe can flow back into the cooling box again, so that the cooling liquid can be continuously recycled.
Further, the control panel is electrically connected with the water pump.
Through adopting above-mentioned technical scheme, just so can control the coolant liquid in the pump extraction cooling case through control panel and dispel the heat to charging pile.
Further, the refrigerating mechanism comprises a mounting groove formed in one side, far away from the charging pile, of the cooling box, a heat insulation cotton pad is fixedly mounted on the inner side wall of the mounting groove, and TEC semiconductor refrigerating sheets with three numbers are fixedly mounted on the inner side of the heat insulation cotton pad.
Through adopting above-mentioned technical scheme, improve refrigeration mechanism just so can cool down the coolant liquid in the cooling box to improve the radiating effect of coolant liquid to the electric pile that fills.
Further, the second heat dissipation fins are in contact with the heating surface of the TEC semiconductor refrigerating plate.
By adopting the technical scheme, the heat dissipation effect of the heating surface of the TEC semiconductor refrigerating sheet can be improved through the second heat dissipation fins, so that the TEC semiconductor refrigerating sheet is prevented from being damaged due to overhigh temperature.
Further, the coiled pipe is tightly attached to the charging pile, and the coiled pipe is a copper coiled pipe.
Through adopting above-mentioned technical scheme, make the coiled pipe better to the radiating effect who fills electric pile like this.
Compared with the prior art, the technical scheme of the application has the following beneficial effects:
This TEC water-cooling fills electric pile, first raceway is used to the water pump through control panel control, carry out the extraction with the coolant liquid in the cooling tank, the water pump uses the second raceway to send into the coiled pipe with the coolant liquid, the coiled pipe fills electric pile through hugging closely, the electric pile is filled in the production heat, the heat can be absorbed by the coolant liquid in the coiled pipe, the coolant liquid that absorbs heat can get back to the cooling tank, TEC semiconductor refrigeration piece can cool down first radiator fin, first radiator fin of cooling can dispel the heat to the coolant liquid in the cooling tank, the temperature of control coolant liquid that just so can be better, thereby reach the coolant liquid and to fill the good purpose of electric pile radiating effect, the second radiator fin can absorb TEC semiconductor refrigeration piece heating surface's temperature, the blowing opportunity draws air and dispels the heat to the second radiator fin, can avoid TEC semiconductor refrigeration piece to damage because of the overheat like this, can cool down the coolant liquid in the cooling tank fast through the TEC semiconductor refrigeration piece, thereby make the coolant liquid to fill the radiating effect of electric pile better.
Drawings
FIG. 1 is a schematic diagram of a front view structure of the present application;
FIG. 2 is a schematic cross-sectional view of a radiator tank and a first radiator fin according to the present application;
FIG. 3 is a schematic diagram of the cross-sectional structure of the heat-dissipating box and the TEC semiconductor cooling plate of the application;
FIG. 4 is a schematic rear view of a radiator tank and a second radiator fin according to the present application;
Fig. 5 is a schematic perspective view of the heat insulation cotton pad of the present application.
In the figure: 1. charging piles; 2. a control panel; 3. a cooling box; 4. sealing cover; 5. a partition plate; 6. a first heat sink fin; 7. a water inlet; 8. a water outlet; 9. a mounting groove; 10. a heat insulating cotton pad; 11. TEC semiconductor refrigerating plate; 12. a second heat sink fin; 13. a blower; 14. a wind scooper; 15. a heat dissipation mechanism; 151. a connecting plate; 152. a water pump; 153. a buckle; 154. a coiled pipe; 155. a first water pipe; 156. and a second water pipe.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1-2 or 4, a TEC water-cooling charging pile in this embodiment includes a charging pile 1, a control panel 2 is fixedly installed on a front surface of the charging pile 1, cooling boxes 3 are fixedly installed on two sides of the charging pile 1, a sealing cover 4 is fixedly installed on one side of each cooling box 3 close to the charging pile 1, a partition 5 is fixedly installed on an inner side of each cooling box 3, two first heat dissipation fins 6 are fixedly installed on inner side walls of each cooling box 3, the first heat dissipation fins 6 are fixedly installed in the cooling boxes 3, and the first heat dissipation fins 6 are in contact with a cooling surface of a TEC semiconductor cooling plate 11.
The top intercommunication of cooling tank 3 has water inlet 7, the top intercommunication of cooling tank 3 has the delivery port 8 that is located water inlet 7 right side, install cooling mechanism 15 on the cooling tank 3, cooling mechanism 15 includes the connecting plate 151 of fixed mounting at second heat radiation fin 12 top, one side fixed mounting that the connecting plate 151 kept away from filling electric pile 1 has water pump 152, control panel 2 is connected with water pump 152 electricity, one side fixed mounting that sealed lid 4 is close to filling electric pile 1 has buckle 153 of a plurality of numbers, fixed mounting has disk pipe 154 between the inboard of a plurality of buckles 153, disk pipe 154's output and water inlet 7 intercommunication, disk pipe 154 closely laminates with filling electric pile 1, and disk pipe 154 is copper disk pipe, delivery port 8 intercommunication has the first raceway 155 with the input intercommunication of water pump 152, the output intercommunication of water pump 152 has the second raceway 156 with disk pipe 154 intercommunication.
In this embodiment, the control panel 2 controls the water pump 152 to pump the cooling liquid in the cooling tank 3 through the first water pipe 155, the water pump 152 uses the second water pipe 156 to send the cooling liquid into the coiled pipe 154, the coiled pipe 154 clings to the charging pile 1, and when the charging pile 1 generates heat, the heat is absorbed by the cooling liquid in the coiled pipe 154, so that the heat of the charging pile 1 is dissipated.
Referring to fig. 1 and 3-5, in the present embodiment, a cooling mechanism is installed on a side of the cooling box 3 away from the charging pile 1. Wherein, refrigeration mechanism is including setting up the mounting groove 9 of one side of keeping away from filling electric pile 1 in cooling tank 3, simultaneously, at the inside wall fixed mounting of mounting groove 9 has thermal-insulated cotton pad 10, and thermal-insulated cotton pad 10's inboard fixed mounting has TEC semiconductor refrigeration piece 11 that the quantity is three.
The cooling box 3 is away from the side of filling stake 1 fixed mounting has second heat radiation fins 12, and second heat radiation fins 12 and TEC semiconductor refrigeration piece 11's the face that generates heat contact, and the side of second heat radiation fins 12 away from filling stake 1 fixed mounting has air-blower 13, and the side of second heat radiation fins 12 away from filling stake 1 fixed mounting has wind scooper 14.
In this embodiment, the TEC semiconductor cooling fin 11 will cool the first heat dissipation fin 6, the cooled first heat dissipation fin 6 will dissipate the heat of the cooling liquid in the cooling tank 3, so that the temperature of the cooling liquid can be better, thereby achieving the purpose that the cooling liquid has a good heat dissipation effect on the charging pile 1, the second heat dissipation fin 12 will absorb the temperature of the heating surface of the TEC semiconductor cooling fin 11, the blower 13 will extract air to blow and dissipate the heat of the second heat dissipation fin 12, and thus the damage of the TEC semiconductor cooling fin 11 due to overheating can be avoided.
The working principle of the embodiment is as follows: the control panel 2 controls the water pump 152 to pump the cooling liquid in the cooling box 3 by the first water pipe 155, the water pump 152 uses the second water pipe 156 to send the cooling liquid into the disc-shaped pipe 154, the disc-shaped pipe 154 is tightly attached to the charging pile 1, when the charging pile 1 generates heat, the heat is absorbed by the cooling liquid in the disc-shaped pipe 154, the cooling liquid absorbing the heat can return to the cooling box 3, the TEC semiconductor refrigerating sheet 11 can cool the first cooling fins 6, the first cooling fins 6 can cool the cooling liquid in the cooling box 3, and thus the temperature of the cooling liquid can be better controlled, and the purpose that the cooling liquid has a good cooling effect on the charging pile 1 is achieved.
The second heat dissipation fins 12 absorb the temperature of the heating surface of the TEC semiconductor cooling plate 11, the air blower 13 can draw air to blow and dissipate heat of the second heat dissipation fins 12, so that the TEC semiconductor cooling plate 11 can be prevented from being damaged due to overheating, cooling liquid in the cooling box 3 can be cooled rapidly through the TEC semiconductor cooling plate 11, and therefore the cooling effect of the cooling liquid on the charging pile 1 is better.
Claims (8)
1. TEC water-cooling fills electric pile, including filling electric pile (1), its characterized in that: the front surface of the charging pile (1) is fixedly provided with a control panel (2), both sides of the charging pile (1) are fixedly provided with cooling boxes (3), one side, close to the charging pile (1), of each cooling box (3) is fixedly provided with a sealing cover (4), the inner side of each cooling box (3) is fixedly provided with a partition plate (5), and the inner side wall of each cooling box (3) is fixedly provided with two first radiating fins (6);
the top of the cooling box (3) is communicated with a water inlet (7), the top of the cooling box (3) is communicated with a water outlet (8) positioned on the right side of the water inlet (7), and a refrigerating mechanism is arranged on one side, far away from the charging pile (1), of the cooling box (3);
The cooling box (3) is kept away from one side fixed mounting who fills electric pile (1) and has second heat radiation fins (12), one side fixed mounting who fills electric pile (1) is kept away from to second heat radiation fins (12) has air-blower (13), one side fixed mounting who fills electric pile (1) is kept away from to second heat radiation fins (12) has wind scooper (14), install cooling mechanism (15) on cooling box (3).
2. The TEC water-cooled charging pile according to claim 1, wherein: the first radiating fins (6) are fixedly arranged in the cooling box (3), and the first radiating fins (6) are in contact with the refrigerating surface of the TEC semiconductor refrigerating sheet (11).
3. The TEC water-cooled charging pile according to claim 1, wherein: the heat dissipation mechanism (15) comprises a connecting plate (151) fixedly installed at the top of the second heat dissipation fin (12), a water pump (152) is fixedly installed on one side, away from the charging pile (1), of the connecting plate (151), a plurality of buckles (153) are fixedly installed on one side, close to the charging pile (1), of the sealing cover (4), a plurality of tray pipes (154) are fixedly installed between the inner sides of the buckles (153), a water outlet (8) is communicated with a first water conveying pipe (155) communicated with the input end of the water pump (152), and a second water conveying pipe (156) communicated with the tray pipes (154) are communicated with the output end of the water pump (152).
4. A TEC water-cooled charging stake according to claim 3, characterized in that: the output end of the disc-shaped pipe (154) is communicated with the water inlet (7).
5. A TEC water-cooled charging stake according to claim 3, characterized in that: the control panel (2) is electrically connected with the water pump (152).
6. The TEC water-cooled charging pile according to claim 1, wherein: the cooling mechanism comprises a mounting groove (9) which is formed in one side, far away from the charging pile (1), of the cooling box (3), a heat insulation cotton pad (10) is fixedly arranged on the inner side wall of the mounting groove (9), and TEC semiconductor cooling sheets (11) with three quantity are fixedly arranged on the inner side of the heat insulation cotton pad (10).
7. The TEC water-cooled charging pile according to claim 6, wherein: the second radiating fins (12) are in contact with the heating surface of the TEC semiconductor refrigerating plate (11).
8. A TEC water-cooled charging stake according to claim 3, characterized in that: the disc-shaped tube (154) is tightly attached to the charging pile (1), and the disc-shaped tube (154) is a copper disc-shaped tube.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323272201.0U CN221023341U (en) | 2023-12-01 | 2023-12-01 | TEC water-cooling fills electric pile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323272201.0U CN221023341U (en) | 2023-12-01 | 2023-12-01 | TEC water-cooling fills electric pile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221023341U true CN221023341U (en) | 2024-05-28 |
Family
ID=91134049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323272201.0U Active CN221023341U (en) | 2023-12-01 | 2023-12-01 | TEC water-cooling fills electric pile |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221023341U (en) |
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2023
- 2023-12-01 CN CN202323272201.0U patent/CN221023341U/en active Active
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