CN220526290U - Heat abstractor of computer all-in-one - Google Patents

Heat abstractor of computer all-in-one Download PDF

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Publication number
CN220526290U
CN220526290U CN202321793624.4U CN202321793624U CN220526290U CN 220526290 U CN220526290 U CN 220526290U CN 202321793624 U CN202321793624 U CN 202321793624U CN 220526290 U CN220526290 U CN 220526290U
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China
Prior art keywords
integrated machine
air
computer integrated
liquid
computer
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CN202321793624.4U
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Inventor
华啟林
丁壮
周洋
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Anhui Huahuahua Intelligent Technology Co ltd
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Anhui Huahuahua Intelligent Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02DCLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model relates to the field of heat dissipation equipment and discloses a heat dissipation device of a computer integrated machine, which comprises a computer integrated machine body and a heat dissipation mechanism arranged on the computer integrated machine body, wherein the heat dissipation mechanism comprises an assembly plate, a first dustproof net, an air suction cover, an air suction fan and an air distribution plate, and an assembly hole is formed in the inner wall of the left side of the computer integrated machine body. The utility model has the following advantages and effects: when the outside air is sucked and conveyed to the inside of the computer integrated machine body by the air suction fan, the air entering the inside of the computer integrated machine body can be cooled firstly, and then the cooled air is blown to the surface of the electronic element inside the computer integrated machine body, so that the effect of heat dissipation and cooling of the electronic element can be enhanced, the inside of the computer integrated machine body can be quickly and effectively cooled, the electronic element inside the computer integrated machine body is prevented from being damaged due to high temperature, and the stable operation of the computer integrated machine body is ensured.

Description

Heat abstractor of computer all-in-one
Technical Field
The utility model relates to the technical field of heat dissipation equipment, in particular to a heat dissipation device of a computer integrated machine.
Background
The computer integrated machine is a novel market product between the desktop computer and the notebook computer at present, integrates a host part and a display part into a novel computer, and is innovative in that internal elements are highly integrated. The computer integrated machine has the advantages of good mobility, high portability, fashionable appearance, light weight, exquisite structure, space saving and the like, and is widely applied to offices. Because the computer integrated machine integrates a plurality of electronic elements together, heat generated during operation is more concentrated, and therefore, a heat dissipation device is required to be arranged in the computer integrated machine for heat dissipation, and the computer integrated machine can be ensured to stably operate. Through retrieval, the patent document with the authorized bulletin number of CN212623954U announces a high-efficiency heat dissipation assembly for a computer all-in-one machine, the computer all-in-one machine comprises a host and a base, the base is arranged on the surface of the bottom of the host, first through holes are formed in the top and the bottom of the surface of the other side of the host, first dustproof net plates are arranged on the surface of the first through holes, second through holes are formed in the left side and the right side of the surface of the other side of the host, second dustproof net plates are arranged on the surface of the second through holes, a third through hole is formed in the middle of the surface of the other side of the host, and an air suction mechanism is arranged on the inner wall of the third through hole.
The scheme still has at least the following disadvantages when in actual use: when the temperature of the surrounding working environment where the computer integrated machine is located is higher (for example, a working room temporarily built outdoors in summer), the air suction mechanism sucks air with higher external temperature into the computer integrated machine to perform heat dissipation, the heat dissipation effect is not ideal enough, the heat dissipation efficiency is low, and further, the computer integrated machine cannot be guaranteed to perform effective heat dissipation and cooling inside the computer integrated machine, and stable operation of the computer integrated machine cannot be guaranteed.
Therefore, we propose a heat dissipating device of a computer integrated machine for solving the above-mentioned problems.
Disclosure of Invention
The utility model aims to provide a heat dissipation device of a computer integrated machine, which can cool air entering the computer integrated machine body firstly, then blow the cooled air to the surface of an electronic element in the computer integrated machine body, so that the heat dissipation and cooling effect of the electronic element can be enhanced, the inside of the computer integrated machine body can be rapidly and effectively cooled, the electronic element in the computer integrated machine body is prevented from being damaged due to high temperature, and the stable operation effect of the computer integrated machine body is ensured.
The technical aim of the utility model is realized by the following technical scheme: the utility model provides a heat abstractor of computer all-in-one, includes the computer all-in-one body and sets up the cooling mechanism on the computer all-in-one body, cooling mechanism includes assembly plate, first dust screen, induced draft cover, induced draft fan and air distribution board, the pilot hole has been seted up on the left side inner wall of computer all-in-one body, assembly plate passes through screw fixed mounting on the left side outer wall of computer all-in-one body, the inlet port that is linked together with the pilot hole has been seted up on the assembly plate, first dust screen fixed mounting is in the inlet port, induced draft cover fixed mounting is on the right side wall of assembly plate, the left side and the right side of induced draft cover are open structure, the right side of induced draft cover runs through the pilot hole, induced draft fan fixed mounting is in the induced draft cover, air distribution board fixed mounting is on the right side outer wall of induced draft cover, the air distribution hole has been seted up on the air distribution board.
The utility model is further provided with: the number of the air distribution holes is multiple, the air distribution holes are distributed in an array mode, and the air distribution holes are sequentially arranged in an inclined mode from the middle to the two sides.
The utility model is further provided with: the cooling mechanism further comprises a liquid storage box, cooling liquid, a semiconductor refrigerator, a miniature water pump, a liquid suction pipe and a serpentine cooling pipe, wherein the liquid storage box is fixedly installed on the left side wall of the assembling plate and located below the first dust screen, the cooling liquid is stored in the liquid storage box, the semiconductor refrigerator is fixedly installed at the bottom of the liquid storage box, the refrigerating end of the semiconductor refrigerator extends into the liquid storage box, the miniature water pump is fixedly installed on the outer wall of the front side of the liquid storage box, one end of the liquid suction pipe is fixedly connected with the suction end of the miniature water pump, one end of the liquid suction pipe, far away from the miniature water pump, extends into the liquid storage box, the serpentine cooling pipe is fixedly installed in the suction cover and located between the suction fan and the air distribution plate, one end of the serpentine cooling pipe sequentially penetrates through the bottom wall of the suction cover, the assembling hole and the assembling plate and is fixedly connected with the discharge end of the miniature water pump, and the other end of the serpentine cooling pipe sequentially penetrates through the bottom wall of the suction cover, the assembling hole and the assembling plate and extends into the liquid storage box.
The utility model is further provided with: the top of the liquid storage box is provided with a liquid adding hole, and a sealing cock is arranged in the liquid adding hole in a threaded manner.
The utility model is further provided with: the top fixed mounting of snakelike cooling tube has last pipe strap, goes up pipe strap and the top inner wall fixed connection of cover that induced drafts, and the bottom fixed mounting of snakelike cooling tube has down the pipe strap, and lower pipe strap and the bottom inner wall fixed connection of cover that induced drafts.
The utility model is further provided with: the front side inner wall and the rear side inner wall of the computer integrated machine body are respectively provided with an air outlet hole, and a second dust screen is fixedly arranged in each air outlet hole.
The beneficial effects of the utility model are as follows:
according to the utility model, the heat dissipation mechanism consisting of the assembly plate, the first dust screen, the air suction cover, the air suction fan, the air distribution plate, the liquid storage box, the cooling liquid, the semiconductor refrigerator, the miniature water pump, the liquid suction pipe and the serpentine cooling pipe is utilized, when the air suction fan is utilized to suck outside air into the computer integrated machine body, the air entering the computer integrated machine body can be cooled firstly, then the cooled air is blown to the surface of an electronic element in the computer integrated machine body, so that the heat dissipation and cooling effect on the electronic element can be enhanced, the rapid and effective heat dissipation and cooling on the inside of the computer integrated machine body can be realized, the electronic element in the computer integrated machine body is prevented from being damaged due to high temperature, the stable operation of the computer integrated machine body is ensured, and the rapid and effective heat dissipation and cooling on the inside of the computer integrated machine body can be realized under the condition that the working environment temperature is higher.
According to the utility model, the first dust screen and the second dust screen are utilized, so that dust in the external environment can be prevented from entering the computer integrated machine body, and the aim of good dust prevention is fulfilled.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic perspective view of the present embodiment.
Fig. 2 is a schematic view of a partially sectional structure in front view of the present embodiment.
Fig. 3 is an enlarged schematic view of the portion a in fig. 2.
Fig. 4 is a schematic left-hand cross-sectional view of the cartridge.
Fig. 5 is a schematic view of a left-hand cross-sectional structure of the suction hood.
In the figure, 1, a computer integrated machine body; 2. a fitting hole; 3. an assembly plate; 4. a first dust screen; 5. an air suction cover; 6. an air suction fan; 7. a wind distribution plate; 8. air distribution holes; 9. a liquid storage box; 10. a cooling liquid; 11. a semiconductor refrigerator; 12. a micro water pump; 13. a pipette; 14. serpentine cooling tube; 15. a sealing cock; 16. and a second dust screen.
Description of the embodiments
The technical scheme of the present utility model will be clearly and completely described in connection with specific embodiments. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.
Referring to fig. 1, fig. 2, fig. 3, fig. 4 and fig. 5, the utility model provides a heat dissipating device of a computer integrated machine, which comprises a computer integrated machine body 1 and a heat dissipating mechanism arranged on the computer integrated machine body 1, wherein the heat dissipating mechanism is used for dissipating heat and cooling the inside of the computer integrated machine body 1, and the heat dissipating mechanism comprises:
the heat radiation mechanism comprises an assembly plate 3, a first dustproof net 4, an air suction cover 5, an air suction fan 6, an air distribution plate 7, a liquid storage box 9, cooling liquid 10, a semiconductor refrigerator 11, a miniature water pump 12, a liquid suction pipe 13 and a snake-shaped cooling pipe 14, wherein an assembly hole 2 is formed in the left inner wall of the computer integrated machine body 1, the assembly plate 3 is fixedly arranged on the left outer wall of the computer integrated machine body 1 through screws, the assembly plate 3 is assembled and fixed by adopting the screws, the assembly plate 3 is convenient to assemble and disassemble, the heat radiation mechanism is further convenient to assemble and fix on the computer integrated machine body 1, the heat radiation mechanism is also convenient to disassemble and take down, an air inlet hole communicated with the assembly hole 2 is formed in the assembly plate 3, the air inlet hole is arranged to facilitate the outside air to enter the computer integrated machine body 1, the first dustproof net 4 is fixedly arranged in the air inlet hole, the first dustproof net 4 is used for blocking dust in the interception external environment, dust is prevented from entering the computer integrated machine body 1 through the air inlet hole, the air suction cover 5 is fixedly arranged on the right side wall of the assembly plate 3, the left side and the right side of the air suction cover 5 are of an opening structure, the right side of the air suction cover 5 penetrates through the assembly hole 2, the air suction fan 6 is fixedly arranged in the air suction cover 5, external air can be sucked into the computer integrated machine body 1 by utilizing the air suction fan 6, the aim of air cooling and radiating electronic components in the computer integrated machine body 1 is fulfilled, the air distribution plate 7 is fixedly arranged on the outer wall of the right side of the air suction cover 5, the air distribution plate 7 is provided with a plurality of air distribution holes 8, the plurality of air distribution holes 8 are distributed in an array, the plurality of air distribution holes 8 are sequentially arranged in an inclined manner from the middle to two sides, the air entering the computer integrated machine body 1 can be more comprehensively and fully diffused, can ensure that the electronic components in the computer integrated machine body 1 are cooled by air in a comprehensive and effective way, the liquid storage box 9 is fixedly arranged on the left side wall of the assembly plate 3 and positioned below the first dust screen 4, the cooling liquid 10 is stored in the liquid storage box 9, the semiconductor refrigerator 11 is fixedly arranged at the bottom of the liquid storage box 9, the refrigerating end of the semiconductor refrigerator 11 extends into the liquid storage box 9, the semiconductor refrigerator 11 is used for cooling the cooling liquid 10 which flows back into the liquid storage box 9, the micro water pump 12 is fixedly arranged on the outer wall of the front side of the liquid storage box 9, one end of the liquid suction pipe 13 is fixedly connected with the suction end of the micro water pump 12, one end of the liquid suction pipe 13 which is far away from the micro water pump 12 extends into the liquid storage box 9, the serpentine cooling pipe 14 is fixedly arranged in the air suction cover 5 and positioned between the air suction fan 6 and the air distribution plate 7, one end of a serpentine cooling pipe 14 sequentially penetrates through the bottom wall of the air suction cover 5, the assembly hole 2 and the assembly plate 3 and is fixedly connected with the discharge end of the miniature water pump 12, the other end of the serpentine cooling pipe 14 sequentially penetrates through the bottom wall of the air suction cover 5, the assembly hole 2 and the assembly plate 3 and extends into the liquid storage box 9, the miniature water pump 12 is used for pumping cooling liquid 10, the cooling liquid 10 can be controlled to circularly flow in the serpentine cooling pipe 14 and the liquid storage box 9, the circulating flow of the cooling liquid 10 in the serpentine cooling pipe 14 is utilized, heat in air entering the air suction cover 5 from the outside can be sucked away, the purpose of cooling the air is achieved, the cooled air is blown to the surface of an electronic element in the computer integrated machine body 1 again, the heat dissipation and cooling effect on the electronic element can be improved, and the serpentine cooling pipe 14 can be supported by aluminum alloy or copper alloy materials with heat conductivity numbers, and then can be effectual in giving the coolant liquid 10 that flows in the snakelike cooling tube 14 to the heat transfer in the air, all offered the venthole on the front side inner wall and the rear side inner wall of computer all-in-one body 1, equal fixed mounting has second dust screen 16 in two ventholes, and the setting of venthole is used for the inside hot air of computer all-in-one body 1 to discharge, utilizes second dust screen 16 can block the interception to the dust in the external environment, avoids the dust to get into inside the computer all-in-one body 1 through the venthole.
In this embodiment, the liquid feeding hole has been seted up at the top of receiver 9, and sealed cock 15 is installed to the downthehole screw thread of liquid feeding for add the coolant liquid 10 to receiver 9, also be convenient for use the straw equipment to follow the coolant liquid 10 in the receiver 9 and take out from the liquid feeding hole, conveniently change coolant liquid 10.
In this embodiment, an upper pipe clamp is fixedly installed at the top of the serpentine cooling pipe 14, and is fixedly connected with the top inner wall of the air suction cover 5, a lower pipe clamp is fixedly installed at the bottom of the serpentine cooling pipe 14, and is fixedly connected with the bottom inner wall of the air suction cover 5, so as to improve the stability of the serpentine cooling pipe 14.
In this embodiment, the air suction fan 6, the micro water pump 12 and the semiconductor refrigerator 11 are electrically connected with the internal circuit of the computer integrated machine body 1 through wires, when the computer integrated machine body 1 is powered on and operated, the air suction fan 6, the micro water pump 12 and the semiconductor refrigerator 11 are powered on and operated, and when the computer integrated machine body 1 is powered off, the air suction fan 6, the micro water pump 12 and the semiconductor refrigerator 11 are powered off and stopped.
Through the structure, when the air suction fan 6 is used for sucking outside air into the computer integrated machine body 1, the heat dissipation device of the computer integrated machine can firstly cool the air entering the computer integrated machine body 1, then the cooled air is blown to the surface of the electronic element in the computer integrated machine body 1, the heat dissipation and cooling effect of the electronic element can be enhanced, the rapid and effective heat dissipation and cooling of the inside of the computer integrated machine body 1 can be realized, the electronic element in the computer integrated machine body 1 is prevented from being damaged due to high temperature, the stable operation of the computer integrated machine body 1 is ensured, when the computer integrated machine body 1 is opened by a worker for working and using, the air suction fan 6, the micro water pump 12 and the semiconductor refrigerator 11 are electrified and operated at the moment, and the air suction fan 6 is used, the outside air can be sucked into the suction hood 5, the cooling liquid 10 can be pumped by utilizing the operation of the miniature water pump 12, so that the cooling liquid can circularly flow in the serpentine cooling pipe 14 and the liquid storage box 9, when the air entering the suction hood 5 passes around the serpentine cooling pipe 14, the heat in the air entering the suction hood 5 from the outside can be sucked away by utilizing the circular flow of the cooling liquid 10 in the serpentine cooling pipe 14, the purpose of cooling the air is realized, the cooled air passes through the plurality of air distribution holes 8 to be uniformly and comprehensively diffused in the computer integrated machine body 1, the cooled air can be blown to the surfaces of electronic components in the computer integrated machine body 1, the electronic components can be rapidly and effectively cooled, the cooling liquid 10 with heat flowing back into the liquid storage box 9 can be cooled by utilizing the semiconductor refrigerator 11, so that the cooling liquid can absorb heat and cool the air effectively during the circulation flow in the serpentine cooling pipe 14, and the hot air in the computer integrated machine body 1 is discharged from the air outlet.
The heat dissipation device of the computer integrated machine provided by the utility model is described in detail. The principles and embodiments of the present utility model have been described herein with reference to specific examples, which are intended to be merely illustrative of the methods of the present utility model and their core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the utility model can be made without departing from the principles of the utility model and these modifications and adaptations are intended to be within the scope of the utility model as defined in the following claims.

Claims (6)

1. The utility model provides a heat abstractor of computer all-in-one, its characterized in that, including computer all-in-one body (1) and the cooling mechanism of setting on computer all-in-one body (1), cooling mechanism includes assembly plate (3), first dust screen (4), cover (5) that induced drafts, suction fan (6) and air distributor (7), set up mounting hole (2) on the left side inner wall of computer all-in-one body (1), assembly plate (3) are in through screw fixed mounting on the left side outer wall of computer all-in-one body (1), set up the inlet port that is linked together with mounting hole (2) on assembly plate (3), first dust screen (4) fixed mounting is in the inlet port, cover (5) fixed mounting is in on the right side wall of assembly plate (3), the left side and the right side of cover (5) are open structure, the right side of cover (5) is run through mounting hole (2), suction fan (6) fixed mounting is in cover (5), cloth (7) are in air distributor (7) are fixed on the air distributor (8) on the side air distributor (8).
2. The heat dissipation device of a computer integrated machine according to claim 1, wherein: the number of the air distribution holes (8) is multiple, the air distribution holes (8) are distributed in an array mode, and the air distribution holes (8) are sequentially arranged in an inclined mode from the middle to two sides.
3. The heat dissipation device of a computer integrated machine according to claim 1, wherein: the heat dissipation mechanism further comprises a liquid storage box (9), cooling liquid (10), a semiconductor refrigerator (11), a micro water pump (12), a liquid suction pipe (13) and a serpentine cooling pipe (14), wherein the liquid storage box (9) is fixedly installed on the left side wall of the assembly plate (3) and is located below the first dust screen (4), the cooling liquid (10) is stored in the liquid storage box (9), the semiconductor refrigerator (11) is fixedly installed at the bottom of the liquid storage box (9), the refrigerating end of the semiconductor refrigerator (11) extends into the liquid storage box (9), the micro water pump (12) is fixedly installed on the outer wall of the front side of the liquid storage box (9), one end of the liquid suction pipe (13) is fixedly connected with the suction end of the micro water pump (12), one end of the liquid suction pipe (13) far away from the micro water pump (12) extends into the liquid storage box (9), the serpentine cooling pipe (14) is fixedly installed in the air suction cover (5) and is located between the air suction fan (6) and the air suction cover (7), one end of the liquid suction pipe (13) is fixedly installed at the suction end of the liquid suction pipe (12) and one end of the liquid suction pipe (12) is connected with the suction pipe (5) in sequence, the other end of the serpentine cooling tube (14) sequentially penetrates through the bottom wall of the air suction cover (5), the assembly hole (2) and the assembly plate (3) and extends into the liquid storage box (9).
4. A heat sink for a computer integrated machine according to claim 3, wherein: the top of the liquid storage box (9) is provided with a liquid adding hole, and a sealing cock (15) is arranged in the liquid adding hole in a threaded manner.
5. A heat sink for a computer integrated machine according to claim 3, wherein: the top fixed mounting of snakelike cooling tube (14) has last pipe strap, go up the pipe strap with the top inner wall fixed connection of cover (5) induced drafts, the bottom fixed mounting of snakelike cooling tube (14) has down the pipe strap, down the pipe strap with the bottom inner wall fixed connection of cover (5) induced drafts.
6. The heat dissipation device of a computer integrated machine according to claim 1, wherein: the front side inner wall and the rear side inner wall of the computer integrated machine body (1) are respectively provided with an air outlet hole, and a second dustproof net (16) is fixedly arranged in each air outlet hole.
CN202321793624.4U 2023-07-10 2023-07-10 Heat abstractor of computer all-in-one Active CN220526290U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321793624.4U CN220526290U (en) 2023-07-10 2023-07-10 Heat abstractor of computer all-in-one

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321793624.4U CN220526290U (en) 2023-07-10 2023-07-10 Heat abstractor of computer all-in-one

Publications (1)

Publication Number Publication Date
CN220526290U true CN220526290U (en) 2024-02-23

Family

ID=89923307

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321793624.4U Active CN220526290U (en) 2023-07-10 2023-07-10 Heat abstractor of computer all-in-one

Country Status (1)

Country Link
CN (1) CN220526290U (en)

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