CN215866989U - Probe card, detection device and wafer detection device - Google Patents

Probe card, detection device and wafer detection device Download PDF

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Publication number
CN215866989U
CN215866989U CN202122005542.6U CN202122005542U CN215866989U CN 215866989 U CN215866989 U CN 215866989U CN 202122005542 U CN202122005542 U CN 202122005542U CN 215866989 U CN215866989 U CN 215866989U
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probe
guide rail
probe card
probes
tested
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宋慧
王国峰
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Beihai Huike Semiconductor Technology Co Ltd
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Beihai Huike Semiconductor Technology Co Ltd
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Abstract

The application discloses detection device of probe card, detection device and wafer, the probe card is used for detecting the portion that awaits measuring of the product that awaits measuring, the probe card includes: the probe group is at least provided with two groups and is used for detecting at least two parts to be detected simultaneously; the number of the probes is multiple, and at least two probes form one probe group: the probe is arranged on the base; wherein all the probes in each probe set are used for detecting the same part to be detected; the distance between different probe sets is adjustable. According to the method, the probe card is suitable for detecting various products to be detected with different specifications, the cost is saved, and the testing efficiency is improved.

Description

Probe card, detection device and wafer detection device
Technical Field
The present disclosure relates to the field of testing technologies, and particularly, to a probe card, a detecting device, and a detecting device for a wafer.
Background
With the progress of society and the continuous development of industrial production, the integration level of products such as display panels, electrical components, wafers and the like is greatly improved, taking a wafer as an example, the number of components on the wafer can even reach tens of thousands, the wafer needs to leave a factory, the components need to be detected to ensure the quality, the detection purpose can be achieved by testing the testing pads on the wafer generally, the number of the testing pads is the same and numerous, and a certain time is consumed for carrying out all the detections on all the testing pads, so that the efficient performance of the related electrical parameter tests on the products with high integration level is particularly important;
taking the test of the wafer as an example, two methods are commonly applied at present, one is to use a probe to perform an individual test on each test pad, but the test efficiency is low and the required time is long; in another high-efficiency test method, a probe card is used, and a plurality of probe sets are arranged on the probe card, so that a plurality of test pads can be simultaneously measured, and the test efficiency is remarkably improved.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a probe card, detection device and detection device of wafer, the interval between a plurality of probe group on same probe card can be adjusted to be applicable to the product that awaits measuring that multiple awaits measuring department interval is different, practice thrift the cost, improve detection efficiency.
The application discloses probe card for detect the portion that awaits measuring of the product that awaits measuring includes: the probe group is at least provided with two groups and is used for detecting at least two parts to be detected simultaneously; the number of the probes is multiple, and at least two probes form one probe group: the probe group is arranged on the base; wherein all the probes in each probe set are used for detecting the same part to be detected; the distance between different probe sets is adjustable.
Optionally, the probe set comprises a fixed probe set and at least one movable probe set, the fixed probe set is fixed at one end of the base, and the movable probe set is movably arranged on the base.
Optionally, the base is provided with at least two insert blocks, and each insert block is provided with the probe group formed by at least two probes; correspond every on the base the inserted block is provided with two fixed through holes at least, the inserted block detachable is fixed to the difference fixed through hole.
Optionally, a guide rail is arranged on the base, at least two sliders are arranged on the guide rail, each slider is provided with at least two probe sets formed by the probes, and the sliders are slidably arranged on the guide rail.
Optionally, the guide rail includes a first sub-guide rail and a second sub-guide rail which are arranged in parallel, the slider includes a first connecting portion and a second connecting portion, the first connecting portion is connected with the first guide rail in a sliding manner, and the second connecting portion is connected with the second guide rail in a sliding manner.
Optionally, the first sub-guide rail and the second sub-guide rail are linear rails parallel to each other; the probes in the probe groups can move on the linear track through the sliding block, so that the distance between different probe groups can be adjusted.
Optionally, the guide rail is a convex guide rail or a concave guide rail, and a sliding groove matched with the guide rail in shape is arranged at the lower part of the sliding block.
Optionally, the base is provided with a printed circuit board, the guide rail is arranged on the printed circuit board, the probe is electrically connected with the printed circuit board through the guide rail, and the printed circuit board provides a test signal for the probe.
The application also discloses a detection device, which comprises the probe card, a driving motor, a driving mechanism and an object stage, wherein the driving mechanism is arranged on the guide rail, and the driving motor is electrically connected with the driving mechanism so as to drive the probe to move along the guide rail; the object stage is used for placing the product to be detected, and a plurality of parts to be detected are arranged in the product to be detected; the object stage is movable and is used for detecting different parts to be detected by the probe card.
The application also discloses a detection device for the wafer, including the aforesaid detection device, the product that awaits measuring is the wafer, the portion of awaiting measuring does test pad on the wafer.
The probe card is characterized in that a plurality of probe sets are arranged on a base of the probe card, so that one probe card can simultaneously detect a plurality of parts to be detected; and every probe group comprises two at least probes to once test, it has two test results at least to correspond a portion that awaits measuring, improves efficiency of software testing and accuracy, and above all, the interval between the different probe groups is adjustable, thereby is applicable to the product that awaits measuring that multiple portion interval that awaits measuring is different, when changing the product that awaits measuring promptly, need not to change the probe card, and only need adjust the interval between the probe group on the probe card, can test, practiced thrift the cost, improved detection efficiency.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a schematic diagram illustrating testing of an exemplary probe card;
FIG. 2 is a schematic diagram illustrating testing of an exemplary probe card;
FIG. 3 is a schematic view of a probe card according to an embodiment of the present application;
FIG. 4 is a schematic view of a probe card according to an embodiment of the present application;
FIG. 5 is a schematic view of a probe card insert and mounting holes according to an embodiment of the present invention;
FIG. 6 is a schematic view of a probe card according to another embodiment of the present application;
FIG. 7 is a schematic diagram of a single rail structure of a probe card according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of another exemplary single rail configuration for a probe card according to an embodiment of the present invention;
FIG. 9 is a schematic view of a probe card according to yet another embodiment of the present application;
FIG. 10 is a schematic view of a probe card according to yet another embodiment of the present application;
FIG. 11 is a schematic view of a probe card according to still another embodiment of the present application;
FIG. 12 is a schematic view of a detection device according to an embodiment of the present application;
10, a detection device; 100. a probe card; 110. a probe; 120. a probe set; 170. a base; 121. fixing the probe group; 122. moving the probe group; 130. inserting a block; 131. a fixing through hole; 132. an insertion end; 140. a guide rail; 141. a first sub-rail; 142. a second sub-rail; 143. a chute; 150. a slider; 151. a connecting portion; 152. a first connection portion; 153. a second connecting portion; 154. a sliding groove; 155. a sliding part; 160. a printed circuit board; 200. a product/wafer to be tested; 210. a component to be tested; 220. a portion under test/test pad; 300. a drive motor; 400. a drive mechanism; 500. an object stage; 600. a wafer; 700. a detection signal generator; 710. and a data line.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, fixed connections, removable connections, and integral connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
The conventional single-pair and single-pair probes can be compatible with the test of products to be tested with different sizes, but the probe test methods are inconvenient to a certain extent, because the conventional probes cannot realize the simultaneous test of a plurality of parts to be tested in the products to be tested, the test efficiency is influenced; in order to solve the technical problem, the inventors of the present invention have tried to perform a test using a probe card having a plurality of probes or a plurality of probe groups, which can simultaneously test a plurality of portions to be tested, and take a product to be tested as a wafer and the portion to be tested as a test pad in the wafer as an example, such a probe card can simultaneously test a plurality of test pads, thereby improving the test efficiency.
Fig. 1 is a schematic diagram illustrating a test of an exemplary probe card, and as shown in fig. 1, the probe card 100 includes four probe groups 120, each probe group 120 includes four probes 110, and each probe group 120 is used for testing one dut 220. Taking the product 200 to be tested as the wafer 200 and the part 220 to be tested as the Test pad 220 in the Device 210 (DUT) to be tested on the wafer 200 as an example, the design of the probe card 100 can Test a plurality of Test pads 220 simultaneously, so that the Test efficiency is improved, and since four probes 110 are used for detecting the Test pads 220 at the same time, four Test data can be generated, so that the Test efficiency and the Test accuracy can be improved; such a probe card 100 still has its own drawbacks, as shown in fig. 2:
fig. 2 is a schematic diagram illustrating a test of a probe card, and referring to fig. 2, it can be seen that, when a small-sized probe card 100 is placed on a large-sized wafer 200 for testing, the pitch between probe groups 120 of the probe card 110 is fixed, and when the probe card 120 and the probes 110 are offset from the center of the test pads 220 and even do not overlap with the test pads 220, the probe card 100 needs to be designed separately for substantially every size of wafer 200, and even the pitch between the test pads 220 in some wafers 200 is not exactly the same, so that a plurality of probe cards 100 may need to be replaced when testing one wafer 200, and the applicability of the probe card 100 is poor.
In this respect, the inventor makes further improvements, and the improved scheme is as follows:
fig. 3 is a schematic diagram of a probe card according to an embodiment of the present application, and as shown in fig. 3, as an embodiment of the present application, the present application discloses a probe card 100 for inspecting a portion under test 210 of a product under test 200, including: the probe assembly comprises a probe set 120, a probe 110 and a base 170, wherein the needle tail of the probe 110 is arranged on the base 170 of the probe card 100, and the needle head of the probe 110 is used for detecting a part to be detected 220 in a product to be detected 200; the probe 110 has a plurality of probes, and at least two probes 110 form a probe group 120; all the probes 110 in each probe group 120 are used for detecting the same portion to be detected 210, and the distance between different probe groups 120 is adjustable. Compared with the condition that only one probe 110 tests the part to be tested 210, the plurality of probes 110 test the part to be tested 210 together, so that the test speed and efficiency are obviously improved, a plurality of test results can be obtained at the same time, and the test accuracy is improved; meanwhile, in the present application, the position of the probe sets 120 on the probe card 100 is adjustable, so that the distance between different probe sets 120 is adjustable. Due to the design, the probe card can still be suitable when the sizes of the products to be tested 200 are different, particularly the distances between the parts to be tested 220 in the products to be tested 200 are different; taking the product 200 to be tested as the wafer 200 and the part 220 to be tested as the testing pad 220 in the device 210 to be tested on the wafer 200 as an example, when the wafer 200 with different specifications is replaced and the distance between the different testing pads 220 in the wafer 200 is changed (or the distance between the central points of the different testing pads is changed), the probe card 100 of the present application can correspondingly adjust the distance between the probe sets 120, so that the probe sets 120 on the probe card 100 can still correspond to the testing pads 220, thereby achieving the purpose that the same probe card 100 is suitable for the wafers 200 with different specifications, improving the applicability of the probe card 100, and being beneficial to reducing the production cost. When adjusting the pitch of the probe group 120, it is preferable that the probes 110 in the probe group 120 are adjusted to correspond to the center of the test pad 220 or to be close to the center of the test pad 220.
Herein, the pitch between the probe sets 120 refers to a pitch between center points of the probes 110 in the probe sets 120, or a pitch between two nearest probes 110 in the probe sets 120. The center point of the probe group 120 refers to a center point formed by the plurality of probes 110 in the probe group 120, the plurality of probes 110 are generally regularly arranged to form a regular polygon, the center point formed by the plurality of probes 110 is a center point of the polygon, and if the plurality of probes 110 form an irregular polygon, the center point of the irregular polygon can be preset as required.
As shown in fig. 4, fig. 4 is a schematic view of a probe card of the present application. A plurality of fixing through holes 131 for fixing the probes 110 are formed in the base 170 of the probe card 100, and the number of the fixing through holes 131 may be greater than that of the probes 110, thereby facilitating the position adjustment of the probe sets 120 on the fixing through holes 131. The probe card 100 of the present application includes at least two probe sets 120 for simultaneously inspecting at least two to-be-tested parts 210; the center points of the different probe sets 120 are located at adjustable distances. The plurality of probe sets 120 are arranged on the base 170 of one probe card 100, and when the parts to be tested 210 of a plurality of products to be tested 200 with different specifications need to be tested, the plurality of probe sets 120 can be used for simultaneously testing the parts to be tested 210 of the plurality of products to be tested 200, so that the testing speed of the plurality of products to be tested 200 is increased, and the testing efficiency is improved; meanwhile, for products 200 to be tested with different sizes, the distances between the central positions of the parts to be tested 210 are different due to the different sizes of the products 200 to be tested, which may cause the distances between the central positions of the parts to be tested 210 to be farther and farther as the sizes of the products to be tested 200 become larger; if a plurality of probe sets 120 with non-adjustable center point positions are used for measurement, when all the probes 110 in one of the probe sets 120 correspond to the center position of the dut 210 of one of the products 200, the positions corresponding to the other probe sets 120 may not be the center position of the dut 210 of the products 200 and may generate large deviations. In the present application, the distance between the center points of the probe sets 120 is adjustable, and at this time, the distance between the center points of the probe sets 120 is adjusted to adapt to the positions of the portions to be measured 210 with different center position intervals, and all the probes 110 in the probe sets 120 are respectively in one-to-one correspondence with the center positions of the portions to be measured 210 with different center position intervals, so as to ensure that the probe sets 120 can simultaneously measure the portions to be measured 210 with different center position intervals. By using the probe sets 120 on the base 170 of one probe card 100 and aligning the to-be-tested parts 210 with different center positions, the types and the number of the probe cards 100 are reduced, the cost is saved, and the measurement efficiency is improved by measuring at the same time.
Fig. 5 is a schematic view of a probe card with at least two insert blocks 130 and fixing through holes, as shown in fig. 5, as another embodiment of the present invention, the base 170 of the probe card 100 of the present invention is provided with at least two insert blocks 130, and the insert blocks 130 are square and have conductive blocks, such as metal blocks, or other shapes with conductive materials. Each insert block 130 is provided with a probe group 120 formed by at least two probes 110; the tail of the probe 110 is mounted on the plug 130, and the tip is used for detecting the portion 210 to be tested of the product 200 to be tested. In addition, the fixing through holes 131 originally used for fixing the probes 110 may also be used for fixing the insert blocks 130, at least two fixing through holes 131 are provided on the base 170 of the probe card 100 corresponding to each insert block 130, an insertion end 132 fixed to the fixing through holes 131 is further provided on the insert block 130, the size of the insertion end 132 is adapted to the fixing through holes 131, and the insert block 130 can be detachably fixed to different fixing through holes 131. And the combination between at least two fixed through holes 131 corresponds to the portion to be detected 210 with different center position intervals, that is, the position of each jack inserted into the fixed through hole 131 corresponds to the portion to be detected 210 with different center position intervals, so as to ensure that the probe set 120 on the insert block 130 can correspond to the portion to be detected 210 with different center position intervals when the insert block 130 is inserted into different fixed through holes 131, and detect the portion to be detected 210 with different center position intervals.
When actually detecting the to-be-tested parts 210 of different to-be-tested products 200, the probe sets 120 formed by at least two probes 110 are installed on the insertion block 130, the insertion block 130 and the fixing through holes 131 on the base 170 of the probe card 100 are detachably fixed through the insertion end 132 on the insertion block 130, when only one insertion block 130 is needed to test the to-be-tested parts 210 with different center position intervals, the insertion block 130 only needs to be pulled down from the position of the last fixing through hole 131 and installed at the position suitable for the to-be-tested product 200 with the next size, so that the to-be-tested parts 210 of the to-be-tested products 200 with the other size can be tested, the applicability of the probe card 100 is improved, meanwhile, when the insertion block 130 or the probes 110 are damaged, the quick replacement can be carried out through a detachable structure, the working efficiency is improved, of course, the insertion block 130 can also be provided with a plurality of fixing through holes 131 more than the number of the insertion blocks 130, this ensures that the base 170 of the probe card 100 has a sufficient number of fixing through-holes 131 to facilitate positional adjustment between the plurality of insert blocks 130. When the plurality of the insertion blocks 130 are provided, the plurality of sets of the probe sets 120 are provided on the base 170 of the probe card 100, and a plurality of products 200 to be tested can be simultaneously detected, and meanwhile, when a plurality of portions 210 to be tested with different center position intervals need to be tested, only the positions of the fixing through holes 131 of the plurality of insertion blocks 130 on the base 170 of the probe card 100 need to be correspondingly adjusted, and the probe sets 120 on the plurality of insertion blocks 130 are correspondingly arranged on the center positions of the portions 210 to be tested with different center position intervals, so that the portions 210 to be tested with different center position intervals can be simultaneously tested, the operation is convenient, the cost is saved, and the working efficiency is improved. In this application, the insertion end 132 of the insertion block 130 may be a screw, and the fixing through hole 131 may be a screw hole. The insert block 130 is detachably mounted on the base 170 of the probe card 100 by means of screws and screw holes, so that it is easy and convenient to replace. However, in the present application, the fixing method between the insert block 130 and the base 170 of the probe card 100 is not limited to the fixing method of the screw and the screw hole, and may be a fastening method; moreover, the guide rail 140 is disposed on the base 170 of the probe card 100, and the fixing through hole 131 is disposed on the guide rail 140 to be matched and fixed with the plug block 130, so that the above effects can be achieved, and the description thereof is omitted.
Fig. 6 is a schematic view of a probe card according to another embodiment of the present invention, as shown in fig. 6, a printed circuit board 160 is disposed on a base 170 of a probe card 100, a guide rail 140 is disposed on the printed circuit board 160, and the guide rail 140 may have a length of 2.8 mm and a width of 38 μm. The dimensions of the guide rail 140 given in this application are the preferred dimensions of the embodiment, but are not limited to only a length of 2.8 mm and a width of 38 μm, but other dimensions are also possible.
The probes 110 are electrically connected to a printed circuit board 160 through the rails 140, and the printed circuit board 160 provides test signals to the probes 110. At least two sliders 150 are disposed on the guide rail 140, each slider 150 is disposed with at least two probe sets 120 formed by the probes 110, and the sliders 150 are slidably disposed on the guide rail 140. When the parts to be tested 210 with different center position intervals need to be tested, the sliders 150 on the guide rails 140 are moved, the positions of the probe groups 120 on the sliders 150 are adjusted, the positions of the different probe groups 120 are adjusted to the parts to be tested 210 of the corresponding products to be tested 200, and the parts to be tested 210 with different center position intervals can be tested. Through the mode of the slider 150 on the sliding guide rail 140, not only the adjustment of the distance between the central points of the different probe sets 120 becomes simpler, but also the adjustment of the plurality of sliders 150 is flexible, so that the probe card 100 can be adapted to the portions to be detected 210 with different distances between the central points, so that the probe card 100 can detect the portions to be detected 210 with different distances between the central points at the same time, the cost is saved, and the detection efficiency is improved.
Further, as shown in fig. 7, the guide rail 140 may be provided in a single piece, and when one guide rail 140 is provided on the base 170 of the probe card 100, the guide rail 140 is a convex-type guide rail 140 or a concave-type guide rail 140, and the lower portion of the slider 150 is provided with a slide groove 143 having a shape matched with the guide rail 140. When the guide rail 140 is the guide rail 140 shaped like a Chinese character 'ao', the guide rail 140 is provided with a slide groove 143, the corresponding slide block 150 is provided with a connecting part 151, the connecting part 151 on the slide block 150 can be embedded into the slide groove 143 and moves along the slide groove 143, and the probe group 120 on the slide block 150 is moved to the position corresponding to the part to be measured 210 of the product; by designing the sliding groove 143 on the guide rail 140 to be in sliding connection with the slider 150, the probe sets 120 on the slider 150 can move on the guide rail 140 more easily, and the positions and distances among the plurality of probe sets 120 can be adjusted more easily to adapt to the portions to be measured 210 with different center position intervals, so that the probes 110 in the probe sets 120 can be adjusted to the center positions corresponding to the portions to be measured 210 more conveniently. This improves not only the applicability of the probe card 100 but also the inspection efficiency.
In the present application, the way of fitting and fixing the guide rail 140 and the slider 150 is not limited to the way of providing the sliding groove 143 on the guide rail 140, as shown in fig. 8, the guide rail 140 may also be a raised guide rail 140, the raised guide rail 140 includes a raised sliding portion 155, the upper portion of the slider 150 has a sliding groove 154, the sliding portion 155 on the raised guide rail 140 is inserted into the sliding groove 154 on the slider 150, so that the slider 150 and the raised guide rail 140 are slidably connected, the slider 150 can move on the guide rail 140, and the probe set 120 is mounted on the slider 150, which can also achieve the above effects, and will not be described again.
As shown in fig. 9, the number of the guide rails 140 may be two, the guide rail 140 includes a first sub-guide 141 and a second sub-guide 142 arranged in parallel, the slider 150 includes a first connecting portion 152 and a second connecting portion 153, the first connecting portion 152 is slidably connected to the first guide rail 140, and the second connecting portion 153 is slidably connected to the second guide rail 140. At this time, the slider 150 moves along the position between the first sub-guide rail 141 and the second sub-guide rail 142, the first guide rail 140 and the second guide rail 140 limit the slider 150 between the two guide rails 140, a certain limiting effect is provided for the slider 150, and the moving track of the slider 150 is limited, so that the slider 150 moves on the guide rails 140 more stably, and in the sliding process, the probe group 120 on the slider 150 can be positioned to the central position of the part to be tested 210 of the product to be tested 200 to be tested more quickly and efficiently, thereby shortening the detection time for the part to be tested 210 with different central position intervals, and improving the detection efficiency.
In addition, in the present application, the probes 110 on the slider 150 or the insert 130 may be detachable, or may be integrally formed with the slider 150 or the insert 130, for example, a slider 150 or an insert 130 for fixing four probes 110 to form one probe set 120 or other number of probes 110 to form a probe set 120 is designed in advance according to the required size of the product 200 to be tested; when the probe 110 is damaged and needs to be replaced, the corresponding probe 110 can be replaced only by replacing the corresponding sliding block 150 or the corresponding inserting block 130, so that the step of installing the probe 110 is simplified, the installation time is shortened, and the working efficiency is improved.
Meanwhile, according to the present invention, two guide rails 140 are designed on the printed circuit board 160 on the base 170 of the probe card 100, on the two guide rails 140, four screw holes into which the probes 110 at the center of the part to be measured 210 are inserted may be designed in advance on the guide rails 140 according to the part to be measured 210 having different center position intervals, so as to fix the probes 110 conveniently, the positions where the probes 110 need to be fixed are determined in advance according to the part to be measured 210 of the product to be measured 200, and the probes 110 may be installed in different corresponding screw holes in a pluggable manner. By such a method, one probe card 100 can satisfy the requirement of efficiently testing the parts to be tested 210 with different center-to-center positions, thereby realizing the requirement of efficient and flexible testing.
Specifically, as shown in fig. 10, the base 170 of the probe card 100 is provided with four probe sets 120, and each probe set 120 includes four probes 110; the first sub-rail 141 and the second sub-rail 142 are linear rails parallel to each other; the probes 110 in the probe group 120 can all move on a linear track through the slider 150, so that the distance between the central points of different probe groups 120 can be adjusted. Four probes 110 constitute a probe group 120, and four probes 110 test a portion 210 to be tested simultaneously, compare original probe card 100 single probe 110 test a portion 210 to be tested, the test efficiency of four probes 110 is higher, a probe card 100 can test four portions 210 to be tested that the central position interval is different simultaneously along the straight line, through combining four probe groups 120 together, design two guide rails 140 and carry out position shift to probe group 120, design the position on guide rail 140 in advance according to the product size of testing, guarantee that a probe card 100 can realize testing the portion 210 to be tested that the central position interval is different.
In addition, the guide rail 140 in the present application is not limited to the two linear guide rails 140, and the guide rails 140 may be guide rails 140 having other shapes, and the probes 110 of the two guide rails 140 may move not only in the X-axis direction but also in other directions, such as the Y-axis and Z-axis directions, and the probes 110 may move toward the portion to be measured 210 of the product to be measured 200 along the X-axis and Y-axis directions, and may adjust the position along the X-axis, Y-axis and Z-axis directions by the probes 110 themselves. However, it is currently important that there is misalignment in the X-direction, so that movement is primarily in the X-direction, and Y-direction or other movement can be used as an auxiliary movement to adjust the position of the probe sets 120. Meanwhile, the number of the guide rails 140 is not limited to one or two, and the more the guide rails 140 are, the more the sliders 150 or the inserts 130 are mounted, the more the probe groups 120 can be moved, and the more the parts to be tested 210 having different center positions and pitches can be tested. In the present application, the number and shape of the guide rails 140 are described only for the illustration of the preferred embodiment, and the number and shape of the guide rails 140 are not particularly limited.
For example, in the present application, the motion trajectory of each probe 110 in the probe set 120 is the same, the motion trajectory of each probe 110 is at least two concentric circular rings, and is connected to the linear structure between each circular ring, and correspondingly, the guide rail 140 is designed as at least two concentric circular ring guide rails, and is connected to the linear guide rail between each circular ring guide rail, the distance between two adjacent circular ring guide rails may be small, the probe 110 may change the track between different circular ring guide rails through the linear guide rail, and the position of the probe 110 is finely adjusted, so as to change the distance between different probe sets 120.
As another embodiment of the present application, as shown in fig. 11, the probe set 120 includes a fixed probe set 121 in which the probes 110 are fixed at one end of a base 170 of the probe card 100, and at least one movable probe set 122 in which the movable probe set 122 is movably disposed on the base 170 of the probe card 100. In such a design, one probe group 120, i.e., four needles on the fixed probe group 121, are fixed in relative positions, so that the first to-be-tested part 210 on the base 170 of the probe card 100 can be ensured to be located at the center of the to-be-tested part 210, the to-be-tested part 210 of one to-be-tested product 200 is first tested by the fixed probe group 121, the position of the fixed probe group 121 is determined to correspond to the center position of the to-be-tested part 210 of the to-be-tested product 200, and then the movable probe groups 122 on other positions to be tested are tested later are adjusted according to the size of the to-be-tested product 200 by the center position of the fixed probe group 121, so as to find the center of the to-be-tested part 210 for testing. In the actual test process, the sizes of the peripheries of the products 200 to be tested with different sizes may be different, but the actual test positions are the central positions of the parts 210 to be tested of the products 200 to be tested, and the actual reason is often that the common probe card cannot detect the parts 210 to be tested because the distances between the central positions of the parts to be tested are different; therefore, after the central position of the fixed probe set 121 is determined to correspond to the central position of the dut 210, the other probe sets 120 can be quickly adjusted to the central positions of the duts 210 corresponding to different products to be tested 200 for testing. Meanwhile, different probe sets 120 can be positioned to the center of the portion to be detected 210 to be detected more quickly and accurately. The detection speed and the detection efficiency are obviously improved.
As another embodiment of the present invention, as shown in fig. 12, the present application further discloses a testing apparatus 10 including the probe card 100, the driving motor 300, the driving mechanism 400, and the stage 500, wherein the driving mechanism 400 is disposed on the guide rail 140, the driving mechanism 400 is connected to the driving motor 300, the driving motor 300 converts electric energy into kinetic energy of the driving mechanism 400, the driving mechanism 400 drives the probes 110 to move along the guide rail 140, so as to move the probe groups 120 formed by the plurality of probe groups 120, and adjust the center positions among the plurality of probe groups 120 to adapt to the testees 210 having different center position pitches, so that the probes 110 in the plurality of probe groups 120 can respectively correspond to the center positions of the testees 210 having different center position pitches, and thus the testees 210 having different center position pitches can be tested.
The detection apparatus 10 further comprises a detection signal generator 700, the detection signal generator 700 being connected to the probe 110; specifically, the data line 710 may be directly electrically connected to the probe 110, or the guide rail 140 may be made of a conductor, and then the detection signal generator 700 is electrically connected to the guide rail 140, and the guide rail 140 is electrically connected to the probe 110. Thus, the test signal detected by the tip of the probe 110 can be transmitted to the test signal generator 700 through the data line 710 to obtain the required test data.
In addition, in the actual test process, the product 200 to be tested is placed on the objective table 500, and a plurality of test pads 220 to be tested are arranged in the product 200 to be tested; since the center positions of the plurality of test pads 220 to be inspected are spaced differently, the positions between the probe groups 120 need to be adjusted. The stage 500 is movable for the probe card 100 to inspect the test pads 220 having different center-to-center positions. When testing the test pads 220 having different center-to-center distances, the stage 500 may be moved to adjust the positions of the test pads 220 so that the center positions of the test pads 220 correspond to the positions of the probes 110 in the probe group 120. The position of the probe set 120 is adjusted on the base 170 of the probe card 100 by matching the position of the movable object stage 500, and the probe set 120 is adjusted in two directions from the detecting end and the object carrying section, so that the time for the probe set 120 to correspond to the central position of the part 210 to be detected of the product 200 to be detected is shortened, the detection time is greatly shortened, and the detection efficiency is improved. The objective table 500 in the application can be an objective table and also can be a mechanical arm, when the objective table 500 is a table, the product 200 to be tested can be directly placed on the objective table, and when the objective table 500 is a mechanical arm, the product 200 to be tested is grasped by the mechanical arm to be tested.
Further, the stage 500 may be movable, and the position of the center point of the probe group 120 may be adjustable, so as to perform fine adjustment, so as to adjust the position of the center point of the probe group 120 to the center of the testing pad 220; the switching of the test pads 220 with different center position intervals is realized; in the present application, the stage 500 may be immovable, and in this case, the probe card 100 may be designed to be relatively large, and the center point position of the probe group 120 may be adjustable, so that one probe group 120 detects a plurality of test pads 220 with different center position pitches.
The portion under test 210 of the product under test 200 that can be used by the inspection apparatus 10 in the present application may be the portion under test 210 of a semiconductor chip or other electronic device, such as the portion under test 210 in a display device or in a wafer 600, or the portion under test 210 of other products. The wafer 600 is taken as an example only, and when the product 200 to be tested is the wafer 600, the portion to be tested 210 is the testing pad 220 in the wafer 600.
Therefore, there are many situations that a common probe card cannot test a plurality of parts to be tested 210, taking the wafer 600 as an example, firstly, on the same wafer 600, the distances between different test pads 220 may be different, resulting in different distances between the middle positions of different test pads 220; second, the probe card 100, in which the probe set 120 is not adjustable, is basically unable to be applied to the detection of wafers 600 of different specifications because the wafers 600 of different specifications have the same size of test pads 220, but the distance between the center positions of the test pads 220 is smaller and the distance between the wafers 600 of different sizes is larger.
For testing of chips on the wafer 600, the probe card 100 disclosed in the present application is also used for testing. The probes 110 on the base 170 of the probe card 100 are capable of simultaneously making electrical signal connections with a plurality of test pads 220 on the wafer 600 and a tester. After the wafer 600 is tested, the probe card 100 is lifted or the wafer 600 is lowered to separate the probe card 100 from the chips to be tested. The next batch of chips to be tested is then positioned through the probe 110 stage and electrical contact is made between the probe card 100 and the chips to be tested by lowering the probe card 100 or raising the wafer 600. The above testing process may be repeated until all the chips to be tested on the wafer 600 are tested. Therefore, the test pads 220 with different center position intervals on the wafer 600 can be simultaneously detected through one probe card 100, the efficiency of detecting the wafer 600 is improved, and the cost is saved.
It should be noted that the inventive concept of the present application can form many embodiments, but the present application has a limited space and cannot be listed one by one, so that, on the premise of no conflict, any combination between the above-described embodiments or technical features can form a new embodiment, and after the embodiments or technical features are combined, the original technical effect will be enhanced.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.

Claims (10)

1. A probe card for inspecting a portion to be inspected of a product to be inspected, comprising:
the probe sets are at least provided with two groups and are used for detecting at least two parts to be detected simultaneously;
a plurality of probes, at least two of which constitute one of said probe sets; and
a base on which the probe set is mounted;
wherein all the probes in each probe set are used for detecting the same part to be detected; the distance between different probe sets is adjustable.
2. The probe card of claim 1, wherein the probe set comprises a fixed probe set fixed at one end of the base and at least one movable probe set movably disposed on the base.
3. The probe card of claim 1, wherein the base is provided with at least two insert blocks, and each insert block is provided with the probe group formed by at least two probes;
correspond every on the base the inserted block is provided with two fixed through holes at least, the inserted block detachable is fixed to the difference fixed through hole.
4. The probe card of claim 1, wherein the base has a guide rail, the guide rail has at least two sliders, each of the sliders has at least two probe sets formed by the probes, and the sliders are slidably disposed on the guide rail.
5. The probe card of claim 4, wherein the guide rail comprises a first sub-guide rail and a second sub-guide rail arranged in parallel, and the slider comprises a first connecting portion and a second connecting portion, wherein the first connecting portion is slidably connected with the first sub-guide rail, and the second connecting portion is slidably connected with the second sub-guide rail.
6. The probe card of claim 5,
the first sub-guide rail and the second sub-guide rail are linear rails which are parallel to each other;
the probes in the probe groups can move on the linear track through the sliding block, so that the distance between different probe groups can be adjusted.
7. The probe card according to claim 4, wherein the guide rail is a convex-shaped guide rail or a concave-shaped guide rail, and a sliding groove having a shape matching the guide rail is formed at a lower portion of the slider.
8. The probe card of claim 4, wherein the base is provided with a printed circuit board, the guide rails are provided on the printed circuit board, the probes are electrically connected with the printed circuit board through the guide rails, and the printed circuit board provides test signals for the probes.
9. An inspection apparatus, comprising the probe card of any one of claims 4 to 7, a driving motor, a driving mechanism, and a stage, wherein the driving mechanism is disposed on the guide rail, and the driving motor is electrically connected to the driving mechanism to drive the probe to move along the guide rail;
the object stage is used for placing the product to be detected, and a plurality of parts to be detected are arranged in the product to be detected;
the object stage is movable and is used for detecting different parts to be detected by the probe card.
10. An inspection apparatus for a wafer, comprising the inspection apparatus as claimed in claim 9, wherein the product to be inspected is a wafer, and the portion to be inspected is a test pad on the wafer.
CN202122005542.6U 2021-08-24 2021-08-24 Probe card, detection device and wafer detection device Active CN215866989U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115032430A (en) * 2022-06-07 2022-09-09 长鑫存储技术有限公司 Probe structure and manufacturing method thereof
CN115792557A (en) * 2023-02-03 2023-03-14 苏州联讯仪器股份有限公司 Probe installation structure for wafer-level reliability test and reliability test system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115032430A (en) * 2022-06-07 2022-09-09 长鑫存储技术有限公司 Probe structure and manufacturing method thereof
CN115032430B (en) * 2022-06-07 2024-05-03 长鑫存储技术有限公司 Probe structure and manufacturing method thereof
CN115792557A (en) * 2023-02-03 2023-03-14 苏州联讯仪器股份有限公司 Probe installation structure for wafer-level reliability test and reliability test system

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