CN220651980U - Die bonding equipment - Google Patents

Abstract

The application provides a die bonding equipment, include: a machine table; the feeding mechanism is arranged on the machine; the conveying mechanism comprises a transfer head, a first driver for driving the transfer head to lift and a second driver for driving the first driver to move along the length direction of the machine table, a plurality of adsorption positions for respectively sticking grains are arranged on the transfer head, the power output end of the first driver is connected with the transfer head, the power output end of the second driver is connected with the first driver, and the second driver is arranged on the machine table; and the die bonding table is arranged on the machine. The utility model provides a solid brilliant equipment, transfer head can absorb a plurality of crystalline grains on the wafer simultaneously, realizes the synchronous motion of a plurality of crystalline grains to be convenient for assemble a plurality of crystalline grains to the solid brilliant position that corresponds on the base plate, reduce solid brilliant operation repetition number of times by a wide margin, improve solid brilliant efficiency, promote production efficiency.

Description

Die bonding equipment

Technical Field

The application belongs to the technical field of die bonding, and more particularly relates to die bonding equipment.

Background

The existing die bonding equipment generally adopts a rotary platform to adjust the position of a chip on a die ring, adopts a clamp platform to fix the position of a substrate, absorbs the chip from the die ring through a die bonding mechanism, and then transmits the chip to the substrate for die bonding operation. The die bonding mechanism comprises a suction nozzle, a swing arm for supporting the suction nozzle and a driver for driving the swing arm to rotate, the suction nozzle transfers one chip at a time, when the array to-be-die bonding position exists on the substrate, the die bonding mechanism needs repeated die bonding operation for multiple times, the die bonding efficiency is low, and the production efficiency is influenced.

Disclosure of Invention

An object of the embodiment of the application is to provide a die bonding device, so as to solve the technical problem that the die bonding efficiency of the die bonding device is lower when the array to-be-die bonded positions exist on a substrate in the prior art.

In order to achieve the above purpose, the technical scheme adopted in the application is as follows: provided is a die bonding apparatus including:

a machine table;

the feeding mechanism is used for bearing a wafer with a crystal grain array and is arranged on the machine table;

the conveying mechanism comprises a transfer head, a first driver for driving the transfer head to lift and a second driver for driving the first driver to move along the length direction of the machine table, wherein a plurality of adsorption positions for respectively sticking and taking the crystal grains are arranged on the transfer head, the power output end of the first driver is connected with the transfer head, the power output end of the second driver is connected with the first driver, and the second driver is arranged on the machine table; the method comprises the steps of,

the die bonding table is used for clamping the substrate to be assembled with the crystal grains and is arranged on the machine.

Through adopting the transfer head, set up a plurality of absorption positions on the transfer head, can absorb a plurality of crystalline grains on the wafer simultaneously, realize the synchronous motion of a plurality of crystalline grains to be convenient for assemble a plurality of crystalline grains to the solid brilliant position that corresponds on the base plate. Therefore, the carrying mechanism can carry out die bonding operation once, so that die bonding of a plurality of crystal grains can be realized, the repeated times of die bonding operation are greatly reduced, the die bonding efficiency is improved, and the production efficiency is improved.

In one embodiment, the transfer head comprises a supporting plate and an adhesion layer arranged on one side of the supporting plate, the supporting plate is connected with the power output end of the first driver, a plurality of sticking bosses are formed on one side, away from the supporting plate, of the adhesion layer in a protruding mode, and the sticking bosses form the adsorption positions.

By adopting the technical means, the die bonding device can correspond to a plurality of dies and die bonding positions so as to bond the dies at the same time.

In one embodiment, each corner of the sticking boss is convexly provided with a positioning column for matching and positioning the crystal grains in a direction away from the supporting plate.

By adopting the technical means, the position accuracy of the crystal grains can be improved.

In one embodiment, the cross-sectional area of the end of the positioning column away from the sticking boss is tapered toward a direction away from the supporting plate.

By adopting the technical means, the crystal grain can be guided to be contacted with the surface of the sticking boss.

In one embodiment, a plurality of the adsorption sites are arranged in a rectangular array, a circular array, or an annular array.

By adopting the technical means, the die bonding positions which are arranged in a rectangular array, a circular array or a circular array can be adapted.

In one embodiment, the die bonding apparatus further includes a first detection mechanism for detecting the die position on the wafer, the first detection mechanism includes a first camera, a first linear driver for driving the first camera to move along a width direction of the machine, and a second linear driver for driving the first linear driver to move along a length direction of the machine, the second linear driver is mounted on the machine, a power output end of the second linear driver is connected to a power output end of the first linear driver, and a power output end of the first linear driver is connected to the first camera.

By adopting the technical means, the position of the transfer head when the crystal grains are stuck can be controlled.

In one embodiment, the die bonding apparatus further includes a second detection mechanism for detecting a die bonding position on the substrate, the second detection mechanism includes a second camera, a third linear driver for driving the second camera to move along a width direction of the machine, and a fourth linear driver for driving the third linear driver to move along a length direction of the machine, the fourth linear driver is mounted on the machine, a power output end of the fourth linear driver is connected to a power output end of the third linear driver, and a power output end of the third linear driver is connected to the second camera.

By adopting the technical means, the position of the transfer head during die bonding can be controlled.

In one embodiment, the die bonding equipment further comprises a cleaning table for cleaning the adsorption position, the cleaning table comprises a scrubbing plate, a third driver for driving the scrubbing plate to move and a mounting seat for supporting the third driver, the mounting seat is mounted on the machine table, the third driver is mounted on the mounting seat, and a power output end of the third driver is connected with the scrubbing plate.

By adopting the technical means, the transfer head can be scrubbed after the transfer head is subjected to die bonding so as to avoid residual grains or foreign matters on the transfer head.

In one embodiment, the cleaning stage is located between the die bonding stage and the feeding mechanism.

By adopting the technical means, the transfer head can be scrubbed in the process that the transfer head moves from the die bonding table to the feeding mechanism.

In one embodiment, the feeding mechanism comprises a first clamp seat for clamping the wafer, a first driving assembly for driving the first clamp seat to rotate, and a second driving assembly for driving the first driving assembly to translate, wherein the second driving assembly is installed on the machine table, a power output end of the second driving assembly is connected with the first driving assembly, and a power output end of the first driving assembly is connected with the first clamp seat.

By adopting the technical means, the position of the wafer can be adjusted so as to correspond to the adsorption phase on the transfer head.

In one embodiment, the die bonding stage comprises a second clamp seat for clamping the substrate and a third driving assembly for driving the second clamp seat to translate, the third driving assembly is mounted on the machine, and a power output end of the third driving assembly is connected with the second clamp seat.

By adopting the technical means, the horizontal position of the substrate can be adjusted so that the die fixing position on the substrate corresponds to the die position on the transfer head.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of a die bonding apparatus according to an embodiment of the present application;

fig. 2 is a schematic three-dimensional structure of a die bonding apparatus according to an embodiment of the present disclosure;

FIG. 3 is a schematic perspective view of the transfer head of FIG. 2;

FIG. 4 is a side view of the transfer head of FIG. 2;

fig. 5 is a top view of the transfer head of fig. 2.

Wherein, each reference sign in the figure:

10-machine;

20-a feeding mechanism; 21-a first clamp seat; 22-a first drive assembly; 23-a second drive assembly;

30-a carrying mechanism; 31-a transfer head; 311-supporting plates; 312-an adhesion layer; 3120-adsorption sites; 3121-sticking a boss; 3122-positioning posts; 32-a first driver; 33-a second driver;

40-die bonding stage; 41-a second clamp seat; 42-a third drive assembly; 43-fourth drive assembly;

50-a cleaning table; 51-scrubbing plate; 52-a third driver; 53-mount;

60-a first detection mechanism; 61-a first camera; 62-a first linear drive; 63-a second linear drive;

70-a second detection mechanism; 71-a second camera; 72-a third linear drive; 73-fourth linear drive.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Referring to fig. 1 to 3, a die bonding apparatus according to an embodiment of the present application will be described. The die bonding equipment comprises a machine table 10, a feeding mechanism 20, a carrying mechanism 30 and a die bonding table 40, wherein the feeding mechanism 20, the carrying mechanism 30 and the die bonding table 40 are arranged on the machine table 10; the loading mechanism 20 is used for carrying a wafer, and the wafer is provided with a die array; the carrying mechanism 30 comprises a transfer head 31, a first driver 32 and a second driver 33, wherein the first driver 32 is used for driving the transfer head 31 to lift (i.e. move along the Z-axis direction), the second driver 33 is used for driving the first driver 32 to move along the length direction X of the machine table 10, a plurality of adsorption positions 3120 are arranged on the transfer head 31, each adsorption position 3120 is used for respectively sticking a crystal grain, namely one adsorption position 3120 is correspondingly stuck with one crystal grain, the power output end of the first driver 32 is connected with the transfer head 31, the power output end of the second driver 33 is connected with the first driver 32, and the second driver 33 is arranged on the machine table 10; the die bonding stage 40 is used for clamping a substrate to be assembled with a die, and the die bonding stage 40 is mounted on the machine 10. By adopting the transfer head 31, a plurality of adsorption sites 3120 are provided on the transfer head 31, a plurality of dies on a wafer can be simultaneously sucked, and synchronous movement of the plurality of dies is realized, so that the plurality of dies are assembled to corresponding die fixing positions on a substrate. Therefore, the carrying mechanism 30 can carry out die bonding operation once, so that die bonding of a plurality of crystal grains can be realized, the repeated times of die bonding operation are greatly reduced, the die bonding efficiency is improved, and the production efficiency is improved. Meanwhile, since the positions among the plurality of crystal grains are kept fixed after the plurality of crystal grains are stuck by the transfer head 31, the alignment times can be reduced and the efficiency can be improved.

In addition, compared with the prior art that adopts the suction nozzle to transfer the crystal grain one by one, be limited by suction nozzle processing size restriction, when the crystal grain is less than suction nozzle size, the suction nozzle can't absorb the crystal grain, because transfer head 31 glues and gets the crystal grain in this application, has better effect of gluing to the less crystal grain of granule, can satisfy the die bonding requirement of less grain diameter.

In one embodiment of the present application, referring to fig. 1 to 3, the first driver 32 may be a flat linear motor, a voice coil motor, or the like, so that the transfer head 31 can be controlled to be lifted and lowered to facilitate the adsorption or release of the die.

In an embodiment of the present application, referring to fig. 1 to 3, the second driver 33 may be a flat linear motor, or a linear driving assembly such as a motor screw nut assembly, so that the position of the transfer head 31 along the length direction X of the machine 10 can be controlled, so as to control the position of the transfer head 31 along the X axis direction when taking and placing the die. The machine 10 and the first driver 32 may be slidably connected via a guide rail disposed along the X-axis direction, so as to guide the first driver 32 to move along the X-axis direction, and keep the first driver 32 stable.

In one embodiment of the present application, referring to fig. 3 to 5, the transfer head 31 includes a support plate 311 and an adhesive layer 312 disposed on one side of the support plate 311, the support plate 311 is connected to a power output end of the first driver 32, a plurality of sticking bosses 3121 are formed on the adhesive layer 312 towards a side far from the support plate 311, and the sticking bosses 3121 form a adsorbing position 3120. When the supporting plate 311 is close to the wafer downwards, the plurality of bonding pads 3121 can contact with the corresponding die first, so as to facilitate adhesion of the plurality of dies, control the number and arrangement of the dies to correspond to the die bonding positions on the substrate, and prevent adhesion of other portions of the adhesion layer 312 to the dies.

Alternatively, the transfer head 31 may be an elastic stamp transfer head or the like. The transfer head 31 may be of such an adhesive strength to the die by temperature control that the adhesive strength of the adhesive lands 3121 to the die is large at low temperature and the adhesive strength of the adhesive lands 3121 to the die is small at high temperature. When the transfer head 31 presses the wafer, it may be at a lower temperature so that the bonding pad 3121 can adsorb the die; when the transfer head 31 presses down the substrate, it may be at a higher temperature to enable the bonding pad 3121 to release the die.

In one embodiment of the present application, referring to fig. 3 to 5, each corner of the bonding boss 3121 is provided with a positioning post 3122, the positioning post 3122 protrudes away from the supporting plate 311, and the positioning post 3122 is used for positioning the die in a matching manner. By adopting the positioning posts 3122, the position of the die can be positioned in cooperation, and the positional accuracy of the die on the bonding boss 3121 can be improved.

In one embodiment of the present application, referring to fig. 3 to 5, the cross-sectional area of the end of the positioning post 3122 away from the bonding boss 3121 is tapered toward the direction away from the supporting plate 311. In this way, the die can be guided to be centered on the lower end surface of the bonding boss 3121 in the process of bonding the die by the transfer head 31, so that the upper surface of the die is close to the lower surface of the bonding boss 3121, and is adsorbed and fixed by the lower surface of the bonding boss 3121. Optionally, the end of the positioning post 3122 away from the bonding boss 3121 is tapered, so that the die can be conveniently guided to be close to the lower end surface of the bonding boss 3121.

In one embodiment of the present application, referring to fig. 3 to 5, a plurality of adsorption sites 3120 are arranged in a rectangular array. Thus, the die bonding positions of the rectangular array on the substrate can be matched. Of course, in other embodiments of the present application, the plurality of adsorption sites 3120 may also be in a circular array or annular array to match the die attach sites on the substrate when they are circular or annular.

In one embodiment of the present application, referring to fig. 1 to 3, the die bonding apparatus further includes a first detecting mechanism 60 for detecting a die position on the wafer, the first detecting mechanism 60 includes a first camera 61, a first linear driver 62 and a second linear driver 63, the first linear driver 62 is used for driving the first camera 61 to move along a width direction Y of the machine 10, the second linear driver 63 is used for driving the first linear driver 62 to move along a length direction X of the machine 10, the second linear driver 63 is mounted on the machine 10, a power output end of the second linear driver 63 is connected with a power output end of the first linear driver 62, and a power output end of the first linear driver 62 is connected with the first camera 61. The first camera 61 is used for photographing the wafer on the loading mechanism 20 to identify the die position on the wafer. By employing the first and second linear drivers 62 and 63, the first camera 61 can be driven to move in the X-axis direction and the Y-axis direction so as to accurately locate the positions of the dies on the wafer.

Alternatively, the first linear driver 62 may be a flat linear motor, or a linear driving assembly such as a motor screw nut assembly, so that the position of the first camera 61 along the width direction Y of the machine 10 can be controlled to control the position along the Y axis direction when the transfer head 31 glues the die. The second linear driver 63 may have the same or similar structure as the first linear driver 62.

In one embodiment of the present application, referring to fig. 1 to 3, the die bonding apparatus further includes a second detecting mechanism 70 for detecting a die bonding position on the substrate, the second detecting mechanism 70 includes a second camera 71, a third linear driver 72, and a fourth linear driver 73, the third linear driver 72 is configured to drive the second camera 71 to move along a width direction Y of the machine 10, the fourth linear driver 73 is configured to drive the third linear driver 72 to move along a length direction X of the machine 10, the fourth linear driver 73 is mounted on the machine 10, a power output end of the fourth linear driver 73 is connected to a power output end of the third linear driver 72, and a power output end of the third linear driver 72 is connected to the second camera 71. The second camera 71 is used for photographing the substrate on the die bonding stage 40 to identify the die bonding position on the substrate. By adopting the third and fourth linear drivers 72 and 73, the second camera 71 can be driven to move in the X-axis direction and the Y-axis direction so as to accurately position the die bonding position on the substrate.

Alternatively, the second detection mechanism 70 may be of the same or similar construction as the first detection mechanism 60.

In one embodiment of the present application, referring to fig. 1 to 3, the die bonding apparatus further includes a cleaning stage 50 for cleaning the adsorption site 3120, the cleaning stage 50 includes a scrubbing plate 51, a third driver 52 and a mounting base 53, the third driver 52 is used for driving the scrubbing plate 51 to move, the mounting base 53 supports the third driver 52, the mounting base 53 is mounted on the machine 10, the third driver 52 is mounted on the mounting base 53, and a power output end of the third driver 52 is connected to the scrubbing plate 51. The third driver 52 drives the scrubbing plate 51 to scrub the transfer head 31 as the transfer head 31 passes through the cleaning stage 50, so as to avoid the residual die when the transfer head 31 releases the die.

Alternatively, the third driver 52 may be a component that drives the scrubbing plate 51 to reciprocate by a linear motor or a rotary motor, etc., and the scrubbing plate 51 may be slidably connected to the mounting base 53, so that the scrubbing plate 51 can be controlled to wipe the bottom of the transfer head 31 and smooth movement of the scrubbing plate 51 is ensured.

In one embodiment of the present application, referring to fig. 1 to 3, a cleaning stage 50 is located between the die attach stage 40 and the loading mechanism 20. In this way, the transfer head 31 can be scrubbed in the process of moving the transfer head 31 from the die bonding table 40 to the feeding mechanism 20, which is helpful for reducing the travel of the transfer head 31.

In one embodiment of the present application, referring to fig. 1 to 3, the loading mechanism 20 includes a first chuck base 21, a first driving component 22 and a second driving component 23, the first chuck base 21 is used for clamping a wafer, the first driving component 22 is used for driving the first chuck base 21 to rotate, the second driving component 23 is used for driving the first driving component 22 to translate (i.e. move along an XY axis plane), the second driving component 23 is mounted on the machine table 10, a power output end of the second driving component 23 is connected with the first driving component 22, and a power output end of the first driving component 22 is connected with the first chuck base 21. The rotation and translation of the wafer can be controlled by the first drive assembly 22 and the second drive assembly 23 to realize the adjustment of the angle of the crystal grain, the X-axis position and the Y-axis position. Wherein the X-axis direction, the Y-axis direction and the Z-axis direction are perpendicular to each other.

Alternatively, the first driving assembly 22 may be a rotating platform driven by a rotating motor, etc., so that the wafer rotation angle can be controlled and the rotation angle of the die can be adjusted.

Alternatively, the second driving assembly 23 may be an XY axis moving stage or an XYZ axis moving stage, so that the wafer position on the first chuck base 21 can be adjusted to facilitate the transfer head 31 to take out the die.

In one embodiment of the present application, referring to fig. 1 to 3, the die bonding stage 40 includes a second chuck base 41 and a third driving assembly 42, the second chuck base 41 is used for clamping a substrate, the third driving assembly 42 is used for driving the second chuck base 41 to translate (i.e. move along the XY axis plane), the third driving assembly 42 is mounted on the machine 10, and a power output end of the third driving assembly 42 is connected to the second chuck base 41. The translation of the substrate can be controlled by the third drive assembly 42 to achieve adjustment of the die attach position on the substrate.

Optionally, the die bonding stage 40 further includes a fourth driving assembly 43, the fourth driving assembly 43 is configured to drive the second fixture seat 41 to rotate, the fourth driving assembly 43 is mounted at a power output end of the third driving assembly 42, and the power output end of the third driving assembly 42 is connected to the second fixture seat 41. In this way, the angle of the substrate can be adjusted.

Alternatively, the fourth driving component 43 may be a rotating platform driven by a rotating motor, so that the rotation angle of the substrate can be controlled and the rotation angle of the die bonding position can be adjusted.

Alternatively, the third driving assembly 42 may be an XY axis moving stage or an XYZ axis moving stage, so that the die bonding position on the second chuck base 41 can be adjusted to facilitate the fixation of the die by the transfer head 31.

When the substrate is a circular plate, the die bonding stage 40 may have a similar structure to the loading mechanism 20. When the substrate is a rectangular plate, the second chuck base 41 may employ an existing substrate chuck assembly.

The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but is intended to cover any and all modifications, equivalents, and alternatives falling within the spirit and principles of the present application.

Claims (10)

1. A die bonding apparatus, comprising:

a machine (10);

the feeding mechanism (20) is used for bearing a wafer with a crystal grain array, and the feeding mechanism (20) is arranged on the machine table (10);

the carrying mechanism (30) comprises a transfer head (31), a first driver (32) for driving the transfer head (31) to lift and a second driver (33) for driving the first driver (32) to move along the length direction (X) of the machine table (10), wherein a plurality of adsorption positions (3120) for respectively sticking the crystal grains are arranged on the transfer head (31), the power output end of the first driver (32) is connected with the transfer head (31), the power output end of the second driver (33) is connected with the first driver (32), and the second driver (33) is arranged on the machine table (10); the method comprises the steps of,

and the die bonding table (40) is used for clamping the substrate on which the crystal grains are to be assembled, and the die bonding table (40) is arranged on the machine table (10).

2. The die bonding apparatus according to claim 1, wherein: the transfer head (31) comprises a supporting plate (311) and an adhesion layer (312) arranged on one side of the supporting plate (311), the supporting plate (311) is connected with a power output end of the first driver (32), a plurality of sticking bosses (3121) are formed by protruding the adhesion layer (312) towards one side far away from the supporting plate (311), and the sticking bosses (3121) form the adsorption position (3120).

3. The die bonding apparatus according to claim 2, wherein: positioning columns (3122) for matching and positioning the crystal grains are convexly arranged at the corners of the sticking boss (3121) towards the direction far away from the supporting plate (311).

4. The die bonding apparatus of claim 3, wherein: the cross section area of one end of the locating column (3122) far away from the sticking boss (3121) is gradually reduced towards the direction far away from the supporting plate (311).

5. The die bonding apparatus according to claim 1, wherein: the adsorption sites (3120) are arranged in a rectangular array, a circular array or a circular array.

6. The die bonding apparatus according to any one of claims 1 to 5, wherein: the die bonding equipment further comprises a first detection mechanism (60) for detecting the position of the crystal grain on the wafer, the first detection mechanism (60) comprises a first camera (61), a first linear driver (62) for driving the first camera (61) to move along the width direction (Y) of the machine table (10) and a second linear driver (63) for driving the first linear driver (62) to move along the length direction (X) of the machine table (10), the second linear driver (63) is mounted on the machine table (10), the power output end of the second linear driver (63) is connected with the power output end of the first linear driver (62), and the power output end of the first linear driver (62) is connected with the first camera (61).

7. The die bonding apparatus according to any one of claims 1 to 5, wherein: the die bonding equipment further comprises a second detection mechanism (70) for detecting the die bonding position on the substrate, the second detection mechanism (70) comprises a second camera (71), a third linear driver (72) for driving the second camera (71) to move along the width direction (Y) of the machine table (10) and a fourth linear driver (73) for driving the third linear driver (72) to move along the length direction (X) of the machine table (10), the fourth linear driver (73) is installed on the machine table (10), the power output end of the fourth linear driver (73) is connected with the power output end of the third linear driver (72), and the power output end of the third linear driver (72) is connected with the second camera (71).

8. The die bonding apparatus according to any one of claims 1 to 5, wherein: the die bonding equipment further comprises a cleaning table (50) for cleaning the adsorption position (3120), the cleaning table (50) comprises a scrubbing plate (51), a third driver (52) for driving the scrubbing plate (51) to move and a mounting seat (53) for supporting the third driver (52), the mounting seat (53) is mounted on the machine table (10), the third driver (52) is mounted on the mounting seat (53), and a power output end of the third driver (52) is connected with the scrubbing plate (51).

9. The die bonding apparatus according to claim 8, wherein: the cleaning table (50) is located between the die bonding table (40) and the feeding mechanism (20).

10. The die bonding apparatus according to any one of claims 1 to 5, wherein: the feeding mechanism (20) comprises a first clamp seat (21) for clamping the wafer, a first driving assembly (22) for driving the first clamp seat (21) to rotate and a second driving assembly (23) for driving the first driving assembly (22) to translate, the second driving assembly (23) is arranged on the machine table (10), a power output end of the second driving assembly (23) is connected with the first driving assembly (22), and a power output end of the first driving assembly (22) is connected with the first clamp seat (21); and/or the number of the groups of groups,

the die bonding table (40) comprises a second clamp seat (41) for clamping the substrate and a third driving assembly (42) for driving the second clamp seat (41) to translate, the third driving assembly (42) is installed on the machine table (10), and the power output end of the third driving assembly (42) is connected with the second clamp seat (41).