CN220981609U - Refrigerating device and temperature control system - Google Patents

Abstract

The utility model relates to a refrigerating device and a temperature control system, comprising: the first throttle mechanism includes a first throttle valve; the cooling module comprises a first compressor, a first condenser, a first throttle valve and a first heat exchanger which are sequentially communicated to form a cooling loop; the cooling module is provided with a heat exchange pipeline which is communicated between the output end of the first condenser and the input end of the first compressor; the refrigeration module comprises a second compressor, a second condenser, a second throttle valve and a second heat exchanger which are sequentially communicated to form a refrigeration loop; the first pipeline is communicated between the second heat exchanger and the second compressor, and the heat exchange pipeline is thermally coupled with the first pipeline through the third heat exchanger. When the refrigeration module is in high-temperature test of high-power electronic components, the refrigerant in the redundant refrigeration module exchanges heat with the refrigerant in the first pipeline, so that the temperature of the refrigerant in the first pipeline is reduced, and the shutdown accident caused by overhigh exhaust temperature of the compressor due to overhigh load is avoided.

Description

Refrigerating device and temperature control system

Technical Field

The utility model relates to the technical field of temperature control, in particular to a refrigerating device and a temperature control system.

Background

Before the electronic components (such as chips) are shipped, they need to be tested for performance using test equipment. In general, when an electronic component is tested, it is temperature-controlled by a temperature control system. The temperature control system comprises a cold source and a heat source, after the electronic components start to be tested and the temperature rises, the cold source power in the temperature control system is unchanged, and the heat source reduces the power, so that the electronic components are always at the target temperature. When the electronic component suddenly ends the test, the heat source needs to increase power to make the temperature constant in order to ensure that the electronic component is at the target temperature, so that the electronic component is tested at the target temperature in a reciprocating manner because the electronic component does not generate heat.

In the prior art, a bypass pipeline is designed in the cold source, and the bypass pipeline can guide the refrigerant throttled by the condenser to the air return end of the compressor, so that shutdown accidents caused by overhigh exhaust temperature of the compressor due to overhigh load are prevented when high-power electronic components of the cold source are tested at high temperature. However, when the exhaust temperature is too high for protection, more cold energy is lost by the cold source, the temperature control effect of the whole machine is reduced, and the capability of pressing high-power electronic components cannot be achieved. Meanwhile, when the temperature control system is operated, if the exhaust temperature is too high, the temperature control of the electronic components is unstable when the return air is suddenly opened for cooling.

Disclosure of utility model

In view of the above, it is necessary to provide a refrigeration apparatus and a temperature control system capable of preventing an excessive compressor discharge temperature and ensuring temperature control stability of the temperature control system.

A refrigeration device, comprising:

a first throttle mechanism including a first throttle valve;

The cooling module comprises a first compressor, a first condenser, the first throttle valve and a first heat exchanger which are sequentially communicated to form a cooling loop; the cooling module is provided with a heat exchange pipeline which is communicated between the output end of the first condenser and the input end of the first compressor;

The refrigeration module comprises a second compressor, a second condenser, a second throttle valve and a second heat exchanger which are sequentially communicated to form a refrigeration loop;

The first pipeline is communicated between the second heat exchanger and the second compressor, and the heat exchange pipeline is thermally coupled with the first pipeline through the third heat exchanger.

In one embodiment, the heat exchange line is provided independently of the cooling circuit and in parallel with the first heat exchanger.

In one embodiment, one end of the heat exchange pipeline is communicated with the cooling circuit between the first throttle valve and the first heat exchanger, and the other end of the heat exchange pipeline is communicated with the cooling circuit between the first heat exchanger and the first compressor; and the refrigerant in the heat exchange pipeline is expanded and depressurized through the first throttle valve.

In one embodiment, one end of the heat exchange pipeline is communicated with the cooling loop between the first condenser and the first throttle valve, and the other end of the heat exchange pipeline is communicated with the cooling loop between the first heat exchanger and the first compressor;

The first throttling mechanism further comprises a third throttling valve arranged on the heat exchange pipeline, and the refrigerant in the heat exchange pipeline is expanded and depressurized through the third throttling valve.

In one embodiment, the refrigeration device further comprises a first control valve, and the first control valve is installed on the heat exchange pipeline to control on-off of the heat exchange pipeline; and/or

The refrigeration device further comprises a second pipeline which is a part of the cooling loop and is communicated between the first throttle valve and the first heat exchanger; the refrigerating device further comprises a second control valve, and the second control valve is arranged on the second pipeline and used for controlling the on-off of the second pipeline.

In one embodiment, the heat exchange line is part of the cooling circuit and is connected between the output of the first condenser and the input of the first compressor.

In one embodiment, the refrigeration device comprises at least two refrigeration modules, and the first pipeline of each refrigeration module is thermally coupled with the heat exchange pipeline through the same third heat exchanger.

In one embodiment, the refrigeration device further comprises a second throttle mechanism comprising the second throttle valve;

The refrigerating device further comprises a bypass pipeline, the bypass pipeline is independent of the refrigerating loop, one end of the bypass pipeline is communicated with the output end of the second condenser, the other end of the bypass pipeline is communicated with the first pipeline, and refrigerant in the bypass pipeline is expanded and depressurized through the second throttling mechanism.

In one embodiment, one end of the bypass pipeline is communicated with the refrigeration circuit between the second condenser and the second throttle valve, and the other end of the bypass pipeline is communicated with the first pipeline; the second throttling mechanism further comprises a fourth throttling valve, the fourth throttling valve is arranged on the bypass pipeline, and the refrigerant in the bypass pipeline is expanded and depressurized through the fourth throttling valve;

Or one end of the bypass pipeline is communicated with the refrigerating circuit between the second throttle valve and the second heat exchanger, the other end of the bypass pipeline is communicated with the first pipeline, and the refrigerant in the bypass pipeline is expanded and reduced in pressure through the second throttle valve.

In one embodiment, the refrigeration device comprises at least two refrigeration modules, and the first pipeline of each refrigeration module is thermally coupled with the heat exchange pipeline through the same third heat exchanger;

The other end of the bypass pipeline is communicated with the first pipeline between the second heat exchanger and the third heat exchanger; or the other end of the bypass pipeline is communicated with the first pipeline between the third heat exchanger and the second compressor.

In one embodiment, the power of the first compressor is less than the power of the second compressor.

A temperature control system comprising a heating device and a refrigerating device according to any one of the above, wherein the second heat exchanger of the refrigerating device is used for refrigerating different electronic components, and the heating device is used for heating the electronic components so that the temperature of the electronic components is within a preset temperature range.

According to the refrigerating device and the temperature control system, the heat exchange pipeline is thermally coupled with the first pipeline through the third heat exchanger, so that the refrigerant in the heat exchange pipeline can exchange heat with the refrigerant in the first pipeline through the third heat exchanger, when the refrigerating module is in high-power electronic component high-temperature test, the refrigerant in the redundant refrigerating module exchanges heat with the refrigerant in the first pipeline, the temperature of the refrigerant in the first pipeline is reduced, namely the temperature of the return air end flowing to the second compressor is reduced, and the shutdown accident caused by overhigh exhaust temperature of the compressor due to overhigh load is avoided. Compared with the prior art, the method for reducing the return air temperature of the compressor by guiding the refrigerant throttled by the condenser to the return air end of the compressor through the bypass pipeline can not cause the loss of cold in the refrigeration module when the exhaust temperature is excessively high for protection, so that the temperature control effect is better. Meanwhile, when the refrigerating device is operated, if the exhaust temperature of the second compressor is too high, the temperature control of the electronic components is not unstable when the return air is suddenly started for cooling.

Drawings

FIG. 1 is a schematic diagram of a refrigeration apparatus according to an embodiment of the present application;

fig. 2 is a schematic diagram of a refrigeration apparatus according to another embodiment of the present application;

fig. 3 is a schematic diagram of a refrigeration apparatus according to another embodiment of the present application;

fig. 4 is a schematic diagram of a refrigeration apparatus according to still another embodiment of the present application;

fig. 5 is a schematic diagram of a refrigeration apparatus according to another embodiment of the present application;

FIG. 6 is a schematic diagram of a refrigeration apparatus according to yet another embodiment of the present application;

fig. 7 is a control logic diagram for the refrigeration apparatus shown in fig. 4 and 6.

Reference numerals illustrate:

100. A refrigerating device; 10. a cooling module; 11. a first compressor; 12. a first condenser; 13. a first throttle valve; 14. a first heat exchanger; 20. a refrigeration module; 21. a second compressor; 22. a second condenser; 23. a second throttle valve; 24. a second heat exchanger; 30. a heat exchange pipeline; 40. a first pipeline; 50. a third heat exchanger; 60. a third throttle valve; 70. a first control valve; 80. a second control valve; 90. a bypass line; 110. and a fourth throttle valve.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

An embodiment of the application provides a temperature control system for controlling the temperature of an electronic component. Specifically, the electronic component is a chip, and the temperature control system is used for controlling the temperature of the chip. Of course, in other embodiments, the type of the electronic component used for controlling the temperature of the temperature control system is not limited.

Referring to fig. 1, the temperature control system includes a cooling device 100 and a heating device, wherein the cooling device 100 is used as a cold source for cooling electronic components, the heating device is used as a heat source for heating the electronic components, and the cooling device 100 and the heating device are used for cooling and heating to control the temperature of the electronic components.

The refrigeration device 100 includes a first throttling mechanism and a cooling module 10. The first throttle mechanism includes a first throttle valve 13, and the cooling module 10 includes a first compressor 11, a first condenser 12, the first throttle valve 13, and a first heat exchanger 14, which are sequentially connected to form a cooling circuit.

When the cooling module 10 is in operation, the first compressor 11 sucks in the high-temperature low-pressure refrigerant gas output from the output end of the first heat exchanger 14, compresses the refrigerant into the high-temperature high-pressure refrigerant gas, and discharges the high-temperature high-pressure refrigerant gas from the discharge end of the first compressor 11 to the first condenser 12. When passing through the first condenser 12, the refrigerant is condensed into medium-temperature high-pressure refrigerant liquid by the first condenser 12, and is expanded and reduced in pressure into low-temperature low-pressure refrigerant by the first throttle valve 13, and finally is input into the first heat exchanger 14 again from the input end of the first heat exchanger 14. When the low-temperature low-pressure liquid refrigerant enters the first heat exchanger 14, the low-temperature low-pressure liquid refrigerant can exchange heat with a piece to be cooled (electronic component), so that the temperature of the piece to be cooled is controlled. The refrigerant after heat exchange enters the first compressor 11 again from the output end of the first heat exchanger 14, and thus, the refrigerant is circulated and reciprocated.

The refrigeration apparatus 100 further includes a refrigeration module 20, and the refrigeration module 20 includes a second compressor 21, a second condenser 22, a second throttle valve 23, and a second heat exchanger 24, which are sequentially connected to form a refrigeration circuit. The second heat exchanger 24 serves as an evaporator of the refrigeration circuit, and is capable of exchanging heat with electronic components. When the refrigeration module 20 is in operation, the second compressor 21 sucks in the high-temperature low-pressure refrigerant gas output from the output end of the second heat exchanger 24, compresses the refrigerant into the high-temperature high-pressure refrigerant gas, and discharges the high-temperature high-pressure refrigerant gas from the discharge end of the second compressor 21 to the second condenser 22. When passing through the second condenser 22, the refrigerant is condensed into medium-temperature high-pressure refrigerant liquid by the second condenser 22, and is expanded and reduced in pressure into low-temperature low-pressure refrigerant by the second throttle valve 23, and finally is input into the second heat exchanger 24 again from the input end of the second heat exchanger 24. When the low-temperature low-pressure liquid refrigerant enters the second heat exchanger 24, the low-temperature low-pressure liquid refrigerant can exchange heat with the electronic components, so that the temperature of the electronic components is controlled. The refrigerant after heat exchange enters the second compressor 21 again from the output end of the second heat exchanger 24, and thus, the refrigerant is circulated and reciprocated.

The cooling module 10 further includes a heat exchange pipeline 30, and the heat exchange pipeline 30 is connected between the output end of the first condenser 12 and the input end of the first compressor 11. The refrigeration unit 100 further includes a first conduit 40 and a third heat exchanger 50 as part of the refrigeration circuit, the first conduit 40 being in communication between the second heat exchanger 24 and the second compressor 21, the heat exchange conduit 30 being thermally coupled to the first conduit 40 by the third heat exchanger 50.

In the above arrangement, the heat exchange pipeline 30 is thermally coupled to the first pipeline 40 through the third heat exchanger 50, so that the refrigerant in the heat exchange pipeline 30 can exchange heat with the refrigerant in the first pipeline 40 through the third heat exchanger 50, and when the refrigeration module 20 is in a high-power electronic component high-temperature test, the refrigerant in the redundant refrigeration module 10 (the refrigeration module 10 is in a non-use state under a part of production working conditions) exchanges heat with the refrigerant in the first pipeline 40, so that the temperature of the refrigerant in the first pipeline 40 is reduced, namely, the temperature of the refrigerant flowing to the air return end of the second compressor 21 is reduced, and the shutdown accident caused by the overhigh exhaust temperature of the compressor due to overhigh load is avoided. Compared with the prior art that the air return temperature of the compressor is reduced by guiding the refrigerant throttled by the condenser to the air return end of the compressor through the bypass pipeline 90, the air return temperature control device can not cause the loss of cold in the refrigeration module 20 when the air discharge temperature is excessively high for protection, so that the temperature control effect is better. Meanwhile, when the cooling device 100 is operated, if the exhaust temperature of the second compressor 21 is too high, the temperature control of the electronic components is not unstable when the return air is suddenly opened for cooling.

In some embodiments, the power of the first compressor 11 is smaller than that of the second compressor 21, at this time, the cooling capacity provided by the cooling module 10 is smaller than that provided by the cooling module 20, and the cooling module 10 with small cooling capacity is used to cool the compressor return air temperature of the cooling module 20 with large cooling capacity, so as to reduce the waste of cooling capacity. Of course, in other embodiments, the power of the first compressor 11 and the second compressor 21 is not limited, for example, the power of the first compressor 11 may be set to be greater than or equal to the power of the second compressor 21.

In some embodiments, the heat exchange line 30 is provided independently of the cooling circuit and in parallel with the first heat exchanger 14. In this way, the heat exchange pipeline 30 does not prevent the normal operation of the first heat exchanger 14 when the refrigerant in the heat exchange pipeline 30 exchanges heat with the refrigerant in the first pipeline 40.

Further, with continued reference to fig. 1, one end of the heat exchange pipeline 30 is connected to the cooling circuit between the first throttle valve 13 and the first heat exchanger 14, and the other end is connected to the cooling circuit between the first heat exchanger 14 and the first compressor 11, and the cooling in the heat exchange pipeline 30 is expanded and reduced in pressure through the first throttle valve 13. In this way, the refrigerant flowing out of the first condenser 12 is throttled and depressurized by the first throttle valve 13 and then is divided into two paths, one path flows to the first heat exchanger 14, and the other path flows to the heat exchange pipeline 30, that is, the two paths of refrigerant are throttled by the first throttle valve 13, so that the structure of the refrigeration device 100 is simpler.

In other embodiments, referring to fig. 2, one end of the heat exchange line 30 is connected to the cooling circuit between the first condenser 12 and the first throttle valve 13, and the other end is connected to the cooling circuit between the first heat exchanger 14 and the first compressor 11. The first throttle mechanism further comprises a third throttle valve 60, and the cooling medium in the heat exchange pipeline 30 is expanded and depressurized through the third throttle valve 60. In this way, the refrigerant flowing to the first heat exchanger 14 is expanded and reduced in pressure through the first throttle valve 13, and the refrigerant in the heat exchange pipeline 30 is expanded and reduced in pressure through the third throttle valve 60, so that the expansion and the reduction of the two paths of refrigerants can be independently controlled.

Further, the refrigeration device 100 further includes a first control valve 70, where the first control valve 70 is installed on the heat exchange pipeline 30 to control on/off of the heat exchange pipeline 30. The refrigeration device 100 further includes a second pipeline as a part of the cooling circuit, the second pipeline is communicated between the first throttle valve 13 and the first heat exchanger 14, and the refrigeration device 100 further includes a second control valve 80, where the second control valve 80 is disposed on the second pipeline, so as to control on-off of the second pipeline.

In the above arrangement, the first control valve 70 can control the on/off of the heat exchange pipeline 30, so as to control whether the refrigerant of the cooling module 10 enters the third heat exchanger 50 to exchange heat with the refrigerant in the first pipeline 40, and the second control valve 80 can control the on/off of the second pipeline, so as to control whether the refrigerant of the cooling module 10 enters the first heat exchanger 14 to cool the to-be-cooled member.

In other embodiments, referring to fig. 3, the heat exchange line 30 is part of the cooling circuit and is connected between the output of the first condenser 12 and the input of the first compressor 11. In this way, the refrigerant in the heat exchange pipeline 30 can still exchange heat with the refrigerant in the first pipeline 40 through the third heat exchanger 50, so as to achieve the purpose of reducing the return air temperature of the second compressor 21.

Further, the heat exchange pipeline 30 is connected between the first throttle valve 13 and the first heat exchanger 14, so that the low-temperature refrigerant exchanges heat with the refrigerant in the first pipeline 40 when the low-temperature refrigerant does not pass through the first heat exchanger 14, the return air temperature of the second compressor 21 can be sufficiently reduced, and the shutdown accident caused by the overhigh exhaust air temperature of the second compressor 21 due to overhigh load is avoided.

It is contemplated that in other embodiments, the heat exchange line 30 may also be connected between the output of the first condenser 12 and the input of the first compressor 11, such as, but not limited to, the heat exchange line 30 being connected between the output of the first condenser 12 and the first heat exchanger 14.

In some embodiments, the refrigeration apparatus 100 includes at least two refrigeration modules 20, the first circuit 40 of each refrigeration module 20 being thermally coupled to the heat exchange circuit 30 by the same third heat exchanger 50. In this way, the cooling medium in the heat exchange pipeline 30 can exchange heat with the cooling medium in the at least two first pipelines 40 through the same third heat exchanger 50, so that the return air temperature of the at least two refrigeration modules 20 is kept consistent, and a consistent temperature control effect is achieved.

In some embodiments, referring to fig. 4, the refrigeration device 100 further includes a second throttling mechanism including the second throttling valve 23 described above. The refrigeration device 100 further includes a bypass line 90, the bypass line 90 being provided independently of the refrigeration circuit, one end of the bypass line 90 being in communication with the output of the second condenser 22, and the other end being in communication with the first line 40, the refrigerant in the bypass line 90 being expanded and depressurized by the second throttle mechanism. When the high-power electronic component is subjected to the ultrahigh temperature test, the refrigerant in the heat exchange pipeline 30 can be controlled to exchange heat with the refrigerant in the first pipeline 40, the bypass pipeline 90 is controlled to guide the refrigerant expanded and depressurized by the second throttling mechanism to the first pipeline 40, and the air return temperature of the second compressor 21 can be reduced under the dual functions of the heat exchange pipeline 30 and the bypass pipeline 90, so that the second compressor 21 is prevented from being stopped due to the ultrahigh exhaust temperature during the ultrahigh temperature working condition.

It should be noted that, when the low-power electronic component is tested at a high temperature, the refrigerant after the expansion and the depressurization of the second throttling mechanism may be led to the first pipeline 40 only through the bypass pipeline 90, and the refrigerant led through the bypass pipeline 90 reduces the air return temperature of the second compressor 21, so that the low-power electronic component is tested at a lower temperature than the high-power electronic component, and the heat sink lost by the bypass pipeline 90 is not too large, so that the better temperature control effect can still be achieved.

Further, the bypass line 90 has one end connected to the refrigeration circuit between the second condenser 22 and the second throttle valve 23, and the other end connected to the first line 40. The second throttle mechanism further includes a fourth throttle valve 110, the fourth throttle valve 110 being mounted on the bypass line 90, the refrigerant in the bypass line 90 being expanded and depressurized through the fourth throttle valve 110. In this way, the refrigerant flowing to the second heat exchanger 24 is expanded and depressurized by the second throttle valve 23, and the refrigerant in the bypass line 90 is expanded and depressurized by the fourth throttle valve 110, so that the expansion and depressurization of the two paths of refrigerant can be independently controlled.

In other embodiments, referring to fig. 5, one end of the bypass line 90 is connected to the refrigeration circuit between the second throttle valve 23 and the second heat exchanger 24, and the other end is connected to the first line 40, and the refrigerant in the bypass line 90 is expanded and depressurized through the second throttle valve 23. In this way, the refrigerant flowing out of the second condenser 22 is throttled and depressurized by the second throttle valve 23 and then is divided into two paths, one path flows to the second heat exchanger 24, and the other path flows to the bypass line 90, that is, the two paths of refrigerant are throttled by the second throttle valve 23, so that the structure of the refrigeration device 100 is simpler.

Further, with continued reference to fig. 4 and 5, the other end of the bypass line 90 is connected to the first line 40 between the second heat exchanger 24 and the third heat exchanger 50, so that after the refrigerant in the bypass line 90 flows to the first line 40, the refrigerant in at least two first lines 40 exchanges heat through the third heat exchanger 50, and the return air temperature of each second compressor 21 is consistent, so as to achieve a consistent temperature control effect.

It is conceivable that in other embodiments, referring to fig. 6, the other end of the bypass line 90 may be further disposed to be connected to the first line 40 between the third heat exchanger 50 and the second compressor 21, where the refrigerant in at least two first lines 40 exchanges heat through the third heat exchanger 50, and flows into the bypass line 90 to mix with the refrigerant after exchanging heat in the third heat exchanger 50, and where the return air temperature uniformity effect of each second compressor 21 is weaker.

The control principle of the refrigeration apparatus 100 provided in the present application will be described in detail with three specific embodiments:

First embodiment (see fig. 1):

The refrigeration device 100 includes a cooling module 10 and two refrigeration modules 20. The heat exchange pipeline 30 is independent of the cooling circuit, one end of the heat exchange pipeline 30 is communicated with the cooling circuit between the first throttle valve 13 and the first heat exchanger 14, and the other end of the heat exchange pipeline 30 is communicated with the cooling circuit between the first heat exchanger 14 and the first compressor 11. The heat exchange line 30 is provided with a first control valve 70 and the cooling circuit between the first throttle valve 13 and the first heat exchanger 14 is provided with a second control valve 80. The cooling medium in the heat exchange line 30 is expanded and reduced in pressure by the first throttle valve 13, and the heat exchange line 30 is thermally coupled with the two first lines 40 of the two refrigeration modules 20 by the same third heat exchanger 50. Wherein the power of the first compressor 11 is smaller than the power of the second compressor 21.

The refrigeration module 20 is used for testing high-power electronic components:

when in high temperature working condition: the refrigeration module 20 requires a return air to cool down, the first control valve 70 is open and the second control valve 80 is closed.

Normal temperature working condition: the first control valve 70 is closed, and the second control valve 80 is opened or closed according to the cooling capacity demand of the cooling member to be cooled in the cooling module 10.

Low temperature operating mode: the refrigeration module 20 does not need to return air for cooling, the first control valve 70 is closed, the second control valve 80 is opened, and the first heat exchanger 14 of the cooling module 10 can be used for cooling the cooling object.

Wherein the low temperature condition is-55 ℃ to 0 ℃, the normal temperature condition is 0 ℃ to 50 ℃, and the high temperature condition is 50 ℃ to 150 ℃, and of course, in other embodiments, the specific temperatures of the low temperature condition, the normal temperature condition and the high temperature condition are not limited.

The refrigeration module 20 is used for testing low-power electronic components:

the return air temperature of the refrigeration module 20 is not too high under the three working conditions of low temperature, normal temperature and high temperature, so the first control valve 70 is not required to be opened.

Second embodiment (see fig. 4):

The difference from the first embodiment is that: each refrigeration module 20 is correspondingly provided with a bypass pipeline 90, one end of each bypass pipeline 90 is communicated between the second condenser 22 and the second throttle valve 23, the other end of each bypass pipeline 90 is communicated on the first pipeline 40 between the second heat exchanger 24 and the third heat exchanger 50, a fourth throttle valve 110 is arranged on the bypass pipeline 90, and the fourth throttle valve 110 is communicated in the bypass pipeline 90 for expansion and depressurization.

Referring to fig. 7, the refrigeration module 20 is used for testing high-power electronic components:

The bypass line 90 is closed under the three conditions of low temperature, normal temperature and high temperature, and the first control valve 70 and the second control valve 80 are controlled in the same manner as in the embodiment.

Referring to fig. 7, the refrigeration module 20 is used for testing low-power electronic components:

When in high temperature working condition: the first control valve 70 and the second control valve 80 are both closed and the bypass line 90 is opened.

At normal temperature, the working condition is as follows: the first control valve 70 is closed, the second control valve 80 is opened or closed according to the cooling demand of the cooling member to be cooled in the cooling module 10, and the bypass line 90 is closed.

At low temperature conditions: the first control valve 70 is closed, the second control valve 80 is open, and the bypass line 90 is closed.

Third embodiment (see fig. 6):

the difference from the second embodiment is that: the other end of the bypass line 90 communicates with the first line 40 between the third heat exchanger 50 and the second compressor 21.

The control manner of the refrigeration module 20 used for testing high-power electronic components and testing low-power electronic components is the same as that of the embodiment.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (11)

1. A refrigeration device, comprising:

A first throttle mechanism including a first throttle valve (13);

The cooling module (10) comprises a first compressor (11), a first condenser (12), a first throttle valve (13) and a first heat exchanger (14) which are sequentially communicated to form a cooling loop; the cooling module (10) is provided with a heat exchange pipeline (30), and the heat exchange pipeline (30) is communicated between the output end of the first condenser (12) and the input end of the first compressor (11);

The refrigeration module (20) comprises a second compressor (21), a second condenser (22), a second throttle valve (23) and a second heat exchanger (24) which are sequentially communicated to form a refrigeration loop; -the refrigeration module (20) has a first conduit (40) as part of the refrigeration circuit, the first conduit (40) being in communication between the second heat exchanger (24) and the second compressor (21); and

-A third heat exchanger (50), the heat exchange line (30) being thermally coupled to the first line (40) by means of the third heat exchanger (50).

2. A refrigeration unit according to claim 1, characterized in that the heat exchange circuit (30) is provided independently of the cooling circuit and in parallel with the first heat exchanger (14).

3. A refrigeration unit according to claim 2, wherein one end of the heat exchange line (30) is connected to the cooling circuit between the first throttle valve (13) and the first heat exchanger (14), and the other end is connected to the cooling circuit between the first heat exchanger (14) and the first compressor (11); the refrigerant in the heat exchange pipeline (30) is expanded and depressurized through the first throttle valve (13).

4. A refrigeration unit according to claim 2, wherein one end of the heat exchange line (30) is connected to the cooling circuit between the first condenser (12) and the first throttle valve (13), and the other end is connected to the cooling circuit between the first heat exchanger (14) and the first compressor (11);

The first throttling mechanism further comprises a third throttling valve (60) arranged on the heat exchange pipeline (30), and the cooling in the heat exchange pipeline (30) is expanded and depressurized through the third throttling valve (60).

5. A refrigeration unit according to claim 3 or 4, characterized in that it further comprises a first control valve (70), said first control valve (70) being mounted on said heat exchange line (30) to control the on-off of said heat exchange line (30); and/or

The refrigeration device further comprises a second pipeline which is a part of the cooling circuit and is communicated between the first throttle valve (13) and the first heat exchanger (14); the refrigerating device further comprises a second control valve (80), and the second control valve (80) is arranged on the second pipeline and used for controlling the on-off of the second pipeline.

6. A refrigeration unit according to claim 1, wherein the heat exchange circuit (30) is part of the cooling circuit and communicates between the output of the first condenser (12) and the input of the first compressor (11).

7. The refrigeration unit according to claim 1, characterized in that it comprises at least two said refrigeration modules (20), said first circuit (40) of each said refrigeration module (20) being thermally coupled to said heat exchange circuit (30) through the same said third heat exchanger (50).

8. A refrigerating device according to claim 1, characterized in that it further comprises a second throttling mechanism comprising the second throttling valve (23);

The refrigerating device further comprises a bypass pipeline (90), the bypass pipeline (90) is independent of the refrigerating circuit, one end of the bypass pipeline (90) is communicated with the output end of the second condenser (22), the other end of the bypass pipeline is communicated with the first pipeline (40), and the refrigerant in the bypass pipeline (90) is expanded and reduced in pressure through the second throttling mechanism.

9. A refrigeration unit as claimed in claim 8, wherein said bypass line (90) has one end communicating with said refrigeration circuit between said second condenser (22) and said second throttle valve (23) and the other end communicating with said first line (40); the second throttling mechanism further comprises a fourth throttling valve (110), the fourth throttling valve (110) is arranged on the bypass pipeline (90), and cooling in the bypass pipeline (90) is expanded and reduced in pressure through the fourth throttling valve (110);

Or one end of the bypass pipeline (90) is communicated with the refrigerating circuit between the second throttle valve (23) and the second heat exchanger (24), the other end of the bypass pipeline is communicated with the first pipeline (40), and the refrigerating in the bypass pipeline (90) is expanded and reduced in pressure through the second throttle valve (23).

10. The refrigeration unit according to claim 9, characterized in that it comprises at least two said refrigeration modules (20), said first circuit (40) of each said refrigeration module (20) being thermally coupled to said heat exchange circuit (30) by means of the same said third heat exchanger (50);

the other end of the bypass pipeline (90) is communicated with the first pipeline (40) between the second heat exchanger (24) and the third heat exchanger (50); or the other end of the bypass pipeline (90) is communicated with the first pipeline (40) between the third heat exchanger (50) and the second compressor (21).

11. A temperature control system, characterized by comprising a heating device and a refrigerating device according to any of claims 1-10, wherein the second heat exchanger (24) of the refrigerating device is used for refrigerating different electronic components, and the heating device is used for heating the electronic components such that the temperature of the electronic components is within a preset temperature range.