CN220671508U - Electrical measurement mechanism for PCB without locating hole and edge folding - Google Patents
Electrical measurement mechanism for PCB without locating hole and edge folding Download PDFInfo
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- CN220671508U CN220671508U CN202322230234.2U CN202322230234U CN220671508U CN 220671508 U CN220671508 U CN 220671508U CN 202322230234 U CN202322230234 U CN 202322230234U CN 220671508 U CN220671508 U CN 220671508U
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- 238000005259 measurement Methods 0.000 title claims description 18
- 239000000523 sample Substances 0.000 claims abstract description 28
- 238000012360 testing method Methods 0.000 claims abstract description 6
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 238000001514 detection method Methods 0.000 abstract description 6
- 230000005856 abnormality Effects 0.000 abstract description 3
- 238000005452 bending Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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Abstract
The utility model belongs to the technical field of electric testing, and relates to an electric testing mechanism for a PCB without a locating hole and a folding edge, which comprises an upper die and a lower die, wherein a plurality of probes are arranged in the middle of the upper die and the lower die, a plurality of guide limiting pins and an auxiliary locating frame are arranged on the lower die in a floating manner, a hollowed-out area, a locating step area and an outer edge area are arranged in the middle of the auxiliary locating frame, the upper surface of the outer edge area is higher than the upper surface of the locating step area, each edge of the auxiliary locating frame is provided with a through hole, the through holes are positioned in the outer edge area, and the guide limiting pins comprise tip ends penetrating through the through holes, an annular supporting platform for supporting the lower surface of the auxiliary locating frame and springs for controlling the tip ends and the annular supporting platform to float together. The electric measuring mechanism enables the PCB without locating holes and folding edges and the auxiliary locating frame to form a whole. When the die is assembled, the probe is only pressed down, so that the problem of bending is not easy to occur, and a conductive circuit is formed, so that the conductive detection can be carried out, whether the open circuit or the short circuit abnormality exists or not is accurately judged, and misjudgment caused by damage of the probe is avoided.
Description
Technical Field
The utility model relates to the technical field of electric measurement, in particular to an electric measurement mechanism for a PCB without a locating hole and a flanging.
Background
After the processing is finished, the PCB (printed circuit board) needs to be electrically tested, and can be delivered after being qualified. The electrical measuring mechanism is contacted with different bonding pads on the PCB through the probes, and whether the circuit in the PCB is bad due to short circuit or disconnection is detected through the probes. Along with the improvement of the precision of the PCB and the diversification of products, the accuracy of electric measurement also has high requirements.
In order to locate the PCB, the edge of the functional area of the traditional PCB is provided with a folded edge, and a locating hole is arranged on the folded edge, so that the position of the PCB is located in the processing and detection processes, and after the detection is qualified, the folded edge is cut off. PCB boards include many types, such as COB boards (chip on board) and SMD boards (surface mount device boards), and in order to take into account the saving of material costs, these PCB boards have no folds and cannot be provided with positioning holes, which can bring about different positioning modes for the inspection.
Chinese patent CN208902768U discloses a tool and device for automatic testing of display motherboard ICT, the device adopts fixed mould to place the mainboard, and fixed mould has the through-hole that supplies the test needle to pass, still needs to fix a position for the PCB board through little reference column, this requires the hem that the PCB board needs to set up to have the locating hole, does not satisfy the demand of no locating hole no hem PCB board.
Chinese patent CN201654072U discloses a PCB board testing stand, which uses the opposite of the upper support column of the upper die and the lower support column of the lower die, and the top ends of the two support columns are matched in a concave-convex manner, so as to realize the accurate matching of the upper die and the lower die. However, the accuracy is mainly between the upper die and the lower die, and the accuracy improvement on the PCB is limited. If the bonding pads of the PCB board are small (the length and width dimensions of the bonding pads are less than 0.15 mm), it is difficult to align the probes (the diameter is about 0.1 mm), and even if the PCB board itself has little skew, it is likely that the probes are bent to connect with the nearby bonding pads, thus causing erroneous judgment and easy damage of the probes.
It is therefore necessary to design an electrical measurement mechanism for a locating hole-free and hemmless PCB to avoid the above problems.
Disclosure of Invention
The utility model mainly aims to provide an electrical measurement mechanism for a PCB without a locating hole and a flanging, which can better help the PCB without the locating hole to locate and vertically lift, so that a probe can accurately correspond to a bonding pad on the PCB without the locating hole and the flanging, and the probe is prevented from being bent and deformed, so that an electrical measurement result is accurate.
The utility model realizes the aim through the following technical scheme: an electrical measurement mechanism for a PCB without positioning holes and folding edges comprises an upper die and a lower die, wherein a plurality of probes are arranged in the middle of the upper die and the middle of the lower die, a plurality of guide limiting pins and an auxiliary positioning frame are arranged on the lower die in a floating mode, a hollowed-out area for avoiding all the probes, a positioning step area positioned at the edge of the hollowed-out area and an outer edge area positioned outside the positioning step area are arranged in the middle of the auxiliary positioning frame, the upper surface of the outer edge area is higher than the upper surface of the positioning step area, a through hole is formed in each edge of the auxiliary positioning frame, the through hole is positioned in the outer edge area, the guide limiting pins comprise tips penetrating through the through holes, annular supporting platforms for supporting the lower surface of the auxiliary positioning frame and springs for controlling the tips and the annular supporting platforms to float together, and the upper die is provided with guide holes matched with the guide limiting pins.
Specifically, the probe of the lower die is positioned in a groove, and the auxiliary positioning frame is positioned in the upper projection range of the groove.
Further, each side of the groove is provided with at least two guide limiting pins.
Specifically, the opposite sides of the hollow area are provided with grabbing plate notches, and the deepest positions of the grabbing plate notches are located outside the interface of the positioning step area and the outer edge area.
Specifically, the height difference between the outer edge area and the positioning step area is a, the thickness of the PCB is b, and b is more than or equal to a and less than or equal to b+0.1mm.
Further, the thickness of the positioning step area is 0.2-0.5mm.
The technical scheme of the utility model has the beneficial effects that:
in the electric measurement mechanism, the guide limiting pin supports the periphery of the auxiliary positioning frame through the annular supporting table, and the lifting direction guide of the auxiliary positioning frame is realized through the cooperation of the guide limiting pin and the through hole; meanwhile, the position of the upper die corresponds to that of the lower die by the aid of the matching of the tip and the guide hole of the guide limiting pin. The locating step area and the outer edge area have height difference, the range of the locating step area is precisely matched with the outline of the PCB, so that the PCB can be embedded in the auxiliary locating frame when being placed on the locating step area, and the PCB without locating holes and folding edges and the auxiliary locating frame form a whole. When the die is assembled, the whole vertical descending is performed, the bonding pad on the back of the PCB is contacted with the probe of the lower die, the probe is only pressed down, the problem of bending is not easy to occur, and the probe of the upper die is also contacted with the bonding pad on the whole surface of the PCB, so that a conductive circuit is formed, the conductive detection can be performed, whether the circuit breaking or the short circuit abnormality exists or not can be accurately judged, and the misjudgment caused by the damage of the probe is avoided.
Drawings
FIG. 1 is a perspective view of a lower die of an electrical measurement mechanism for a PCB without locating holes and folding edges in an embodiment;
FIG. 2 is an enlarged view of a portion of the position A of FIG. 1;
FIG. 3 is a top view of the lower die;
fig. 4 is a partial perspective view of the area near the pilot pin prior to clamping.
Marked in the figure as:
1-lower die, 11-groove, 111-probe;
2-guiding limiting pins, 21-tips, 22-annular brackets and 23-springs;
3-auxiliary positioning frames, 31-positioning step areas, 32-outer edge areas, 33-through holes and 34-plate grabbing notches; 4-upper die, 41-pilot hole.
Detailed Description
The present utility model will be described in further detail with reference to specific examples.
Examples:
as shown in fig. 1 to 4, an electrical measurement mechanism for a PCB board without positioning holes and folding edges of the present utility model includes an upper die 4 and a lower die 1, wherein the middle parts of the upper die 4 and the lower die 1 are respectively provided with a plurality of probes 111, the probes 111 of the lower die 1 are positioned in a groove 11, a plurality of alignment limiting pins 2 and an auxiliary positioning frame 3 are arranged on the lower die 1 in a floating manner, a hollow area avoiding all the probes 111, a positioning step area 31 positioned at the edge of the hollow area and an outer edge area 32 positioned outside the positioning step area 31 are arranged in the middle of the auxiliary positioning frame 3, the upper surface of the outer edge area 32 is higher than the upper surface of the positioning step area 31, each edge of the auxiliary positioning frame 3 is provided with a through hole 33, the through hole 33 is positioned in the outer edge area 32, the alignment limiting pins 2 comprise tips 21 penetrating through the through holes 33, annular brackets 22 supporting the lower surfaces of the auxiliary positioning frame 3, and springs 23 controlling the tips 21 and the annular brackets 22 to float together, and the upper die 4 is provided with alignment limiting holes 41 matching the alignment limiting pins 2.
The guide limiting pin 2 supports the periphery of the auxiliary positioning frame 3 through the annular supporting table 22, and realizes the lifting direction guide of the auxiliary positioning frame 3 through the cooperation with the through hole 33; meanwhile, the position of the upper die 4 corresponds to that of the lower die 1 by the cooperation of the tip 21 and the guide hole 41 of the guide limiting pin 2. The positioning step area 31 and the outer edge area 32 have height difference, the range of the positioning step area 31 is precisely matched with the outline of the PCB without the positioning hole and the folding edge, the length and width dimensional precision of the positioning step area 31 is less than or equal to 0.05mm, the peripheral forming dimensional precision of the PCB without the positioning hole and the folding edge is less than or equal to 0.05mm, the PCB without the positioning hole and the folding edge can be embedded in the auxiliary positioning frame 3 when placed on the positioning step area 31, and the PCB without the positioning hole and the folding edge and the auxiliary positioning frame 3 form a whole. When the die is assembled, the whole vertical descending is realized, the bonding pad on the back surface of the PCB without the locating hole and the folding edge is contacted with the probe 111 of the lower die 1, the probe 111 is only pressed down, the bending problem is difficult to occur, and the probe of the upper die 4 is contacted with the bonding pad on the whole surface of the PCB without the locating hole and the folding edge, so that a conductive circuit is formed, the conductive detection can be performed, whether the disconnection or the short circuit abnormality exists or not is accurately judged, and the misjudgment caused by the damage of the probe 111 is avoided.
As shown in fig. 3, each side of the groove 11 is provided with at least two guide limit pins 2.
Thus, the auxiliary positioning frame 3 is not easy to turn, and the positioning is accurate.
As shown in fig. 2 and 3, the hollow area is provided with a grabbing plate notch 34 at a relative position, and the deepest position of the grabbing plate notch 34 is located outside the interface between the positioning step area 31 and the outer edge area 32.
After the PCB without locating hole and folding edge is embedded into the auxiliary locating frame 3, the operation of taking out is needed, and as the edge of the PCB without locating hole and folding edge reaches the interface between the locating step area 31 and the outer edge area 32 at most, the plate grabbing notch 34 can form a space for the fingers to run through, so that the PCB without locating hole and folding edge which is electrically tested is conveniently taken out.
As shown in FIG. 4, the height difference between the outer edge region 32 and the positioning step region 31 is a, and the thickness of the PCB without positioning holes and folding edges is b, wherein b is less than or equal to a and less than or equal to b+0.1mm.
The thickness of the PCB without the locating hole and the folding edge is equal to or slightly smaller than the height difference between the outer edge area 32 and the locating step area 31, so that the damage caused by the pressure of the upper die 4 acting on the PCB without the locating hole and the folding edge during die assembly can be avoided. During detection, the PCB without the locating hole and the folding edge is protected.
As shown in fig. 4, the thickness of the positioning step region 31 is 0.2-0.5mm.
The positioning step area 31 has enough thickness to support the PCB without the positioning hole and the folding edge, so that the thickness of the positioning step area 31 cannot be lower than 0.2mm according to the use experience; and if the positioning step region 31 is too thick, the outer edge region 32 is thickened, resulting in waste of material, so that the thickness of the positioning step region 31 cannot be higher than 0.5mm.
What has been described above is merely some embodiments of the present utility model. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit of the utility model.
Claims (6)
1. An electrical measurement mechanism for a PCB board without locating holes and folding edges comprises an upper die and a lower die, wherein the middle parts of the upper die and the lower die are provided with a plurality of probes, and the electrical measurement mechanism is characterized in that: the lower die is provided with a plurality of guide limiting pins and an auxiliary positioning frame in a floating mode, a hollow area for avoiding all probes, a positioning step area located at the edge of the hollow area and an outer edge area located outside the positioning step area are arranged in the middle of the auxiliary positioning frame, the upper surface of the outer edge area is higher than the upper surface of the positioning step area, through holes are formed in each edge of the auxiliary positioning frame, the through holes are located in the outer edge area, the guide limiting pins comprise pointed ends penetrating through the through holes, annular supporting platforms for supporting the lower surfaces of the auxiliary positioning frame and springs for controlling the pointed ends and the annular supporting platforms to float together, and the upper die is provided with guide holes matched with the guide limiting pins.
2. The electrical measurement mechanism for a locating hole-less hemmless PCB of claim 1 wherein: the probe of the lower die is positioned in a groove, and the auxiliary positioning frame is positioned in the upper projection range of the groove.
3. The electrical measurement mechanism for a locating hole-less hemmless PCB of claim 2 wherein: each side of the groove is provided with at least two guide limiting pins.
4. The electrical measurement mechanism for a locating hole-less hemmless PCB of claim 1 wherein: the two opposite sides of the hollowed-out area are provided with grabbing plate notches, and the deepest positions of the grabbing plate notches are located outside the interface of the positioning step area and the outer edge area.
5. The electrical measurement mechanism for a locating hole-less hemmless PCB of claim 1 wherein: the height difference between the outer edge area and the positioning step area is a, and the thickness of the PCB without the positioning hole and the folded edge is b, wherein b is more than or equal to a and less than or equal to b+0.1mm.
6. The electrical testing mechanism for a locating hole-less hemmless PCB of claim 5 wherein: the thickness of the positioning step area is 0.2-0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322230234.2U CN220671508U (en) | 2023-08-17 | 2023-08-17 | Electrical measurement mechanism for PCB without locating hole and edge folding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322230234.2U CN220671508U (en) | 2023-08-17 | 2023-08-17 | Electrical measurement mechanism for PCB without locating hole and edge folding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220671508U true CN220671508U (en) | 2024-03-26 |
Family
ID=90327983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322230234.2U Active CN220671508U (en) | 2023-08-17 | 2023-08-17 | Electrical measurement mechanism for PCB without locating hole and edge folding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220671508U (en) |
-
2023
- 2023-08-17 CN CN202322230234.2U patent/CN220671508U/en active Active
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