CN220586498U - Heat dissipation structure - Google Patents
Heat dissipation structure Download PDFInfo
- Publication number
- CN220586498U CN220586498U CN202321801266.7U CN202321801266U CN220586498U CN 220586498 U CN220586498 U CN 220586498U CN 202321801266 U CN202321801266 U CN 202321801266U CN 220586498 U CN220586498 U CN 220586498U
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- heat sink
- heat dissipating
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 27
- 230000001154 acute effect Effects 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 4
- 230000004308 accommodation Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000012356 Product development Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the application provides a heat radiation structure of circuit board, heat radiation structure includes: a heat sink and a housing that forms an accommodation space accommodating the heat sink with the circuit board; the heat sink has: a bottom part contacted with a device to be heat-dissipated on the circuit board; a top portion remote from the bottom portion; and a connecting portion connecting the bottom portion and the top portion; the housing presses a surface of the top portion remote from the bottom portion. According to the embodiment of the application, the fixing structure of the heat dissipation part in a traditional hard matching mode is not needed, so that the cost can be reduced, and the wiring of the circuit board is not limited.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation structure.
Background
Heat dissipation components are typically included in electronic devices to dissipate heat from high power devices, including but not limited to integrated circuit chips (Integrated Circuit Chip, simply referred to as IC chips).
In the conventional mounting manner of the heat dissipation member, the heat dissipation member and the device to be heat-dissipated are generally fixed to each other by means of hard fitting such as welding, screws or buckles.
The inventors found that in such a structure, it is necessary to calculate not only whether or not the applied pressure would damage the heat dissipation member and the device to be dissipated, but also the wiring restriction of the PCB in the case where the device to be dissipated is an IC chip provided on a printed circuit board (Printed Circuit Board, abbreviated as PCB), causing wiring difficulties.
It should be noted that the foregoing description of the background art is only for the purpose of facilitating a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background section of the present application.
Disclosure of Invention
In order to solve at least one of the above problems or other similar problems, embodiments of the present application provide a heat dissipation structure, which eliminates the fixing structure of the heat dissipation component in the conventional hard-fit manner, reduces the cost, and does not limit the wiring of the circuit board.
According to an embodiment of a first aspect of the present application, there is provided a heat dissipation structure of a circuit board, wherein the heat dissipation structure includes:
radiator
A housing that forms an accommodating space accommodating the heat sink with the circuit board;
the heat sink has:
a bottom part contacted with a device to be heat-dissipated on the circuit board;
a top portion remote from the bottom portion; and
a connecting portion connecting the bottom portion and the top portion;
the housing presses a surface of the top portion remote from the bottom portion.
In one or more of the embodiments described herein,
the bottom and the connecting part are formed into a U shape.
In one or more of the embodiments described herein,
the bottom, the connecting portion and the top are formed in an inverted-Chinese-character 'ji' shape.
In one or more of the embodiments described herein,
the included angle between the bottom and the connecting part is an acute angle.
In one or more of the embodiments described herein,
the inner surface of the housing is formed with protrusions,
an edge portion of the top portion remote from the connecting portion is pressed and deformed by the protrusion.
In one or more of the embodiments described herein,
the top portion is formed with a groove portion extending at least to the edge portion.
In one or more of the embodiments described herein,
the top portion further includes a main body portion connected to the connection portion, the edge portion is disposed in the main body portion, and the groove portion includes a first groove portion formed between the edge portion and the main body portion.
In one or more of the embodiments described herein,
the main body part comprises a middle part and side parts positioned at two sides of the middle part, the edge part is arranged at the middle part, the first groove part is formed between the edge part and the side parts,
the slot portion further includes a second slot portion formed between the middle portion and the side portion.
In one or more of the embodiments described herein,
the edge portion and the middle portion are formed in a T-shape, and the first groove portion and the second groove portion are formed in an L-shape.
In one or more of the embodiments described herein,
the bottom is contacted with the device to be heat-dissipated through heat-dissipating rubber.
One of the beneficial effects of the embodiment of the application is that: by pressing the top of the heat sink through the housing, the fixing structure of the heat sink member of the conventional hard-fit manner is not required, and the cost can be reduced without causing limitation to the wiring of the circuit board.
Specific embodiments of the present application are disclosed in detail below with reference to the following description and drawings, indicating the manner in which the principles of the present application may be employed. It should be understood that the embodiments of the present application are not limited in scope thereby. The embodiments of the present application include many variations, modifications and equivalents within the spirit and scope of the appended claims.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments in combination with or instead of the features of the other embodiments.
Drawings
Elements and features described in one drawing or one implementation of an embodiment of the present application may be combined with elements and features shown in one or more other drawings or implementations. Furthermore, in the drawings, like reference numerals designate corresponding parts throughout the several views, and may be used to designate corresponding parts as used in more than one embodiment.
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is apparent that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art. In the drawings:
FIG. 1 is a schematic diagram of an embodiment of the present application including a heat dissipating structure;
FIG. 2 is another schematic diagram of an embodiment of the present application including a heat dissipating structure;
fig. 3 is a schematic diagram of a heat sink according to an embodiment of the present application.
Reference numerals illustrate:
10: heat radiation structure, 11-1: radiator, 12: a housing, 20: circuit board, 110: bottom, 111: top, 112: connection part, 21: to-be-heat-dissipated device, 22: heat dissipation rubber, 120: projection, 1110: edge portion, 113: groove portion 1131: first groove portion, 1132: second groove portion, 1111: body part, 11111: middle part, 11112: a side portion.
Detailed Description
The foregoing and other features of embodiments of the present application will become apparent from the following description, taken in conjunction with the accompanying drawings. In the following description and drawings, particular implementations of the present application embodiments are disclosed in detail, which demonstrate some of the implementations in which the principles of the present application embodiments may be employed, it being understood that the present application embodiments are not limited to the implementations described, but, on the contrary, the present application embodiments include all modifications, variations, and equivalents falling within the scope of the appended claims.
In the present application embodiments, the term "and/or" includes any and all combinations of one or more of the associated listed terms. The terms "comprises," "comprising," "including," "having," and the like, are intended to reference the presence of stated features, elements, components, or groups of components, but do not preclude the presence or addition of one or more other features, elements, components, or groups of components.
In the embodiments herein, the singular forms "a," an, "and" the "may include plural forms, and should be construed broadly as" one "or" one type "and not as limited to the meaning of" one; furthermore, the term "comprising" is to be interpreted as including both the singular and the plural, unless the context clearly dictates otherwise. Furthermore, the term "according to" should be understood as "at least partially according to … …", and the term "based on" should be understood as "based at least partially on … …", unless the context clearly indicates otherwise.
Various implementations of the examples of the present application are described below with reference to the accompanying drawings. These embodiments are merely illustrative and are not limiting of the examples of the present application.
The embodiment of the application provides a heat dissipation structure of a circuit board.
Fig. 1 is a schematic diagram of an embodiment of the present application including a heat dissipating structure 10. A cross-sectional view of the heat dissipating structure 10 is shown.
As shown in fig. 1, the heat dissipation structure 10 includes a heat sink 11 and a housing 12, and the housing 12 and a circuit board 20 constitute an accommodating space accommodating the heat sink 11.
As shown in fig. 1, the heat sink 11 has a bottom 110, a top 111, and a connection portion 112, the bottom 110 is in contact with the device 21 to be heat-dissipated on the circuit board 20, the top 111 is away from the bottom 110, and the connection portion 112 connects the bottom 110 and the top 111.
As shown in fig. 1, the housing 12 presses a surface 111S of the top 111 away from the bottom 110.
As is apparent from the above embodiments, the top 111 of the heat sink 11 is pressed by the housing 12, so that the conventional fixing structure of the heat sink member of the hard-fitting type is not required, the cost can be reduced, and the wiring of the circuit board is not limited.
For example, there is often a case in the electronic device, and the case is fixed to the circuit board after the case is mounted, and the case presses the heat sink to fix the heat sink.
In addition, the fixing structure of the conventional heat dissipation component in the hard-fit manner often needs to occupy a certain space on the circuit board, for example, the heat dissipation component is welded on the circuit board or is fixed on the circuit board through screws or snap-fit, but in the embodiment of the application, the space for fixing the heat dissipation component is not required to be reserved on the circuit board, so that the limitation on the wiring on the circuit board is avoided, and especially in the product development stage, the wiring on the circuit board such as a PCB is dense, and no redundant space is available for fixing the heat dissipation component.
In the embodiment of the present application, the heat dissipation structure 10 may be applied to various electronic devices, such as various industrial automation devices or products, which is not limited in this application.
As shown in fig. 1, in one or more embodiments, the bottom 110 and the connection portion 112 are formed in a U shape, in other words, the bottom 110 and the connection portion 112 are formed in a U shape when viewed along one direction, that is, opposite sides of the bottom 110 are respectively provided with one connection portion. Therefore, under the condition that the top of the radiator is pressed, the balanced stress of the radiator can be realized, and therefore, the reliable fixing is realized.
However, the present application is not limited thereto, and the bottom portion 110 and the connection portion 112 may be formed in other shapes, such as a cylindrical shape.
In one or more embodiments, as shown in FIG. 1, the bottom 110, the connecting portion 112, and the top 111 are formed in an inverted "few" shape. That is, opposite sides of the bottom 110 are provided with a top 111, respectively, the bottom 110 and the top 111 are substantially parallel, and the bottom 110 and the top 111 are connected by a connection portion 112. The radiator itself is of a flexible structure, that is, the whole shape of the radiator can be deformed under the condition of pressure, so that the shell can easily and reliably press the radiator, and the balanced stress and the reliable fixation of the radiator can be realized.
However, the present application is not limited thereto, and the bottom portion 110, the connection portion 112, and the top portion 111 may be formed in other shapes, for example, the top portion 111 is ring-shaped extending in the circumferential direction of the bottom portion 110, and the connection portion 112 is disposed between the top portion 111 and the bottom portion 110.
In one or more embodiments, as shown in fig. 1, the angle a between the base 110 and the connecting portion 112 is acute. Thus, in the case where the housing presses the top of the heat sink, the force applied to the bottom 110 by the connection portion 112 presses the heat sink against the device to be heat-dissipated, so that the fixing reliability of the heat sink can be improved.
However, the present application is not limited thereto, and for example, the angle between the bottom 110 and the connecting portion 112 may be a right angle or an obtuse angle, which is not limited thereto.
As shown in fig. 1, in one or more embodiments, the bottom 110 is in contact with the device 21 to be heat-dissipated through the heat dissipating rubber 22. Thereby, the heat radiation efficiency of the heat radiator can be improved. The heat dissipation rubber can also be called as heat conduction silica gel, etc., and reference is made to the technology.
Fig. 2 is another schematic diagram of an embodiment of the present application, including a heat dissipating structure 10, showing an enlarged schematic view of a portion a in fig. 1.
As shown in fig. 2, in one or more embodiments, the inner surface of the housing 12 is formed with a protrusion 120, and an edge portion 1110 of the top 111 remote from the connection portion 112 is deformed by the protrusion 120. Thereby, the case 12 can be reliably fixed to the heat sink 11.
In the present embodiment, the specific shape, size, number, and arrangement position of the protrusions 120 are not limited as long as the protrusions 120 can reliably press the top 111 of the heat sink.
As shown in fig. 2, in the embodiment of the present application, the housing 12 may press the edge of the heat sink 11, that is, the edge portion 1110 of the top 111, so as to fix the heat sink 11, but the present application is not limited thereto, and the housing 12 may also press other portions of the top 111 of the heat sink 11, such as a portion near the connection portion, which is not limited thereto.
In the embodiment of the application, the casing 12 presses the radiator 11 to deform the radiator 11 itself, so that the radiator 11 contacts with the device 21 to be radiated more reliably, and the radiating efficiency can be improved.
Furthermore, since the heat sink 11 can be deformed, it is possible to adapt to the same housing even if the heat sink is different in size and/or thickness.
As shown in fig. 2, the broken line in fig. 2 shows the heat spreader 11-1 having a larger thickness relative to the heat spreader 11, and for the same installation environment or space, even if the thickness of the heat spreader 11-1 is larger, the heat spreader 11-1 can be pressed by the housing 12 to deform the heat spreader 11-1 to achieve reliable fixing of the heat spreader 11-1, and the deformation degree and manner of the heat spreader are not limited in the embodiment of the present application, so long as the deformation degree and manner of the heat spreader are within the pressure range of deformation of the heat spreader, and in this case, damage to the heat spreader, such as an IC chip, is not caused.
In addition, under the condition that the heat dissipation rubber is coated between the radiator and the device to be cooled, even if the coating thickness of the heat dissipation rubber is different, the fixing of the radiator is not affected, and the coating operation is convenient.
An exemplary structure for deforming the heat sink is described below.
Fig. 3 is a schematic diagram of a heat sink according to an embodiment of the present application, showing a perspective view of the heat sink.
In one or more embodiments, as shown in fig. 3, the top portion 111 is formed with a slot portion 113, the slot portion 113 extending at least to the edge portion 1110. That is, since the groove portion is formed at the portion of the radiator pressed by the housing, the pressed portion is easily deformed with respect to other portions when the housing presses the radiator, and thus the attachment and fixation of the radiator can be easily achieved, and the radiator can be easily deformed by recessing the radiator, so that the radiator having different thicknesses can be adapted.
In the embodiment of the present application, the specific shape and number of the groove portions 113 are not limited, as long as the groove portions 113 extend at least to the edge portions 1110, so that the heat sink is easily deformed, and thus the mounting and fixing of the heat sink can be easily achieved.
In the embodiment of the present application, the groove 113 may penetrate the thickness direction of the top 111, but the present application is not limited thereto, and for example, the groove 113 may be a groove formed on the surface of the top 111, which does not penetrate the thickness direction of the top.
As shown in fig. 3, in one or more embodiments, top 111 further includes a body portion 1111 coupled to coupling portion 112, edge portion 1110 is disposed on body portion 1111, and slot portion 113 includes a first slot portion 1131 formed between edge portion 1110 and body portion 1111. That is, a part of the edge portion 1110 is provided in the body portion 1111, and a partial region between the edge portion 1110 and the body portion 1111 is formed with a first groove portion 1131. As a result, the edge portion 1110 is easily deformed when pressed by the case, and the attachment and fixation of the radiator can be easily achieved.
In one or more embodiments, as shown in FIG. 3, the body portion 1111 includes a middle portion 11111 and side portions 11112 located on opposite sides of the middle portion 11111, the edge portion 1110 is disposed on the middle portion 11111, a first slot portion 1131 is formed between the edge portion 1110 and the side portions 11112, and the slot portion 113 further includes a second slot portion 1132 formed between the middle portion 11111 and the side portions 11112. Thus, the edge portion 1110 is more likely to deform when pressed by the case, and the attachment and fixation of the radiator can be easily achieved.
In one or more embodiments, as shown in fig. 3, the edge portion and the middle portion are formed in a T-shape, and the first gap and the second gap are formed in an L-shape. Thereby, the groove portions are provided in symmetrical positions in the top portion, thereby facilitating the realization of reliability of the mounting fixation of the heat sink.
It should be noted that the above description of the groove portions is only an exemplary illustration, and the groove portions may be other structures formed on the top, for example, fig. 3 shows that the first groove portion 1131 and the second groove portion 1132 are both linear, but the application is not limited thereto, the first groove portion 1131 and the second groove portion 1132 may also be in a wavy or irregular shape, fig. 3 shows that the second groove portion 1132 is perpendicular to the first groove portion 1131, but the application is not limited thereto, the second groove portion 1132 may not be perpendicular to the first groove portion 1131, and fig. 3 shows that the second groove portion 1132 is disposed between the middle portion 11111 and the side portion 11112 as a whole, but the application is not limited thereto, and the second groove portion 1132 may also be disposed between the middle portion 11111 and the portion of the side portion 11112.
As is apparent from the above embodiments, the top 111 of the heat sink 11 is pressed by the housing 12, so that the conventional fixing structure of the heat sink member of the hard-fitting type is not required, the cost can be reduced, and the wiring of the circuit board is not limited.
It should be noted that fig. 1 to 3 above only schematically illustrate the heat dissipation structure of the embodiment of the present application, but the present application is not limited thereto, and specific details of each structure or component may refer to the related art; it is also possible to add structures or components not shown in fig. 1 to 3 or to reduce one or more structures or components in fig. 1 to 3. Reference may be made to the related art for parts or elements not specifically indicated in fig. 1 to 3, which are not limited in this application.
While the embodiments of the present application have been described in connection with specific embodiments, it should be apparent to those skilled in the art that these descriptions are intended to be illustrative, and not limiting in scope. Various modifications and alterations to the embodiments of this application may be made by those skilled in the art in light of the spirit and principles of the embodiments of this application, which are also within the scope of the embodiments of this application.
Preferred implementations of the embodiments of the present application are described above with reference to the accompanying drawings. The many features and advantages of the embodiments are apparent from the detailed specification, and thus, it is intended by the appended claims to cover all such features and advantages of the embodiments which fall within the true spirit and scope thereof. Further, since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the implementations of the embodiments of the present application to the exact construction and operation illustrated and described, and accordingly, all suitable modifications and equivalents may be resorted to, falling within the scope thereof.
Claims (10)
1. A heat dissipation structure for a circuit board, the heat dissipation structure comprising:
radiator
A housing that forms an accommodating space accommodating the heat sink with the circuit board;
the heat sink has:
a bottom part contacted with a device to be heat-dissipated on the circuit board;
a top portion remote from the bottom portion; and
a connecting portion connecting the bottom portion and the top portion;
the housing presses a surface of the top portion remote from the bottom portion.
2. The heat dissipating structure of claim 1, wherein,
the bottom and the connecting part are formed into a U shape.
3. The heat dissipating structure of claim 2, wherein,
the bottom, the connecting portion and the top are formed in an inverted-Chinese-character 'ji' shape.
4. The heat dissipating structure of claim 3 wherein,
the included angle between the bottom and the connecting part is an acute angle.
5. The heat dissipating structure of claim 1, wherein,
the inner surface of the housing is formed with protrusions,
an edge portion of the top portion remote from the connecting portion is pressed and deformed by the protrusion.
6. The heat dissipating structure of claim 5, wherein,
the top portion is formed with a groove portion extending at least to the edge portion.
7. The heat dissipating structure of claim 6, wherein,
the top portion further includes a main body portion connected to the connection portion, the edge portion is disposed in the main body portion, and the groove portion includes a first groove portion formed between the edge portion and the main body portion.
8. The heat dissipating structure of claim 7,
the main body part comprises a middle part and side parts positioned at two sides of the middle part, the edge part is arranged at the middle part, the first groove part is formed between the edge part and the side parts,
the slot portion further includes a second slot portion formed between the middle portion and the side portion.
9. The heat dissipating structure of claim 8, wherein,
the edge portion and the middle portion are formed in a T-shape, and the first groove portion and the second groove portion are formed in an L-shape.
10. The heat dissipating structure of claim 1, wherein,
the bottom is contacted with the device to be heat-dissipated through heat-dissipating rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321801266.7U CN220586498U (en) | 2023-07-10 | 2023-07-10 | Heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321801266.7U CN220586498U (en) | 2023-07-10 | 2023-07-10 | Heat dissipation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220586498U true CN220586498U (en) | 2024-03-12 |
Family
ID=90114785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321801266.7U Active CN220586498U (en) | 2023-07-10 | 2023-07-10 | Heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220586498U (en) |
-
2023
- 2023-07-10 CN CN202321801266.7U patent/CN220586498U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4892527B2 (en) | Electronic control device | |
| US7441590B2 (en) | Radiator for semiconductor | |
| US6603665B1 (en) | Heat dissipating assembly with thermal plates | |
| JP7003289B2 (en) | Board storage housing | |
| JP2011054640A (en) | Shield package substrate | |
| CN109417068B (en) | Semiconductor device with a plurality of semiconductor chips | |
| JP2010057345A (en) | Electronic control device | |
| JP2001332670A (en) | Mounting structure of semiconductor device | |
| US10880989B2 (en) | Electrical junction box | |
| JP2006287100A (en) | Capacitor module | |
| EP4343829A1 (en) | Heat dissipation apparatus, circuit module, electronic device, and method for assembling circuit module | |
| US9906157B2 (en) | Package assembly | |
| JP2018018984A (en) | Heat dissipation structure and electronic apparatus | |
| CN220586498U (en) | Heat dissipation structure | |
| WO2011155317A1 (en) | Heat dissipation structure for electronic device | |
| JP2002368481A (en) | Electronic apparatus | |
| JP7115032B2 (en) | substrate | |
| JPH09283886A (en) | Substrate mounting method, mounting substrate structure and electronic apparatus using mounting substrate structure | |
| JP2007173318A (en) | Heat dissipation structure and information device | |
| JP2011023469A (en) | Circuit module | |
| US11393739B2 (en) | Heat dissipation device for electronic component | |
| JP2004031854A (en) | Heat radiation structure | |
| CN118102681B (en) | Electronic equipment | |
| JP4299796B2 (en) | Heat sink fixing structure | |
| JPH1126660A (en) | Heat radiation structure of high heat generating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |