CN220819861U - Automatic chip checking structure - Google Patents
Automatic chip checking structure Download PDFInfo
- Publication number
- CN220819861U CN220819861U CN202322010488.3U CN202322010488U CN220819861U CN 220819861 U CN220819861 U CN 220819861U CN 202322010488 U CN202322010488 U CN 202322010488U CN 220819861 U CN220819861 U CN 220819861U
- Authority
- CN
- China
- Prior art keywords
- chip
- inspection
- upright post
- camera
- mounting upright
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007689 inspection Methods 0.000 claims abstract description 161
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 230000007246 mechanism Effects 0.000 claims description 16
- 238000007599 discharging Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000013072 incoming material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The application provides an automatic chip checking structure, which comprises: a base plate, a left side mounting upright post and a right side mounting upright post; the inspection platform is arranged on the upper surface of the substrate and is positioned between the left side mounting upright post and the right side mounting upright post; the chip 1 surface inspection device is arranged in the middle of the left mounting upright post and is used for inspecting the 1 surface of the chip; a chip 2 surface inspection device which is arranged on one side of the substrate and inspects the 2 surface of the chip; a chip 3 surface inspection device, which is arranged on one side of the right mounting upright post and is used for inspecting the 3 surface of the chip; a chip 4 surface inspection device, wherein the upper end of the upright post is arranged on the left side to inspect the 4 surface of the chip, and the chip 4 surface inspection device is positioned above the chip 1 surface inspection device; and the vacuum device is arranged on one side of the substrate close to the left mounting upright post.
Description
Technical Field
The application relates to the field of chip inspection, in particular to an automatic chip inspection structure.
Background
In the existing chip inspection process, the manual inspection is adopted, but the original manual measurement is inferior, the manual inspection is low in efficiency, due to the fact that the chip is small, fatigue of the vision of people is easily caused under the long-time inspection, defective products are caused to flow out, the other inspection mode is to inspect equipment, most of the equipment is provided with vision positioning, the chip height inspection or the suction nozzle height inspection is not performed, the suction nozzle is small and the vacuum air hole is small, the suction nozzle is required to be very close to the chip distance to suck up products, but the suction nozzle cannot contact the chip to damage the chips, so that the carrying disc is deformed, the products have a certain tolerance, under the condition that the height difference exists after the suction nozzle is replaced, the suction height cannot be accurately controlled, the situation that the chip cannot be sucked up or the chip is crushed is easily caused, meanwhile, vibration is generated when the inspection equipment works, the vision positioning equipment on the equipment is easily caused to shake, the camera is caused to take pictures, and the chip inspection is affected. The efficiency of chip inspection is very low, and the error rate of inspection is very high, so that the inspection of the chip by manual work is not finished.
Disclosure of utility model
In order to solve the above technical problems, the present application provides an automatic chip inspection structure, comprising: a base plate, a left side mounting upright post and a right side mounting upright post;
The inspection platform is arranged on the upper surface of the substrate and positioned between the left side mounting upright post and the right side mounting upright post;
The chip 1 surface inspection device is arranged in the middle of the left mounting upright post and is used for inspecting the 1 surface of the chip;
A chip 2 surface inspection device which is arranged on one side of the substrate and inspects the 2 surface of the chip;
A chip 3 surface inspection device, which is arranged on one side of the right mounting upright post and is used for inspecting the 3 surface of the chip;
A chip 4 surface inspection device, wherein the upper end of the upright post is arranged on the left side to inspect the 4 surface of the chip, and the chip 4 surface inspection device is positioned above the chip 1 surface inspection device;
and the vacuum device is arranged on one side of the substrate close to the left mounting upright post.
Through above technical scheme, carry out automatic inspection such as dirty, fish tail, gold layer stripping, broken limit, damage, outcrop size to 4 faces of chip of incoming material through 5 cameras, promoted the yield of chip, reduced personnel's working strength and work degree of difficulty.
The application is further arranged for an inspection platform, further comprising:
a light source;
And the inspection platform moving mechanism is arranged below the inspection platform so as to realize the movement of the inspection platform in the XY axis direction.
Through above technical scheme, be applicable to the automatic absorption of different specification size chips, automatic position correction in order to be convenient for camera inspection and go up the action of getting of unloading module.
The present application is further configured such that the sheet 1 surface inspection apparatus further includes: the chip 1 surface inspection camera, the chip 1 surface fixing device, the chip 1 surface microscope set and the chip 1 surface lens, wherein the chip 1 surface inspection camera and the chip 1 surface lens are respectively arranged at two ends of the chip 1 surface fixing device, and the chip 1 surface microscope set is arranged at the other end of the chip 1 surface inspection camera.
The application is further configured that the chip 2-side inspection device further includes: the chip 2 surface inspection camera, the chip 2 surface fixing device and the chip 2 surface lens, wherein the chip 2 surface inspection camera and the chip 2 surface lens are respectively arranged at two ends of the chip 2 surface fixing device.
The application is further configured that the chip 3-side inspection device further includes: the chip 3 surface inspection camera, the chip 3 surface fixing device and the chip 3 surface lens, wherein the chip 3 surface inspection camera and the chip 3 surface lens are respectively arranged at two ends of the chip 3 surface fixing device.
The application is further configured that the chip 4-side inspection device further includes: the chip 4 surface extends out of the poor inspection microscope set, the chip 4 surface inspection positioning camera, the chip 4 surface fixing device, the chip 4 surface lens set Z-axis movement mechanism and the chip 4 surface lens;
One end of the Z-axis motion mechanism of the chip 4-plane mirror group is fixed on the left side of the mounting upright post;
The poor inspection microscope set extending from the surface of the chip 4 is fixedly connected with the Z-axis movement mechanism of the lens set of the surface of the chip 4;
The chip 4 surface fixing device is fixed on one side of the chip 4 surface extending out of the poor inspection microscope group, and the chip 4 surface inspection positioning camera and the chip 4 surface lens are respectively arranged at two ends of the chip 4 surface fixing device.
Through the technical scheme, the automatic inspection of the chip 4 surface is realized through the 5 cameras, the yield of products is improved, the production cost of the products is reduced, and the profit of enterprises is improved.
The present application is further configured as a vacuum apparatus, further comprising: vacuum gauge and vacuum solenoid valve to guarantee that the chip can adsorb on the inspection platform.
Through the technical scheme, the vacuum generated by the vacuum device enables the inspection platform to have adsorption force, so that chips with different specifications are firmly adsorbed on the inspection platform of the chip, and actions such as camera inspection and the like are performed.
The beneficial effects of the application are as follows: the automatic inspection of the surface of the chip 4 is realized, the yield of products is improved, the production cost of the products is reduced, and the profit of enterprises is improved; the automatic inspection of the equipment is realized, the dependence of operators is reduced, and the accuracy of product inspection is improved; the working strength and difficulty of operators are reduced.
Drawings
The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and together with the description serve to explain the principles of the application. Many of the intended advantages of other embodiments and embodiments will be readily appreciated as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.
FIG. 1 is a schematic diagram of an automatic chip inspection structure according to an embodiment of the present application;
Fig. 2 is a workflow diagram of a chip autocheck architecture according to an embodiment of the application.
Meaning of each number in the figure:
14. A four-side inspection module; 14a, a chip 4 mirror group; 14b, mounting a stand column on the left side; 14c, a chip 1 surface inspection microscope set; 14d, a vacuum gauge; 14e, a vacuum electromagnetic valve; 14f, a chip 2 surface inspection camera; 14g, X-axis inspection platform; 14h, a Y-axis inspection platform; 14i, a substrate; 14j, a theta axis inspection platform; 14k, a chip 3 surface inspection camera; 14m, a chip inspection platform; 14n, a chip 4 surface inspection positioning camera; 14p, the surface of the chip 4 extends out of the poor inspection microscope group; 14q, right side mounting posts.
Detailed Description
In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the application may be practiced. For this, directional terms, such as "top", "bottom", "left", "right", "upper", "lower", and the like, are used with reference to the orientation of the described figures. Because components of embodiments can be positioned in a number of different orientations, the directional terminology is used for purposes of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized or logical changes may be made without departing from the scope of the present application. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present application is defined by the appended claims.
The present application proposes an automatic chip inspection structure, fig. 1 shows a schematic structural diagram (part of the structure is not shown in the figure) of an automatic chip inspection structure according to an embodiment of the present application, and as shown in fig. 1, the apparatus includes: a base plate 14i, a left side mounting column 14b, and a right side mounting column 14q;
And an inspection platform provided on the upper surface of the base plate 14i and located between the left side mounting column 14b and the right side mounting column 14 q;
A chip 1 surface inspection device, which is arranged in the middle of the left mounting upright post 14b and is used for inspecting the 1 surface of the chip;
A chip 2 surface inspection device provided on one side of the substrate 14i for inspecting the chip 2 surface;
a chip 3 surface inspection device, which is arranged on one side of the right mounting upright post 14q to inspect the 3 surface of the chip;
A chip 4 surface inspection device, wherein the upper end of the upright post 14b is arranged on the left side to inspect the 4 surface of the chip, and the chip 4 surface inspection device is positioned above the chip 1 surface inspection device;
And a vacuum device provided on a side of the base plate 14i close to the left mounting column 14 b.
Specifically, the inspection platform further includes:
a light source;
And the inspection platform moving mechanism is arranged below the inspection platform so as to realize the movement of the inspection platform in the XY axis direction.
Specifically, the chip 1 surface inspection device further includes: the chip 1 surface inspection camera, the chip 1 surface fixing device, the chip 1 surface microscope set and the chip 1 surface lens, wherein the chip 1 surface inspection camera and the chip 1 surface lens are respectively arranged at two ends of the chip 1 surface fixing device, and the chip 1 surface microscope set is arranged at the other end of the chip 1 surface inspection camera.
Chip 2 face inspection device still includes: the chip 2 surface inspection camera 14f, the chip 2 surface fixing device and the chip 2 surface lens, wherein the chip 2 surface inspection camera 14f and the chip 2 surface lens are respectively arranged at two ends of the chip 2 surface fixing device.
Chip 3 face inspection device still includes: the chip 3 surface inspection camera 14k, the chip 3 surface fixing device and the chip 3 surface lens, wherein the chip 3 surface inspection camera 14k and the chip 3 surface lens are respectively arranged at two ends of the chip 3 surface fixing device.
Chip 4 face inspection device still includes: the chip 4 surface extends out of the poor inspection microscope set 14p, the chip 4 surface inspection positioning camera 14n, the chip 4 surface fixing device, the chip 4 surface lens set 14aZ axis movement mechanism and the chip 4 surface lens;
one end of the chip 4 mirror group 14aZ axis movement mechanism is fixed on the left side mounting upright post 14b;
the poor-projection inspection microscope set 14p of the surface of the chip 4 is fixedly connected with the 14 aZ-axis movement mechanism of the surface of the chip 4;
The chip 4 surface fixing device is fixed on one side of the chip 4 surface extending out of the poor inspection microscope set 14p, and the chip 4 surface inspection positioning camera 14n and the chip 4 surface lens are respectively arranged at two ends of the chip 4 surface fixing device.
Specifically, the vacuum apparatus further comprises: a vacuum gauge 14d and a vacuum solenoid valve 14e to ensure that the chip is attracted to the inspection platform.
Fig. 2 is a workflow diagram of a chip autocheck architecture according to an embodiment of the application. As shown in fig. 2, the inspection platform moves to the material inlet position of the inspection platform through the X/Y axis of the inspection platform moving mechanism, the material inlet arm module places the chip on the chip inspection platform 14m, vacuum is established, and the chip is adsorbed on the platform; the inspection platform moves to enable the chip to be located below the chip 4 surface inspection positioning camera 14n, the camera photographs and positions and performs chip 4 surface inspection to obtain a position coordinate A of the chip at the moment, the camera transmits the position coordinate A of the chip to the PC system, according to the coordinate A, the system automatically calculates a coordinate B required by the chip 4 surface extension failure inspection microscope set 14p for inspection, the inspection platform moves in an X/Y mode to enable the chip to be brought to the position of the coordinate B, and the chip 4 surface microscope set 14aZ axis movement mechanism is self-adjusted to enable the picture of the chip 4 surface extension failure inspection microscope set 14p to be clear, and the chip 4 surface extension failure inspection is performed; according to the coordinate B, the PC system automatically calculates a coordinate C required by the surface inspection of the chip 1, and the inspection platform movement mechanism X/Y moves to bring the chip to the position of the coordinate C for the surface defect inspection of the chip 1; according to the coordinate C, the PC system automatically calculates a coordinate D required by the surface inspection of the chip 3, and the movement mechanism X/Y of the inspection platform moves to bring the chip to the position of the coordinate D to perform the surface defect inspection of the chip 3; according to the coordinate D, the PC system automatically calculates a coordinate E required by the surface inspection of the chip 2, automatically adjusts a discharging coordinate F of the inspection platform and a receiving coordinate G of the discharging Arm, the discharging Arm absorbs the chip at the coordinate G, brings the chip to the inspection coordinate E of the surface of the chip 2, the surface inspection of the chip 2 is carried out, the inspection is completed, and the discharging Arm module moves to a discharging position with the chip; so far, the 4-sided inspection of the chip is completed.
It will be apparent to those skilled in the art that various modifications and variations can be made to the embodiments of the present application without departing from the spirit and scope of the application. In this manner, the application is also intended to cover such modifications and variations as come within the scope of the appended claims and their equivalents. The word "comprising" does not exclude the presence of other elements or steps than those listed in a claim. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims shall not be construed as limiting the scope.
Claims (7)
1. An automatic chip inspection structure, comprising: a base plate, a left side mounting upright post and a right side mounting upright post;
The inspection platform is arranged on the upper surface of the substrate and is positioned between the left side mounting upright post and the right side mounting upright post;
The chip 1 surface inspection device is arranged in the middle of the left mounting upright post and is used for inspecting the 1 surface of the chip;
a chip 2 surface inspection device provided with the chip 2 surface inspection device on one side of the substrate to inspect the chip 2 surface;
A chip 3 surface inspection device, wherein the chip 3 surface inspection device is arranged on one side of the right mounting upright post to inspect the 3 surface of the chip;
a chip 4 surface inspection device, wherein the upper end of the left mounting upright post is used for inspecting the 4 surface of the chip, and the chip 4 surface inspection device is positioned above the chip 1 surface inspection device;
And the vacuum device is arranged on one side of the substrate, which is close to the left side mounting upright post.
2. The automated chip inspection structure of claim 1, wherein the inspection platform further comprises:
a light source;
And the inspection platform moving mechanism is arranged below the inspection platform so as to realize the movement of the inspection platform in the XY axis direction.
3. The automatic chip inspection structure according to claim 1, wherein the chip 1 side inspection device further comprises: the chip 1 surface inspection camera, the chip 1 surface fixing device, the chip 1 surface microscope set and the chip 1 surface lens, wherein the chip 1 surface inspection camera and the chip 1 surface lens are respectively arranged at two ends of the chip 1 surface fixing device, and the chip 1 surface microscope set is arranged at the other end of the chip 1 surface inspection camera.
4. The automatic chip inspection structure according to claim 1, wherein the chip 2-side inspection device further comprises: the chip 2 surface inspection camera, the chip 2 surface fixing device and the chip 2 surface lens, wherein the chip 2 surface inspection camera and the chip 2 surface lens are respectively arranged at two ends of the chip 2 surface fixing device.
5. The automatic chip inspection structure according to claim 1, wherein the chip 3-side inspection device further comprises: the chip 3 surface inspection camera, the chip 3 surface fixing device and the chip 3 surface lens, wherein the chip 3 surface inspection camera and the chip 3 surface lens are respectively arranged at two ends of the chip 3 surface fixing device.
6. The automatic chip inspection structure according to claim 1, wherein the chip 4-side inspection device further comprises: the chip 4 surface extends out of the poor inspection microscope set, the chip 4 surface inspection positioning camera, the chip 4 surface fixing device, the chip 4 surface lens set Z-axis movement mechanism and the chip 4 surface lens;
one end of the chip 4-plane mirror group Z-axis movement mechanism is fixed on the left side mounting upright post;
the poor inspection microscope set extending from the surface of the chip 4 is fixedly connected with the Z-axis movement mechanism of the surface microscope set of the chip 4;
the chip 4 surface fixing device is fixed on one side of the chip 4 surface extending out of the poor inspection microscope group, and the chip 4 surface inspection positioning camera and the chip 4 surface lens are respectively arranged at two ends of the chip 4 surface fixing device.
7. The automatic chip inspection structure according to claim 1, wherein the vacuum device further comprises: the vacuum meter and the vacuum electromagnetic valve are used for ensuring that the chip can be adsorbed on the inspection platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322010488.3U CN220819861U (en) | 2023-07-28 | 2023-07-28 | Automatic chip checking structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322010488.3U CN220819861U (en) | 2023-07-28 | 2023-07-28 | Automatic chip checking structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220819861U true CN220819861U (en) | 2024-04-19 |
Family
ID=90709041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322010488.3U Active CN220819861U (en) | 2023-07-28 | 2023-07-28 | Automatic chip checking structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220819861U (en) |
-
2023
- 2023-07-28 CN CN202322010488.3U patent/CN220819861U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107228861B (en) | Defect detection device of liquid crystal panel | |
| CN107966458B (en) | Substrate half-plate detection device | |
| JP6128337B2 (en) | Semiconductor device manufacturing method and manufacturing apparatus | |
| CN105721859A (en) | Aligning apparatus for image module and application method thereof | |
| CN214472864U (en) | Polaroid defect detection equipment and system | |
| CN109906029A (en) | Electronic component mounting apparatus and electronic component mounting method | |
| CN220819861U (en) | Automatic chip checking structure | |
| CN115274484A (en) | Wafer detection device and detection method thereof | |
| CN216960683U (en) | Real-time alignment mounter based on vision | |
| CN206177368U (en) | Cell -phone size comprehensive tester | |
| CN110572561B (en) | Production process of VCM mobile phone camera module | |
| CN218885376U (en) | Display module assembly check out test set | |
| CN111508861A (en) | Semiconductor element bonding apparatus | |
| CN208887568U (en) | A kind of detection device | |
| TWI654913B (en) | Vacuum adsorption wafer bonding method | |
| TWI603410B (en) | Testing system for re-constructed wafer and the method thereof | |
| KR20130117256A (en) | Flip chip bonding apparatus and method for bonding flip chip | |
| CN112867386B (en) | Automatic chip mounting device, suction nozzle thereof and automatic chip mounting method | |
| CN205595353U (en) | Detector pastes dress system | |
| TWI723492B (en) | Adhesion device, micro light emitting diode optical inspection and repairing equipment and optical inspection and repairing method | |
| KR102117652B1 (en) | Apparatus for testing of display panel | |
| CN210694100U (en) | VCM cell-phone camera module production water line | |
| KR101328609B1 (en) | Trace inspection device | |
| CN109078863B (en) | Optical detection equipment | |
| TWM595220U (en) | Defect detection equipment for semi-finished products |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |