CN220962339U

CN220962339U - Efficient radiator structure for computer

Info

Publication number: CN220962339U
Application number: CN202321909359.1U
Authority: CN
Inventors: 毛金宝
Original assignee: Suzhou Suzhong Precision Metal Product Co ltd
Current assignee: Suzhou Suzhong Precision Metal Product Co ltd
Priority date: 2023-07-20
Filing date: 2023-07-20
Publication date: 2024-05-14
Anticipated expiration: 2033-07-20

Abstract

The utility model provides a high-efficiency radiator structure for a computer, which comprises a base, a bracket, a heat conduction cover plate, a heat conduction unit and a heat dissipation unit, wherein the base is provided with a heat conduction cover plate; the bracket is hinged at the bottom of the base; the base is internally provided with a flow guide cavity, the upper part of the base is provided with an opening, and the heat conduction cover plate is buckled on the opening; the rear side surface of the base is provided with a socket communicated with the flow guide cavity; the heat radiation unit comprises a heat radiation shell and a fan; in the utility model, the heat-conducting unit increases the heat-radiating area in the diversion cavity, optimizes the airflow channel, and improves the air flow speed and direction to the greatest extent by reasonably arranging the heat-radiating unit and the heat-conducting unit, so that the airflow when the fan blows through the heat-conducting fin can be effectively guided, and the heat-radiating effect is enhanced; the temperature of the display card can be reduced, the display card and other related components are effectively protected, and the stability and performance of the equipment are improved; is especially important for long-time high-load operation, games, graphic processing and other tasks, and can prolong the service life of equipment.

Description

Efficient radiator structure for computer

Technical Field

The utility model relates to the technical field of radiators, in particular to a high-efficiency radiator structure for a computer.

Background

With the continuous pursuit of computer performance in modern society, the use of notebook computers has become an important component in people's daily life and work. In particular, in the fields of graphic design, games, data processing, and the like, there is an increasing demand for high-performance graphic cards. However, due to the small size of the notebook computer and the limited heat dissipation space, the heat generated by the display card in the operation process is difficult to effectively dissipate, and the problem of insufficient heat dissipation is increasingly prominent.

Graphics cards are one of the most important components in notebook computers, which are responsible for handling graphics and image related tasks and generate a lot of heat. If the temperature of the display card is too high, the performance of the equipment is reduced, the stability is affected and even faults occur. To solve this problem, various heat dissipation techniques and heat sink structures have been proposed and applied.

The common notebook computer radiator structure in the market at present mainly comprises radiating fins, fans, radiating pipes and other components. The heat sink is typically made of a highly thermally conductive material such as copper, aluminum, or aluminum magnesium alloy for increasing the heat dissipation area and accelerating heat transfer. The fan is responsible for blowing through the radiating fins so as to enhance the radiating effect. The heat dissipating tube is often used to quickly transfer the heat generated by the graphics card to the heat sink, so as to improve the heat dissipating efficiency.

However, the conventional radiator structure has some limitations and disadvantages in solving the problem of heat dissipation of the display card of the notebook computer. Firstly, due to the size limitation of the notebook computer, the volume and the heat dissipation area of the heat sink are relatively small, and the improvement of the heat dissipation effect is limited. Secondly, the design of the air flow channel in the radiator is not optimized, so that the air flow speed and direction when the cooling fan blows across the radiating fins are not ideal, and the radiating efficiency is affected.

Disclosure of utility model

Aiming at the technical defects, the utility model aims to provide the efficient radiator structure for the computer, which can effectively guide the air flow when the fan blows through the heat conducting fin and enhance the radiating effect.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

A high-efficiency radiator structure for a computer comprises a base, a bracket, a heat conduction cover plate, a heat conduction unit and a heat dissipation unit; the support is hinged to the bottom of the base; the heat conduction cover plate is buckled on the opening; a jack communicated with the flow guide cavity is arranged on the rear side surface of the base; the heat dissipation unit comprises a heat dissipation shell and a fan; the heat dissipation shell penetrates through the socket from the outside of the base and is detachably inserted into the flow guide cavity; the fan is fixed in the heat dissipation shell; an air inlet and an air outlet are arranged on the heat dissipation shell, the air inlet is positioned in the flow guide cavity, and the air outlet is positioned outside the base; the heat conduction unit is arranged in the diversion cavity; the heat conduction unit comprises a bottom plate and a plurality of heat conduction sheets fixed on the bottom plate; the heat conducting fins are arranged in parallel at intervals, and the upper ends of the heat conducting fins are abutted against the lower end face of the heat conducting cover plate; the heat conduction cover plate is densely provided with a plurality of vent holes, and the vent holes are communicated with the diversion cavity.

Preferably, a separation plate is arranged in the diversion cavity and is fixedly connected with the base; the splitter plate divides the diversion cavity into a left cavity and a right cavity; the heat conduction unit and the heat dissipation unit are respectively provided with two heat conduction units and two heat dissipation units, and are respectively arranged in the left cavity and the right cavity.

Preferably, the upper part of the bottom plate is integrally provided with a connecting plate; the connecting plate is provided with a connecting hole; a connecting rod matched with the connecting hole is arranged in the flow guide cavity; the connecting rod is fixedly connected with the base; the connecting holes of the connecting plates are sleeved on the connecting rods.

Preferably, a sponge strip is arranged in the diversion cavity; the sponge strip is abutted to the lower ends of the radiating fins.

Preferably, an anti-slip pad is fixedly arranged on the upper end surface of the heat conduction cover plate; the two anti-slip pads are symmetrically arranged on two sides of the heat conducting cover plate.

Preferably, the two brackets are symmetrically arranged on two sides of the base; the bracket comprises a bedplate and a supporting plate; one end of the bedplate is hinged with one end of the base opposite to the socket; the top of the supporting plate is hinged to the lower end face of the base; the upper end surface of the bedplate is provided with a plurality of slots matched with the supporting plate; the slots are distributed on the bedplate in an array mode at equal intervals; the bottom of the supporting plate is movably inserted into the slot.

Preferably, an arc baffle is fixedly arranged at one end of the base opposite to the socket.

Compared with the prior art, the utility model has the following beneficial effects:

In the utility model, the heat-conducting unit increases the heat-radiating area in the diversion cavity, optimizes the airflow channel, and improves the air flow speed and direction to the greatest extent by reasonably arranging the heat-radiating unit and the heat-conducting unit, so that the airflow when the fan blows through the heat-conducting fin can be effectively guided, and the heat-radiating effect is enhanced; the temperature of the display card can be reduced, the display card and other related components are effectively protected, and the stability and performance of the equipment are improved; is especially important for long-time high-load operation, games, graphic processing and other tasks, and can prolong the service life of equipment.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model. It is evident that the drawings in the following description are only examples, from which other drawings can be obtained by a person skilled in the art without the inventive effort.

FIG. 1 is a schematic diagram of the structure of the present utility model;

Fig. 2 is a schematic diagram of a split structure of the present utility model.

Wherein:

1. a vent hole; 2. an anti-slip pad; 3. a thermally conductive cover plate; 4. a base; 5. a slot; 6. a support plate; 7. a platen; 8. an arc baffle; 9. a fan; 10. a heat dissipation housing; 11. an air outlet; 12. an air inlet; 13. a socket; 14. a partition plate; 15. a connecting rod; 16. a diversion cavity; 17. a sponge strip; 18. a bottom plate; 19. and a heat conductive sheet.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments will be clearly and completely described with reference to the accompanying drawings in the embodiments of the present utility model, and the following embodiments are used to illustrate the present utility model, but are not intended to limit the scope of the present utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1 and 2, a high-efficiency radiator structure for a computer comprises a base 4, a bracket, a heat conducting cover plate 3, a heat conducting unit and a heat radiating unit; the bracket is hinged at the bottom of the base 4 and is used for supporting the base 4 and adjusting the setting angle of the base 4; the inside of the base 4 is provided with a flow guide cavity 16, the upper part is provided with an opening, the heat conduction cover plate 3 is buckled on the opening, the heat conduction cover plate 3 can be taken down from the opening, and the heat conduction cover plate 3 is made of a copper plate, so that good heat conductivity is ensured; the rear side surface of the base 4 is provided with a socket 13 communicated with the diversion cavity 16; the heat radiation unit comprises a heat radiation shell 10 and a fan 9; the heat dissipation shell 10 passes through the insertion opening 13 from the outside of the base 4 and is detachably inserted into the diversion cavity 16; the fan 9 is fixed in the heat dissipation shell 10; an air inlet 12 and an air outlet 11 are arranged on the heat dissipation shell 10, the air inlet 12 is positioned in the flow guide cavity 16, and the air outlet 11 is positioned outside the base 4; when the fan 9 rotates, the air in the diversion cavity 16 is discharged to the outside of the diversion cavity 16 through the air inlet 12 and the air outlet 11; the heat conduction unit is arranged inside the diversion cavity 16; the heat conducting unit comprises a bottom plate 18 and a plurality of heat conducting fins 19 fixed on the bottom plate 18, and the bottom plate 18 is attached to the bottom of the flow guiding cavity 16; the heat conducting fins 19 are arranged in parallel at intervals, the upper ends of the heat conducting fins 19 are abutted against the lower end face of the heat conducting cover plate 3, and an airflow channel is formed between the heat conducting fins 19 and communicated with the air inlet 12; a plurality of vent holes 1 are densely distributed on the heat conduction cover plate 3, and the vent holes 1 are communicated with the diversion cavity 16; part of heat emitted by the display card is transferred to the inside of the flow guide cavity 16 through the heat conducting cover plate 3, so that the temperature in the flow guide cavity 16 is increased, the fan 9 is started to exhaust air in the flow guide cavity 16, the vent holes 1 densely distributed on the heat conducting cover plate 3 uniformly suck air in the bottom area of the notebook computer, after the air flow flows, air with lower external temperature blows at the bottom position of the notebook computer, the heat is brought into the flow guide cavity 16, and then the heat is discharged through the air inlet 12 and the air outlet 11, so that air exhaust type heat dissipation is realized; the heat conduction fins 19 can uniformly conduct heat in the flow guide cavity 16, so that the influence on the overall heat dissipation effect due to overhigh temperature of a local area in the flow guide cavity 16 after long-time use is prevented; the densely distributed ventilation holes 1 can enable the bottom of the notebook computer to be in uniform contact with flowing air, so that uniform heat dissipation of the notebook computer is realized.

Further, a partition plate 14 is arranged in the diversion cavity 16, and the partition plate 14 is fixedly connected with the base 4; the partition plate 14 partitions the diversion chamber 16 into a left chamber and a right chamber; the heat conduction unit and the heat dissipation unit are respectively provided with two heat conduction units and two heat dissipation units, and are respectively arranged in the left cavity and the right cavity, so that the heat dissipation effect of the left side and the right side of the notebook computer is more uniform, and the heat dissipation effect is improved.

Further, a connection plate is integrally provided at the upper part of the bottom plate 18; the connecting plate is provided with a connecting hole; a connecting rod 15 matched with the connecting hole is arranged in the diversion cavity 16; the connecting rod 15 is fixedly connected with the base 4; the connecting hole of connecting plate cup joints and sets up on connecting rod 15, puts into the water conservancy diversion intracavity 16 with the heat conduction unit, and the connecting plate is fixed on connecting rod 15, inserts the jack 13 with the heat dissipation unit, then the lock is gone up heat conduction apron 3 and is accomplished the installation.

Further, a sponge strip 17 is arranged in the diversion cavity 16; the sponge strip 17 is abutted to the lower end of the radiating fin, when the base 4 is obliquely arranged, dust in the flow guide cavity 16 can slide down and is absorbed by the sponge strip 17, so that cleaning is facilitated.

Further, an anti-slip pad 2 is fixedly arranged on the upper end surface of the heat conduction cover plate 3; the two anti-slip pads 2 are symmetrically arranged on two sides of the heat conduction cover plate 3, and after the notebook computer is placed on the heat conduction cover plate 3, the friction force between the anti-slip pads 2 and the notebook computer is increased, so that the notebook computer is prevented from sliding off.

Further, two brackets are arranged and symmetrically arranged on two sides of the base 4; the bracket comprises a bedplate 7 and a supporting plate 6; one end of the bedplate 7 is hinged with one end of the base 4 opposite to the socket 13; the top of the supporting plate 6 is hinged on the lower end surface of the base 4; a plurality of slots 5 matched with the supporting plate 6 are arranged on the upper end surface of the bedplate 7; the slots 5 are distributed on the bedplate 7 in an equally-spaced array; the bottom of the supporting plate 6 is movably inserted into the slot 5, and the supporting plate 6 is inserted into different slots 5, so that the inclination angle of the base 4 can be adjusted.

Further, an arc baffle 8 is fixedly arranged at one end, opposite to the socket 13, of the base 4, so that the notebook computer is prevented from slipping down.

Those skilled in the art will appreciate that while some embodiments described herein include some features contained in other embodiments but not others, combinations of features of different embodiments are equally meant to be within the scope of the utility model and form different embodiments. For example, in the above embodiments, those skilled in the art can use the above embodiments in combination according to known technical solutions and technical problems to be solved by the present utility model.

The foregoing description is only illustrative of the preferred embodiment of the present utility model, and is not to be construed as limiting the utility model, but is to be construed as limiting the utility model to any simple modification, equivalent variation and variation of the above embodiments according to the technical matter of the present utility model without departing from the scope of the utility model.

Claims

1. The efficient radiator structure for the computer is characterized by comprising a base (4), a bracket, a heat conduction cover plate (3), a heat conduction unit and a heat dissipation unit; the support is hinged to the bottom of the base (4); a flow guide cavity (16) is arranged in the base (4), an opening is arranged at the upper part of the base, and the heat conduction cover plate (3) is buckled on the opening; a socket (13) communicated with the diversion cavity (16) is arranged on the rear side surface of the base (4); the heat radiation unit comprises a heat radiation shell (10) and a fan (9); the heat dissipation shell (10) passes through the socket (13) from the outside of the base (4) and is detachably inserted into the diversion cavity (16); the fan (9) is fixed in the heat dissipation shell (10); an air inlet (12) and an air outlet (11) are arranged on the heat dissipation shell (10), the air inlet (12) is positioned in the flow guide cavity (16), and the air outlet (11) is positioned outside the base (4); the heat conduction unit is arranged in the diversion cavity (16); the heat conduction unit comprises a base plate (18) and a plurality of heat conduction sheets (19) fixed on the base plate (18); the heat conducting fins (19) are arranged in parallel at intervals, and the upper ends of the heat conducting fins (19) are abutted against the lower end face of the heat conducting cover plate (3); a plurality of vent holes (1) are densely distributed on the heat conduction cover plate (3), and the vent holes (1) are communicated with the flow guide cavity (16).

2. The efficient radiator structure for the computer according to claim 1, wherein a partition plate (14) is arranged in the diversion cavity (16), and the partition plate (14) is fixedly connected with the base (4); the splitter plate (14) divides the diversion cavity (16) into a left cavity and a right cavity; the heat conduction unit and the heat dissipation unit are respectively provided with two heat conduction units and two heat dissipation units, and are respectively arranged in the left cavity and the right cavity.

3. A high-efficiency radiator structure for a computer according to claim 1, characterized in that the upper part of the bottom plate (18) is integrally provided with a connecting plate; the connecting plate is provided with a connecting hole; a connecting rod (15) matched with the connecting hole is arranged in the flow guiding cavity (16); the connecting rod (15) is fixedly connected with the base (4); the connecting holes of the connecting plates are sleeved on the connecting rods (15).

4. A high-efficiency radiator structure for a computer according to claim 1, characterized in that a sponge strip (17) is arranged in the diversion cavity (16).

5. The efficient radiator structure for a computer according to any one of claims 1 to 4, wherein an anti-slip pad (2) is fixedly arranged on the upper end surface of the heat conducting cover plate (3); the two anti-slip pads (2) are symmetrically arranged on two sides of the heat conducting cover plate (3).

6. A high-efficiency radiator structure for a computer according to any one of claims 1 to 4, wherein two of said brackets are arranged symmetrically on both sides of said base (4); the bracket comprises a bedplate (7) and a supporting plate (6); one end of the bedplate (7) is hinged with one end of the base (4) opposite to the socket (13); the top of the supporting plate (6) is hinged to the lower end face of the base (4); the upper end surface of the bedplate (7) is provided with a plurality of slots (5) which are matched with the supporting plate (6); the slots (5) are distributed on the bedplate (7) in an equally-spaced array; the bottom of the supporting plate (6) is movably inserted into the slot (5).

7. A high-efficiency radiator structure for a computer according to any one of claims 1 to 4, wherein an arc-shaped baffle (8) is fixedly arranged at one end of the base (4) opposite to the socket (13).