CN220821478U

CN220821478U - Pressing plate structure of integrated circuit packaging wire bonding machine

Info

Publication number: CN220821478U
Application number: CN202322663145.7U
Authority: CN
Inventors: 段江韬; 刘伟; 李华培
Original assignee: Xi'an Guozhi Electronic Technology Co ltd
Current assignee: Xi'an Guozhi Electronic Technology Co ltd
Priority date: 2023-09-28
Filing date: 2023-09-28
Publication date: 2024-04-19
Anticipated expiration: 2033-09-28

Abstract

The utility model provides a pressing plate structure of an integrated circuit packaging wire welding machine, which belongs to the technical field of wire welding machines and comprises a base plate arranged at the bottom side of the wire welding machine, wherein the top of the base plate is provided with a clamping assembly for limiting members to be welded through mutually approaching pressing plates at multiple angles. According to the utility model, the clamping assembly is arranged, so that the pressing plate limits the integrated circuit package, the limiting plate limits and guides the integrated circuit package through the electric push rod, the integrated circuit package can be positioned at the center of the base plate, meanwhile, a series of transmissions of the limiting plate can drive the pressing plate to move downwards, the integrated circuit package is limited in the horizontal direction and simultaneously completes the peripheral synchronous limiting, the synchronous limiting clamping of the integrated circuit package in the horizontal direction and the longitudinal direction is ensured, the stability of the integrated circuit package is ensured, and the welding wire effect on the integrated circuit package is improved.

Description

Pressing plate structure of integrated circuit packaging wire bonding machine

Technical Field

The utility model relates to the technical field of fertilizer processing equipment, in particular to a pressing plate structure of an integrated circuit packaging wire bonding machine.

Background

The integrated circuit is a miniature electronic device or component, and is made up by adopting a certain technological process, and making the elements of transistor, resistor, capacitor and inductor and wiring required in a circuit together on a small semiconductor chip or medium substrate or several small semiconductor chips or medium substrates, then packaging them in a tube shell so as to obtain the invented miniature structure with the required circuit function.

Chinese patent application No.: the utility model of CN202222024541.0 discloses a platen structure of a wire bonding machine. The welding machine solves the technical problems that an existing pressing plate for a welding machine is inconvenient to replace, the position of the pressing plate cannot be adjusted, the universality is poor, and the like. The pressing plate structure of the wire welding machine comprises a pressing plate main body made of heat-resistant materials, wherein a connecting body and a mounting body are mounted on the pressing plate main body, a welding plate groove for mounting a welding plate is further formed in the pressing plate main body, the connecting body is mounted on one side of the welding plate groove, a clamping groove is further formed in the connecting body, the mounting body is mounted on the other side of the welding plate groove, a threaded hole is formed in the mounting body, one end of the welding plate is clamped in the clamping groove of the connecting body, the other end of the welding plate leans against the mounting body, a fixing hole is further formed in the welding plate, a fixing screw penetrates through the fixing hole and is matched with the threaded hole in the mounting body, two ends of the pressing plate main body are T-shaped parts, clamping blocks are further connected in a sliding mode, adjusting grooves are formed in the clamping blocks, however, in the practical application process, the existing pressing plate is limited by unidirectional extrusion, other parts are not limited in the welding wire process, sliding occurs under the action of external force, and therefore the stability of the integrated circuit packaging is affected.

Disclosure of utility model

In view of this, the utility model provides a pressing plate structure of a wire bonding machine for packaging integrated circuits, which can synchronously limit and clamp the periphery of the integrated circuit package, thereby ensuring the stability of the integrated circuit package.

In order to solve the technical problems, the utility model provides a pressing plate structure of an integrated circuit packaging wire bonding machine, which comprises a base plate arranged at the bottom side of the wire bonding machine, wherein the top of the base plate is provided with a clamping assembly for limiting members to be welded through mutually approaching pressing plates at multiple angles;

The clamping assembly comprises two movable boxes, the movable boxes are slidably connected to the tops of base plates, two movable lead screws are rotationally connected to the movable boxes, a transmission gear is fixedly connected to the bottoms of the movable lead screws, a transmission rack is meshed to one side of the transmission gear, the same limiting plate is fixedly connected between the two transmission racks, lead screw bases are connected to the outer surfaces of the movable lead screws in a threaded mode, and the two lead screw bases extend to the outer portions of the movable boxes and are fixedly connected with pressing plates.

Further, two spouts have been seted up to movable box one side, the spout is linked together with movable box inner chamber, lead screw seat sliding connection is in the spout, the cell body has been seted up to movable box one side, and limiting plate sliding connection is in the cell body, limiting plate one side fixedly connected with reset spring, the reset spring other end and movable box inner wall one side fixed connection.

Further, the equal fixedly connected with backup pad in bed plate top both sides, backup pad one side fixedly connected with two electric putter, electric putter keeps away from the one end and the removal case one side fixed connection of backup pad.

Further, the bed plate top is provided with sweeps the subassembly, it includes the fixed block to sweep the subassembly, the sliding tray has been seted up to fixed block one side, be provided with the gasbag in the sliding tray, gasbag one side and sliding tray inner wall one side fixed connection, gasbag opposite side fixedly connected with connecting rod, connecting rod sliding connection is in the sliding tray, connecting rod one end and removal case one side fixed connection.

Further, the connecting pipe is fixedly connected with the bottom of the air bag, the connecting pipe is embedded in the fixed block, a plurality of air blowing pipes are fixedly connected with one side of the connecting pipe, and one end of each air blowing pipe extends to the outside of the fixed block.

Further, the top of the base plate is provided with a movable frame, and one side of the movable frame is provided with a welding main body.

In summary, compared with the prior art, the application has at least one of the following beneficial technical effects:

1. According to the integrated circuit packaging device, the clamping assembly is arranged, the electric push rod drives the limiting plate to move through the moving box to be attached to the integrated circuit packaging, the integrated circuit packaging drives the limiting plate to move in the groove body, the limiting plate drives the transmission gear to rotate through the movable transmission rack, the transmission gear drives the lead screw seat to move in the groove through the moving lead screw, the lead screw seat drives the pressing plate to move downwards, the pressing plate limits the integrated circuit packaging, the limiting plate limits and guides the integrated circuit packaging through the electric push rod, the integrated circuit packaging can be located at the center of the base plate, meanwhile, a series of driving of the limiting plate can drive the pressing plate to move downwards, the integrated circuit packaging is limited in the horizontal direction and simultaneously completes peripheral side synchronous limiting, the integrated circuit packaging is ensured to be clamped in the horizontal direction and the longitudinal synchronous limiting, the stability of the integrated circuit packaging is ensured, and the welding wire effect on the integrated circuit packaging is improved.

2. According to the utility model, the sweeping component is arranged, the movable box drives the connecting rod to move, the connecting rod drives the air bag to shrink, so that air in the air bag is discharged through the connecting pipe and the air blowing pipe and sweeps the base plate, and the remnants and dust thereof after welding wire processing are removed, so that the base plate is kept clean, the influence of the remnants on subsequent processing caused by welding wire processing is avoided, meanwhile, self-cleaning after welding wires is realized, and the workload of workers is reduced.

Drawings

FIG. 1 is a schematic view of a three-dimensional structure of the present utility model;

FIG. 2 is an enlarged schematic view of the portion A of FIG. 1 in accordance with the present utility model;

Fig. 3 is a perspective exploded view of the clamping assembly of the present utility model.

Reference numerals illustrate:

1. A base plate; 2. a clamping assembly; 201. a pressing plate; 202. a screw rod seat; 203. moving the lead screw; 204. a transmission gear; 205. a limiting plate; 206. a return spring; 207. a drive rack; 208. a moving case; 209. a chute; 210. an electric push rod; 211. a support plate; 3. a moving rack; 4. welding the main body; 5. a purge assembly; 501. an air bag; 502. an air blowing pipe; 503. a sliding groove; 504. a connecting rod; 505. and a fixed block.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to fig. 1 to 3 of the embodiments of the present utility model. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. All other embodiments, which are obtained by a person skilled in the art based on the described embodiments of the utility model, fall within the scope of protection of the utility model.

As shown in fig. 1-3: the embodiment provides an integrated circuit encapsulation bonding wire machine clamp plate structure, including installing in the bed plate 1 of bonding wire machine bottom side, the bed plate 1 top is provided with clamping assembly 2 for through the spacing welding component of waiting of clamp plate multi-angle that is close to each other, the bed plate 1 top is provided with removes frame 3, removes frame 3 one side and is provided with welding main part 4.

The clamping assembly 2 comprises two moving boxes 208, the moving boxes 208 are slidably connected to the top of the base plate 1, two moving screws 203 are rotationally connected to the moving boxes 208, a transmission gear 204 is fixedly connected to the bottom of the moving screws 203, a transmission rack 207 is meshed to one side of the transmission gear 204, the two transmission racks 207 are fixedly connected with a same limiting plate 205, screw bases 202 are connected to the outer surfaces of the moving screws 203 in a threaded manner, the two screw bases 202 extend to the outside of the moving boxes 208 and are fixedly connected with a pressing plate 201, two sliding grooves 209 are formed in one side of the moving boxes 208, the sliding grooves 209 are communicated with the inner cavity of the moving boxes 208, the screw bases 202 are slidably connected in the sliding grooves 209, a groove body is formed in one side of the moving boxes 208, the limiting plate 205 is slidably connected in the groove body, a reset spring 206 is fixedly connected to one side of the limiting plate 205, a supporting plate 211 is fixedly connected to both sides of the top of the base plate 1, two electric push rods 210 are fixedly connected to one side of a supporting plate 211, one end of the electric push rod 210, which is far away from the supporting plate 211, is fixedly connected with one side of a moving box 208, which is fixedly connected with the other end of a reset spring 206, which is fixedly connected with one side of the inner wall of the moving box 208, two sides of the top of a base plate 1 are fixedly connected with the supporting plate 211, one side of the supporting plate 211 is fixedly connected with two electric push rods 210, one end of the electric push rod 210, which is far away from the supporting plate 211, is fixedly connected with one side of the moving box 208, through the clamping assembly 2, the electric push rods 210 drive a limiting plate 205 to move and attach to an integrated circuit package, the integrated circuit package drives the limiting plate 205 to move in a groove body, the limiting plate 205 drives a transmission gear 204 to rotate through a transmission rack 207, the transmission gear 204 drives a screw seat 202 to move in a chute 209 through a transmission screw 203, the screw seat 202 drives a pressing plate 201 to move downwards, and the pressing plate 201 limits the integrated circuit package, limiting plate 205 carries out spacing direction to the integrated circuit package through electric putter 210 for the integrated circuit package can be in the central point of bed plate 1 put, and a series of transmission of limiting plate 205 can drive clamp plate 201 downwardly moving simultaneously, makes the integrated circuit package receive spacing while accomplishing week side synchronous spacing in the horizontal direction, guarantees the integrated circuit package in horizontal direction with the synchronous spacing centre gripping of fore-and-aft, guarantees the stability of integrated circuit package, improves the bonding wire effect to the integrated circuit package.

The base plate 1 top is provided with sweeps subassembly 5, sweep subassembly 5 includes fixed block 505, sliding tray 503 has been seted up to fixed block 505 one side, be provided with gasbag 501 in the sliding tray 503, gasbag 501 one side and sliding tray 503 inner wall one side fixed connection, gasbag 501 opposite side fixedly connected with connecting rod 504, connecting rod 504 sliding connection is in sliding tray 503, connecting rod 504 one end and removal case 208 one side fixed connection, gasbag 501 bottom fixedly connected with connecting pipe, and the connecting pipe inlays and locate in the fixed block 505, and a plurality of bonding wires 502 of connecting pipe one side fixedly connected with, bonding wire 502 one end extends to the fixed block 505 outside, through setting up and sweeping subassembly 5, remove case 208 and drive connecting rod 504 and remove, connecting rod 504 drives gasbag 501 shrink, make the air in the gasbag 501 pass through connecting pipe and bonding wire 502 and sweep air outlet and to base plate 1, remove the incomplete material and dust after the bonding wire processing, thereby keep clean on the base plate 1, avoid the influence of processing incomplete material to subsequent processing, simultaneously, self-cleaning after the realization, reduce staff's work load.

Working principle: when the integrated circuit packaging device is used, an integrated circuit package is placed on the base plate 1 by a worker, then, the worker starts the electric push rod 210, the electric push rod 210 drives the movable box 208 to move, the movable box 208 drives the limiting plate 205 to move, the limiting plate 205 is attached to the integrated circuit package, the integrated circuit package drives the limiting plate 205 to move in the groove body, the limiting plate 205 drives the transmission rack 207 to move, the transmission rack 207 drives the transmission gear 204 to rotate, the transmission gear 204 drives the movable screw 203 to rotate, the movable screw 203 drives the screw seat 202 to move in the sliding groove 209, the screw seat 202 drives the pressing plate 201 to move downwards, the welding wire 201 limits the integrated circuit package, then, the welding main body 4 moves under the driving of the movable frame 3 and performs welding treatment on the integrated circuit package, after the completion of the welding treatment, the electric push rod 210 performs resetting movement, the electric push rod 210 drives the movable box 208 to move, the movable box 208 drives the connecting rod 504 to move, the connecting rod 504 drives the air bag 501 to shrink, and air in the air bag 501 is discharged through the connecting pipe and the blowing pipe 502 to sweep the base plate 1.

Furthermore, it should be noted that, in the description of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those skilled in the art according to the specific circumstances.

While the foregoing is directed to the preferred embodiments of the present utility model, it will be appreciated by those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present utility model, and such modifications and adaptations are intended to be comprehended within the scope of the present utility model.

Claims

1. An integrated circuit package bonding wire machine clamp plate structure, its characterized in that: the welding wire machine comprises a base plate (1) arranged at the bottom side of the welding wire machine, wherein a clamping assembly (2) is arranged at the top of the base plate (1), the clamping assembly (2) comprises two movable boxes (208), and the movable boxes (208) are connected to the top of the base plate (1) in a sliding manner;

The movable box (208) is rotationally connected with two movable lead screws (203), a transmission gear (204) is fixedly connected to the bottom of the movable lead screw (203), a transmission rack (207) is meshed on one side of the transmission gear (204), the same limiting plate (205) is fixedly connected between the two transmission racks (207), lead screw bases (202) are connected with the outer surface of the movable lead screw (203) in a threaded mode, and the two lead screw bases (202) extend to the outer portion of the movable box (208) and are fixedly connected with pressing plates (201) and are used for limiting members to be welded in the circumferential direction through the pressing plates (201) which are close to each other.

2. The integrated circuit package wire bonding machine platen structure of claim 1, wherein: two spouts (209) have been seted up to removal case (208) one side, spout (209) are linked together with remove case (208) inner chamber, lead screw seat (202) sliding connection is in spout (209), the cell body has been seted up to removal case (208) one side, and limiting plate (205) sliding connection in the cell body, limiting plate (205) one side fixedly connected with reset spring (206), reset spring (206) other end and removal case (208) inner wall one side fixed connection.

3. The integrated circuit package wire bonding machine platen structure of claim 2, wherein: the utility model discloses a movable box, including base plate (1), backup pad (211) are all fixedly connected with in both sides at the top of base plate (1), backup pad (211) one side fixedly connected with two electric putter (210), one end and movable box (208) one side fixedly connected with that backup pad (211) are kept away from to electric putter (210).

4. The integrated circuit package wire bonding machine platen structure of claim 3, wherein: the top of the base plate (1) is provided with a purging component (5), the purging component (5) comprises a fixed block (505), one side of the fixed block (505) is provided with a sliding groove (503), an air bag (501) is arranged in the sliding groove (503), one side of the air bag (501) is fixedly connected with one side of the inner wall of the sliding groove (503), the other side of the air bag (501) is fixedly connected with a connecting rod (504), the connecting rod (504) is slidably connected in the sliding groove (503), and one end of the connecting rod (504) is fixedly connected with one side of the movable box (208).

5. The integrated circuit package wire bonding machine platen structure of claim 4, wherein: the bottom of the air bag (501) is fixedly connected with a connecting pipe, the connecting pipe is embedded in the fixed block (505), one side of the connecting pipe is fixedly connected with a plurality of air blowing pipes (502), and one end of each air blowing pipe (502) extends to the outside of the fixed block (505).

6. The integrated circuit package wire bonding machine platen structure of claim 5, wherein: the welding device is characterized in that a movable frame (3) is arranged at the top of the base plate (1), and a welding main body (4) is arranged on one side of the movable frame (3).