CN220653600U - Multilayer substrate - Google Patents

Abstract

The purpose of the present utility model is to provide a multilayer substrate that can suppress the occurrence of characteristic impedance mismatch in the region between a signal conductor layer and a radiation conductor layer. The maximum width in the line width direction of the 2 nd connection section (A12) is smaller than the maximum width in the line width direction of the 1 st connection section (A11). The 1 st intermediate section (A21) includes a1 st thick line section (A21 b) having a width in the line width direction larger than the width in the line width direction of the line section (A31). The 2 nd intermediate section (A22) includes A2 nd thick line section (A22 b) having a width in the line width direction larger than the width in the line width direction of the line section (A31). The 1 st thick line section (a 21 b) and the 2 nd thick line section (a 22 b) are adjacent to the line section (a 31).

Description

Multilayer substrate

Technical Field

The present utility model relates to a multilayer substrate including a radiation conductor layer.

Background

As a conventional utility model for a multilayer substrate, an antenna module described in patent document 1 is known. The antenna module includes an antenna package and a connection member. The connection member is a flexible band-shaped substrate. The connection member includes a power supply line. The antenna package is fixed on the connection member. The antenna package includes a patch antenna. The patch antenna is electrically connected to the power supply line.

Prior art literature

Patent literature

Patent document 1: U.S. patent application publication 2020/0194893 specification

However, in the antenna module described in patent document 1, there is a case where a mismatch in characteristic impedance occurs in a section between the patch antenna and the power supply line.

Disclosure of Invention

Problems to be solved by the utility model

Accordingly, an object of the present utility model is to provide a multilayer substrate capable of suppressing a characteristic impedance mismatch between a signal conductor layer and a radiation conductor layer.

Technical scheme for solving problems

The multilayer substrate according to one embodiment of the present utility model includes:

a laminated body having a structure in which a plurality of insulator layers including an intermediate insulator layer and a negative-side adjacent insulator layer are laminated so as to be aligned in a Z-axis direction, wherein each of the plurality of insulator layers has a positive main surface and a negative main surface located on a negative side of the positive main surface in a Z-axis direction, and the negative-side adjacent insulator layer is located on the negative side of the Z-axis direction of the intermediate insulator layer and is in contact with the intermediate insulator layer;

a radiation conductor layer provided on the laminate and located on the positive side of the Z axis with respect to the intermediate insulator layer;

A signal conductor layer provided on the laminate and located on the negative side of the Z axis with respect to the intermediate insulator layer;

a connection conductor layer provided on the negative main surface of the intermediate insulator layer and including a 1 st connection section, a 2 nd connection section, a line section, a 1 st intermediate section, and a 2 nd intermediate section, wherein the 1 st intermediate section is adjacent to the 1 st connection section, the 2 nd intermediate section is adjacent to the 2 nd connection section, and the line section is adjacent to the 1 st intermediate section and the 2 nd intermediate section;

a 1 st ground conductor layer which is provided on the laminate, is located on the negative side of the Z axis with respect to the connection conductor layer and the signal conductor layer, and overlaps at least a part of the connection conductor layer and at least a part of the signal conductor layer when viewed in the Z axis direction;

a 1 st interlayer connection conductor in contact with the 1 st connection section; and

a 2 nd interlayer connection conductor in contact with the 2 nd connection section,

one of the 1 st interlayer connection conductor and the 2 nd interlayer connection conductor penetrates through the intermediate insulator layer in the Z-axis direction and electrically connects the radiation conductor layer and the connection conductor layer,

The other of the 1 st interlayer connection conductor and the 2 nd interlayer connection conductor penetrates through the negative-side adjacent insulator layer in the Z-axis direction and electrically connects the signal conductor layer and the connection conductor layer,

the direction in which the connection conductor layer extends is defined as the direction of extension,

a direction orthogonal to the extending direction and the Z-axis direction is defined as a line width direction,

the 1 st connection section is located at the 1 st end of the connection conductor layer in the extending direction, the 2 nd connection section is located at the 2 nd end of the connection conductor layer in the extending direction, the 2 nd end of the connection conductor layer is located at the opposite side of the 1 st end of the connection conductor layer in the extending direction,

in the extending direction, both ends of the 1 st connection section are located at equal distances from the center of the 1 st interlayer connection conductor as viewed in the Z-axis direction,

in the extending direction, both ends of the 2 nd connection section are located at equal distances from the center of the 2 nd interlayer connection conductor as viewed in the Z-axis direction,

the maximum width in the line width direction of the 2 nd connection section is smaller than the maximum width in the line width direction of the 1 st connection section,

The 1 st intermediate section includes a 1 st thick line section having a width in the line width direction larger than a width in the line width direction of the line section,

the 2 nd intermediate section includes a 2 nd thick line section having a width in the line width direction larger than a width in the line width direction of the line section,

the 1 st thick line section and the 2 nd thick line section are adjacent to the line section.

Effects of the utility model

According to the multilayer substrate of the present utility model, it is possible to suppress the occurrence of characteristic impedance mismatch in the section between the signal conductor layer and the radiation conductor layer.

Drawings

Fig. 1 is an exploded perspective view of a multilayer substrate 10.

Fig. 2 is a cross-sectional view of the multilayer substrate 10 at A-A of fig. 1.

Fig. 3 is a top view of the connection conductor layer 24.

Fig. 4 is a smith chart.

Fig. 5 is a plan view of the connection conductor layer 24 a.

Fig. 6 is a top view of the connection conductor layer 24 b.

Fig. 7 is a plan view of the connection conductor layer 24 c.

Fig. 8 is a smith chart.

Fig. 9 is a plan view of the connection conductor layer 24 d.

Fig. 10 is a cross-sectional view of the multilayer substrate 10 a.

Fig. 11 is a cross-sectional view of the multilayer substrate 10 b.

Fig. 12 is a plan view of the connection conductor layer 24 provided on the multilayer substrate 10 b.

Description of the reference numerals

10. 10a, 10b: a multilayer substrate;

12: a laminate;

12a: a1 st laminated body portion;

12b: a2 nd laminated body portion;

14a to 14g: an insulator layer;

15a to 15c: a protective layer;

18: a2 nd ground conductor layer;

20: a radiation conductor layer;

22a, 22b, 24 a-24 d: a connection conductor layer;

26: a signal conductor layer;

28: a1 st ground conductor layer;

a1: interval 1;

a11: a1 st connection section;

a12: a2 nd connection section;

a2: interval 2;

a21: 1 st intermediate interval;

a21b: 1 st thick line section;

a21a: 1 st thin line section;

a22: a2 nd intermediate section;

a22b: a2 nd thick line interval;

a22a: a2 nd thin line section;

a3: interval 3;

a31: a line section;

v1 to v4: and an interlayer connection conductor.

Detailed Description

(embodiment 1)

[ Structure of multilayer substrate 10 ]

Hereinafter, the structure of the multilayer substrate 10 according to embodiment 1 of the present utility model will be described with reference to the drawings. Fig. 1 is an exploded perspective view of a multilayer substrate 10. Fig. 2 is a cross-sectional view of the multilayer substrate 10 at A-A of fig. 1. Fig. 3 is a top view of the connection conductor layer 24.

Hereinafter, the lamination direction of the laminated body 12 of the multilayer substrate 10 is defined as the up-down direction. The up-down direction is consistent with the Z-axis direction. The upward direction is the positive direction of the Z axis. The downward direction is the negative direction of the Z-axis. The multilayer substrate 10 is viewed in the up-down direction, and two directions in which the sides of the multilayer substrate 10 extend are defined as the left-right direction and the front-back direction, respectively. The left-right direction is consistent with the X-axis direction. The front-rear direction coincides with the Y-axis direction. The left-right direction is orthogonal to the up-down direction. The front-rear direction is orthogonal to the up-down direction and the left-right direction. The definition of the direction in this specification is an example. Therefore, the direction of the multilayer substrate 10 in actual use and the direction in the present specification do not need to be identical. In the drawings, the vertical direction may be reversed. Similarly, in each drawing, the left-right direction may be reversed. The front-to-back direction may also be reversed in each of the figures.

Hereinafter, X is a component or member of the multilayer substrate 10. In the present specification, unless otherwise specified, each part of X is defined as follows. The front part of X means the front half of X. The rear part of X means the rear half of X. The left part of X means the left half of X. The right part of X means the right half of X. The upper part of X means the upper half of X. The lower part of X means the lower half of X. The front end of X means the front end of X. The rear end of X means the end in the rear direction of X. The left end of X means the left end of X. The right end of X means the right end of X. The upper end of X means the end in the upward direction of X. The lower end of X means the end in the lower direction of X. The front end of X means the front end of X and the vicinity thereof. The rear end of X means the rear end of X and the vicinity thereof. The left end of X means the left end of X and the vicinity thereof. The right end of X means the right end of X and the vicinity thereof. The upper end of X means the upper end of X and the vicinity thereof. The lower end of X means the lower end of X and the vicinity thereof.

The multilayer substrate 10 is used for electronic devices such as mobile phones. As shown in fig. 1, the multilayer substrate 10 includes a laminate 12, a 2 nd ground conductor layer 18, a radiation conductor layer 20, connection conductor layers 22a, 22b, 24, a signal conductor layer 26, a 1 st ground conductor layer 28, and interlayer connection conductors v1 to v4.

The laminated body 12 has a plate shape. The laminated body 12 has a structure in which insulator layers 14a to 14g and protective layers 15a to 15c are laminated in the Z-axis direction. The insulator layers 14a to 14d and the protective layer 15a have rectangular shapes when viewed in the vertical direction. The insulator layers 14e to 14g and the protective layers 15b, 15c have a belt shape extending in the left-right direction as viewed in the up-down direction. The protective layer 15a, the insulator layers 14a to 14f, and the protective layer 15b are arranged in this order from the top. The insulator layers 14e and 14f and the protective layer 15b extend rightward from the insulator layers 14a to 14d as viewed in the vertical direction.

The insulator layer 14g is stacked above the insulator layer 14e. Insulator layer 14g is located to the right of insulator layer 14 d. However, the insulator layer 14g is not in contact with the insulator layer 14 d. The protective layer 15c is laminated over the insulator layer 14 g.

The insulator layers 14a to 14g and the protective layers 15a to 15c as described above each have an upper main surface (positive main surface) and a lower main surface (negative main surface) located below (negative side in the Z axis) the upper main surface (positive main surface). The insulator layers 14a to 14g include an insulator layer 14d as an intermediate insulator layer and an insulator layer 14e as a negative-side adjacent insulator layer. The insulator layer 14e as the negative-side adjacent insulator layer is located below (negative side of Z-axis) the insulator layer 14d as the intermediate insulator layer, and is in contact with the insulator layer 14d as the intermediate insulator layer.

The material of the insulator layers 14a to 14g is a thermoplastic resin such as polyimide or a liquid crystal polymer. The protective layers 15a to 15c are insulating films applied to the upper main surface or the lower main surface of the insulator layer. The protective layers 15a to 15c protect the radiation conductor layer 20, the 1 st ground conductor layer 28, and the 2 nd ground conductor layer 18, respectively. The laminate 12 as described above has flexibility.

As shown in fig. 2, the laminated body 12 includes A1 st section A1, A2 nd section A2, and A3 rd section A3, which are sequentially arranged in the left-right direction (X-axis direction orthogonal to the Z-axis direction). The 1 st section A1, the 2 nd section A2 and the 3 rd section A3 are arranged in this order from left to right. The thickness in the up-down direction (Z-axis direction) of the 1 st section A1 is larger than the thickness in the up-down direction (Z-axis direction) of the 2 nd section A2. The thickness in the up-down direction (Z-axis direction) of the 3 rd section A3 is larger than the thickness in the up-down direction (Z-axis direction) of the 2 nd section A2. The thickness in the up-down direction (Z-axis direction) of the 3 rd section A3 is smaller than the thickness in the up-down direction (Z-axis direction) of the 1 st section A1.

As shown in fig. 2, the laminated body 12 includes a1 st laminated body 12a and a2 nd laminated body 12b. The 1 st laminated body 12a includes insulator layers 14a to 14c located above (on the positive side of the Z axis) the insulator layer 14d as an intermediate insulator layer, and a protective layer 15a. The 2 nd laminated body 12b includes insulator layers 14e and 14f located below (on the negative side of the Z axis) the insulator layer 14d as the intermediate insulator layer. The 2 nd laminated body 12b further includes an insulator layer 14g and protective layers 15b and 15c. The laminated body 12 is produced by thermocompression bonding the 1 st laminated body 12a and the 2 nd laminated body 12b after thermocompression bonding the 1 st laminated body 12a and the 2 nd laminated body 12b.

The radiation conductor layer 20 functions as a patch antenna. The radiation conductor layer 20 radiates and/or receives a high frequency signal. As shown in fig. 1, the radiation conductor layer 20 is provided on the laminated body 12. The radiation conductor layer 20 is located above (on the positive side of the Z axis) the insulator layer 14d as an intermediate insulator layer. In more detail, the radiation conductor layer 20 is located on the upper main surface of the insulator layer 14 a. The radiation conductor layer 20 has a diamond shape having diagonal lines extending in the left-right direction and the front-rear direction, as viewed in the up-down direction.

The high frequency signal is transmitted through the signal conductor layer 26. As shown in fig. 1, the signal conductor layer 26 is provided on the laminated body 12. The signal conductor layer 26 is located lower (negative side of Z-axis) than the insulator layer 14d as an intermediate insulator layer. In more detail, the signal conductor layer 26 is located on the lower main surface of the insulator layer 14 e. The signal conductor layer 26 has a line shape extending in the left-right direction as viewed in the up-down direction. As shown in fig. 2, the signal conductor layer 26 is located in the 1 st section A1, the 2 nd section A2, and the 3 rd section A3.

High frequency signals are transmitted through the connection conductor layer 24. The connection conductor layer 24 is provided on the laminate 12. The connection conductor layer 24 is located on the lower main surface (negative main surface) of the insulator layer 14d as an intermediate insulator layer. The connection conductor layer 24 has a line shape extending in the left-right direction as viewed in the up-down direction. The right end portion of the connection conductor layer 24 overlaps the left end portion of the signal conductor layer 26 as viewed in the up-down direction. As shown in fig. 2, the connection conductor layer 24 is located in the 1 st section A1. The connection conductor layer 24 is not located in the 2 nd section A2 and the 3 rd section A3.

The 1 st ground conductor layer 28 is connected to the ground potential. The 1 st ground conductor layer 28 is provided on the laminate 12. The 1 st ground conductor layer 28 is located below the connection conductor layer 24 and the signal conductor layer 26 (negative side of the Z axis). The 1 st ground conductor layer 28 is located on the lower main surface of the insulator layer 14 f. The 1 st ground conductor layer 28 covers substantially the entire lower main surface of the insulator layer 14 f. As a result, the 1 st ground conductor layer 28 overlaps at least a part of the connection conductor layer 24 and at least a part of the signal conductor layer 26 when viewed in the vertical direction (Z-axis direction). In the present embodiment, the 1 st ground conductor layer 28 overlaps the entire connecting conductor layer 24 and the entire signal conductor layer 26 as viewed in the vertical direction. Further, there is no conductor between the 1 st ground conductor layer 28 and the connection conductor layer 24. There is no conductor between the 1 st ground conductor layer 28 and the signal conductor layer 26. Further, the 1 st ground conductor layer 28 overlaps the radiation conductor layer 20 as viewed in the up-down direction (Z-axis direction). The 1 st ground conductor layer 28 as described above is located in the 1 st section A1, the 2 nd section A2, and the 3 rd section A3.

The 2 nd ground conductor layer 18 is connected to the ground potential. The 2 nd ground conductor layer 18 is provided on the laminate 12. The 2 nd ground conductor layer 18 is located above the signal conductor layer 26 (on the positive side of the Z axis). The 2 nd ground conductor layer 18 is located on the upper main surface of the insulator layer 14 g. The 2 nd ground conductor layer 18 covers substantially the entire upper main surface of the insulator layer 14 g. As a result, the 2 nd ground conductor layer 18 overlaps at least a part of the signal conductor layer 26 when viewed in the vertical direction (Z-axis direction). In the present embodiment, the 2 nd ground conductor layer 18 overlaps the entire signal conductor layer 26 as viewed in the vertical direction. Between the 2 nd ground conductor layer 18 and the signal conductor layer 26, no conductor other than the interlayer connection conductor v4 and the 1 st ground conductor layer 28 is present. The 2 nd ground conductor layer 18 as described above is located in the 3 rd section A3. The 2 nd ground conductor layer 18 is not located in the 1 st section A1 and the 2 nd section A2.

As described above, in the 1 st section A1 and the 2 nd section A2, the signal conductor layer 26 forms a microstrip line structure together with the 1 st ground conductor layer 28. In the 3 rd section A3, the signal conductor layer 26 forms a strip line structure together with the 1 st ground conductor layer 28 and the 2 nd ground conductor layer 18. Thus, the characteristic impedance generated in the signal conductor layer 26 is a predetermined characteristic impedance (50Ω).

The connection conductor layer 22a is located on the upper main surface of the insulator layer 14 b. The connection conductor layer 22a has a line shape extending in the left-right direction. The left end portion of the connection conductor layer 22a overlaps the radiation conductor layer 20 as viewed in the up-down direction.

The connection conductor layer 22b is located on the upper main surface of the insulator layer 14 c. The connection conductor layer 22b has a line shape extending in the left-right direction. The left end portion of the connection conductor layer 22b overlaps the left end portion of the connection conductor layer 24 as viewed in the up-down direction. The right end portion of the connection conductor layer 22b overlaps the right end portion of the connection conductor layer 22a as viewed in the up-down direction.

The interlayer connection conductor v1 penetrates the insulator layer 14a in the up-down direction. The interlayer connection conductor v1 is in contact with the left end portion of the radiation conductor layer 20 and the connection conductor layer 22 a. Thereby, the interlayer connection conductor v1 electrically connects the radiation conductor layer 20 and the connection conductor layer 22 a.

The interlayer connection conductor v2 penetrates the insulator layer 14b in the up-down direction. The interlayer connection conductor v2 is in contact with the right end portion of the connection conductor layer 22a and the right end portion of the connection conductor layer 22 b. Thereby, the interlayer connection conductor v2 electrically connects the connection conductor layer 22a and the connection conductor layer 22 b.

The interlayer connection conductor v3 is an example of the 2 nd interlayer connection conductor. The interlayer connection conductor v3 penetrates the insulator layer 14d and the insulator layer 14c as intermediate insulator layers in the up-down direction (Z-axis direction). The interlayer connection conductor v3 is in contact with the left end portion of the connection conductor layer 22b and the left end portion of the connection conductor layer 24. Thereby, the interlayer connection conductor v3 electrically connects the connection conductor layer 22b and the connection conductor layer 24. In this way, the interlayer connection conductor v3 is electrically connected to the radiation conductor layer 20.

The interlayer connection conductor v4 is an example of the 1 st interlayer connection conductor. The interlayer connection conductor v4 penetrates the insulator layer 14e as the negative-side adjacent insulator layer in the up-down direction (Z-axis direction). The interlayer connection conductor v4 is in contact with the right end portion of the connection conductor layer 24 and the left end portion of the signal conductor layer 26. Thereby, the interlayer connection conductor v4 electrically connects the connection conductor layer 24 and the signal conductor layer 26. Therefore, the interlayer connection conductor v4 is electrically connected to the signal conductor layer 26.

Here, the length of the current path from the interlayer connection conductor v3 to the radiation conductor layer 20 is shorter than the length of the current path from the interlayer connection conductor v4 to the radiation conductor layer 20 described later. The length of the current path from the interlayer connection conductor v4 to the signal conductor layer 26 is shorter than the length of the current path from the interlayer connection conductor v3 to the signal conductor layer 26.

The 2 nd ground conductor layer 18, the radiation conductor layer 20, the connection conductor layers 22a, 22b, 24, the signal conductor layer 26, and the 1 st ground conductor layer 28 as described above are formed by patterning a metal foil adhered to the upper main surface or the lower main surface of the insulator layers 14a to 14 g. The metal foil is, for example, copper foil. The interlayer connection conductors v1 to v3 are formed by, for example, filling conductive paste into through holes penetrating the insulator layers 14a to 14d in the vertical direction, and curing the conductive paste by heating. The interlayer connection conductor v4 is formed by filling solder into a through hole penetrating the insulator layer 14e in the up-down direction. As described above, the material of the interlayer connection conductor v3 as the 2 nd interlayer connection conductor is different from the material of the interlayer connection conductor v4 as the 1 st interlayer connection conductor.

Details of the structure of the connection conductor layer 24 are described below with reference to fig. 3. The direction in which the connection conductor layer 24 extends is defined as the extending direction. The extending direction is the left-right direction. A direction orthogonal to the extending direction and the up-down direction (Z-axis direction) is defined as a line width direction. The line width direction is the front-back direction.

The connection conductor layer 24 includes A1 st connection section a11, A2 nd connection section a12, a line section a31, A1 st intermediate section a21, and A2 nd intermediate section a22. The 1 st connection section a11, the 1 st intermediate section a21, the line section a31, the 2 nd intermediate section a22, and the 2 nd connection section a12 are arranged in this order from right to left. Therefore, the 1 st intermediate section a21 is adjacent to the 1 st connection section a 11. The 2 nd intermediate section a22 is adjacent to the 2 nd connection section a 12. The line section a31 is adjacent to the 1 st intermediate section a21 and the 2 nd intermediate section a22. The 1 st connection section a11 is located at the right end (1 st end) of the connection conductor layer 24 in the extending direction. The 2 nd connection section a12 is located at the left end (2 nd end) of the connection conductor layer 24 in the extending direction. Therefore, the right end of the 1 st connection section a11 coincides with the right end of the connection conductor layer 24. The left end of the 2 nd connection section a12 coincides with the left end of the connection conductor layer 24.

The interlayer connection conductor v4 (1 st interlayer connection conductor) is in contact with the 1 st connection section a 11. In the left-right direction as the extending direction, both ends of the 1 st connection section a11 are located at equal distances from the center of the interlayer connection conductor v4 (1 st interlayer connection conductor) as viewed in the up-down direction (Z-axis direction). Therefore, the distance from the center of the interlayer connection conductor v4 to the left end of the 1 st connection section a11 is equal to the distance from the center of the interlayer connection conductor v4 to the right end of the 1 st connection section a 11.

The interlayer connection conductor v3 (the 2 nd interlayer connection conductor) is in contact with the 2 nd connection section a 12. In the left-right direction as the extending direction, both ends of the 2 nd connection section a12 are located at positions equidistant from the center of the interlayer connection conductor v3 (2 nd interlayer connection conductor) as viewed in the up-down direction (Z-axis direction). Therefore, the distance from the center of the interlayer connection conductor v3 to the left end of the 2 nd connection section a12 is equal to the distance from the center of the interlayer connection conductor v3 to the right end of the 2 nd connection section a 12. The maximum width in the front-rear direction (line width direction) of the 2 nd connection section a12 is smaller than the maximum width in the front-rear direction (line width direction) of the 1 st connection section a 11. The 1 st connection section a11 and the 2 nd connection section a12 have a circular shape. The diameter of the 2 nd connection section a12 is smaller than the diameter of the 1 st connection section a 11.

The 1 st intermediate section a21 includes a1 st thin section a21a and a1 st thick section a21b. The 1 st thin line section a21a has a width in the front-rear direction (line width direction) smaller than a width in the front-rear direction (line width direction) of the 1 st thick line section a21b. The 1 st thick line section a21b is adjacent to the line section a 31. The 1 st thick line section a21b has a width in the front-rear direction (line width direction) larger than the width in the front-rear direction (line width direction) of the line section a 31.

The 2 nd intermediate section a22 includes A2 nd thin section a22a and A2 nd thick section a22b. The 2 nd thin line section a22a has a width in the front-rear direction (line width direction) smaller than that in the front-rear direction (line width direction) of the 2 nd thick line section a22b. The 2 nd thick line section a22b is adjacent to the line section a 31. The 2 nd thick line section a22b has a width in the front-rear direction (line width direction) larger than the width in the front-rear direction (line width direction) of the line section a 31.

[ Effect ]

According to the multilayer substrate 10, it is possible to suppress the occurrence of characteristic impedance mismatch in the section between the signal conductor layer 26 and the radiation conductor layer 20. Hereinafter, description will be made with reference to the drawings. Fig. 4 is a smith chart. Z0 is a characteristic impedance generated in the line section a 31. Z0 is 50Ω. Z1 is a characteristic impedance generated in the 1 st connection section a 11. Z1 is, for example, 20Ω.

In more detail, in the multilayer substrate 10, the width in the line width direction of the 1 st connection section a11 and the 2 nd connection section a12 of the connection conductor layer 24 is larger than the width in the line width direction of the line section a 31. The interlayer connection conductor v4 is in contact with the 1 st connection section a 11. The interlayer connection conductor v3 is in contact with the 2 nd connection section a 12. Therefore, the characteristic impedance generated in the 1 st connection section a11 and the 2 nd connection section a12 of the connection conductor layer 24 easily deviates from the desired specific impedance (50Ω).

Therefore, the connection conductor layer 24 includes the 1 st intermediate section a21. The 1 st intermediate section a21 includes a1 st thin line section a21a having a width in the line width direction smaller than that of the 1 st thick line section a21b. The 1 st intermediate section a21 is adjacent to the 1 st connection section a 11. Thus, the 1 st thin line section a21a functions as an inductance. That is, an inductor is connected in series to the line segment a 31. Thus, as shown by an arrow X1 of the smith chart of fig. 4, the 1 st thin line section a21a rotates the impedance clockwise with Z1 as a starting point.

The 1 st intermediate section a21 includes a1 st thick line section a21b having a width in the line width direction larger than the width in the line width direction of the line section a 31. The 1 st thick line section a21b is adjacent to the line section a 31. Further, the 1 st thick line section a21b overlaps the 1 st ground conductor layer 28 when viewed in the vertical direction. Therefore, a capacitance is generated in the 1 st thick line section a21b. That is, a capacitor is connected in parallel to the line segment a 31. Thus, as shown by an arrow X2 of the smith chart of fig. 4, the 1 st thick line section a21b rotates the impedance clockwise from the tip of the arrow X1.

As a result, the 1 st intermediate section a21 can match the characteristic impedance generated in the line section a31 with the characteristic impedance generated in the 1 st connection section a 11. Although not described, the characteristic impedance generated in the line section a31 and the characteristic impedance generated in the 2 nd connection section a12 can be matched by the 2 nd intermediate section a22 based on the same principle. As described above, according to the multilayer substrate 10, it is possible to suppress the occurrence of a mismatch in characteristic impedance in the section between the signal conductor layer 26 and the radiation conductor layer 20. Further, the multilayer substrate 10 can be made wider by suppressing the occurrence of characteristic impedance mismatch in the section between the signal conductor layer 26 and the radiation conductor layer 20.

Further, according to the multilayer substrate 10, the 1 st connection section a11 and the interlayer connection conductor v4 can be connected more reliably. In more detail, the laminated body 12 is manufactured by thermocompression bonding the 1 st laminated body 12a and the 2 nd laminated body 12b after thermocompression bonding the 1 st laminated body 12a and the 2 nd laminated body 12 b. When the 1 st laminated body 12a and the 2 nd laminated body 12b are thermally bonded, the 1 st connection section a11 and the interlayer connection conductor v4 are connected. Therefore, the maximum width in the line width direction of the 1 st connection section a11 is larger than the maximum width in the line width direction of the 2 nd connection section a 12. This makes it possible to more reliably connect the 1 st connection section a11 and the interlayer connection conductor v4.

(modification 1)

The connection conductor layer 24a according to modification 1 will be described below with reference to the drawings. Fig. 5 is a plan view of the connection conductor layer 24 a.

The connection conductor layer 24a is different from the connection conductor layer 24 in the following respects.

The width w1 in the line width direction of the 1 st thick line section a21b is larger than the width w2 in the line width direction of the 2 nd thick line section a22 b.

The width w11 in the line width direction of the 1 st thin line section a21a and the width w12 in the line width direction of the 2 nd thin line section a22a are smaller than the width w3 in the line width direction of the line section a 31.

Other structures of the connection conductor layer 24a are the same as those of the connection conductor layer 24, and therefore description thereof is omitted. The multilayer substrate 10 having the connection conductor layer 24a can achieve the same operational effects as the multilayer substrate 10 having the connection conductor layer 24.

In addition, according to the multilayer substrate 10 including the connection conductor layer 24a, the characteristic impedance generated in the line section a31 and the characteristic impedance generated in the 1 st connection section a11 can be matched by the 1 st intermediate section a 21. The maximum width in the line width direction of the 1 st connection section a11 is larger than the maximum width in the line width direction of the 2 nd connection section a 12. Therefore, the characteristic impedance generated in the 1 st connection section a11 is smaller than the characteristic impedance generated in the 2 nd connection section a 12. That is, the difference between the predetermined characteristic impedance (50Ω) and the characteristic impedance generated in the 1 st connection section a11 becomes large. Therefore, the width w1 in the line width direction of the 1 st thick line section a21b is larger than the width w2 in the line width direction of the 2 nd thick line section a22 b. Thus, the capacitance value generated in the 1 st thick line section a21b increases. The width w11 in the line width direction of the 1 st thin line section a21a and the width w12 in the line width direction of the 2 nd thin line section a22a are smaller than the width w3 in the line width direction of the line section a 31. This increases the inductance value generated in the 1 st thin line section a21 a. As a result, the 1 st intermediate section a21 can match the characteristic impedance generated in the line section a31 with the characteristic impedance generated in the 1 st connection section a 11.

(modification 2)

The connection conductor layer 24b according to modification 2 will be described below with reference to the drawings. Fig. 6 is a top view of the connection conductor layer 24 b.

The connection conductor layer 24b is different from the connection conductor layer 24a in the shape of the 1 st thick line section a21b and the 2 nd thick line section a22 b. The 1 st thick line section a21b and the 2 nd thick line section a22b have a tapered shape. The widths of the 1 st thick line section a21b and the 2 nd thick line section a22b in the line width direction become smaller as approaching the line section a 31. Thus, abrupt changes in characteristic impedance generated in the 1 st thick line section a21b and the 2 nd thick line section a22b can be suppressed. The other configuration of the connection conductor layer 24b is the same as that of the connection conductor layer 24 a. The multilayer substrate 10 having the connection conductor layer 24b can achieve the same operational effects as the multilayer substrate 10 having the connection conductor layer 24 a.

(modification 3)

The connection conductor layer 24c according to modification 3 will be described below with reference to the drawings. Fig. 7 is a plan view of the connection conductor layer 24 c.

The connection conductor layer 24c differs from the connection conductor layer 24 in that the 1 st thin line section a21a and the 2 nd thin line section a22a are not present. The 1 st thick line section a21b is adjacent to the 1 st connecting section a 11. The 2 nd thick line section a22b is adjacent to the 2 nd connecting section a 12. Other structures of the connection conductor layer 24c are the same as those of the connection conductor layer 24, and therefore description thereof is omitted.

According to the multilayer substrate 10 including the connection conductor layer 24c, it is possible to suppress the occurrence of characteristic impedance mismatch in the section between the signal conductor layer 26 and the radiation conductor layer 20. Hereinafter, description will be made with reference to the drawings. Fig. 8 is a smith chart. Z0 is a characteristic impedance generated in the line section a 31. Z0 is 50Ω. Z1 is a characteristic impedance generated in the 1 st connection section a 11. Z1 is, for example, 20Ω.

In more detail, in the multilayer substrate 10, the width in the line width direction of the 1 st connection section a11 and the 2 nd connection section a12 of the connection conductor layer 24c is larger than the width in the line width direction of the line section a 31. The interlayer connection conductor v4 is in contact with the 1 st connection section a 11. The interlayer connection conductor v3 is in contact with the 2 nd connection section a 12. Therefore, the characteristic impedance generated in the 1 st connection section a11 and the 2 nd connection section a12 of the connection conductor layer 24c easily deviates from the desired specific impedance (50Ω).

Therefore, the connection conductor layer 24c includes the 1 st intermediate section a21. The 1 st thick line section a21b overlaps the 1 st ground conductor layer 28 when viewed in the vertical direction. Thus, the 1 st thick line section a21b functions as a transmission line. The 1 st intermediate section a21 includes a1 st thick line section a21b having a width in the line width direction larger than the width in the line width direction of the line section a 31. Therefore, the characteristic impedance Z2 generated in the 1 st thick line section a21b is smaller than the given characteristic impedance (50Ω). Thus, the impedance moves along a circle passing through Z0 with the characteristic impedance Z2 generated in the 1 st thick line section a21b as the center. Therefore, the characteristic impedance Z2 generated in the 1 st thick line section a21b is set to a proper value, and the length of the 1 st thick line section a21b is set to a proper length. Thus, the 1 st intermediate section a21 can match the characteristic impedance generated in the line section a31 with the characteristic impedance generated in the 1 st connection section a 11. Although not described, the characteristic impedance generated in the line section a31 and the characteristic impedance generated in the 2 nd connection section a12 can be matched by the 2 nd intermediate section a22 based on the same principle. As described above, according to the multilayer substrate 10 including the connection conductor layer 24c, it is possible to suppress the occurrence of the mismatch of characteristic impedance in the section between the signal conductor layer 26 and the radiation conductor layer 20.

(modification 4)

The connection conductor layer 24d according to modification 4 is described below with reference to the drawings. Fig. 9 is a plan view of the connection conductor layer 24 d.

The connection conductor layer 24d differs from the connection conductor layer 24 in that the line segment a31 is curved as viewed in the up-down direction. As described above, the line segment a31 may not have a straight line shape. Other structures of the connection conductor layer 24d are the same as those of the connection conductor layer 24, and therefore description thereof is omitted. The multilayer substrate 10 having the connection conductor layer 24d can achieve the same operational effects as the multilayer substrate 10 having the connection conductor layer 24.

(embodiment 2)

The multilayer substrate 10a according to embodiment 2 will be described below with reference to the drawings. Fig. 10 is a cross-sectional view of the multilayer substrate 10 a.

The multilayer substrate 10a differs from the multilayer substrate 10 in that the main insulating material of the 2 nd laminated body 12b is different from the main insulating material of the 1 st laminated body 12 a. The young's modulus of the main insulating material of the 2 nd laminated body 12b is lower than that of the 1 st laminated body 12 a. The material of the 1 st laminated body 12a is Tef1on (registered trademark), FR-4. The material of the 2 nd laminate 12b is polyimide or a liquid crystal polymer, for example. Other structures of the multilayer substrate 10a are the same as those of the multilayer substrate 10, and therefore, description thereof is omitted. The multilayer substrate 10a can achieve the same operational effects as the multilayer substrate 10.

In the multilayer substrate 10a, the young's modulus of the main insulating material of the 2 nd laminated body 12b is lower than that of the 1 st laminated body 12 a. This makes it possible to easily process the 2 nd laminated body 12b into an arbitrary shape.

(embodiment 3)

The multilayer substrate 10b according to embodiment 3 will be described below with reference to the drawings. Fig. 11 is a cross-sectional view of the multilayer substrate 10 b. Fig. 12 is a plan view of the connection conductor layer 24 provided on the multilayer substrate 10 b.

The multilayer substrate 10b differs from the multilayer substrate 10 mainly in that the interlayer connection conductor v3 is located on the signal conductor layer 26 side and the interlayer connection conductor v4 is located on the radiation conductor layer 20 side.

In embodiment 3, not only the insulator layers 14e and 14f extend rightward from the insulator layers 14a to 14c, but also the insulator layer 14d extends rightward from the insulator layers 14a to 14 c. The insulator layer 14g is stacked above the insulator layer 14 d. In embodiment 3, the insulator layer 14c corresponds to an intermediate insulator layer, and the insulator layer 14d corresponds to a negative-side adjacent insulator layer.

The 1 st laminated body 12a includes insulator layers 14a to 14c and a protective layer 15a. The 2 nd laminated body 12b includes insulator layers 14d to 14g and protective layers 15b and 15c. The laminated body 12 is produced by thermocompression bonding the 1 st laminated body 12a and the 2 nd laminated body 12b after thermocompression bonding the 1 st laminated body 12a and the 2 nd laminated body 12 b.

The connection conductor layer 24 is located on the upper main surface of the insulator layer 14 d. As shown in fig. 12, the connection conductor layer 24 is provided so that the direction from the 1 st connection section a11 toward the 2 nd connection section a12 coincides with the right direction. In embodiment 3, the left end portion of the connection conductor layer 24 corresponds to the 1 st end portion of the connection conductor layer 24, and the right end portion of the connection conductor layer 24 corresponds to the 2 nd end portion of the connection conductor layer 24.

The interlayer connection conductor v3 penetrates the insulator layers 14d and 14e in the vertical direction. The interlayer connection conductor v3 is in contact with the right end portion of the connection conductor layer 24, that is, the 2 nd connection section a12 of the connection conductor layer 24 and the left end portion of the signal conductor layer 26. Thereby, the interlayer connection conductor v3 electrically connects the connection conductor layer 24 and the signal conductor layer 26. Therefore, the interlayer connection conductor v3 is electrically connected to the signal conductor layer 26.

The interlayer connection conductor v4 penetrates the insulator layer 14c in the up-down direction. The interlayer connection conductor v4 contacts the 1 st connection section a11 of the connection conductor layer 24, which is the left end portion of the connection conductor layer 22b and the left end portion of the connection conductor layer 24. Thereby, the interlayer connection conductor v4 electrically connects the connection conductor layer 22b and the connection conductor layer 24. Thus, the interlayer connection conductor v4 is electrically connected to the radiation conductor layer 20.

Here, the length of the current path from the interlayer connection conductor v4 to the radiation conductor layer 20 is shorter than the length of the current path from the interlayer connection conductor v3 to the radiation conductor layer 20. The length of the current path from the interlayer connection conductor v3 to the signal conductor layer 26 is shorter than the length of the current path from the interlayer connection conductor v4 to the signal conductor layer 26.

Other structures of the multilayer substrate 10b are the same as those of the multilayer substrate 10, and therefore, description thereof is omitted. The multilayer substrate 10b can achieve the same operational effects as the multilayer substrate 10.

(other embodiments)

The multilayer board according to the present utility model is not limited to the multilayer boards 10, 10a, and 10b, and can be modified within the scope of the gist thereof. The structures of the multilayer substrates 10, 10a, and 10b may be arbitrarily combined. The structures of the connection conductor layers 24, 24a to 24d may be arbitrarily combined.

The width of the 1 st thick line segment a21b in the line width direction may be equal to or less than the width of the 2 nd thick line segment a22b in the line width direction.

The width of the 1 st thin line section a21a in the line width direction and the width of the 2 nd thin line section a22a in the line width direction may be equal to or greater than the width of the line section a31 in the line width direction.

The multilayer substrates 10, 10a, and 10b may further include a ground conductor that is located above the signal conductor layer 26 and overlaps the signal conductor layer 26 when viewed in the vertical direction.

The laminate 12 may not have flexibility.

The material of the insulator layers 14a to 14g may be other than thermoplastic resin.

The material of the interlayer connection conductor v3 as the 2 nd interlayer connection conductor may be the same as the material of the interlayer connection conductor v4 as the 1 st interlayer connection conductor.

The present utility model has the following structure.

(1) A multilayer substrate is provided with:

a laminated body having a structure in which a plurality of insulator layers including an intermediate insulator layer and a negative-side adjacent insulator layer are laminated so as to be aligned in a Z-axis direction, wherein each of the plurality of insulator layers has a positive main surface and a negative main surface located on a negative side of the positive main surface in a Z-axis direction, and the negative-side adjacent insulator layer is located on the negative side of the Z-axis direction of the intermediate insulator layer and is in contact with the intermediate insulator layer;

a radiation conductor layer provided on the laminate and located on the positive side of the Z axis with respect to the intermediate insulator layer;

a signal conductor layer provided on the laminate and located on the negative side of the Z axis with respect to the intermediate insulator layer;

A connection conductor layer provided on the negative main surface of the intermediate insulator layer and including a 1 st connection section, a 2 nd connection section, a line section, a 1 st intermediate section, and a 2 nd intermediate section, wherein the 1 st intermediate section is adjacent to the 1 st connection section, the 2 nd intermediate section is adjacent to the 2 nd connection section, and the line section is adjacent to the 1 st intermediate section and the 2 nd intermediate section;

a 1 st ground conductor layer which is provided on the laminate, is located on the negative side of the Z axis with respect to the connection conductor layer and the signal conductor layer, and overlaps at least a part of the connection conductor layer and at least a part of the signal conductor layer when viewed in the Z axis direction;

a 1 st interlayer connection conductor in contact with the 1 st connection section; and

a 2 nd interlayer connection conductor in contact with the 2 nd connection section,

one of the 1 st interlayer connection conductor and the 2 nd interlayer connection conductor penetrates through the intermediate insulator layer in the Z-axis direction and electrically connects the radiation conductor layer and the connection conductor layer,

the other of the 1 st interlayer connection conductor and the 2 nd interlayer connection conductor penetrates through the negative-side adjacent insulator layer in the Z-axis direction and electrically connects the signal conductor layer and the connection conductor layer,

The direction in which the connection conductor layer extends is defined as the direction of extension,

a direction orthogonal to the extending direction and the Z-axis direction is defined as a line width direction,

the 1 st connection section is located at the 1 st end of the connection conductor layer in the extending direction, the 2 nd connection section is located at the 2 nd end of the connection conductor layer in the extending direction, the 2 nd end of the connection conductor layer is located at the opposite side of the 1 st end of the connection conductor layer in the extending direction,

in the extending direction, both ends of the 1 st connection section are located at equal distances from the center of the 1 st interlayer connection conductor as viewed in the Z-axis direction,

in the extending direction, both ends of the 2 nd connection section are located at equal distances from the center of the 2 nd interlayer connection conductor as viewed in the Z-axis direction,

the maximum width in the line width direction of the 2 nd connection section is smaller than the maximum width in the line width direction of the 1 st connection section,

the 1 st intermediate section includes a 1 st thick line section having a width in the line width direction larger than a width in the line width direction of the line section,

The 2 nd intermediate section includes a 2 nd thick line section having a width in the line width direction larger than a width in the line width direction of the line section,

the 1 st thick line section and the 2 nd thick line section are adjacent to the line section.

(2) The multilayer substrate according to (1), wherein,

the width in the line width direction of the 1 st thick line section is larger than the width in the line width direction of the 2 nd thick line section.

(3) The multilayer substrate according to any one of (1) or (2), wherein,

the 1 st intermediate section includes a 1 st thin line section having a width in the line width direction smaller than a width in the line width direction of the 1 st thick line section,

the 2 nd intermediate section includes a 2 nd thin line section having a width in the line width direction smaller than a width in the line width direction of the 2 nd thick line section,

the 1 st thin line section is adjacent to the 1 st connection section,

the 2 nd thin line section is adjacent to the 2 nd connection section.

(4) The multilayer substrate according to (3), wherein,

the width of the 1 st thin line section in the line width direction and the width of the 2 nd thin line section in the line width direction are smaller than the width of the line section in the line width direction.

(5) The multilayer substrate according to any one of (1) to (4), wherein,

the 1 st ground conductor layer overlaps the radiation conductor layer as viewed in the Z-axis direction.

(6) The multilayer substrate according to any one of (1) to (5), wherein,

the laminated body has a 1 st section and a 2 nd section arranged in an X-axis direction orthogonal to the Z-axis direction,

the thickness in the Z-axis direction of the 1 st section is larger than the thickness in the Z-axis direction of the 2 nd section,

the connection conductor layer is located in the 1 st section,

the signal conductor layer is located in the 1 st section and the 2 nd section.

(7) The multilayer substrate according to any one of (1) to (6), wherein,

the laminated body has a 1 st section, a 2 nd section, and a 3 rd section which are sequentially arranged in an X-axis direction orthogonal to the Z-axis direction,

the thickness in the Z-axis direction of the 1 st section is larger than the thickness in the Z-axis direction of the 2 nd section,

the thickness in the Z-axis direction of the 3 rd section is larger than the thickness in the Z-axis direction of the 2 nd section,

the multilayer substrate further includes a 2 nd ground conductor layer, the 2 nd ground conductor layer being located in the 3 rd section and not located in the 1 st section and the 2 nd section,

The 1 st grounding conductor layer is positioned in the 1 st section, the 2 nd section and the 3 rd section,

the 2 nd ground conductor layer is located on the positive side of the Z axis with respect to the signal conductor layer and overlaps at least a part of the signal conductor layer when viewed in the Z axis direction,

in the 1 st section and the 2 nd section, the signal conductor layer and the 1 st ground conductor layer form a microstrip line structure,

in the 3 rd section, the signal conductor layer forms a strip line structure together with the 1 st ground conductor layer and the 2 nd ground conductor layer.

(8) The multilayer substrate according to any one of (1) to (7), wherein,

the laminated body comprises a 1 st laminated body part and a 2 nd laminated body part,

the 1 st laminated body includes one or more of the insulator layers and the intermediate insulator layer located on the positive side of the Z-axis with respect to the intermediate insulator layer,

the 2 nd laminate portion includes one or more of the insulator layers located on the negative side of the Z-axis from the intermediate insulator layer,

the main insulating material of the 2 nd laminated body is different from the main insulating material of the 1 st laminated body.

(9) The multilayer substrate according to (8), wherein,

the young's modulus of the main insulating material of the 2 nd laminated body portion is lower than the young's modulus of the main insulating material of the 1 st laminated body portion.

(10) The multilayer substrate according to any one of (8) or (9), wherein,

the material of the 2 nd interlayer connection conductor is different from the material of the 1 st interlayer connection conductor.

(11) The multilayer substrate according to any one of (1) to (10), wherein,

the laminate has flexibility.

(12) The multilayer substrate according to any one of (1) to (11), wherein a material of the plurality of insulator layers is a thermoplastic resin.

Claims (12)

1. A multilayer substrate is characterized by comprising:

a laminated body having a structure in which a plurality of insulator layers including an intermediate insulator layer and a negative-side adjacent insulator layer are laminated so as to be aligned in a Z-axis direction, wherein each of the plurality of insulator layers has a positive main surface and a negative main surface located on a negative side of the positive main surface in a Z-axis direction, and the negative-side adjacent insulator layer is located on the negative side of the Z-axis direction of the intermediate insulator layer and is in contact with the intermediate insulator layer;

a radiation conductor layer provided on the laminate and located on the positive side of the Z axis with respect to the intermediate insulator layer;

A signal conductor layer provided on the laminate and located on the negative side of the Z axis with respect to the intermediate insulator layer;

a connection conductor layer provided on the negative main surface of the intermediate insulator layer and including a 1 st connection section, a 2 nd connection section, a line section, a 1 st intermediate section, and a 2 nd intermediate section, wherein the 1 st intermediate section is adjacent to the 1 st connection section, the 2 nd intermediate section is adjacent to the 2 nd connection section, and the line section is adjacent to the first intermediate section and the 2 nd intermediate section;

a 1 st ground conductor layer which is provided on the laminate, is located on the negative side of the Z axis with respect to the connection conductor layer and the signal conductor layer, and overlaps at least a part of the connection conductor layer and at least a part of the signal conductor layer when viewed in the Z axis direction;

a 1 st interlayer connection conductor in contact with the 1 st connection section; and

a 2 nd interlayer connection conductor in contact with the 2 nd connection section,

one of the 1 st interlayer connection conductor and the 2 nd interlayer connection conductor penetrates through the intermediate insulator layer in the Z-axis direction and electrically connects the radiation conductor layer and the connection conductor layer,

The other of the 1 st interlayer connection conductor and the 2 nd interlayer connection conductor penetrates through the negative-side adjacent insulator layer in the Z-axis direction and electrically connects the signal conductor layer and the connection conductor layer,

the direction in which the connection conductor layer extends is defined as the direction of extension,

a direction orthogonal to the extending direction and the Z-axis direction is defined as a line width direction,

the 1 st connection section is located at the 1 st end of the connection conductor layer in the extending direction, the 2 nd connection section is located at the 2 nd end of the connection conductor layer in the extending direction, the 2 nd end of the connection conductor layer is located at the opposite side of the 1 st end of the connection conductor layer in the extending direction,

in the extending direction, both ends of the 1 st connection section are located at equal distances from the center of the 1 st interlayer connection conductor as viewed in the Z-axis direction,

in the extending direction, both ends of the 2 nd connection section are located at equal distances from the center of the 2 nd interlayer connection conductor as viewed in the Z-axis direction,

the maximum width in the line width direction of the 2 nd connection section is smaller than the maximum width in the line width direction of the 1 st connection section,

The 1 st intermediate section includes a 1 st thick line section having a width in the line width direction larger than a width in the line width direction of the line section,

the 2 nd intermediate section includes a 2 nd thick line section having a width in the line width direction larger than a width in the line width direction of the line section,

the 1 st thick line section and the 2 nd thick line section are adjacent to the line section.

2. The multilayer substrate according to claim 1, wherein,

the width in the line width direction of the 1 st thick line section is larger than the width in the line width direction of the 2 nd thick line section.

3. The multilayer substrate according to claim 1 or 2, wherein,

the 1 st intermediate section includes a 1 st thin line section having a width in the line width direction smaller than a width in the line width direction of the 1 st thick line section,

the 2 nd intermediate section includes a 2 nd thin line section having a width in the line width direction smaller than a width in the line width direction of the 2 nd thick line section,

the 1 st thin line section is adjacent to the 1 st connection section,

The 2 nd thin line section is adjacent to the 2 nd connection section.

4. The multilayer substrate according to claim 3, wherein,

the width of the 1 st thin line section in the line width direction and the width of the 2 nd thin line section in the line width direction are smaller than the width of the line section in the line width direction.

5. The multilayer substrate according to claim 1 or 2, wherein,

the 1 st ground conductor layer overlaps the radiation conductor layer as viewed in the Z-axis direction.

6. The multilayer substrate according to claim 1 or 2, wherein,

the laminated body has a 1 st section and a 2 nd section arranged in an X-axis direction orthogonal to the Z-axis direction,

the thickness in the Z-axis direction of the 1 st section is larger than the thickness in the Z-axis direction of the 2 nd section,

the connection conductor layer is located in the 1 st section,

the signal conductor layer is located in the 1 st section and the 2 nd section.

7. The multilayer substrate according to claim 1 or 2, wherein,

the laminated body has a 1 st section, a 2 nd section, and a 3 rd section which are sequentially arranged in an X-axis direction orthogonal to the Z-axis direction,

The thickness in the Z-axis direction of the 1 st section is larger than the thickness in the Z-axis direction of the 2 nd section,

the thickness in the Z-axis direction of the 3 rd section is larger than the thickness in the Z-axis direction of the 2 nd section,

the multilayer substrate further includes a 2 nd ground conductor layer, the 2 nd ground conductor layer being located in the 3 rd section and not located in the 1 st section and the 2 nd section,

the 1 st grounding conductor layer is positioned in the 1 st section, the 2 nd section and the 3 rd section,

the 2 nd ground conductor layer is located on the positive side of the Z axis with respect to the signal conductor layer and overlaps at least a part of the signal conductor layer when viewed in the Z axis direction,

in the 1 st section and the 2 nd section, the signal conductor layer and the 1 st ground conductor layer form a microstrip line structure,

in the 3 rd section, the signal conductor layer forms a strip line structure together with the 1 st ground conductor layer and the 2 nd ground conductor layer.

8. The multilayer substrate according to claim 1 or 2, wherein,

the laminated body comprises a 1 st laminated body part and a 2 nd laminated body part,

the 1 st laminated body includes one or more of the insulator layers and the intermediate insulator layer located on the positive side of the Z-axis with respect to the intermediate insulator layer,

The 2 nd laminate portion includes one or more of the insulator layers located on the negative side of the Z-axis from the intermediate insulator layer,

the main insulating material of the 2 nd laminated body is different from the main insulating material of the 1 st laminated body.

9. The multilayer substrate according to claim 8, wherein,

the young's modulus of the main insulating material of the 2 nd laminated body portion is lower than the young's modulus of the main insulating material of the 1 st laminated body portion.

10. The multilayer substrate according to claim 8, wherein,

the material of the 2 nd interlayer connection conductor is different from the material of the 1 st interlayer connection conductor.

11. The multilayer substrate according to claim 1 or 2, wherein,

the laminate has flexibility.

12. The multilayer substrate according to claim 1 or 2, wherein,

the material of the plurality of insulator layers is a thermoplastic resin.