CN216245012U - Refrigeration module and chip testing and sorting machine - Google Patents
Refrigeration module and chip testing and sorting machine Download PDFInfo
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- CN216245012U CN216245012U CN202122821230.2U CN202122821230U CN216245012U CN 216245012 U CN216245012 U CN 216245012U CN 202122821230 U CN202122821230 U CN 202122821230U CN 216245012 U CN216245012 U CN 216245012U
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Abstract
The utility model relates to the technical field of high and low temperature tests, in particular to a refrigeration module and a chip test sorting machine. The refrigeration module comprises an evaporator, a compressor, a condenser, a throttling device and a return air cooling device; the evaporator, the compressor, the condenser and the throttling device are sequentially connected in a surrounding manner, a refrigerant output by the evaporator can enter the compressor for compression and then enter the condenser for condensation, and the refrigerant output by the condenser can enter the evaporator after being throttled by the throttling device; the air return cooling device can cool the refrigerant output from the evaporator and then enter the compressor. The chip testing and sorting machine comprises the refrigerating module. The utility model provides a refrigeration module and a chip test separator, which are used for relieving the technical problem that a compressor in the refrigeration module of the chip test separator in the prior art is easy to damage due to overheating of an air return refrigerant.
Description
Technical Field
The utility model relates to the technical field of high and low temperature tests, in particular to a refrigeration module and a chip test sorting machine.
Background
In the semiconductor manufacturing and packaging test industry, a chip testing and sorting machine is a device for testing semiconductor devices and sorting the semiconductor devices based on test results, can test the performance of the semiconductor devices in the environments of high temperature, low temperature, normal temperature and other specified temperatures, and is suitable for testing the semiconductor devices with higher requirements in industry, automobiles, military industry and the like.
The chip testing and sorting machine generally comprises a testing module, a refrigerating module and a heating module, wherein the refrigerating module can refrigerate, the heating module can heat, the testing module is provided with a testing chamber used for testing a semiconductor device, and the refrigerating module and the heating module both act on the semiconductor device to enable the semiconductor device to reach the expected temperature.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a refrigeration module of a chip testing and sorting machine in the prior art, where the refrigeration module includes a compressor 1 ', a condenser 2', a throttling device 3 ', and an evaporator 4', and the above four components respectively output/input a refrigerant through a delivery pipe. The compressor 1 ' sucks low-pressure gaseous refrigerant from the evaporator 4 ', compresses the refrigerant and then discharges the high-pressure high-temperature gaseous refrigerant to the condenser 2 ', the refrigerant forms high-pressure liquid refrigerant after releasing heat, the refrigerant is throttled and decompressed by the throttling device 3 ' to generate low-pressure low-temperature gas-liquid two-phase refrigerant, the low-pressure low-temperature gas-liquid two-phase refrigerant enters the evaporator 4 ', the two-phase refrigerant absorbs heat in the evaporator 4 ' to form low-pressure gaseous refrigerant, and the low-pressure gaseous refrigerant is sucked by the compressor 1 ' to complete the whole refrigerant circulation. The evaporator 4' acts on the semiconductor device to evaporate the cooling medium to absorb heat to the semiconductor device, thereby reducing the temperature of the semiconductor device.
However, when the chip testing handler is working, if the heat load of the evaporator 4 ' is higher than the cooling capacity, the return air refrigerant from the evaporator 4 ' to the compressor 1 ' will be overheated, which may cause the compressor to be damaged.
Therefore, the present application provides a new refrigeration module and chip test handler for the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a refrigeration module to solve the technical problem that a compressor in the refrigeration module of a chip test separator in the prior art is easy to damage due to overheating of an air return refrigerant.
The utility model also aims to provide a chip testing and sorting machine to further solve the technical problem that a compressor in a refrigerating module of the chip testing and sorting machine in the prior art is easy to damage due to overheating of an air return refrigerant.
In view of the first object, the present invention provides a refrigeration module;
comprises an evaporator, a compressor, a condenser, a throttling device and a return air cooling device;
the evaporator, the compressor, the condenser and the throttling device are sequentially connected in a surrounding manner, a refrigerant output by the evaporator can enter the compressor for compression and then enter the condenser for condensation, and the refrigerant output by the condenser can enter the evaporator after being throttled by the throttling device;
the air return cooling device can cool the refrigerant output from the evaporator and then enter the compressor.
Further, the return air temperature reduction device comprises a first pipeline;
the first pipeline is connected between the liquid outlet end of the throttling device and the liquid outlet end of the evaporator and can communicate the liquid outlet end of the throttling device with the liquid outlet end of the evaporator.
Further, the return air cooling device also comprises a first heat exchanger;
the first heat exchanger is arranged between the evaporator and the compressor, the first pipeline is connected to a liquid inlet of the first heat exchanger, and a liquid outlet end of the throttling device and the liquid inlet of the first heat exchanger can be communicated.
Further, the return air cooling device further comprises a first on-off valve, and the first on-off valve is arranged on the first pipeline and used for controlling on-off of the first pipeline.
Further, the first on-off valve is an electric valve.
Further, the return air temperature reduction device comprises a second pipeline and a throttling device arranged on the second pipeline;
the second pipeline is connected between the liquid outlet end of the condenser and the liquid outlet end of the evaporator and can communicate the liquid outlet end of the condenser with the liquid outlet end of the evaporator.
Further, the return air cooling device also comprises a second heat exchanger;
the second heat exchanger is arranged between the evaporator and the compressor, the second pipeline is connected to a liquid inlet of the second heat exchanger, and a liquid outlet end of the condenser and the liquid inlet of the second heat exchanger can be communicated with each other.
Furthermore, the return air cooling device further comprises a second on-off valve, and the second on-off valve is arranged on the second pipeline and used for controlling the on-off of the second pipeline.
Further, the second shut-off valve is an electric valve.
By adopting the technical scheme, the refrigeration module has the following beneficial effects:
it should be noted that the evaporator outputs a low-pressure gaseous refrigerant, the low-pressure gaseous refrigerant enters the compressor to be compressed and then outputs a high-pressure high-temperature gaseous refrigerant to the condenser, the high-pressure gaseous refrigerant is condensed by the condenser to release heat to form a high-pressure liquid refrigerant, the high-pressure liquid refrigerant is throttled and depressurized by the throttling device to generate a low-pressure low-temperature gas-liquid two-phase refrigerant, the low-pressure low-temperature gas-liquid two-phase refrigerant enters the evaporator, the two-phase refrigerant is evaporated and absorbed in the evaporator to form a low-pressure gaseous refrigerant, and the temperature of the low-pressure gaseous refrigerant is increased due to heat absorption and evaporation.
The refrigeration module cools the high-temperature gaseous return air refrigerant output from the evaporator through the return air cooling device to form a low-temperature refrigerant and then enters the compressor, so that the temperature of the return air refrigerant entering the compressor is reduced, and the compressor is prevented from being damaged due to overheating of the return air refrigerant to a certain extent.
Based on the second objective, the utility model provides a chip testing and sorting machine, which comprises the refrigeration module.
By adopting the technical scheme, the chip testing and sorting machine has the following beneficial effects:
by arranging the refrigeration module in the chip testing and sorting machine, correspondingly, the chip testing and sorting machine has all the advantages of the refrigeration module, and the description is omitted.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a schematic diagram of a refrigeration module of a prior art chip test handler;
fig. 2 is a schematic structural diagram of a refrigeration module according to an embodiment of the present invention;
fig. 3 is a second schematic structural diagram of a refrigeration module according to an embodiment of the present invention;
fig. 4 is a third schematic structural diagram of a refrigeration module according to an embodiment of the present invention;
fig. 5 is a fourth schematic structural diagram of a refrigeration module according to an embodiment of the present invention.
Reference numerals:
1' -a compressor; 2' -a condenser; 3' -a throttling device; 4' -an evaporator;
1-an evaporator; 2-a compressor; 3-a condenser; 4-a throttling device;
51-a first conduit; 52-first heat exchanger; 53-first on-off valve; 54-a second conduit; 55-a restrictor; 56-a second heat exchanger; 57-second on-off valve.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example one
Referring to fig. 2, the present embodiment provides a refrigeration module, which includes an evaporator 1, a compressor 2, a condenser 3, a throttling device 4, and a return air temperature-reducing device; the evaporator 1, the compressor 2, the condenser 3 and the throttling device 4 are sequentially connected in a surrounding manner, a refrigerant output by the evaporator 1 can enter the compressor 2 for compression and then enter the condenser 3 for condensation, and the refrigerant output by the condenser 3 can enter the evaporator 1 after being throttled by the throttling device 4; the return air temperature reduction device can reduce the temperature of the refrigerant output from the evaporator 1 and then enter the compressor 2.
Alternatively, the throttling device 4 is a throttle valve or an expansion valve or the like.
It should be noted that the evaporator 1 outputs a low-pressure gaseous refrigerant, the low-pressure gaseous refrigerant enters the compressor 2 to be compressed and then outputs a high-pressure high-temperature gaseous refrigerant to the condenser 3, the high-pressure gaseous refrigerant is condensed and released heat by the condenser 3 to form a high-pressure liquid refrigerant, the high-pressure liquid refrigerant is throttled and depressurized by the throttling device 4 to generate a low-pressure low-temperature gas-liquid two-phase refrigerant, the low-pressure low-temperature gas-liquid two-phase refrigerant enters the evaporator 1, the two-phase refrigerant is evaporated and absorbed heat in the evaporator 1 to form a low-pressure gaseous refrigerant, and the temperature of the low-pressure gaseous refrigerant is increased due to heat absorption and evaporation.
The refrigeration module of this embodiment forms a low-temperature refrigerant after cooling the high-temperature gaseous return air refrigerant output from the evaporator 1 through the return air cooling device, and then enters the compressor 2, so that the temperature of the return air refrigerant entering the compressor 2 is reduced, and the return air refrigerant is prevented from being overheated to some extent and damaging the compressor 2.
Preferably, referring to fig. 2 and 3, in the present embodiment, the return air cooling device includes a first pipeline 51; the first pipeline 51 is connected between the liquid outlet end of the throttling device 4 and the liquid outlet end of the evaporator 1, and can communicate the liquid outlet end of the throttling device 4 with the liquid outlet end of the evaporator 1.
The liquid outlet end of the throttling device 4 is arranged between the throttling device 4 and the evaporator 1, and the liquid outlet end of the evaporator 1 is arranged between the evaporator 1 and the compressor 2.
With this arrangement, the first conduit 51 communicates between the liquid outlet end of the restriction 4 and the liquid outlet end of the evaporator 1. Therefore, part of the low-pressure and low-temperature refrigerant output from the liquid outlet end of the throttling device 4 can enter the first pipeline 51, part of the low-pressure and low-temperature refrigerant can enter the evaporator 1, and the refrigerant output from the first pipeline 51 and the refrigerant output from the evaporator 1 are mixed and then enter the compressor 2 together.
The refrigerant output from the evaporator 1 is a high-temperature low-pressure refrigerant, and the refrigerant output from the first pipeline 51 is a low-pressure low-temperature refrigerant, so that the refrigerant output from the evaporator 1 can be cooled after being mixed with the high-temperature low-pressure refrigerant, the temperature of the return air refrigerant entering the compressor 2 is reduced, and the compressor 2 is prevented from being damaged due to overheating of the return air refrigerant to a certain extent.
Preferably, referring to fig. 3, in the present embodiment, the return air temperature reduction device further includes a first heat exchanger 52; the first heat exchanger 52 is disposed between the evaporator 1 and the compressor 2, and the first pipeline 51 is connected to a liquid inlet of the first heat exchanger 52, so as to communicate a liquid outlet end of the throttling device 4 with a liquid inlet of the first heat exchanger 52.
With this arrangement, the first on-off valve 53 is opened, and the first pipe 51 connects the liquid outlet end of the throttling device 4 with the liquid inlet of the first heat exchanger 52. Therefore, part of the low-pressure and low-temperature refrigerant output from the liquid outlet end of the throttling device 4 can enter the first pipeline 51 to reach the first heat exchanger 52, part of the low-pressure and low-temperature refrigerant can enter the evaporator 1 and then enter the first heat exchanger 52, and the refrigerant entering the first heat exchanger 52 from the first pipeline 51 and the refrigerant entering the first heat exchanger 52 from the evaporator 1 are fully subjected to heat exchange in the first heat exchanger 52 and then output from the first heat exchanger 52, so that the refrigerant and the refrigerant are mixed and then enter the compressor 2 together.
The refrigerant entering the first heat exchanger 52 from the evaporator 1 is a high-temperature low-pressure refrigerant, and the refrigerant entering the first heat exchanger 52 from the first pipeline 51 is a low-pressure low-temperature refrigerant, so that the refrigerant output by the evaporator 1 can be cooled after the heat exchange between the refrigerant and the first heat exchanger 52, the temperature of the return air refrigerant entering the compressor 2 after mixing is reduced, and the compressor 2 is prevented from being damaged due to overheating of the return air refrigerant to a certain extent.
Preferably, referring to fig. 2 and fig. 3, in this embodiment, the return air cooling device further includes a first on-off valve 53, and the first on-off valve 53 is disposed on the first pipeline 51 and is used for controlling on-off of the first pipeline 51.
Alternatively, the first on-off valve 53 is an electric valve or a manual valve.
With this arrangement, the first on-off valve 53 is opened, so that the first pipe 51 communicates between the liquid outlet end of the throttle device 4 and the liquid outlet end of the evaporator 1, thereby controlling the on-off of the first pipe 51.
Preferably, in the present embodiment, the first on-off valve 53 is an electric valve.
For example, first on-off valve 53 is the solenoid valve, and such setting can realize the first on-off valve 53 of automated control, uses manpower sparingly, reduces the cost of labor, makes the use of refrigeration module more intelligent high-efficient.
Preferably, referring to fig. 4 and 5, in the present embodiment, the return air temperature reducing device includes a second pipeline 54 and a throttling device 55 disposed on the second pipeline 54; the second pipeline 54 is connected between the liquid outlet end of the condenser 3 and the liquid outlet end of the evaporator 1, and can communicate the liquid outlet end of the condenser 3 with the liquid outlet end of the evaporator 1.
The liquid outlet end of the condenser 3 is disposed between the throttling device 4 and the condenser 3, and the liquid outlet end of the evaporator 1 is disposed between the evaporator 1 and the compressor 2.
Alternatively, the restrictor 55 is a capillary tube, a throttle valve, an expansion valve, or the like.
With this arrangement, the second conduit 54 communicates between the liquid outlet end of the condenser 3 and the liquid outlet end of the evaporator 1. Therefore, part of the high-pressure liquid refrigerant output from the liquid outlet end of the condenser 3 can enter the second pipeline 54 and the restrictor 55, and part of the high-pressure liquid refrigerant can enter the evaporator 1, and the refrigerant output from the second pipeline 54 and the restrictor 55 and the refrigerant output from the evaporator 1 are mixed and then enter the compressor 2 together.
The refrigerant output from the evaporator 1 is a high-temperature low-pressure refrigerant, and the high-pressure liquid refrigerant entering the second pipeline 54 is throttled by the throttle 55 to form a low-temperature gas-liquid two-phase refrigerant, so that the refrigerant output from the evaporator 1 can be cooled after being mixed with the high-temperature low-pressure liquid refrigerant, the temperature of the return air refrigerant entering the compressor 2 is reduced, and the compressor 2 is prevented from being damaged due to overheating of the return air refrigerant to a certain extent.
Preferably, referring to fig. 5, in the present embodiment, the return air temperature reduction device further includes a second heat exchanger 56; the second heat exchanger 56 is disposed between the evaporator 1 and the compressor 2, and the second pipeline 54 is connected to a liquid inlet of the second heat exchanger 56, and is capable of communicating a liquid outlet end of the condenser 3 with a liquid inlet of the second heat exchanger 56.
So arranged, the second shut-off valve 57 is opened and the second line 54 connects the liquid outlet of the condenser 3 to the liquid inlet of the second heat exchanger 56. Therefore, part of the high-pressure refrigerant output from the liquid outlet end of the condenser 3 can enter the second pipeline 54 to reach the second heat exchanger 56, part of the high-pressure refrigerant can enter the evaporator 1 and then enter the second heat exchanger 56, and the refrigerant entering the second heat exchanger 56 from the second pipeline 54 and the refrigerant entering the second heat exchanger 56 from the evaporator 1 are fully heat-exchanged in the second heat exchanger 56 and then output from the second heat exchanger 56, so that the refrigerant and the refrigerant are mixed and then enter the compressor 2 together.
The refrigerant entering the second heat exchanger 56 from the evaporator 1 is a high-temperature low-pressure refrigerant, and the refrigerant entering the second heat exchanger 56 from the second pipeline 54 is throttled by the throttle 55 to form a low-temperature gas-liquid two-phase refrigerant, which is a low-temperature refrigerant, so that the refrigerant output by the evaporator 1 can be cooled after the refrigerant exchanges heat in the second heat exchanger 56, the temperature of the return air refrigerant entering the compressor 2 after mixing is reduced, and the return air refrigerant is prevented from being overheated to damage the compressor 2 to a certain extent.
Preferably, referring to fig. 4 and 5, in this embodiment, the return air cooling device further includes a second on-off valve 57, and the second on-off valve 57 is disposed on the second pipeline 54 and is used for controlling on-off of the second pipeline 54.
Alternatively, the second shut-off valve 57 is an electric valve or a manual valve.
With this arrangement, the second cut-off valve 57 is opened, so that the second pipeline 54 communicates the liquid outlet end of the condenser 3 with the liquid outlet end of the evaporator 1, thereby controlling the cut-off of the second pipeline 54.
Preferably, in the present embodiment, the second cut-off valve 57 is an electric valve.
For example, the second on-off valve 57 is an electromagnetic valve, and by adopting the arrangement, the second on-off valve 57 can be automatically controlled, so that the labor is saved, the labor cost is reduced, and the refrigeration module can be used more intelligently and efficiently.
Example two
The second embodiment provides a chip testing and sorting machine, the chip testing and sorting machine comprises the refrigeration module of the first embodiment, the technical features of the refrigeration module disclosed in the first embodiment are also applicable to the second embodiment, and the technical features of the refrigeration module disclosed in the first embodiment are not described repeatedly.
The chip testing sorter that this embodiment provided includes above-mentioned refrigeration module, has further alleviated the compressor among the refrigeration module of chip testing sorter that exists among the prior art and has been because of the fragile technical problem of return air refrigerant overheated.
The chip testing handler of the present embodiment has the advantages of the cooling module of the first embodiment, which are described in detail in the first embodiment and will not be repeated here.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A refrigeration module is characterized by comprising an evaporator (1), a compressor (2), a condenser (3), a throttling device (4) and an air return cooling device;
the evaporator (1), the compressor (2), the condenser (3) and the throttling device (4) are sequentially connected in a surrounding manner, a refrigerant output by the evaporator (1) can enter the compressor (2) for compression and then enter the condenser (3) for condensation, and the refrigerant output by the condenser (3) can enter the evaporator (1) after being throttled by the throttling device (4);
the air return cooling device can cool the refrigerant output from the evaporator (1) and then enter the compressor (2).
2. A refrigeration module as claimed in claim 1, characterized in that the return air temperature reduction means comprise a first line (51);
the first pipeline (51) is connected between the liquid outlet end of the throttling device (4) and the liquid outlet end of the evaporator (1), and the liquid outlet end of the throttling device (4) and the liquid outlet end of the evaporator (1) can be communicated.
3. A refrigeration module as recited in claim 2, wherein said return air temperature reduction device further comprises a first heat exchanger (52);
the first heat exchanger (52) is arranged between the evaporator (1) and the compressor (2), the first pipeline (51) is connected to a liquid inlet of the first heat exchanger (52), and a liquid outlet end of the throttling device (4) can be communicated with a liquid inlet of the first heat exchanger (52).
4. The refrigeration module according to claim 2, wherein the return air temperature reduction device further comprises a first on-off valve (53), and the first on-off valve (53) is arranged on the first pipeline (51) and used for controlling the on-off of the first pipeline (51).
5. A refrigeration module according to claim 4, characterized in that the first on-off valve (53) is an electric valve.
6. A refrigeration module as claimed in claim 1, characterized in that the return air temperature lowering means comprise a second line (54) and a restriction (55) provided in the second line (54);
the second pipeline (54) is connected between the liquid outlet end of the condenser (3) and the liquid outlet end of the evaporator (1) and can communicate the liquid outlet end of the condenser (3) with the liquid outlet end of the evaporator (1).
7. The refrigeration module of claim 6, wherein said return air temperature reduction device further comprises a second heat exchanger (56);
the second heat exchanger (56) is arranged between the evaporator (1) and the compressor (2), the second pipeline (54) is connected to a liquid inlet of the second heat exchanger (56), and a liquid outlet end of the condenser (3) and a liquid inlet of the second heat exchanger (56) can be communicated with each other.
8. The refrigeration module as recited in claim 6, characterized in that the return air temperature reduction device further comprises a second cut-off valve (57), and the second cut-off valve (57) is arranged on the second pipeline (54) and used for controlling the cut-off of the second pipeline (54).
9. Refrigeration module according to claim 8, characterized in that the second shut-off valve (57) is an electric valve.
10. A chip testing handler comprising a refrigeration module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122821230.2U CN216245012U (en) | 2021-11-16 | 2021-11-16 | Refrigeration module and chip testing and sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122821230.2U CN216245012U (en) | 2021-11-16 | 2021-11-16 | Refrigeration module and chip testing and sorting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216245012U true CN216245012U (en) | 2022-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202122821230.2U Active CN216245012U (en) | 2021-11-16 | 2021-11-16 | Refrigeration module and chip testing and sorting machine |
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| CN (1) | CN216245012U (en) |
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2021
- 2021-11-16 CN CN202122821230.2U patent/CN216245012U/en active Active
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