CN220693612U - Liquid cooling device for cabinet of data center - Google Patents
Liquid cooling device for cabinet of data center Download PDFInfo
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- CN220693612U CN220693612U CN202322317686.4U CN202322317686U CN220693612U CN 220693612 U CN220693612 U CN 220693612U CN 202322317686 U CN202322317686 U CN 202322317686U CN 220693612 U CN220693612 U CN 220693612U
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- 238000001816 cooling Methods 0.000 title claims abstract description 113
- 239000007788 liquid Substances 0.000 title claims abstract description 95
- 230000017525 heat dissipation Effects 0.000 claims abstract description 33
- 239000000110 cooling liquid Substances 0.000 claims abstract description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000498 cooling water Substances 0.000 claims description 2
- 238000007599 discharging Methods 0.000 claims description 2
- 238000005265 energy consumption Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012549 training Methods 0.000 description 1
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Abstract
The utility model discloses a liquid cooling device of a data center cabinet, which is used for a data center cabinet containing at least two computing devices, and comprises a main cooling device and unit cooling devices with the number not less than that of the computing devices; the cooling liquid in the main cooling device and the unit cooling device in the heat exchanger are circulated independently of each other. By providing each computing device with an independent unit cooling device, the working conditions of the corresponding unit cooling devices can be independently adjusted according to the heat dissipation working conditions of each computing device, and the working conditions of the main cooling devices can be uniformly adjusted according to the comprehensive heat dissipation requirements of all computing devices, so that the optimal working state is obtained, and the energy consumption is effectively reduced while the heat dissipation requirements are met.
Description
Technical Field
The utility model relates to the technical field of computer system heat dissipation, in particular to a liquid cooling device for a cabinet of a data center.
Background
With the continuous development of the autopilot field and the increasing maturity of autopilot algorithms, the demands of GPU computing power are also increasing, for example, training which can be completed in the previous 2 days is shortened to be completed in 1 day or even half a day. In order to improve the computing power, at least two computing devices are needed in one cabinet, each computing device is provided with 4 4090 display cards, and a 2.4KW computing device power supply device is matched. The computing device has two tera-network cards, which are used for data transmission in the cluster, and one kilomega-network card is used as an out-of-band management port of the computing device. But the heat dissipation capacity of the computer components is also greatly improved while the calculation force is greatly improved, and the heat dissipation problem becomes one of the core problems to be solved. The liquid cooling technology is used as a modern, efficient and reliable heat dissipation mode, so that the liquid cooling technology is widely applied to the heat dissipation of high-performance computers. Therefore, in the prior art, the cooling liquid circulation is utilized to radiate heat of the computing equipment, generally, a single circulation pipeline is adopted and comprises a liquid pump, a computing equipment liquid cooler, a circulation pipeline, an external radiator, a fan, a liquid storage tank and the like, the system cannot respectively radiate heat of different computing equipment, when the heat of each computing equipment is different, the whole heat radiation system controls the flow of the cooling liquid and the rotating speed of the fan of the external radiator preferentially according to the computing equipment with the highest heat, so that the energy consumption is higher.
For example, CN114585220a discloses an intelligent redundant liquid-cooled cooling circuit for a data center cooling system, and in particular discloses a system and method for cooling a data center. In at least one embodiment, cooling is provided for at least one computing component alternately using a backup cooling loop with its own fluid source and liquid-liquid heat exchanger and an auxiliary cooling loop associated with the primary cooling loop and cooling facility. The main cooling loop is mainly an external cooling tower, the auxiliary cooling loop is equal to the single-circulation pipeline, the single-circulation pipeline brings the heat of equipment on all racks from the same main pipeline to a heat exchanger exchanging heat with the main cooling loop, the heat dissipation capacity is effectively improved, but the problem of energy consumption is still not solved, and meanwhile, when any point of the single-circulation pipeline leaks, all computing equipment starts thermal protection due to failure of the heat sink, the work is interrupted, and extra loss is brought.
Disclosure of Invention
In order to solve the above problems, the present disclosure provides a data center cabinet liquid cooling device, which can optimize the heat dissipation effect under the condition of lower energy consumption.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: a data center cabinet liquid cooling apparatus for a data center cabinet containing at least two computing devices, comprising:
a main cooling device and a unit cooling device not less than the number of computing devices;
the unit cooling device includes:
a unit liquid pump for providing circulating flow power for the cooling liquid in the unit cooling device;
the liquid cooler of the computing equipment is arranged on a heat dissipation part of the computing equipment and is used for absorbing and taking away the heat of the heat dissipation part of the small computer equipment through cooling liquid;
the heat exchanger is used for exchanging heat with the cooling liquid in the main cooling device;
the unit circulation pipeline connects the unit liquid pump, the liquid cooler of the computing equipment and the heat exchanger into a closed circulation loop;
the main cooling device is used for absorbing heat from the unit cooling device and discharging the heat to the outside; the cooling liquid in the main cooling device and the unit cooling device in the heat exchanger are circulated independently of each other.
By providing each computing device with an independent unit cooling device, the working conditions of the corresponding unit cooling devices can be independently adjusted according to the heat dissipation working conditions of each computing device, and the working conditions of the main cooling devices can be uniformly adjusted according to the comprehensive heat dissipation requirements of all computing devices, so that the optimal working state is obtained, and the energy consumption is effectively reduced while the heat dissipation requirements are met.
Further, the heat exchanger comprises one heat exchanger unit, or more than two heat exchanger units are connected in series, or in parallel, or in series-parallel.
Further, the heat exchanger unit is provided with a unit fan.
Further, the heat exchanger unit is provided with a coaxial pipeline, the coaxial pipeline comprises an inner pipe and an outer pipe sleeved outside the inner pipe, a gap is formed between the inner wall of the inner pipe and the outer wall of the inner pipe, and cooling liquid in the main cooling device and cooling liquid in the unit cooling device respectively circulate in the inner pipe and the gap.
Further, the main cooling device comprises one or two of a liquid tank and a main radiator, or is integrated integrally; the main cooling device also comprises a main circulation pipeline which connects the heat exchangers of all the unit cooling devices and the main radiator and/or the liquid tank into a closed circulation loop.
Further, the liquid tank comprises a heat exchange coil pipe arranged on the upper portion of the tank body, a main fan for forcing air to flow through the heat exchange coil pipe, and a liquid storage tank arranged on the lower portion, hot liquid conveyed into the heat exchange coil pipe by a main circulation pipeline flows into the liquid storage tank after being cooled by the main fan or falls into the liquid storage tank through a sprayer, and an outlet of the liquid storage tank is connected with an inlet of a main liquid pump.
Further, the intelligent heat exchanger further comprises an MCU controller and a temperature sensor arranged on the heat dissipation part of the computing equipment, wherein the MCU controller independently controls the start, stop and rotation speed of the unit fan corresponding to the heat exchanger unit and/or the start, stop and rotation speed of the unit liquid pump according to the temperature of the temperature sensor.
Further, the liquid tank is installed above the data center cabinet.
Further, the liquid storage tank is of an annular groove structure with a vertically penetrating window, the main fan is installed in the window, and the main fan forces air to flow through the heat exchange coil from the lower direction.
Further, the main cooling device includes:
the main water pump is used for providing circulating flowing power for cooling water in the main cooling device;
the main radiator is used for externally releasing the heat absorbed by the auxiliary unit cooling device;
and the main circulation pipeline connects the main water pump, the heat exchangers of all the unit cooling devices and the main radiator into a closed circulation loop.
Drawings
Fig. 1-3 are schematic diagrams of three embodiments of a data center cabinet liquid cooling apparatus.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1, a data center cabinet liquid cooling apparatus for a data center cabinet 1 containing at least two computing devices 2, in the example of fig. 1, two computing devices 2 are installed in the cabinet 1, including:
a main cooling device and a unit cooling device not less than the number of computing devices;
the unit cooling device includes:
a unit liquid pump 3 for supplying power of circulating flow to the cooling liquid in the unit cooling device;
a computing device liquid cooler which is arranged on a heat dissipation part of the computing device 2 and is used for absorbing and taking away the heat of the heat dissipation part of the small computer device through cooling liquid; the liquid cooler of the computing device may be a small coil or a sealed box with a cooling liquid flow channel inside, and is combined with the heat dissipation component of the computing device 2, so that heat on the heat dissipation component is transferred to the cooling liquid through a medium, and the cooling liquid takes away the heat, so that a lot of heat is not repeated in the prior art.
The heat exchanger is used for exchanging heat with the cooling liquid in the main cooling device;
the unit circulation pipeline connects the unit liquid pump 3, the liquid cooler of the computing equipment and the heat exchanger into a closed circulation loop;
the main cooling device includes:
a main liquid pump 8 for supplying power for circulating the cooling liquid in the main cooling device;
a main radiator 5 for externally releasing heat absorbed from the unit cooling device;
the main circulation pipeline connects the main liquid pump 8, the heat exchangers of all the unit cooling devices and the main radiator 5 into a closed circulation loop;
the cooling liquid in the main cooling device and the unit cooling device in the heat exchanger are circulated independently of each other.
By providing each computing device with an independent unit cooling device, the working conditions of the corresponding unit cooling devices can be independently adjusted according to the heat dissipation working conditions of each computing device, and the working conditions of the main cooling devices can be uniformly adjusted according to the comprehensive heat dissipation requirements of all computing devices, so that the optimal working state is obtained, and the energy consumption is effectively reduced while the heat dissipation requirements are met.
In a practical embodiment, the heat exchanger comprises one heat exchanger unit 4, or more than two heat exchanger units 4 are connected in series, in parallel, or in series-parallel. The heat exchanger unit can be provided with a unit fan according to the heat dissipation power requirement. In the example of fig. 1-3, two heat exchanger units 4 are connected in series. When two or more heat exchanger units 4 are adopted, all or part of fans corresponding to the heat exchanger units 4 can be turned off according to the change of the heat exchange power requirement, so that electric energy is saved. Each heat exchanger unit 4 can also be bridged with a bypass branch between the inlet and the outlet, and the bypass branch and the inlet and the outlet of the heat exchanger unit 4 are respectively provided with an electric control valve, so that one of the heat exchanger units 4 can be cut off when needed, the replacement and the maintenance are convenient, and meanwhile, one heat exchanger unit 4 can be temporarily used for working without stopping. When the parallel structure is adopted, the electric control valve can be additionally arranged at the inlet and the outlet of each heat exchanger unit 4, and the functions can be realized.
In some embodiments, the heat exchanger unit may employ a coaxial pipeline, where the coaxial pipeline includes an inner pipe, and an outer pipe sleeved outside the inner pipe, and a gap is formed between the inner wall and the outer wall of the inner pipe, and the inner pipe and the gap are respectively used for flowing cooling liquid in the main cooling device and the unit cooling device. The annular gap between the outer tube and the inner tube can increase the surface area of the hot liquid needing to be cooled, and the thickness is reduced, so that the heat exchange efficiency is improved, and the volume of the heat exchanger is reduced.
In practical application, the main cooling device comprises one or two of the liquid tank 7 and the main radiator 5, or is integrated integrally. In fig. 1-3, both a liquid tank 7 and a main radiator 5 are provided. When the liquid tank 7 is large enough, the cooling liquid can obtain ideal heat dissipation through natural cooling or through the ways of arranging the cooling fins, the fan and the like on the liquid tank shell, and when the requirement of the cooling circulation is met, a main radiator is not needed, and vice versa, if the main radiator 5 can meet the requirement of heat dissipation, the cooling circulation is ensured to control the temperature within a set range, the liquid tank is not needed, or a small-volume liquid tank can be adopted.
In some embodiments, the liquid tank 7 may be made into an integrated structure with a main radiator function, and includes a heat exchange coil disposed at the upper part of the tank body, a main fan forcing air to flow through the heat exchange coil, and a liquid storage tank disposed at the lower part, where the hot liquid conveyed into the heat exchange coil by the main circulation pipeline flows into the liquid storage tank after being cooled by the main fan or falls into the liquid storage tank through the sprayer, and an outlet of the liquid storage tank is connected with an inlet of the main liquid pump.
In the example of fig. 2 and 3, the liquid tank is mounted above a data center cabinet. The gravity and siphon force of the cooling liquid can be utilized to reduce the energy consumption of the main liquid pump, and a better energy-saving effect is obtained.
In the example of fig. 3, the tank or tank 7 is of annular groove configuration with a vertically extending window in which the main fan 6 is mounted, forcing air to flow from below upwards through the upper heat exchange coil or main radiator 5. The heat dissipated by the heat exchanger unit, the heat exchange coil or the main radiator 5 heats the air in the cabinet body, so that the air in the cabinet body 1 can flow from the air inlet below the cabinet body to the air outlet at the top by utilizing the chimney effect, and the energy consumption of the main fan can be reduced.
In each of the embodiments of fig. 1-3, the heat exchanger further comprises an MCU controller and a temperature sensor arranged on the heat dissipation part of the computing device, wherein the MCU controller independently controls the start, stop and rotation speed of the unit fan corresponding to the heat exchanger unit and/or the start, stop and rotation speed of the unit liquid pump according to the temperature of the temperature sensor. An MCU is a special-purpose microcomputer that integrates a CPU, memory, storage, input/output interfaces, and various peripherals on a single chip. The method can realize various complex algorithms such as data processing, communication control, analog control and the like by writing codes, and can realize the management and control of various peripheral interfaces in a programming mode. The MCU can realize the control of the power supply and the liquid cooling device by selecting different control modes, and designs a proper interface circuit so that the MCU can control parameters such as the switch and the current of the power supply and the liquid cooling device. The MCU is used for controlling the liquid circulation of the liquid cooling device, the operation of the pump, the liquid cooling pipeline and the like so as to better realize the control of the liquid cooling system. The MCU realizes the control of the liquid cooling device and the power supply by selecting different control modes, and can select a plurality of control modes such as PID control, ON/OFF control and the like to realize the control of the liquid cooling device. An alarm device can be additionally arranged, and when the liquid cooling system has abnormal conditions, the MCU can send appointed alarms to operation and maintenance personnel to inform the operation and maintenance personnel to process faults.
The main liquid pump and the unit liquid pump can be high-performance pump sets, so that the flow rate and the flow velocity of liquid are ensured. The liquid cooling system adopts high-heat-conductivity materials, so that the cooling effect is ensured. Meanwhile, a plurality of cooling fins are arranged inside the cabinet, so that the cooling effect is guaranteed. An advanced PCB heat dissipation plate is selected, the MCU and the heat dissipation plate are tightly combined together, and the working efficiency of the MCU is improved. The heat dissipation plate adopts a closed design, so that mutual pollution of liquid and electric elements is avoided. And a temperature sensor and a hydraulic sensor are arranged at key positions of the liquid cooling system, so that the running state of the system is monitored in real time, and the safe running of the liquid cooling system is ensured.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (10)
1. A data center cabinet liquid cooling apparatus for a data center cabinet containing at least two computing devices, comprising:
a main cooling device and a unit cooling device not less than the number of computing devices;
the unit cooling device includes:
a unit liquid pump for providing circulating flow power for the cooling liquid in the unit cooling device;
the liquid cooler of the computing equipment is arranged on a heat dissipation part of the computing equipment and is used for absorbing and taking away the heat of the heat dissipation part of the small computer equipment through cooling liquid;
the heat exchanger is used for exchanging heat with the cooling liquid in the main cooling device;
the unit circulation pipeline connects the unit liquid pump, the liquid cooler of the computing equipment and the heat exchanger into a closed circulation loop;
the main cooling device is used for absorbing heat from the unit cooling device and discharging the heat to the outside;
the cooling liquid in the main cooling device and the unit cooling device in the heat exchanger are circulated independently of each other.
2. The data center cabinet liquid cooling apparatus of claim 1, wherein the heat exchanger comprises one heat exchanger unit, or more than two heat exchanger units connected in series, in parallel, or in series-parallel.
3. The data center cabinet liquid cooling apparatus of claim 2, wherein the heat exchanger unit is provided with a unit fan.
4. The data center cabinet liquid cooling apparatus according to claim 3, wherein the heat exchanger unit has a coaxial line including an inner tube, and an outer tube fitted over the inner tube with a gap between the inner wall and the outer wall of the inner tube, and the inner tube and the gap are respectively circulated with the cooling liquid in the main cooling apparatus and the unit cooling apparatus.
5. The data center cabinet liquid cooling apparatus of claim 4, wherein the primary cooling apparatus comprises one or both of a liquid tank, a primary radiator, or is integrally integrated; the main cooling device also comprises a main circulation pipeline which connects the heat exchangers of all the unit cooling devices and the main radiator and/or the liquid tank into a closed circulation loop.
6. The data center cabinet liquid cooling device according to claim 5, wherein the liquid tank comprises a heat exchange coil arranged at the upper part of the tank body, a main fan for forcing air to flow through the heat exchange coil, and a liquid storage tank arranged at the lower part, hot liquid conveyed into the heat exchange coil by a main circulation pipeline flows into the liquid storage tank through a sprayer after being cooled by the main fan, and an outlet of the liquid storage tank is connected with an inlet of a main liquid pump.
7. The data center cabinet liquid cooling apparatus according to any one of claims 3 to 6, further comprising an MCU controller and a temperature sensor provided on a heat dissipation part of the computing device, wherein the MCU controller independently controls start-stop and rotation speed of a unit fan of a corresponding heat exchanger unit and/or start-stop and rotation speed of a unit liquid pump according to a temperature of the temperature sensor.
8. The data center cabinet liquid cooling apparatus of claim 6, wherein the liquid tank is mounted above the data center cabinet.
9. The data center cabinet liquid cooling apparatus of claim 8, wherein the liquid storage tank is an annular trough structure having a vertically extending window in which the main fan is mounted, the main fan forcing air to flow from below up through the heat exchange coil.
10. The data center cabinet liquid cooling apparatus of any one of claims 1-6, wherein the main cooling apparatus comprises:
the main water pump is used for providing circulating flowing power for cooling water in the main cooling device;
the main radiator is used for externally releasing the heat absorbed by the auxiliary unit cooling device;
and the main circulation pipeline connects the main water pump, the heat exchangers of all the unit cooling devices and the main radiator into a closed circulation loop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322317686.4U CN220693612U (en) | 2023-08-29 | 2023-08-29 | Liquid cooling device for cabinet of data center |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322317686.4U CN220693612U (en) | 2023-08-29 | 2023-08-29 | Liquid cooling device for cabinet of data center |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220693612U true CN220693612U (en) | 2024-03-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322317686.4U Active CN220693612U (en) | 2023-08-29 | 2023-08-29 | Liquid cooling device for cabinet of data center |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220693612U (en) |
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2023
- 2023-08-29 CN CN202322317686.4U patent/CN220693612U/en active Active
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