CN220691081U - Test fixture - Google Patents
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- CN220691081U CN220691081U CN202322202507.2U CN202322202507U CN220691081U CN 220691081 U CN220691081 U CN 220691081U CN 202322202507 U CN202322202507 U CN 202322202507U CN 220691081 U CN220691081 U CN 220691081U
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- 238000012360 testing method Methods 0.000 title claims abstract description 177
- 230000005611 electricity Effects 0.000 claims abstract description 4
- 239000000523 sample Substances 0.000 claims description 4
- 230000003014 reinforcing effect Effects 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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Abstract
The application provides a test fixture relates to the test technical field of biological identification module, including support and test circuit board, wherein, test circuit board sets up in the support to be provided with the test station on the support, with this, conveniently when the test, the fingerprint module that awaits measuring is held to the holding by the test station, and make the first hookup bit of test circuit board be connected with the structure electricity that is arranged in the fingerprint module that awaits measuring to be used for the ground connection, from this, when the test, can be timely apply test current to the structure in the fingerprint module that awaits measuring, thereby detect the current value or the impedance on the structure by test circuit board and thereby judge whether its earth connection performance satisfies predetermined requirement.
Description
Technical Field
The application relates to the technical field of testing of biological identification modules, in particular to a testing jig.
Background
With the innovation of technology, many new types of products are appeared in the electronic field, and requirements for electronic products to meet complex use environments are also more and more stringent, so that the reliability test standard of the existing electronic products is also more and more high, especially for the reliability of electrostatic protection, the electronic products are required to have better grounding design in structural design, so that the grounding performance directly affects the electrostatic reliability of the whole product, and correspondingly, a corresponding grounding test means is required to evaluate the grounding performance of the electronic products.
After the updating iteration of the existing fingerprint module is carried out for a plurality of times, a scheme of grounding the structural member in the fingerprint module is formed, but a test fixture matched with the fingerprint module with the new structure does not appear yet, so that a new test fixture is urgently needed for testing the grounding performance of the novel fingerprint module.
Disclosure of Invention
The present application aims to provide a test fixture for overcoming the defects in the prior art.
In order to achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:
in one aspect of the embodiment of the application, a test fixture is provided for testing fingerprint modules, including the support that has the test station, the test station is used for the holding fingerprint module that awaits measuring, is provided with test circuit board on the support, and one side that test circuit board is close to the fingerprint module that awaits measuring has first hookup location, and test circuit board is connected with the structure electricity that is used for the ground connection in the fingerprint module that awaits measuring through first hookup location.
Optionally, the second connection position of the test circuit board is electrically connected with the module circuit board in the fingerprint module to be tested, so that the structural member is grounded through the module circuit board and the test circuit board in sequence.
Optionally, the second connection location of the test circuit board has a second contact, and the second contact is electrically connected to the module circuit board through the conductive member.
Optionally, the first connection location of the test circuit board has a first contact, and the first contact is electrically connected to the structural member through the conductive member.
Optionally, the test station and the test circuit board are located at different sides of the support, a test channel is formed in the support, one end of the test channel extends to the test station, the other end of the test channel extends to a first contact of the test circuit board, and a conductive piece connected to the first contact penetrates through the test channel.
Optionally, the conductive member is an elastic conductive member, one end of the elastic conductive member is fixed on the test circuit board, and the other end of the elastic conductive member is abutted to the fingerprint module to be tested.
Optionally, the elastic conductive element is a probe.
Optionally, the number of elastic conductive elements is at least one.
Optionally, a groove matched with the shape of the fingerprint module to be tested is formed in the support, and the groove is used as a testing station.
Optionally, an avoidance channel adapted to the module circuit board in the fingerprint module to be tested is formed on the side wall of the groove, and the module circuit board passes through the avoidance channel.
Optionally, the test fixture further includes a supporting member, and the supporting member is used for matching with the bracket to clamp the fingerprint module to be tested.
The beneficial effects of this application include:
the application provides a test fixture, including support and test circuit board, wherein, test circuit board sets up in the support to be provided with the test station on the support, with this, conveniently when the test, the fingerprint module that awaits measuring is held to the holding by the test station, and make the first hookup bit of test circuit board be connected with the structure electricity that is arranged in the fingerprint module that awaits measuring and is grounded, from this, when the test, can be timely apply test current to the structure in the fingerprint module that awaits measuring, thereby detect the current value or the impedance on the structure by test circuit board and thereby judge whether its earth connection performance satisfies predetermined requirement.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a fingerprint module grounded through a structural member according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a test fixture according to an embodiment of the present application;
fig. 3 is a schematic structural diagram of a test fingerprint module of a test fixture according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of another test fixture test fingerprint module according to an embodiment of the present application.
Icon: 110-a bracket; 111-a test station; 112-test channel; 113-an avoidance channel; 114-a depression; 120-testing the circuit board; 121-a first connection site; 122-a second connection bit; 123-first contacts; 124-second contacts; 130-screws; 141-a first conductive member; 142-a second conductive member; 200-a fingerprint module to be tested; 210-a ring frame; 220-cover plate; 230-chip; 240-a first conductive adhesive; 250-module circuit board; 251-connector; 260-a second conductive adhesive; 270-reinforcing sheet; 280-cushion layer; 290-third conductive glue.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. It should be noted that, in the case of no conflict, the features of the embodiments of the present application may be combined with each other, and the combined embodiments still fall within the protection scope of the present application.
In the description of the present application, it should be noted that, the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, or the directions or positional relationships that are conventionally put when the product of the application is used, are merely for convenience of description and simplicity of description, and therefore should not be construed as limiting the present application. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
Along with the development of technology, the structure of fingerprint module also can be updated many times to produce the fingerprint module that has novel ground connection scheme, this type of fingerprint module realizes ground connection mainly through the structure, thereby reaches electrostatic protection's effect, it is to understand that the structure is used for bearing the load and provides the component of supporting strength in the fingerprint module promptly, and in order to satisfy the ground connection demand, the material of structure should have electric conductivity, for example metal etc. as long as it can have certain electric conductivity and better intensity can.
For easy understanding, please refer to fig. 1, a fingerprint module grounded through a structural member is shown, which includes an annular frame 210 and a fingerprint module mounted to the annular frame 210, wherein the annular frame 210 serves as a carrier of the fingerprint module and provides protection for the fingerprint module, and meanwhile, the annular frame 210 can also serve as an appearance piece of the fingerprint module, and the fingerprint module can be used for realizing collection of characteristics such as fingerprints and palmprints of a target object. With reference to fig. 1, the fingerprint module includes a module circuit board 250 and a chip 230 laminated on the module circuit board 250, i.e. the fingerprint sensor, and the chip 230 is electrically connected to the module circuit board 250, however, the electrical connection between the two is not required in the present application, for example, the electrical connection may be performed by the first conductive adhesive 240 (shown in fig. 1), or the electrical connection may be performed by a surface mount process using solder paste or the like. The module circuit board 250 may be in the form of a flexible circuit board, a rigid-flex board, etc., which is not required in the present application.
On this basis, in order to improve the strength of the fingerprint module, as shown in fig. 1, a reinforcing sheet 270 may be further disposed on a side of the module circuit board 250 facing away from the chip 230. Therefore, when the fingerprint module is configured to be grounded, the reinforcing sheet 270 may be electrically connected to the module circuit board 250 through the second conductive adhesive 260 (of course, the electrical connection between the two may not be required in the present application, for example, the electrical connection may also be performed by a surface mounting process using solder paste, etc.), specifically, the reinforcing sheet 270 may be electrically connected to a grounding circuit in the module circuit board 250, and the annular frame 210 may be electrically connected to the reinforcing sheet 270, so that the annular frame 210 is also grounded, and similarly, the electrical connection between the annular frame 210 and the reinforcing sheet 270 may not be required in the present application, for example, the electrical connection may be performed by laser welding or the third conductive adhesive 290 (shown in fig. 1). Therefore, the structural component in the fingerprint module may be the annular frame 210 or the reinforcing sheet 270.
In addition, as shown in fig. 1, in order to improve the service life of the fingerprint module, a cover plate 220 or a coating may be disposed on a side of the chip 230 facing away from the module circuit board 250, so as to provide protection, and prevent the object from directly contacting the chip 230. A connector 251 can be arranged on the module circuit board 250, so that the fingerprint module is convenient to connect with external equipment, and information interaction and grounding are realized. The reinforcing sheet 270 can be further provided with a cushion layer 280 on one side away from the module circuit board 250, so that when the fingerprint module is installed in electronic equipment, the fingerprint module corresponds to a switch module in the electronic equipment through the cushion layer 280, and when the fingerprint module is pressed by external force, the cushion layer 280 presses the switch module to switch the switch state of the switch module. In order to avoid hard contact during pressing, the pad layer 280 may have elasticity, and may be made of silica gel, rubber, or the like. The cushion layer 280 may be secured to the reinforcing sheet 270 by any means such as glue, film, foam, etc.
It should be understood that the specific structure of the fingerprint module grounded through the structural member is not required in the present application, in other words, the fingerprint module grounded through the structural member may be the fingerprint module shown in fig. 1, or may be a modification scheme similar thereto, and the like.
In order to realize the performance test of the fingerprint module, as shown in fig. 2, in one aspect of the embodiment of the present application, a test fixture is provided, including a support 110 and a test circuit board 120, where the test circuit board 120 is disposed on the support 110, and a test station 111 is disposed on the support 110, so that when testing, the fingerprint module 200 to be tested is conveniently accommodated by the test station 111, one side of the test circuit board 120, which is close to the fingerprint module 200 to be tested, has a first connection position 121, and the first connection position 121 of the test circuit board 120 is electrically connected with a structural member for grounding in the fingerprint module 200 to be tested, so that the grounding performance of the structural member is conveniently tested by the test circuit board 120.
In order to facilitate the grounding performance test of the fingerprint module 200 to be tested, a test current may be applied to the structural member in the fingerprint module 200 to be tested at a proper time during the test, so that the test circuit board 120 detects the current value or impedance on the structural member to determine whether the grounding performance meets the predetermined requirement. The main body to which the test current is applied may be an external power supply, or may be a test power supply included in the test fixture, which is not specifically limited in this application.
When the first connection location 121 of the test circuit board 120 is electrically connected to the structural component, the structural component may be the ring frame 210 in the fingerprint module shown in fig. 1, or may be the reinforcing sheet 270, for example, as shown in fig. 3: the first connection bit 121 of the test circuit board 120 is electrically connected with the annular frame 210, as shown in fig. 4, for example, the first connection bit 121 of the test circuit board 120 is electrically connected with the reinforcing sheet 270, so that when a test current is applied to a structural member in the fingerprint module 200 to be tested, the test circuit board 120 can detect the current value or impedance on the structural member to determine whether the grounding performance meets the predetermined requirement, and meanwhile, whether the electrical connection performance between the annular frame 210 and the reinforcing sheet 270 is good can be reflected primarily.
The material of the bracket 110 is not limited in this application, and may be metal, plastic, or the like.
The number of the test stations 111 on the support 110 is not limited, for example, the number of the test stations 111 can be one or more (including two or more), and when the number of the test stations 111 is multiple, the fingerprint modules 200 to be tested can be tested simultaneously, so that batch test can be realized, and the actual production requirement can be met. The plurality of test stations 111 may be arranged in a two-dimensional manner, and the arrangement may be an array or a non-array, and of course, the plurality of test stations 111 may also be arranged in a three-dimensional manner, i.e. may be arranged in a stacked manner on the basis of the two-dimensional manner.
When the support 110 is provided with the plurality of test stations 111, the test circuit board 120 can be provided with a plurality of first connection positions 121, and the plurality of first connection positions 121 and the plurality of test stations 111 are in one-to-one correspondence, so that when the fingerprint module 200 to be tested is contained in each test station 111, the fingerprint module 200 to be tested in each test station 111 can be electrically connected with the corresponding first connection position 121.
In some embodiments, as shown in fig. 2, a groove adapted to the shape of the fingerprint module 200 to be tested is provided on the bracket 110, and the groove can be used as the testing station 111, so that when the fingerprint module 200 to be tested is installed in the groove, as shown in fig. 3 or fig. 4, the bottom of the groove can be used for supporting the fingerprint module 200 to be tested, and the side wall of the groove is used for limiting the circumference of the fingerprint module 200 to be tested, so that the fingerprint module 200 to be tested has better stability during testing. Of course, when the number of the test stations 111 is plural, the corresponding number of the grooves is plural.
In some embodiments, as shown in fig. 2, a recess 114 may be further disposed at the bottom of the groove, where the recess 114 may be adapted to a pad layer 280 in the fingerprint module 200 to be tested, as shown in fig. 3 or fig. 4, when the fingerprint module 200 to be tested is disposed in the groove, the pad layer 280 may be correspondingly accommodated by the recess 114, so as to avoid possible shaking of the fingerprint module 200 to be tested due to protrusion of the pad layer 280, and effectively improve stability and reliability when the fingerprint module is disposed in the bracket 110.
In some embodiments, as shown in fig. 2, the side wall of the groove may be further provided with an avoidance channel 113, where the avoidance channel 113 may be adapted to the module circuit board 250 in the fingerprint module 200 to be tested, so that, as shown in fig. 3 or fig. 4, when the fingerprint module 200 to be tested is installed in the groove, the module circuit board 250 in the fingerprint module 200 to be tested is convenient to extend outwards through the avoidance channel 113. The avoidance channel 113 can be a through hole or a through slot, and is not limited by the application, when the avoidance channel is a through slot, and the opening of the through slot is consistent with the opening of the groove, the difficulty of installing the fingerprint module 200 to be tested and the support 110 can be reduced, and the efficiency of testing can be improved.
In some embodiments, the module circuit board 250 of the fingerprint module 200 to be tested can be electrically connected to the second connection site 122 of the test circuit board 120, so as to connect the ground circuit and facilitate the test of the grounding performance. Specifically, for example, as shown in fig. 2, the test circuit board 120 has a second connection location 122, and as shown in fig. 3 or fig. 4, when the fingerprint module 200 to be tested is installed in the groove, the module circuit board 250 in the fingerprint module 200 to be tested can be electrically connected to the second connection location 122 on the test circuit board 120 through the connector 251, so that the structural member can be grounded sequentially through the module circuit board 250 and the test circuit board 120. Of course, in other embodiments, the module circuit board 250 of the fingerprint module 200 to be tested may be electrically connected to an external device so as to connect the ground circuit.
In some embodiments, the first connection location 121 of the test circuit board 120 may be electrically connected to the structural member through a conductive member (for convenience of distinction, hereinafter referred to as a first conductive member 141), specifically, as shown in fig. 2, the first connection location 121 of the test circuit board 120 has a first contact 123, and the first contact 123 may be a gold finger, a bonding pad, etc. that is connected to a test circuit in the test circuit board 120, and for convenience of the first connection location 121 being electrically connected to the structural member, the first conductive member 141 may be fixedly disposed on the first contact 123, so that, as shown in fig. 3 or fig. 4, when the fingerprint module 200 to be tested is disposed in the groove, an extension length (an extension direction is a direction perpendicular to a horizontal plane of the test circuit board 120, for example, may be disposed between the bottom end of the structural member and the first contact 123 of the test circuit board 120, and may be a POGO pin seat, etc.), so that the first contact 123 of the test circuit board 120 is electrically connected to the structural member smoothly, thereby facilitating the ground test of the test circuit in the test circuit board 120.
In some embodiments, for convenience of layout, the test station 111 and the test circuit board 120 may be located on different sides of the support 110, so that the test circuit board 120 and the fingerprint module 200 to be tested in the test station 111 may be blocked by the support 110, for convenience of smooth electrical connection between the first connection location 121 and the structural member, a test channel 112 may be formed on the support 110, and one end of the test channel 112 extends to the test station 111, and the other end of the test channel 112 extends to the first contact 123 of the test circuit board 120, thereby facilitating the first conductive member 141 to penetrate through the test channel 112 to electrically connect the first contact 123 with the structural member. For example, as shown in fig. 2, the groove and the test circuit board 120 are respectively located at two opposite sides of the bracket 110, more specifically, the groove may be located at the top of the bracket 110, and the test circuit board 120 may be located at the bottom of the bracket 110, so, in order to facilitate the smooth electrical connection between the first connection location 121 and the structural member, a test channel 112 may be formed on the bracket 110, and thus, the first conductive member 141 fixed to the first contact 123 may extend into the groove in a manner of penetrating the test channel 112, as shown in fig. 3 or fig. 4, so that when the fingerprint module 200 to be tested is installed in the groove, the first conductive member 141 is smoothly contacted with the structural member, thereby achieving electrical connection. The first connecting position 121 can be conveniently and smoothly electrically connected with the structural member through the first conductive member 141 through the arrangement of the test channel 112, and the first conductive member 141 can be limited by utilizing the test channel 112, so that the position accuracy of the first conductive member 141 is improved, and the top end of the first conductive member 141 can be conveniently and accurately contacted with the structural member in the fingerprint module 200 to be tested.
In some embodiments, the test channels 112 may be in the form of through holes, through slots, etc., which are not particularly limited in this application.
In some embodiments, the test circuit board 120 may be fixed to the bracket 110 by a plurality of methods such as screws 130 (as shown in fig. 2 to 4), heat staking, adhesive, electric welding, etc., and the specific connection method thereof is not limited in this application.
In some embodiments, in order to facilitate the installation of the fingerprint module 200 to be tested in the test station 111, the structural member and the first conductive member 141 can be kept in good contact, and the test fixture may further include a supporting member, that is, as shown in fig. 3 or fig. 4, after the fingerprint module 200 to be tested is installed in the test station 111, the supporting member applies a supporting force to the cover plate 220 or the coating of the fingerprint module 200 to be tested along a direction perpendicular to the horizontal plane of the test circuit board 120, so that opposite sides of the fingerprint module 200 to be tested are respectively abutted with the bracket 110 and the supporting member, so that the fingerprint module 200 to be tested can be reliably contacted with the first conductive member 141 on the first contact 123.
In some embodiments, the second connection location 122 of the test circuit board 120 may also be electrically connected to the module circuit board 250 through a conductive member (for convenience of distinction, hereinafter referred to as the second conductive member 142), specifically, as shown in fig. 2, the second connection location 122 of the test circuit board 120 may have a second contact 124, and the second contact 124 may be a gold finger, a pad, etc. that may be connected to a ground circuit of the test circuit board 120, and for convenience of the second contact 124 to be electrically connected to the module circuit board 250, the second contact 124 may be fixedly provided with the second conductive member 142 on the second contact 124, so that, as shown in fig. 3 or fig. 4, when the fingerprint module 200 to be tested is installed in the groove, an extension length (an extension direction may also be a direction perpendicular to a horizontal plane of the test circuit board 120) of the second conductive member 142 may be used, for example, may be disposed between the connector 251 and the second contact 124 of the test circuit board 120, and may be a POGO pin seat, so that the second contact 124 of the test circuit board 120 forms a ground circuit board 250 through the second conductive member 142 and the connector 251 of the module circuit board 250, thereby facilitating the ground circuit board to be connected to the module circuit board 250.
In some embodiments, the second connection site 122 of the test circuit board 120 may have a plurality of second contacts 124, where a portion of the second contacts 124 may be connected to the connector 251 of the module circuit board 250 via the second conductive member 142 for implementing the grounding of the fingerprint module 200 to be tested, and the remaining second contacts 124 may still be connected to the connector 251 of the module circuit board 250 via the other second conductive member 142 for implementing the communication test of the fingerprint module 200 to be tested, and so on.
In some embodiments, the first conductive element 141 and/or the second conductive element 142 may be elastic conductive elements, i.e. they have a certain elastic deformability, so as to be able to form an abutment at the contact position when the second conductive element 142 contacts the connector 251 and/or the first conductive element 141 contacts the structural element, so as to provide a reliable electrical connection, for example the first conductive element 141 located at the first contact 123: the length of the first conductive piece 141 is slightly greater than the distance from the structural component of the fingerprint module 200 to be tested, which is arranged in the groove, to the first contact 123, so that when the fingerprint module 200 to be tested is arranged in the groove, the supporting piece can be matched, the structural component of the fingerprint module 200 to be tested is contacted with the first conductive piece 141, and meanwhile, the first conductive piece 141 is caused to deform, so that the stable and reliable contact of the structural component and the first conductive piece is ensured.
In some embodiments, as shown in fig. 2 to 4, the elastic conductive element is a probe, and the probe is thinner, so that on one hand, the influence of the elastic conductive element on the self can be reduced, the accuracy of the test is improved, and on the other hand, the space required by the arrangement of the elastic conductive element can be reduced, thereby being beneficial to the miniaturization of the test fixture. Of course, in other embodiments, the elastic conductive element may also be a spring plate or the like.
In some embodiments, the number of the elastic conductive elements is at least one, so that good electrical connection can be maintained through the remaining elastic conductive elements after a part of the elastic conductive elements are damaged. For example, as shown in fig. 2, a plurality of first contacts 123 may be disposed at the first connection location 121, and each first contact 123 may be provided with a first conductive member 141, so, as shown in fig. 3 or fig. 4, when the fingerprint module 200 to be tested is disposed in the groove, the structural member may be electrically connected to the first connection location 121 of the test circuit board 120 via the plurality of first conductive members 141, and as the number of tests increases, there may be a part of the first conductive members 141 that are worn, deformed, etc., and at this time, good electrical connection may still be maintained by other first conductive members 141, so as to provide redundancy during the test.
The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (11)
1. The utility model provides a test fixture for test fingerprint module, its characterized in that, including the support that has the test station, the test station is used for the holding fingerprint module that awaits measuring be provided with test circuit board on the support, test circuit board is close to one side of fingerprint module that awaits measuring has a hookup location, test circuit board warp first hookup location with be used for the structure electricity of ground connection in the fingerprint module that awaits measuring and be connected.
2. The test fixture of claim 1, wherein the second connection location of the test circuit board is electrically connected to a module circuit board in the fingerprint module to be tested, such that the structural member is grounded sequentially through the module circuit board and the test circuit board.
3. The test fixture of claim 2, wherein the second connection location of the test circuit board has a second contact, the second contact being electrically connected to the module circuit board via a conductive member.
4. The test fixture of claim 1, wherein the first connection location of the test circuit board has a first contact that is electrically connected to the structural member via a conductive member.
5. The test fixture of claim 4, wherein the test station and the test circuit board are located on different sides of the support, a test channel is formed in the support, one end of the test channel extends to the test station, the other end of the test channel extends to a first contact of the test circuit board, and the conductive member connected to the first contact is arranged through the test channel.
6. The test fixture of any one of claims 3 to 5, wherein the conductive member is an elastic conductive member, one end of the elastic conductive member is fixed on the test circuit board, and the other end of the elastic conductive member abuts against the fingerprint module to be tested.
7. The test fixture of claim 6, wherein the elastic conductive element is a probe.
8. The test fixture of claim 6, wherein the number of elastic conductive elements is at least one.
9. The test fixture of any one of claims 1 to 5, wherein a groove adapted to the profile of the fingerprint module to be tested is provided on the support, and the groove is used as the test station.
10. The test fixture of claim 9, wherein a side wall of the recess is provided with a relief channel adapted to a module circuit board in the fingerprint module to be tested, and the module circuit board passes through the relief channel.
11. The test fixture of any one of claims 1 to 5, further comprising a holding member for cooperating with the bracket to hold the fingerprint module to be tested.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322202507.2U CN220691081U (en) | 2023-08-15 | 2023-08-15 | Test fixture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN202322202507.2U CN220691081U (en) | 2023-08-15 | 2023-08-15 | Test fixture |
Publications (1)
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CN220691081U true CN220691081U (en) | 2024-03-29 |
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Family Applications (1)
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CN202322202507.2U Active CN220691081U (en) | 2023-08-15 | 2023-08-15 | Test fixture |
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CN (1) | CN220691081U (en) |
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2023
- 2023-08-15 CN CN202322202507.2U patent/CN220691081U/en active Active
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